CN110699662A

CN110699662A - Film coating method and film layer thereof

Info

Publication number: CN110699662A
Application number: CN201910997632.2A
Authority: CN
Inventors: 宗坚; 彭吉; 代莹静
Original assignee: Jiangsu Favored Nanotechnology Co Ltd
Current assignee: Jiangsu Favored Nanotechnology Co Ltd
Priority date: 2019-10-21
Filing date: 2019-10-21
Publication date: 2020-01-17
Anticipated expiration: 2039-10-21
Also published as: CN110699662B

Abstract

The invention provides a film coating method and a film layer thereof, wherein the film coating method comprises the following steps: the coating method can meet the requirement of preparing thinner film layers on some parts of the surface of the substrate or the surface of the part, and preparing thicker film layers on other parts of the surface of the substrate or the surface of the part, thereby meeting the requirement of coating film layers of partial electronic elements of the substrate, such as circuit interface elements and the like, and ensuring the data transmission performance.

Description

Film coating method and film layer thereof

Technical Field

The invention relates to the field of film coating, and further relates to a film coating method and a film layer thereof.

Background

With the development of electronic products, performance indexes of the electronic products, such as falling frequency resistance, scratch resistance, wear resistance, heat dissipation, waterproofness, corrosion resistance and the like, are important factors for gaining advantages in fierce market competition. The surface modification of electronic products, especially the formation of a very thin protective coating on the surface of the products by using a chemical vapor deposition process, is an important means for improving the performances. For example, a waterproof film or a waterproof nano-film layer is plated on the surface of the electronic device through a vacuum coating process, so that the waterproof performance and the waterproof performance of the electronic product can be effectively improved. When the waterproof electronic product after the film coating treatment is immersed in water, the waterproof film or the waterproof nano film layer can effectively prevent a circuit or an external interface of the electronic product, such as a USB port, a charging port and the like, from being short-circuited due to water inflow, and prevent moisture from corroding a circuit board or an electronic element of the waterproof electronic product.

However, when some electronic components On The circuit board, such as circuit interface components such as an adapter and a USB socket, are subjected to film coating protection, if The waterproof film plated On The surface of The electronic components is thick, The film layer is generally an insulating polymer material, which greatly reduces important functions of The circuit interface components, such as data transmission, electronic signal transmission, and The like, and causes The OTG (On-The-Go) test failure. Therefore, the upper limit of the thickness of the film layer on the surface of the devices is strict. The thickness of the waterproof film on the surfaces of the adapter and the USB socket on the same circuit board is generally smaller than that of the film layer on other parts of the surface of the mainboard of the circuit board.

At present, in order to achieve the effect that different areas have different film thicknesses, the technical means adopted is mainly to carry out masking pretreatment such as pasting paper or coating resin glue, peelable glue and the like on circuit interface elements or other special areas, and the film coating process is carried out twice, 1) after the adapter part is masked, the first film coating is carried out, the thickness of the coated film is larger, and the requirement of key protection devices on a mainboard is met; 2) and removing the shielding, and performing secondary film coating to meet the requirement on the conductivity of the circuit interface element. The masking and the deblocking are often performed manually, which leads to an increase in labor cost and an increase in coating time, which greatly increases the economic cost of the coating process and reduces the mass productivity.

Disclosure of Invention

One advantage of the present invention is to provide a film coating method and a film layer thereof, wherein the film coating method can meet the requirement of preparing a thin film layer on some parts of the surface of a substrate or on the surface of a component, and preparing a thick film layer on other parts of the surface of the substrate or on the surface of the component, so as to meet the requirement of coating a thin film layer on part of electronic components of the substrate, such as circuit interface components, and the like, and ensure data transmission performance.

Another advantage of the present invention is to provide a plating method and a film layer thereof, in which the thickness of a film prepared on the surface of the circuit interface element is within a predetermined range so as not to affect the electrical connection performance of the circuit interface element.

Another advantage of the present invention is to provide a coating method and a coating layer thereof, wherein the coating method can prepare a thin coating layer on some portions or parts of the surface of the substrate and a thick coating layer on other portions or parts by using a coating jig to perform a coating process at one time.

