CN209702849U - A kind of quartz wafer film coating jig integrated frame - Google Patents

A kind of quartz wafer film coating jig integrated frame Download PDF

Info

Publication number
CN209702849U
CN209702849U CN201821828513.1U CN201821828513U CN209702849U CN 209702849 U CN209702849 U CN 209702849U CN 201821828513 U CN201821828513 U CN 201821828513U CN 209702849 U CN209702849 U CN 209702849U
Authority
CN
China
Prior art keywords
mask
fixed substrate
frame
quartz wafer
spacer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201821828513.1U
Other languages
Chinese (zh)
Inventor
辜达元
郭正江
周万华
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongxing Technology Group Co ltd
Original Assignee
HANGZHOU HOSONIC ELECTRONICS CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HANGZHOU HOSONIC ELECTRONICS CO Ltd filed Critical HANGZHOU HOSONIC ELECTRONICS CO Ltd
Priority to CN201821828513.1U priority Critical patent/CN209702849U/en
Application granted granted Critical
Publication of CN209702849U publication Critical patent/CN209702849U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Physical Vapour Deposition (AREA)

Abstract

The utility model discloses a kind of quartz wafer film coating jig integrated frames, it include: upper fixed substrate, lower fixed substrate, MASK fixed frame, the centre of fixed substrate and the lower fixed substrate is arranged in MASK/SPACER fixed frame, the MASK fixed frame and the MASK/SPACER integrated frame.The utility model is by MASK+Spacer whole design, it is seamless without being laminated, so as to avoid because of chip deviation phenomenon caused by assembling, each layer magnet position is evenly distributed on jig plate surrounding and using chip station as on the symmetrical peripheral location of geometric center, so that the magnetic picture radiated around each station is worked as, finally make the quartz wafer position accurate stable of installation and will not shake, the quartz wafer film coating jig frame can solve special ultra-thin quartz wafer plated film, the design of thicker quartz wafer film coating jig frame can also be applied to, it can effectively prevent jig buckling deformation electrode metallizations jig.

