JP3925796B2 - Quartz vibrating piece, manufacturing method thereof, quartz crystal device using quartz crystal vibrating piece, mobile phone device using quartz crystal device, and electronic apparatus using quartz crystal device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a crystal resonator element, a method for manufacturing the same, a crystal device in which the crystal oscillator piece is accommodated in a package, and a mobile phone and an electronic apparatus using the crystal device.
[0002]
[Prior art]
Quartz that contains a crystal resonator element in a small information device such as a hard disk drive (HDD), mobile computer, or IC card, or mobile communication device such as a mobile phone, a car phone, or a paging system Crystal devices such as vibrators and crystal oscillators are widely used.
FIG. 13 is a schematic plan view showing a configuration example of such a crystal device, and FIG. 14 is a schematic cross-sectional view taken along the line EE of FIG.
In these drawings, the crystal device 1 accommodates a crystal vibrating piece 3 inside a package 2. In this case, the package 2 is formed by forming an insulating material in a shallow box shape. After the crystal vibrating piece 3 is accommodated and fixed inside, the package 2 is sealed by the lid 4 via the sealing material 2a. ing.
[0003]
The crystal vibrating piece 3 is formed in the shape shown in the figure by etching the crystal. In this case, the quartz crystal vibrating piece 3 is constituted by a tuning fork type quartz crystal piece including a base portion 5 and a pair of vibrating arms 6 and 7 extending in parallel to the right from the base portion 5 in the drawing. The base part 5 of the quartz crystal vibrating piece 3 is fixed to the electrode parts 9 and 9 on the package 2 side by using conductive adhesives 8 and 8. Excitation electrodes (not shown) are formed on the surfaces of the vibrating arms 6 and 7, and by applying a driving voltage to the excitation electrodes from the outside, as shown by arrows F and F in FIG. The vibrating arms 6 and 7 vibrate so that their tip sides approach and separate from each other. By taking out the vibration frequency based on such vibration, it is used for various signals such as a clock signal for control.
[0004]
[Problems to be solved by the invention]
By the way, in the quartz crystal device 1 having such a structure, as shown in the FF line cut end view (showing only the cut surface) in FIG. An irregular shape such as 11, 11 may be formed. The irregular shapes such as the protrusions 11 and 11 are formed by crystal anisotropy in the process of processing a crystal wafer (not shown) as a crystal material and forming the outer shape of the crystal vibrating piece 3 by etching. It is thought that it will be done.
[0005]
When such protrusions 11, 11 are formed on the vibrating arms 6, 7, as described in FIG. 13, with respect to the original vibration direction F when the crystal vibrating piece 3 is driven, Vibration occurs in the thickness direction of the quartz crystal vibrating piece 3 perpendicular to this direction, that is, in the G direction in FIG. As a result, the vibration characteristics of the quartz crystal resonator element 3 may be adversely affected.
[0006]
The present invention relates to a quartz crystal resonator element and a manufacturing method thereof, and a quartz crystal device using the quartz crystal resonator element, so as not to adversely affect vibration characteristics by suppressing vibration in the thickness direction of the quartz crystal resonator element, It is another object of the present invention to provide a mobile phone and an electronic device using a crystal device.
[0007]
[Means for Solving the Problems]
According to the first aspect of the present invention, there is provided, according to the first invention, a step of forming a corrosion-resistant film on a substrate made of a quartz material, and an outer shape patterning step of forming the corrosion-resistant film into an outer pattern of a crystal vibrating piece having a vibrating arm Etching the substrate made of the quartz material on the basis of the pattern of the outer shape, and forming an outer shape of the quartz crystal vibrating piece leaving an abnormal shape on the first side surface of the vibrating arm; When the side surface opposite to the first side surface is defined as the second side surface, it corresponds to the outer edge portion defining the second side surface and the groove formed in the vibrating arm in the outer shape pattern of the corrosion-resistant film. A half etching patterning step of removing a region to be formed and forming a half etching pattern, and etching the substrate made of the quartz material based on the half etching pattern, Forming a protrusion or protrusions on the second side, and a half-etching process for forming the grooves in the vibrating arm, the method for producing the quartz crystal resonator element and a step of forming an electrode film is accomplished.