Another advantage of the present invention is to provide a coating method and a coating layer thereof, in which the coating method can prepare a thin coating layer on some portions of the surface of the substrate or the surface of a part and prepare a thick coating layer on other portions or the surface of the part by two or more coating processes.

Another advantage of the present invention is to provide a coating method and a coating layer thereof, wherein the thickness of the coating layer is different so as to be adapted to the surface of each component of the substrate having different requirements for the thickness of the coating layer.

Another advantage of the present invention is to provide a coating method and a coating layer thereof, wherein the coating method does not require the use of stickers or other auxiliary articles such as resin adhesives, and wherein the coating jig can be recycled, thereby saving costs and requiring less skill on the operation of workers.

Another advantage of the present invention is to provide a coating method and a coating layer thereof, wherein the coating method can meet the requirements of coating a plurality of electronic components on the surface of a substrate with different thicknesses by one coating, thereby reducing the number of times of coating, improving the coating efficiency, and prolonging the service life of the coating equipment.

Another advantage of the present invention is to provide a coating method and a coating layer thereof, wherein the coating method can use the coating fixture to shield a plurality of electronic components or areas on the surface of the substrate that do not need coating at one time and complete coating, so as to meet the coating requirement of the substrate, effectively reduce the coating steps, and improve the coating efficiency.

Another advantage of the present invention is to provide a coating method and a coating layer thereof, wherein the coating method can coat the coating layer on the surfaces of a plurality of substrates or electronic components to be coated in a large scale, thereby realizing mass production.

Another advantage of the present invention is to provide a coating method and a coating layer thereof, wherein the coating method can ensure that the shape and specification of the coating layer on the surfaces of a plurality of substrates are consistent, and meet the requirement of standardized mass production.

Another advantage of the present invention is to provide a coating method and a coating layer thereof, wherein the coating method can quickly position and mount the substrate, and has the advantages of simple operation, unified standard and improved mounting efficiency.

Another advantage of the present invention is to provide a coating method and a coating layer thereof, wherein the coating method can prevent the substrate from being deformed or damaged by external impact.

Another advantage of the present invention is to provide a coating method and a coating layer thereof, wherein the coating method can maintain the relative stability of the substrate during coating, prevent the substrate from shifting or shaking during coating, and prevent the substrate from being damaged, thereby ensuring the reliability of coating.

Another advantage of the present invention is to provide a coating method and a coating layer thereof, wherein the coating method can simultaneously coat a plurality of substrates, thereby increasing the coating efficiency.

According to one aspect of the present invention, the present invention further provides a coating method comprising the steps of:

the method comprises the steps of forming a thicker film layer on a first part of the surface of a substrate, and forming at least one thinner film layer on a second part of the surface of the substrate, wherein the thickness of the thicker film layer is larger than that of the thinner film layer.

In some embodiments, a coating gap is provided between at least one suspended shield of a coating fixture and the second portion of the substrate, wherein the substrate is mounted to the coating fixture, thereby forming the thicker film layer and the thinner film layer simultaneously.

In some embodiments, the thickness of the thinner film layer is no greater than 250 nm.

In some embodiments, further comprising the step of: and forming at least one uncoated area on the position of the surface of the substrate, which is shielded by the coating clamp.

In some embodiments, the thicker film layer is formed from a first film layer, wherein the thicker film layer is formed from the first film layer and a second film layer.

In some embodiments, there is included the steps of: A. forming the second film layer on the surface of the first part of the substrate by primary coating, wherein the surface of the second part of the substrate is shielded by a coating clamp and cannot be coated; and B, simultaneously forming the first film layer on the surface of the first film layer on the substrate and the surface of the second part through coating again.

In some embodiments, there is included the steps of: a1, simultaneously forming the first film layer on the surface of the first part and the surface of the second part of the substrate through primary coating; and B, forming the second film layer on the first film layer on the surface of the first part of the base material by coating again, wherein the surface of the second part of the base material is shielded by a coating clamp and cannot be coated.

In some embodiments, the method comprises preparing a film on a surface of a substrate by a coating apparatus, wherein the method comprises the following steps: a. mounting the substrate on the coating clamp and placing the substrate in a coating cavity of the coating equipment; b. performing negative pressure generation operation on the coating cavity; and c, preparing a film layer on the surface of the substrate in a chemical vapor deposition mode.