Description

A kind of quartz wafer film coating jig integrated frame
Technical field
The utility model relates to plated film tooling and fixture technical field more particularly to a kind of quartz wafer film coating jig one Frame.
Background technique
Globalization will enter a new era, and one is transmitted the new era of information, thought and innovation by data and connection, 5G gives birth to seasonable.Big data, magnanimity connection and scene experience meet the following widely data and connection business needs, mention Rise user experience.Communication network speed-raising is also extremely urgent, and the high-frequency reference clock of high quality is always in research and development.
Therefore high-frequency basic wave product is developed with good prospect, but the thickness of quartz wafer is inversely proportional with frequency, For example the frequency of 80MHz, the thickness of basic wave quartz wafer about 20um open 1/5 thickness of common A4 paper less than one, are studying this The ultra-thin quartz wafer of sample is in quartz-crystal resonator design, and rule of thumb, the design of quartz wafer electrode metallizations tool frame is straight Connect determine the research and development of products at lose.
Still it takes charge of and first designs this ultra-thin about 20um quartz wafer Novel film-coated tool frame.Previous complete quartz crystal plating Film tool frame includes 1 wafer fixed frame Spacer, 2 plate electrode MASK and two panels fixture cover board Holder, and wherein chip is solid The thickness for determining frame Spacer is thickness design according to quartz wafer, by taking the quartz wafer of 20um thickness as an example, most directly Scheme: the fixed frame Spacer of 20um thickness is exactly manufactured, but jig ultra-thin in this way is easy to warpage, bending, deformation, nothing It is still subsequent not strong using operability by manufacture processing.
Therefore, the engineers and technicians that a kind of quartz wafer film coating jig integrated frame is technical field are developed urgently to solve Certainly the problem of.
Utility model content
In view of this, to enhance the manufacturability of jig and using operability, it, will using the thinking of superposition jig thickness Spacer and MASK design reaches Spacer layers and MASK layers by two-sided half-etching technology on one piece of 40um substrate front and back sides The thickness effect of each 20um, the purpose of this utility model is to provide a kind of quartz wafer film coating jig integrated frames.
In order to achieve the above objectives, the solution of the utility model is:
A kind of quartz wafer film coating jig integrated frame, comprising:
Upper fixed substrate, fixed substrate be rectangle, fixed substrate be equipped with multiple square wafer station slots, Multiple magnet station slots, each first positioning hole in left and right and two rectangle blank windows;
Lower fixed substrate, the lower fixed substrate is identical as fixed substrate shape, right in the lower fixed substrate Multiple square wafer station slots identical with fixed substrate, multiple magnet station slots, two should be provided with The rectangle blank window, pin left and right each first positioning hole and matched with two first positioning holes;
MASK fixed frame corresponds to the chip station groove location on the MASK fixed frame and is provided with multiple MASK stations Slot, the MASK fixed frame are located at the lower part of the lower fixed substrate;
MASK/Spacer one fixed frame corresponds to the chip station groove location on the MASK/SPACER frame and is provided with The lower part of the MASK fixed frame is arranged in multiple MASK/SPACER station slots, the MASK/SPACER integrated frame;
The MASK fixed frame and the MASK/SPACER integrated frame are arranged in fixed substrate and the lower fixation The centre of substrate.
Preferably, magnet position slot is evenly distributed on multiple institutes on fixed substrate and the lower fixed substrate Stating square wafer station slot is on the symmetrical peripheral location of geometric center.
Preferably, multiple magnet station slots on fixed substrate and the lower fixed substrate extend through institute Fixed substrate and the lower fixed substrate are stated, is fixedly installed strong magnets respectively in each magnet station slot.
Preferably, the MASK/SPACER integrated frame and the MASK fixed frame correspond to multiple magnet station slot positions It installs and is equipped with multiple hollow out square grooves.
It preferably, further include two second location holes, two second location holes are separately positioned on fixed base The upper and lower sides middle position of plate and the lower fixed substrate.
Preferably, fixed base and two rectangle blank windows of the lower fixed substrate side are arranged side by side simultaneously Positioned at the two sides of the first positioning hole.
Preferably, two first positioning holes and two second location holes extend through the MASK fixed frame and The MASK/SPACER integrated frame.
Preferably, fixed substrate and the lower fixed substrate are that stainless steel material is manufactured.
Utility model has the advantages that
The utility model designs Spacer, MASK as a whole, and the thickness being superimposed using the two selects suitable substrate Material and thickness not only effectively prevent jig bending deformation, while MASK+Spacer whole design, and no stacking is seamless, thus Chip deviation phenomenon caused by avoiding because of assembling, each layer magnet position are evenly distributed on jig plate surrounding and are several with chip station On what centrosymmetric peripheral location, so that the magnetic picture radiated around each station is worked as, finally make the quartz of installation It wafer position accurate stable and will not shake.The quartz wafer film coating jig frame can solve special ultra-thin quartz wafer plated film, The design of thicker quartz wafer film coating jig frame can be applied to, jig buckling deformation electrode metallizations can be effectively prevent to control Tool.