Here, the protrusions or protrusions provided on the opposite surface of the surface on which the deformed shape of each vibrating arm is formed are the same protrusions or protrusions as the shapes corresponding to the deformed shape on the opposite surface of each vibrating arm. The protrusion may be a continuous protrusion, or may be provided so that a large number or a plurality of protrusions are continuous.
[0008]
According to a second aspect of the present invention, in the configuration of the first aspect of the present invention, the method includes a corrosion-resistant film forming step of forming a metal film on the surface of the substrate made of the quartz material by sputtering or vapor deposition.
The outer shape etching step includes a step of applying a resist to the metal film, exposing and removing the resist to form a pattern of the outer shape, and forming the corrosion-resistant film based on the outer shape pattern. This is a method for manufacturing a quartz crystal vibrating piece.
According to a third aspect of the invention, in the configuration of the first or second aspect of the invention, the protrusions or ridges are formed at a height that substantially matches the protrusion height of the deformed shape.
According to the above configuration, the protrusion or protrusion provided on the surface opposite to the surface on which the deformed shape of each vibrating arm is formed has a height substantially matching the protruding height protruding as the deformed shape. The balance can be made precise and vibrations in the thickness direction of the quartz crystal resonator element can be more effectively suppressed.
[0009]
According to a fourth aspect of the present invention, in the configuration of the first or second aspect of the present invention, a groove extending in the length direction is formed in each of the vibrating arms as the groove in the half etching step .
According to the above configuration, each vibrating arm is formed with a groove extending along the length direction of each vibrating arm, so that an excitation electrode is provided inside the groove. An electric field can be generated efficiently. Thereby, the vibration performance of the quartz crystal vibrating piece can be improved.
[0010]
According to a fifth aspect of the present invention, in the configuration of the first or second aspect, in the outer shape etching step, a cutout portion is formed in the base portion in a region close to the base end portion of each vibrating arm. .
According to the above configuration, in the tuning fork type vibrating piece, by forming the notch at the base, it is possible to effectively prevent the vibration from the vibrating arm from leaking into the base and to suppress the crystal impedance value. it can.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
1 and 2 show a first embodiment of a quartz crystal device according to the present invention. FIG. 1 is a schematic plan view thereof, and FIG. 2 is a schematic sectional view taken along line AA of FIG.
In the figure, the crystal device 30 shows an example in which a crystal resonator is configured. The crystal device 30 accommodates a crystal resonator element 32 in a package 36. The package 36 is formed, for example, by laminating a plurality of substrates formed by molding an aluminum oxide ceramic green sheet as an insulating material, and then sintering. Each of the plurality of substrates is formed with a predetermined hole on the inner side thereof, so that a predetermined internal space S2 is formed on the inner side when stacked.
This internal space S2 is a housing space for housing the crystal vibrating piece.
That is, as shown in FIG. 2, in this embodiment, the package 36 is formed by, for example, stacking the first laminated substrate 61, the second laminated substrate 64, and the third laminated substrate 68 from below. ing.
[0018]
In the inner space S2 of the package 36, in the vicinity of the left end portion, the second laminated substrate 64 that is exposed to the inner space S2 and constitutes the inner bottom portion is, for example, an electrode formed by nickel plating and gold plating on tungsten metallization. Portions 31, 31 are provided.
The electrode portions 31 are connected to the outside to supply a driving voltage. Conductive adhesives 43, 43 are applied on the electrode parts 31, 31, and the base 51 of the crystal vibrating piece 32 is placed on the conductive adhesives 43, 43, so that the conductive adhesive 43 43 are hardened. In addition, as the conductive adhesives 43 and 43, a synthetic resin agent as an adhesive component exhibiting a bonding force and containing conductive particles such as fine silver particles can be used. A system-based or polyimide-based conductive adhesive or the like can be used.