In some embodiments, the coating fixture has a plurality of mounting cavities, wherein a plurality of substrates are respectively mounted in the mounting cavities.

In some embodiments, the coating fixture includes a fixture body and at least one shielding member, wherein the shielding member is disposed on the fixture body, wherein the fixture body has at least one mounting cavity for mounting at least one substrate, wherein the shielding member corresponds to a position of the substrate surface to be shielded, and after mounting, the shielding member correspondingly shields the position of the substrate surface to be shielded.

In some embodiments, the clamp body comprises a first body and a second body, wherein the first body and the second body are openably mounted together and form the mounting cavity therebetween, wherein the shielding member is disposed on an inner wall of the mounting cavity, wherein the clamp body has at least one exposed hole, wherein the exposed hole is communicated with the mounting cavity.

In some embodiments, the shielding member comprises at least a first shielding member and at least a second shielding member, wherein the first shielding member is disposed on the first body for shielding a position to be shielded on one side of the substrate, and the second shielding member is disposed on the second body for shielding a position to be shielded on the other side of the substrate.

In some embodiments, the shielding member includes at least a first positioning portion, wherein the first positioning portion corresponds to a position of at least a second positioning portion of the substrate, and when the shielding member is installed, the first positioning portion and the second positioning portion are fixed in position, so that the shielding member properly and cooperatively shields the position of the substrate to be shielded.

In some embodiments, the clamp main body includes at least a third positioning portion, and the shielding member further includes at least a fourth positioning portion, where the third positioning portion and the fourth positioning portion correspond in position, and when the clamp main body and the shielding member are installed, the third positioning portion and the fourth positioning portion are fixed in position, so that the clamp main body and the shielding member are installed in a positioning manner.

In some embodiments, wherein the filming fixture further includes a set of securing members, wherein the securing members are fastenably mounted to the fixture body and movable between a secured state in which the height of the mounting cavity is reduced, and a disassembled state in which the force is removed, wherein the mounting cavity can be opened to enable the substrate to be disassembled.

In some embodiments, wherein the second component is a circuit interface element of an electronic product.

According to another aspect of the present invention, there is further provided a film, wherein the film forms a substrate and includes a thicker film formed on a surface of a first component of the substrate and a thinner film formed on a surface of a second component of the substrate, wherein the thickness of the thicker film is greater than the thickness of the thinner film.

In some embodiments, the film layer has at least one film layer hole, wherein the film layer hole is located at a position of the substrate where the film coating is not needed to form a film-free region.

In some embodiments, wherein the thicker film layer and the thinner film layer are integrally formed.

In some embodiments, the film comprises a first film and a second film, wherein the portion of the first film stacked with the second film forms the thicker film, and wherein the portion of the first film not stacked with the second film forms the thinner film.

In some embodiments, wherein the film layer is selected from: the coating comprises one or more of an organic silicon nano protective film layer, an organic silicon hard nano protective film layer, a composite structure high-insulation hard nano protective film layer, a high-insulation nano protective film layer with a modulation structure, a plasma polymerization film layer, a gradient increasing structure liquid-proof film layer, a gradient decreasing structure liquid-proof film layer, a film layer with controllable crosslinking degree, a waterproof click-through resistant film layer, a low-adhesion corrosion resistant film layer, a liquid-proof film layer with a multilayer structure, a polyurethane nano film layer, an acrylamide nano film layer, an anti-static liquid-proof nano film layer, an epoxy nano film layer, a high-transparency low-color-difference nano film layer, a high-adhesion aging resistant nano film layer, a silicon-containing copolymer nano film layer and a polyimide nano film layer.

Drawings

Fig. 1 is a schematic structural view of a coating method according to a preferred embodiment of the present invention for preparing a film by a coating apparatus.

Fig. 2 is a schematic structural view of a coating jig according to the above preferred embodiment of the present invention.

Fig. 3 is an exploded view of the coating jig according to the above preferred embodiment of the present invention.

Fig. 4 is a partial schematic cross-sectional view of a film layer prepared by the plating method based on the plating jig according to the above preferred embodiment of the invention.