Detailed description of the invention
It, below will be to use required in embodiment in order to illustrate more clearly of the technical solution of the utility model embodiment Attached drawing be briefly described, it should be understood that the following drawings illustrates only some embodiments of the utility model, therefore should not be by Regard the restriction to range as, for those of ordinary skill in the art, without creative efforts, may be used also To obtain other relevant attached drawings according to these attached drawings.
Fig. 1 is a kind of quartz wafer film coating jig frame embodiment plan view of the utility model;
Scheming (1A) is fixed substrate figure under a kind of quartz wafer film coating jig frame embodiment of the utility model;
Scheming (1B) is fixed substrate figure in a kind of quartz wafer film coating jig frame embodiment of the utility model;
Fig. 2 is a kind of quartz wafer film coating jig frame embodiment MASK+Spacer integrated frame plan view of the utility model;
Scheming (2A) is a kind of quartz wafer film coating jig frame embodiment MASK+Spacer part section amplification of the utility model Figure;
Fig. 3 is a kind of quartz wafer film coating jig frame embodiment MASK plan view of the utility model the utility model;
Scheming (3A) is a kind of quartz wafer film coating jig frame embodiment MASK partial enlarged view of the utility model.
Appended drawing reference indicates explanation in description above:
1, lower fixed substrate;2, magnet station slot;3, square wafer station slot;4, first positioning hole;5, second location hole; 6, rectangle blank window.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are in the premise for not making creative work Under every other embodiment obtained, fall within the protection scope of the utility model.
It should be noted that in the absence of conflict, the feature in the embodiments of the present invention and embodiment can To be combined with each other.
The utility model is described in further detail in the following with reference to the drawings and specific embodiments, but not as the utility model It limits.
As shown in Figure 1, according to problem of the existing technology, now providing one kind in the utility model preferred embodiment Quartz wafer film coating jig frame, comprising:
Upper fixed substrate, upper fixed substrate are rectangle, and upper fixed substrate is equipped with multiple square wafer station slots 3, multiple magnetic Ironworker position slot 2, each first positioning hole 4 in left and right and two rectangle blank windows 6;
Lower fixed substrate 1, lower fixed substrate is identical as upper fixed substrate shape, be correspondingly arranged in lower fixed substrate 1 with The identical multiple square wafer station slots 3 of upper fixed substrate, 2, two rectangle blank windows 6 of multiple magnet station slots, left and right each one A first positioning hole 4 and the pin to match with two first positioning holes 1;
MASK fixed frame corresponds to 3 position of square wafer station slot on the MASK fixed frame and is provided with multiple MASK stations Slot, MASK fixed frame are located at the lower part of lower fixed substrate 1;
MASK/Spacer one fixed frame, correspond on MASK/SPACER frame 3 position of square wafer station slot be provided with it is more The lower part of MASK fixed frame is arranged in a MASK/SPACER station slot, MASK/SPACER integrated frame;
The centre of upper fixed substrate and lower fixed substrate 1 is arranged in the MASK fixed frame and MASK/SPACER integrated frame.
In the utility model preferred embodiment, magnet position slot 2 is evenly distributed in fixed substrate and lower fixed substrate 1 Multiple square wafer station slots 3 be the symmetrical peripheral location of geometric center on.
In the utility model preferred embodiment, multiple magnet station slots 3 in upper fixed substrate and lower fixed substrate divide Not Guan Chuan upper fixed substrate and lower fixed substrate 1, be fixedly installed strong magnets respectively in each magnet station slot 2.
In the utility model preferred embodiment, MASK/SPACER integrated frame and MASK fixed frame correspond to multiple magnet works Position 2 position of slot is provided with multiple hollow out square grooves.
It further include two second location holes in the utility model preferred embodiment, two second location holes 5 are respectively set In the upper and lower sides middle position of upper fixed substrate and lower fixed substrate.
In the utility model preferred embodiment, two rectangle blank windows 6 of upper fixed substrate and lower 1 side of fixed substrate It is arranged side by side and is located at the two sides of first positioning hole 4.
In the utility model preferred embodiment, two first positioning holes 4 and two second location holes 5 extend through MASK Fixed frame and MASK/SPACER integrated frame.
In the utility model preferred embodiment, upper fixed substrate and lower fixed substrate 1 are that stainless steel material is manufactured.
Specifically, in the present embodiment, as shown in Figure 1, 2, 3, the lower fixation of the plated film HOLDER of strong magnets will first be installed additional Substrate is placed in bottom, then places MASK+Spacer integral layer by shop bolt, is then put into stone in square wafer station slot 3 English chip places upper layer MASK fixed frame then through shop bolt and installs the HOLDER fixed substrate of strong magnets additional, complete The exploitation of the ultra-thin quartz wafer coated electrode jig of cost.