[0019]
The quartz crystal vibrating piece 32 is formed by etching a quartz crystal by a manufacturing process to be described later. In the case of the present embodiment, the quartz crystal vibrating piece 32 is particularly illustrated in order to form a small size and obtain necessary performance. It is made into a shape.
That is, the quartz crystal resonator element 32 has a base portion 51 fixed to the package 36 side as will be described later, and a pair of vibrations extending parallel to the fork 51 in the right direction in the drawing with the base portion 51 as a base end. A so-called tuning fork type crystal vibrating piece having arms 34 and 35 and having a shape like a tuning fork as a whole is used.
[0020]
Grooves 56 and 57 extending in the length direction are formed in the respective vibrating arms 34 and 35 of the crystal vibrating piece 32. The grooves 56 and 57 are formed on the vibrating arms 34 as shown in FIG. 3 which is an end view taken along the line BB in FIG. 1 and FIG. 4 which is an end view taken along the line CC in FIG. , 35 on both front and back surfaces.
[0021]
Further, in FIG. 1, lead electrodes 52 and 53 are formed near both ends in the width direction of the end portion (left end portion in FIG. 1) of the base portion 51 of the crystal vibrating piece 32. The lead electrodes 52 and 53 are similarly formed on the back surface (not shown) of the base 51 of the quartz crystal vibrating piece 32.
These lead electrodes 52 and 53 are portions connected to the electrode parts 31 and 31 on the package side by the conductive adhesives 43 and 43 as described above. The lead electrodes 52 and 53 are connected to excitation electrodes 54 and 55 provided in the grooves 56 and 57 of the vibrating arms 34 and 35 as shown in the drawing. Further, as shown in FIG. 4, the excitation electrodes 54 and 55 are also formed on both side surfaces of the vibrating arms 34 and 35, and a groove 57 is formed with respect to one vibrating arm, for example, the vibrating arm 34. The excitation electrode 54 inside and the excitation electrode 55 on the side surface thereof are made to have different polarities.
[0022]
In addition, a through hole 37 that is opened to the outside is provided near the center of the bottom surface of the package 36 by forming through holes 37 a and 37 b that are continuous with the two laminated substrates constituting the package 36. Of the two through holes constituting the through hole 37, the outer through hole 37a, which is the second hole, has a larger inner diameter than the first hole 37b that opens inside the package. Yes. Thereby, the through-hole 37 is a stepped opening including a downward stepped portion 62 in FIG. It is preferable that a metal coating portion is provided on the surface of the stepped portion 62.
[0023]
Here, as the metal sealing material 38 filled in the through-hole 37, for example, a lead-free sealing material is preferably selected. For example, silver brazing, Au / Sn alloy, Au / Xe alloy Selected from etc. Correspondingly, it is preferable to form nickel plating and gold plating on the tungsten metallization in the metal covering portion on the surface of the stepped portion 62.
A lid 39 is joined to the opened upper end of the package 36 for sealing. The lid 39 is preferably sealed and fixed to the package 36, and then, as shown in FIG. In order to adjust the frequency, it is made of a material that transmits light, particularly, thin glass.
As a glass material suitable for the lid 39, for example, borosilicate glass is used, for example, as a thin glass manufactured by the downdraw method.
[0024]
Furthermore, in the quartz crystal resonator element 32 of the present embodiment, the deformed shapes 65 and 65 may be formed in the respective vibrating arms 34 and 35 during the manufacturing process. In FIGS. Is shown as a slightly narrowed protrusion or ridge. Such deformed shapes 65 and 65 are formed by the anisotropy of quartz in the course of quartz etching, as will be described later. In this case, on the same side surface (the right side surface in FIGS. 3 and 4) of each vibrating arm 34, 35, a protrusion or protrusion extending in the length direction of each vibrating arm 34, 35 in the vicinity of the middle in the thickness direction. It appears as an article.
[0025]
On the other hand, in the quartz crystal vibrating piece 32 of the present embodiment, the side of the vibrating arms 34 and 35 opposite to the side where the above-described deformed shapes 65 and 65 are formed, that is, the drawings of the vibrating arms 34 and 35. 3 and 4, projections or ridges 66, 66 extending in the length direction of the vibrating arms 34, 35 are formed near the middle in the thickness direction on the left side surface.