Fig. 5 is a schematic cross-sectional view of a film hole of a film layer prepared by the plating method based on the plating jig according to the above preferred embodiment of the present invention.

Fig. 6 is a schematic plan view of a film hole of a film prepared by the plating method based on the plating jig according to the above preferred embodiment of the present invention.

Fig. 7 is a partial schematic cross-sectional view of a film layer prepared on the surface of a first substrate by the coating method based on the coating jig according to the above preferred embodiment of the invention.

Fig. 8 is a partial schematic cross-sectional view illustrating a film layer prepared on the surface of a second substrate by the plating method based on the plating jig according to the above preferred embodiment of the present invention.

Fig. 9 is a partial schematic cross-sectional view illustrating a thin film layer formed on a surface of a substrate by the plating method using the plating jig according to the above preferred embodiment of the present invention.

Detailed Description

The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art. The basic principles of the invention, as defined in the following description, may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the invention.

It will be understood by those skilled in the art that in the present disclosure, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for ease of description and simplicity of description, and do not indicate or imply that the referenced devices or components must be in a particular orientation, constructed and operated in a particular orientation, and thus the above terms are not to be construed as limiting the present invention.

It is understood that the terms "a" and "an" should be interpreted as meaning that a number of one element or element is one in one embodiment, while a number of other elements is one in another embodiment, and the terms "a" and "an" should not be interpreted as limiting the number.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

Fig. 1 to 9 show a coating method according to a preferred embodiment of the present invention, wherein the coating method is applied to at least one coating apparatus 500, wherein the coating method is capable of satisfying the requirement of preparing a thinner film layer on some parts or components of the surface of at least one substrate 600, and preparing a thicker film layer on other parts or components, so as to satisfy the requirement of coating a thinner film layer on some electronic components of the substrate, such as circuit interface components and the like.

In this embodiment, the coating method utilizes at least one coating fixture 100 to prepare a thin film on some portions of the surface of the substrate or on the surface of the component, and prepare a thick film on other portions of the surface of the substrate or on the surface of the component. That is, in the coating process, the substrate 600 is mounted on the coating jig 100 and placed in the coating apparatus 500 for coating, so that coating layers having different thicknesses are prepared at different portions of the substrate 600 through one or more coating processes. In other words, the thickness of the film layer prepared on the surface of the substrate 600 by the coating method is different, so as to be adaptively formed on the surface of each component of the substrate 600 having different requirements for the thickness of the film layer, for example, a thin film layer is prepared on the surface of a circuit interface element of the substrate 600, such as an adapter, a USB socket, and the like, wherein the thin film layer, such as a waterproof film, not only achieves the waterproof effect of the circuit interface element, but also does not affect the data transmission performance of the circuit interface element due to the thin thickness of the thin film layer.

As shown in fig. 2 and 3, preferably, the coating jig 100 includes a jig main body 10 and at least one shielding member 20, wherein the jig main body 10 has at least one open hole 101 and at least one mounting cavity 102, wherein the exposed hole 101 communicates with the installation cavity 102, wherein the shielding member 20 is provided to the jig main body 10, wherein the base material 600 is fixedly held in the mounting cavity 102 of the jig main body 10, wherein the substrate 600 has at least one electronic component 610, wherein the shielding member 20 just correspondingly shields the electronic component 610 or the region of the surface of the substrate 600 without coating or partial coating, the exposed hole 101 is communicated with the outside, wherein a part of the surface of the substrate 600 requiring a coating film or the electronic component 610 is exposed to the exposed hole 101 to be capable of receiving a coating film, thereby satisfying the requirement of the substrate 600 for coating the film. It can be seen that the worker does not need to additionally use other auxiliary articles such as stickers or resin adhesives to cover the position of the substrate 600 where the coating is needed, wherein the coating fixture 100 can be recycled, thereby saving the cost and requiring less operation skill for the worker.

That is, before coating, the substrate 600 is mounted in the mounting cavity 102 of the coating jig 100, and the position of the substrate 600 where coating is not required is shielded by the shielding member 20 of the coating jig 100, while the position of the substrate 600 where coating is required is exposed, i.e., not shielded, through the exposed hole 101. During coating, a worker needs to put the substrate 600 mounted on the coating fixture 100 into a coating cavity 510 of the coating apparatus 500 to perform coating. After coating, the substrate 600 can be detached from the mounting cavity 102 of the coating fixture 100, wherein the unmasked electronic components or location surfaces of the substrate 600 are coated with the film layer 700, wherein the masked electronic components or location surfaces of the substrate 600 are not coated.