Specifically, in the present embodiment, as shown in Figure 1, plated film HOLDER fixed substrate is formed by two-layer substrate hot pressing, packet The magnet position of the part containing shadow groove, square wafer station slot 3, two shop bolts in left and right, second location hole 5, two rectangle blank Window 6.Underlying substrate processing is as shown in figure (1), and wherein magnet station slot 2, is reinforcement magnetic absorption into hollow design, equably such as Jig plate surrounding is distributed in shown in figure (1A) and on the 3 symmetrical peripheral location of geometric center of square wafer station slot, so that often The magnetic picture radiated around a station is worked as, and is finally made the quartz wafer position accurate stable of installation and will not be shaken.
For top substrate layer as shown in figure (1B), design such as figure (1) with the station and location hole of position, provides peace for magnet arrangement It behave affectedly body.Wherein two shop bolts in left and right, be HOLDER MASK SPACER it is fixed when it is used;Second location hole 5, Ji Kewei Jig assemble when positioning is provided, can also for HOLDER MASK fixed frame dismantle when impetus is provided;Rectangle blank window 6, if MASK/SPACER fixed frame same position makes a check mark, and can pass through HOLDER fixed substrate after assembling and checks its mark, can be in quartz Crystal coating process can be checked easily and be confirmed whether to select correct jig.
Specifically, in the present embodiment, as shown in Fig. 2, be the utility model plated film frame MASK+Spacer plan view, and The key technology of this patent.If aforementioned film coating jig frame plays fixed quartz wafer, the electrode film forming of filming process is determined Whether quality (has skew, deviation, the flaws such as diplopia), restricts the success or failure of hyperfrequency quartz crystal research and development.Wherein open squares Hole location electrode MASK7 provides resonant tank parameter for quartz wafer, its shape, size can use proprietary MASK design Theoretical modeling designs, separately the installation electrode PAD7a machinable provided with contact conductor and subsequent dispensing for extraction electrode spy; Rectangular dash area Spacer 8 is that quartz wafer provides reliable placement square wafer station slot 3, is related to quartz oscillation The reliability and stability of electrical parameter, design shape, size and thickness are all designed in strict accordance with quartz wafer.This is practical Novel diagram is only used as a kind of drawing reference, in addition considers assembling design, therefore with HOLDER with the place design hollow out magnetic of position Ironworker position slot, positioning hole location.
20um quartz wafer ultra-thin for hyperfrequency, the ultra-thin Spacer that designing can manufacture are the weights of design, this is specially Sharp mentality of designing is to be integrally designed lower layer MASK and Spacer, using technology manufacture Spacer station slot is etched partially, is realized super The feasibility of thin jig manufacture.
Specifically, in the present embodiment, the stainless steel substrate of 40um thickness is selected, (2A) plated film MASK+Spacer is such as schemed and fixes Shown in frame part and its profile, it is desirable that the front etch of substrate goes out the step of the Spacer pattern of dash area, reverse side Corrode the cavity of MASK pattern out.Substrate first passes through appearance/size detection, and cleaning, baking pretreatment are to be used after qualification;Then Into two-sided half-etching critical process, as PCB circuit production process, need by pad pasting/mistake modeling drawing/photosensitive/development/ Etching/demoulding link carries out laser marking finally after dimensional gaughing is qualified.But because being two-sided drawing, tow sides Drawing must not deviation, therefore need to keep under strict control positioning accuracy in drawing plate-making;Again because two-sided etch simultaneously, strict control is needed to corrode Time avoids Spacer etching ladder too deep, the depth more than 20um.Its specific design is designed according to specific quartz wafer, this reality Use novel diagram only as a kind of drawing reference.
Specifically, in the present embodiment, as shown in figure 3, being the utility model plated film upper layer MASK plan view, in general stone Upper and lower MASK shape is required to be consistent with position in English crystal MASK design, therefore the upper layer MASK copy pattern in the design Fig. 3 Lower MASK design in 2.But in specific design can also need not be consistent, the utility model diagram is only used as a kind of drawing reference, In addition consider assembling design, therefore with HOLDER with the place design hollow out magnet station slot of position, positioning hole location.
The utility model has the beneficial effects that:
The utility model designs Spacer, MASK as a whole, and the thickness being superimposed using the two selects suitable substrate Material and thickness not only effectively prevent jig bending deformation, while MASK+Spacer whole design, and no stacking is seamless, thus Chip deviation phenomenon caused by avoiding because of assembling, each layer magnet position are evenly distributed on jig plate surrounding and are several with chip station On what centrosymmetric peripheral location, so that the magnetic picture radiated around each station is worked as, finally make the quartz of installation It wafer position accurate stable and will not shake.The quartz wafer film coating jig frame can solve special ultra-thin quartz wafer plated film, The design of thicker quartz wafer film coating jig frame can be applied to, jig buckling deformation electrode metallizations can be effectively prevent to control Tool.
The foregoing is merely the utility model preferred embodiment, be not intended to limit the embodiments of the present invention and Protection scope should can appreciate that all in the utility model specification and diagram to those skilled in the art Hold made equivalent replacement and obviously change obtained scheme, the protection model of the utility model should all be included in In enclosing.