Thereby, in each of the vibrating arms 34 and 35, vibrations in the thickness direction of the quartz crystal vibrating piece 32, that is, the structure of the surface on which the deformed shape is formed and the opposite surface are substantially balanced, that is, The vibration in the G direction in FIG. 2 is suppressed.
[0026]
FIG. 5 shows a quartz crystal in the ratio of the protruding height h of the deformed shapes 65 and 65 formed on the vibrating arms 34 and 35 described above to the protruding height H of the protrusions or protrusions 66 and 66 formed in this embodiment. 4 is a graph obtained by measuring a displacement amount of a vibrating piece 32 in a thickness direction.
As shown in FIG. 5, the ratio H / h of the protrusion height h of the deformed shapes 65 and 65 formed on the vibrating arms 34 and 35 and the protrusion height H of the protrusions or protrusions 66 and 66 is as follows. , 0.8 to 1.1, it has been found that the displacement of the quartz crystal vibrating piece 32 in the thickness direction is significantly suppressed.
Therefore, in order to suppress the displacement of the quartz crystal vibrating piece 32 in the thickness direction and improve the vibration performance, the protrusion height h is substantially the same as the protrusion height h of the deformed shapes 65 and 65 formed on the vibration arms 34 and 35. It is necessary to form the protrusions or ridges 66, 66 so that the height is H.
[0027]
Next, FIG. 6 to FIG. 8 are process diagrams for explaining an example of a method for manufacturing the quartz crystal vibrating piece 32 of the present embodiment, and the manufacturing process is shown in the cut end view of the part corresponding to FIG. It is shown in order.
With reference to these drawings, a method of manufacturing the quartz crystal vibrating piece 32 will be described.
(Process for forming the outer shape of the crystal vibrating piece)
In FIG. 6A, a substrate 71 made of a quartz material having a size capable of separating a plurality or a large number of quartz crystal vibrating pieces 32 is prepared, and the surface (front and back surfaces) of the substrate 71 is formed by a technique such as sputtering or vapor deposition. Then, a corrosion resistant film 72 is formed. As shown in the figure, a corrosion-resistant film 72 is formed on both front and back surfaces of the quartz substrate 71. The corrosion-resistant film 72 is composed of, for example, a chromium layer as a base layer and a gold coating layer coated thereon ( Corrosion-resistant film formation process).
In the following steps, since the same processing is performed on both the upper and lower surfaces in FIG. 6 of the substrate 71, only the upper surface will be described in order to avoid complexity.
[0028]
Next, as shown in FIG. 6B, a resist 73 is applied to the entire surface (resist application step). Then, as shown in FIG. 6C, the resist 73 in a portion that is outside the shape of the crystal vibrating piece 32 corresponding to the outer shape of the crystal vibrating piece 32 is exposed and removed. Subsequently, as shown in FIG. 6D, the exposed corrosion-resistant film 72 is removed by etching with a corresponding etching solution. Thus, patterning of the outer shape including the vibrating arms 34 and 35 of the crystal vibrating piece 32 is performed (outer shape patterning step).
Next, as shown in FIG. 7E, the resist 73 is peeled off, and a resist 74 is newly applied over the entire surface as shown in FIG. 7F (resist application step).
[0029]
Next, as shown in FIG. 7G, a mask (not shown) adapted to the outer shape of the crystal vibrating piece 32 and the shape corresponding to the grooves 56 and 57 of the vibrating arms 34 and 35 is arranged. Patterning corresponding to the grooves 56 and 57 of the vibrating arms 34 and 35 is performed.
[0030]
In this case, it is particularly important for the resists 74b and 74b on the side where the projections or protrusions 66 and 66 extending in the length direction of the respective vibrating arms 34 and 35 are to be formed, and the outer shapes of the respective vibrating arms 34 and 35 therebelow. A mask is used in which the area is reduced so as to be inside by the distance indicated by H in FIG.