It should be noted that a plurality of the substrates 600 may be represented as a first substrate 601, a second substrate 602, and a third substrate, and correspondingly, a plurality of the film layers 700 respectively plated on each of the substrates 600 may be represented as a first film layer 701, a second film layer 702, and a third film layer, respectively, wherein the shape or type of each of the substrates 600 may be the same or different, and wherein the shape, thickness, or material of each of the film layers 700 may be the same or different, which is not limited herein.

As shown in fig. 7, specifically, the plating method includes the steps of:

s10, forming a first film 701 on an electronic component or a position of the surface of the first substrate 601 not shielded by the coating fixture 100 by the first substrate 601 being mounted on the coating fixture 100 and being placed into the coating cavity 510 of the coating apparatus 500 for coating, and forming at least a first film-free region 710 on a position of the surface of the first substrate 601 shielded by the coating fixture 100, wherein the electronic component or the position of the surface of the first substrate 601 shielded by the coating fixture 100 does not form the first film 701; and

s20, the first substrate 601 is detached from the coating fixture 100, and the electronic components on the surface of the first substrate 601 without the first film 701 are exposed or located in the first non-film region 710, so as to ensure the normal operation performance of the electronic components on the surface of the first substrate 601, for example, the electronic components such as the antenna dome on the surface of the substrate 600, the optical devices such as the distance sensor, the camera module, or the acoustic device, are not coated on the film 700, and thus the normal operation performance of each electronic component.

It is understood that the coating apparatus 500 is a vacuum coating apparatus, wherein the coating apparatus 500 provides the coating chamber 510 with a higher vacuum degree, i.e. the coating chamber 510 is not an absolute vacuum, for example, the vacuum degree of the coating chamber 510 is approximately 0.1 to 20Pa, and the coating fixture 100 and the substrate 600 are put into the coating chamber 510 together after being assembled to complete coating. Optionally, the coating type of the coating apparatus 500 may be vacuum ion evaporation, magnetron sputtering, MBE molecular beam epitaxy, PLD laser sputtering deposition, physical vapor deposition, or plasma chemical vapor deposition, and the working principle thereof is not described herein again. Optionally, the film layer 700 includes a film, a thin film, a nano-film layer, or the like, which is plated on the surface of the substrate 600. Alternatively, the film 700 may be implemented as an organic silicon nano-protection film layer, an organic silicon hard nano-protection film layer, a composite structure high insulation hard nano-protection film layer, a high insulation nano-protection film layer with a modulated structure, a plasma polymerization film layer, a gradient increasing structure liquid-proof film layer, a gradient decreasing structure liquid-proof film layer, a film layer with controllable cross-linking degree, a waterproof click-through resistant film layer, a low adhesion corrosion resistant film layer, a liquid-proof film layer with a multi-layer structure, a polyurethane nano-film layer, an acrylamide nano-film layer, an antistatic liquid-proof nano-film layer, an epoxy nano-film layer, a high transparent low color difference nano-film layer, a high adhesion aging resistant nano-film layer, a silicon-containing copolymer nano-film layer, a polyimide nano-. Accordingly, the coating apparatus 500 may be implemented to coat the surface of the substrate 600 with any one or more of the above-described films or film layers, etc., to improve the surface properties of the substrate 600, without being limited thereto.

In the coating process, after the substrate 600 and the coating fixture 100 are assembled and then placed in the coating cavity 510, negative pressure generation operation such as vacuum pumping is performed on the coating cavity 510 of the coating apparatus 500, and then a reaction raw material or an auxiliary raw material required for a film to be prepared is introduced into the coating cavity 510, a radio frequency and/or high voltage pulse power supply is used to generate plasma to activate a chemical vapor deposition reaction, so as to prepare the film 700 on an electronic component or a position on the surface of the substrate 600 that is not shielded by the coating fixture 100. For example, the parameters of the coating device 500 during the coating process are as follows: air intake amount: he: 10-200sccm, perfluorooctyl ethyl acrylate: 10-300 sccm; the vacuum degree of the coating cavity 510 before coating is as follows: less than 10 Pa; the vacuum degree of the coating cavity 510 during coating is as follows: 0.1-20 Pa; coating with a radio frequency pulse power supply, outputting voltage: 10-300V, duty ratio: 5-100%, frequency: 20-360 KHz; coating time: 0.1 to 5hrs, which is only an example and not a limitation to the present invention.