Claims (8)

1. a kind of quartz wafer film coating jig integrated frame characterized by comprising
Upper fixed substrate, fixed substrate are rectangle, and fixed substrate is equipped with multiple square wafer station slots, multiple Magnet station slot, each first positioning hole in left and right and two rectangle blank windows;
Lower fixed substrate, the lower fixed substrate is identical as fixed substrate shape, and correspondence is set in the lower fixed substrate It is equipped with multiple square wafer station slots identical with fixed substrate, multiple magnet station slots, described in two Rectangle blank window, pin left and right each first positioning hole and matched with two first positioning holes;
MASK fixed frame corresponds to the square wafer station groove location on the MASK fixed frame and is provided with multiple MASK stations Slot, the MASK fixed frame are located at the lower part of the lower fixed substrate;
MASK/Spacer one fixed frame corresponds to the square wafer station groove location on the MASK/SPACER frame and is provided with The lower part of the MASK fixed frame is arranged in multiple MASK/SPACER station slots, the MASK/SPACER integrated frame;
The MASK fixed frame and the MASK/SPACER integrated frame are arranged in fixed substrate and the lower fixed substrate Centre.
2. a kind of quartz wafer film coating jig integrated frame according to claim 1, which is characterized in that the magnet station slot The multiple square wafer station slots being evenly distributed on fixed substrate and the lower fixed substrate are geometric center On symmetrical peripheral location.
3. a kind of quartz wafer film coating jig integrated frame according to claim 1 or 2, which is characterized in that fixed Multiple magnet station slots on substrate and the lower fixed substrate extend through fixed substrate and the lower fixation Substrate is fixedly installed strong magnets in each magnet station slot respectively.
4. a kind of quartz wafer film coating jig integrated frame according to claim 1, which is characterized in that the MASK/ SPACER integrated frame and the MASK fixed frame correspond to multiple magnet station groove locations and are provided with multiple hollow out square grooves.
5. a kind of quartz wafer film coating jig integrated frame according to claim 1, which is characterized in that further include two second Location hole, two second location holes are separately positioned among fixed substrate and the upper and lower sides of the lower fixed substrate Position.
6. a kind of quartz wafer film coating jig integrated frame according to claim 1, which is characterized in that fixed base and Two rectangle blank windows of the lower fixed substrate side are arranged side by side and are located at the two sides of the first positioning hole.
7. a kind of quartz wafer film coating jig integrated frame according to claim 5, which is characterized in that two described first fixed Position hole and two second location holes extend through the MASK fixed frame and the MASK/SPACER integrated frame.
8. a kind of quartz wafer film coating jig integrated frame according to claim 1, which is characterized in that fixed substrate It is that stainless steel material is manufactured with the lower fixed substrate.
CN201821828513.1U 2018-11-07 2018-11-07 A kind of quartz wafer film coating jig integrated frame Active CN209702849U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201821828513.1U CN209702849U (en) 2018-11-07 2018-11-07 A kind of quartz wafer film coating jig integrated frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201821828513.1U CN209702849U (en) 2018-11-07 2018-11-07 A kind of quartz wafer film coating jig integrated frame

Publications (1)

Publication Number Publication Date
CN209702849U true CN209702849U (en) 2019-11-29

Family

ID=68636149

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201821828513.1U Active CN209702849U (en) 2018-11-07 2018-11-07 A kind of quartz wafer film coating jig integrated frame

Country Status (1)

Country Link
CN (1) CN209702849U (en)

Similar Documents

Publication Publication Date Title
CN109136874A (en) A kind of ultra-thin quartz wafer film coating jig frame
CN109041425B (en) Method for manufacturing COF double-sided flexible substrate fine circuit and product thereof
TW201508866A (en) Process module, fabricating method thereof and substrate processing method using the process module
CN113891557B (en) Printed circuit board manufacturing method
CN111372382B (en) Primary and secondary board pressing alignment design process method of PCB
CN109348637A (en) A kind of film aligning method for preventing negative film plate circuit etching not clean
CN110515485B (en) Method for preparing large-size touch screen functional sheet by using small screen printing plate
CN209702849U (en) A kind of quartz wafer film coating jig integrated frame
CN109402559B (en) Mask plate and manufacturing method thereof, evaporation device and display device
CN111465168A (en) Method for improving deviation of pressed buried copper block
CN110708873A (en) Manufacturing method for realizing positioning of embedded copper block
CN105282985A (en) Circuit board single-sided local gold plating method and circuit board
JP2011129272A (en) Double-sided transparent conductive film sheet and method of manufacturing the same
CN109457230A (en) A kind of quartz wafer film coating jig integrated frame
CN102638236A (en) Method of manufacturing piezoelectric vibrating reed, piezoelectric vibrator, oscillator, electronic apparatus, and radio timepiece
CN110881245A (en) Circuit board and manufacturing method thereof
JP5426567B2 (en) Printed circuit board, manufacturing method thereof, and panel for manufacturing printed circuit board
CN211713227U (en) Coating jig frame of ultra-thin quartz wafer
CN112188732A (en) Manufacturing method of medical instrument detection plate
CN209555361U (en) A kind of ultra-thin quartz wafer film coating jig frame
CN110904491A (en) Coating jig frame of ultra-thin quartz wafer
US20120204420A1 (en) Method for manufacturing wiring board
KR101365006B1 (en) Touch screen and preparing method for the same
CN103203976B (en) A kind of printing Three-dimensional mask plate
CN117769139A (en) Manufacturing method of printed circuit board

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant
CP01 Change in the name or title of a patent holder

Address after: No. 2880, Moganshan Road, Liangzhu street, Yuhang District, Hangzhou, Zhejiang 310000

Patentee after: Hongxing Technology (Group) Co.,Ltd.

Address before: No. 2880, Moganshan Road, Liangzhu street, Yuhang District, Hangzhou, Zhejiang 310000

Patentee before: HANGZHOU HOSONIC ELECTRONICS Co.,Ltd.

CP01 Change in the name or title of a patent holder