Then, exposure is performed with such a mask applied, and the resist not exposed to light is removed, thereby patterning corresponding to the grooves 56 and 57 of the vibrating arms 34 and 35 and the length of the vibrating arms 34 and 35. Patterning corresponding to the protrusions or protrusions 66 extending in the vertical direction can be performed simultaneously. In FIG. 7G, the distance H is the projection height of the protrusions or ridges 66, 66 as it is.
Next, as shown in FIG. 7H, the exposed quartz substrate 71 is etched with hydrofluoric acid or the like along the outer shape of the corrosion-resistant film 72. Thereby, the portions 71a and 71b corresponding to the vibrating arms 34 and 35 of the crystal vibrating piece 32 are formed, and the etching of the outer shape of the crystal vibrating piece 32 is completed.
[0031]
(Process for forming a groove in each vibrating arm of the crystal vibrating piece)
Subsequently, as shown in FIG. 8 (i), the resists 74 a of the corrosion-resistant film 72 as the portions corresponding to the grooves 56 and 57 and the protrusions or protrusions 66 and 66 for the vibrating arms 34 and 35 of the crystal vibrating piece 32. , 74b are removed to expose the quartz substrate 71.
[0032]
Next, as shown in FIG. 8J, the exposed material portion of the quartz crystal substrate 71 is half-etched. That is, the grooves 56 and 57 and the portions corresponding to the protrusions or ridges 66 and 66 are simultaneously half-etched (half-etching step).
As a result, as shown in the drawing, deformed shapes 65 and 65 are formed on the right side surfaces of the vibrating arms 34 and 35 of the crystal vibrating piece 32 due to the anisotropy of the crystal. At the same time, in the portions 71a and 71b corresponding to the vibrating arms 34 and 35 of the crystal vibrating piece 32, the grooves 56 and 57 and the projections or protrusions 66 and 66 are simultaneously formed, respectively.
[0033]
In this case, since the grooves 56 and 57 and the projections or ridges 66 and 66 are formed at the same time, a special process is added using the half-etching process of the groove formation only by changing the shape of the mask. The protrusions or ridges 66 can be formed without any problem.
Next, as shown in FIG. 8 (k), the resists 74a and 74b are removed, and as shown in FIG. 8 (l), the anticorrosion film 72 is removed to remove the electrode film portion and to remove the crystal vibrating piece 32. The detailed shape formation is completed.
[0034]
(Electrode film formation process)
Subsequently, an electrode of the crystal vibrating piece 32 is formed.
As shown in FIG. 9 (m), the electrode films 75 and 75 are covered with a metal to be an electrode by sputtering or the like on the entire outer surface of a crystal piece on which no electrode is formed. The electrode films 75 and 75 are coated with Au using, for example, Cr as a base layer.
Next, as shown in FIG. 9 (n), resists 76 and 76 are applied to the outside by, for example, a spray method.
[0035]
Next, as shown in FIG. 9 (o), patterning is performed using a mask (not shown) so as to coincide with the shapes of the electrodes 54 and 55 to be formed on the crystal vibrating piece 32 (see FIGS. 1 to 4). The resists 76 and 76 not exposed to light are removed by exposure.
Then, the electrode films 75 and 75 exposed by removing the resist are removed by etching in the order of Au and Cr as shown in FIG.
Finally, as shown in FIG. 10, the crystal vibrating piece 32 is completed by completely removing the resists 76 and 76. In FIG. 10, all the electrodes are denoted by reference numeral 75 for explaining the process, and for example, do not match the sign display of FIG. 4, but FIG. 10 does not distinguish electrodes having different polarities. As shown, the structure is the same.
[0036]
As described above, according to the manufacturing method described above, the grooves 56 and 57 having a predetermined depth are formed in the respective vibrating arms 34 and 35 of the crystal vibrating piece 32 by half etching. , 57 can be used to leave protrusions or ridges 66, 66 whose outer shapes are half-etched in the thickness direction on the side surfaces of the vibrating arms 34, 35. Therefore, by selecting a portion to be left by half-etching, a protrusion or a surface on the surface opposite to the surface on which the deformed shapes 65 and 65 are formed corresponding to the deformed shapes 65 and 65 formed on the vibrating arms 34 and 35. It is relatively easy to provide the protrusions. In this case, the projection height at which the projections or ridges 66 and 66 are provided can be easily determined only by determining the distance H in FIG.