By way of example, the substrate 600 is implemented as a PCB, wherein the substrate 600 is a plate-shaped structure, wherein the electronic component 610 is disposed on the surface of the substrate 600, wherein the coating fixture 100 is adapted to the substrate 600, that is, the shape and size of the substrate 600 are matched with the shape and size of the mounting cavity 102, so that the substrate 600 is just fittingly and fixedly mounted in the mounting cavity 102 of the coating fixture 100, and the portion of the surface of the substrate 600 that does not need coating or the electronic component is shielded by the shielding member 20 or the fixture body 10, while the portion of the surface of the substrate 600 that needs coating or the electronic component is exposed to the exposed hole 101 to meet the coating requirement.

It will be understood by those skilled in the art that the substrate 600 may also be implemented as other shaped and structured products to be coated, such as mobile phones, electronic devices, housings of electronic devices, keyboard films, or other types of products to be coated, without limitation. Correspondingly, the shape and structure of the coating fixture 100 can be just matched with the shape and structure of the substrate 600, so that the substrate 600 can be just fixedly mounted in the mounting cavity 102 of the coating fixture 100, and the shielding member 20 shields the part to be coated, thereby meeting the coating requirement. That is, the coating jig 100 can be customized according to the structural sizes of different types of the base material 600, so as to meet market demands.

In this embodiment, the fixture body 10 and the shielding member 20 of the coating fixture 10 can be circularly detached and installed for multiple times, so that a plurality of substrates 600 can be circularly installed on the coating fixture 10, a unified coating is realized, and a new sticker is not required to be replaced for each coating, which saves cost, and the shape and specification of the film 700 coated on the surface of each substrate 600 are basically kept unified, thereby improving production efficiency, satisfying the requirement of standardized mass production, and having low cost, high durability and cyclic utilization.

As shown in fig. 8, further, the plating method further includes the steps of:

s30, forming the second film layer 702 on the electronic component or position on the surface of the second substrate 602 not shielded by the coating fixture 100 and forming at least one second film-free area 720 on the electronic component or position on the surface of the second substrate 602 shielded by the coating fixture 100 by mounting the second substrate 602 on the coating fixture 100 and placing the second substrate 602 into the coating chamber 510 of the coating apparatus 500 for coating, wherein the second film layer 702 is not formed on the electronic component or position on the surface of the second substrate 602 shielded by the coating fixture 100; and

s40, by detaching the second substrate 602 from the coating fixture 100, the electronic component on the surface of the second substrate 602 without the second film layer 702 is exposed or located in the second film-free area 702, so as to ensure the normal operation performance of the electronic component on the second substrate 602.

It is understood that the first substrate and the second substrate are respectively and sequentially mounted on the same coating fixture 100 and then placed into the coating chamber 510 of the coating apparatus 500 for coating, wherein the first substrate and the second substrate are substantially identical in shape and size, that is, the first substrate and the second substrate are respectively and adaptively mounted on the coating fixture 100, and the positions of the first substrate and the second substrate, which are respectively shielded by the coating fixture 100, are substantially identical, so that the first substrate and the second substrate can be coated with the film 700 at the same position during coating. That is, the shape and size of the first film layer 701 substantially correspond to the shape and size of the second film layer 702, and accordingly, the shape, size, number and position of the first film-free region 701 and the second film-free region 702 are substantially the same.

It is noted that the materials or thicknesses of the first and second film layers may be the same or different. That is, in the coating process, when the kind or amount of the material filled in the coating chamber 510 of the coating apparatus 500 is different or the coating time, voltage or other parameters of the coating apparatus 500 are different, the material or thickness of the first film layer formed on the first substrate surface is different from that of the second film layer formed on the second substrate surface. When the kinds and amounts of the materials, the coating time, and other parameters filled in the coating chamber 510 of the coating apparatus 500 are the same, the materials and thicknesses of the first and second films can be substantially the same, thereby achieving uniformity.