[0037]
Next, a second embodiment of the quartz crystal device will be described in detail with reference to FIG.
FIG. 11A is a schematic plan view showing the configuration of the crystal device 80, and FIG. 11B is a schematic cross-sectional view taken along the line DD of FIG. 11A.
In these drawings, the portions denoted by the same reference numerals as those of the quartz crystal device 30 of the first embodiment have a common configuration, and therefore, overlapping description will be omitted, and differences will be mainly described.
[0038]
In other words, in the base 51 of the crystal vibrating piece 32 housed in the crystal device 80, the base 51 is cut at a position close to the base end side of the pair of vibrating arms 34 and 35 in the width direction of the base 51. A notch portion or a constricted portion 81 may be provided.
Thereby, it is possible to prevent the vibration of the crystal vibrating piece 32 from leaking into the base 51 and to reduce the CI (crystal impedance) value.
[0039]
Furthermore, in this embodiment, a hole is formed in the lowermost substrate 61 of the multilayer substrate constituting the package 36 in the vicinity of the right end in FIG. 11B, so that a recess 42 corresponding to the thickness of the multilayer substrate is formed. Is formed. The concave portion 42 is located below the tip portion that is the free end of the crystal vibrating piece 32. Thereby, in this embodiment, when an impact is applied to the package 36 from the outside, even when the free end of the crystal vibrating piece 32 is displaced in the direction of the arrow G and is shaken, it contacts the inner bottom surface of the package 36. Is effectively prevented from being done.
Other functions and effects are the same as those of the first embodiment.
[0040]
FIG. 12 is a diagram showing a schematic configuration of a digital mobile phone device as an example of an electronic apparatus using the crystal device according to the above-described embodiment of the present invention.
In the figure, a microphone 308 for receiving the voice of the sender and a speaker 309 for outputting the received content as a voice output are provided, and further, an integrated circuit or the like as a control unit connected to the modulation and demodulation unit of the transmission / reception signal. The CPU (Central Processing Unit) 301 is provided.
In addition to modulation and demodulation of transmission / reception signals, the CPU 301 controls an information input / output unit 302 including an LCD as an image display unit and operation keys for inputting information, and a memory 303 including a RAM and a ROM. It has become. For this reason, the crystal device 30 or the crystal device 80 is attached to the CPU 301, and the output frequency is used as a clock signal suitable for the control contents by a predetermined frequency dividing circuit (not shown) incorporated in the CPU 301. Have been to. The crystal device 30 attached to the CPU 301 may not be a single crystal device 30 or the like, but may be an oscillator that combines the crystal device 30 and the like with a predetermined frequency dividing circuit or the like.
[0041]
The CPU 301 is further connected to a temperature compensated crystal oscillator (TCXO) 305, and the temperature compensated crystal oscillator 305 is connected to the transmitter 307 and the receiver 306. Thus, even if the basic clock from the CPU 301 fluctuates when the environmental temperature changes, it is corrected by the temperature compensated crystal oscillator 305 and supplied to the transmission unit 307 and the reception unit 306.
[0042]
As described above, by using the crystal device 30 according to the above-described embodiment in an electronic device such as the digital cellular phone device 300 including the control unit, excellent vibration characteristics can be achieved even when the device is small. Therefore, an accurate clock signal can be generated.
[0043]
The present invention is not limited to the above-described embodiment. Each configuration of each embodiment can be appropriately combined or omitted, and can be combined with other configurations not shown.
In addition, the present invention can be applied to all crystal devices regardless of the names of crystal resonators, crystal oscillators, etc., as long as the crystal resonator element is accommodated in the package.
Further, in the above-described embodiment, a box-shaped material using a crystal material is used for the package. However, the present invention is not limited to such a form, and at least a part of the package is provided with a portion through which light can be transmitted. If so, the present invention can be applied to any package or case with a case.
[Brief description of the drawings]
FIG. 1 is a schematic plan view showing a first embodiment of a quartz crystal device of the present invention.
FIG. 2 is a schematic cross-sectional view taken along line AA in FIG.
FIG. 3 is a cross-sectional end view taken along line BB in FIG. 1;
4 is a cross-sectional end view taken along the line CC in FIG. 1;
5 is a graph showing the displacement of the quartz crystal vibrating piece in the G direction according to the ratio between the height of the protrusion provided on the quartz crystal vibrating piece housed in the quartz crystal device of FIG. 1 and the height of the irregularly shaped portion.
6 is a schematic cross-sectional view sequentially showing manufacturing steps of a quartz crystal vibrating piece housed in the quartz crystal device of FIG. 1. FIG.
7 is a schematic cross-sectional view sequentially showing manufacturing steps of a quartz crystal vibrating piece housed in the quartz crystal device of FIG. 1. FIG.
8 is a schematic cross-sectional view sequentially showing the manufacturing steps of the crystal vibrating piece housed in the crystal device of FIG.
9 is a schematic cross-sectional view sequentially showing the manufacturing steps of the crystal vibrating piece housed in the crystal device of FIG.
10 is a schematic cross-sectional view showing the final stage of the manufacturing process of the crystal resonator element housed in the crystal device of FIG. 1;
11A and 11B are diagrams showing a crystal device according to a second embodiment of the present invention, in which FIG. 11A is a schematic plan view showing a configuration of the crystal device 80, and FIG. 11B is a DD line of FIG. FIG.
FIG. 12 is a diagram showing a schematic configuration of a digital mobile phone device as an example of an electronic apparatus using a crystal device according to an embodiment of the present invention.
FIG. 13 is a schematic plan view showing a configuration example of a conventional crystal device.
14 is a schematic sectional view taken along line EE in FIG.
15 is an end view taken along line F-F in FIG. 13;
[Explanation of symbols]
30, 80 ... quartz device, 32 ... quartz vibrating piece, 34, 35 ... vibrating arm, 56, 57 ... groove, 65, 65 ... irregular shape (part), 66, 66 ..Protrusions or ridges.

Claims (5)

Forming a corrosion-resistant film on a substrate made of quartz material;
An external patterning step of forming the corrosion-resistant film into an external pattern of a crystal vibrating piece having a vibrating arm;
An outer shape etching step of etching the substrate made of the quartz material based on the pattern of the outer shape, and forming the outer shape of the quartz crystal vibrating piece while leaving the abnormal shape on the first side surface of the vibrating arm;
In the vibrating arm, when a side surface opposite to the first side surface is defined as a second side surface, an outer edge portion defining the second side surface and the vibrating arm are formed in the outer shape pattern of the corrosion-resistant film. A half etching patterning step of removing a region corresponding to the groove to form a half etching pattern;
A half-etching step of etching the substrate made of the quartz material based on the half-etching pattern, forming a protrusion or a ridge on the second side surface, and forming a groove on the vibrating arm;
Forming an electrode film; and
A method for producing a quartz crystal vibrating piece, comprising: It is a manufacturing method of the crystal vibrating piece according to claim 1,
A corrosion-resistant film forming step of forming a metal film on the surface of the substrate made of the quartz material by sputtering or vapor deposition;
The outer shape etching step includes a step of applying a resist to the metal film, exposing and removing the resist to form a pattern of the outer shape, and forming the corrosion-resistant film based on the outer shape pattern. A method for manufacturing a quartz crystal vibrating piece. 3. The method for manufacturing a quartz crystal vibrating piece according to claim 1 , wherein the protrusions or protrusions are formed at a height that substantially coincides with the height of the irregularly shaped protrusion. 3. The method for manufacturing a quartz crystal vibrating piece according to claim 1 , wherein a groove extending in a length direction of each vibrating arm is formed as the groove in the half etching step . 3. The crystal vibrating piece manufacturing method according to claim 1 , wherein in the outer shape etching step, a cutout portion is formed in the base portion in a region close to a base end portion of each of the vibrating arms. Method.

Images