In this embodiment, the substrate 600 (the first substrate 601 or the second substrate 602) has at least one no-coating position 603 and at least one first component 604, wherein the no-coating position 603 includes no-coating electronic components on the surface of the substrate 600, such as an antenna dome, an optical device, such as a distance sensor, a camera module, or an acoustic device, and the first component 604 includes a substrate surface of the substrate 600, an electric circuit, and electronic components capable of being coated.

Accordingly, when the substrate 600 is mounted to the plating jig 100, the no-plating position 603 is shielded by the jig main body 10 or the shield 20, in which the first part 604 is exposed to the exposure hole 101 without being shielded by the plating jig 100.

Specifically, in the step S10, the first film 701 is formed on the first part 604 of the surface of the first substrate 601, and in the step S20, the first film-free region 710 is formed at the plating-unnecessary position 603 of the first substrate 601. Further, the first film-free region 710 includes, but is not limited to, a hole-type or a groove-type region to adapt to the shape or structure of the non-coating position 603 of the first substrate 600.

Accordingly, in the step S30, the second film layer 702 is formed on the first part 604 of the surface of the second substrate 602, and in the step S40, the second film-free area 720 is formed at the position 603 of the second substrate 602 where no film is required.

In the process of coating, since the first film-free region 710 and the second film-free region 720 are respectively formed by the position 603 of the substrate 600 where coating is not needed being blocked by the shielding member 20 of the coating jig 100 and the film 700 cannot be coated, each of the film-free regions (the first film-free region 710 or the second film-free region 720) corresponds to the shape or number of the shielding surface of the corresponding shielding member 20, wherein the number or shape of the plurality of first film-free regions 710 or the plurality of second film-free regions 720 respectively corresponds to the number or shape of the plurality of positions 603 where coating is not needed.

For example, if the shielding surface of the shielding member 20 is circular, the shape of the film-free layer region (the first film-free layer region 710 or the second film-free layer region 720) is also circular with the same size. Or the shape of the shielding surface of the shielding member 20 may also be square, triangle, quadrangle, polygon, irregular shape, etc., wherein the film-free layer region (the first film-free layer region 710 or the second film-free layer region 720) is correspondingly the same size as the shape of the shielding surface of the shielding member 20.

As shown in fig. 5 and 6, in other words, the film 700 has at least one film hole 730, wherein the film 700 is plated on the first part 604 of the substrate 600, wherein the film hole 730 is located at the non-plating position 603 of the substrate 600 and forms the film-free region (the first film-free region 710 and the second film-free region 720). Optionally, the membrane layer holes 730 include, but are not limited to, circular holes such as circular holes, square holes, irregular holes, etc., or edge holes such as semi-circular holes, arc holes, semi-circular holes, etc., wherein the periphery of the circular holes are completely surrounded by the membrane layer 700, wherein the edge holes are located at the edge of the membrane layer 700.

When the film 700 is coated on the first part 604 of the substrate 600, the coating-free position 603 of the substrate 600 is located at the bottom of the film hole 730 and forms a groove structure with the film hole 730. Of course, since the thickness of the film layer 700 is nano-scaled and the depth of the film layer holes 730 is nano-scaled, the channel-type structure is generally substantially imperceptible to the touch by the human hand.

As shown in fig. 4 to 9, further, the preferred embodiment further provides the film layer 700 prepared by the coating method, wherein the film layer 700 has the film layer hole 730, wherein the film layer 700 is coated on the surface of the substrate 600, wherein the film layer hole 730 is located at the non-coating position 603 of the substrate 600 and forms the film-free region (the first film-free region 710 and the second film-free region 720). Preferably, the film 700 includes at least one thicker film 7012 formed on the surface of the first component 604 of the substrate 600 and at least one thinner film 7011 formed on the surface of the second component 605 of the substrate 600, wherein the thickness of the thicker film 7012 is greater than the thickness of the thinner film 7011.

As shown in fig. 3, more specifically, the fixture body 10 includes a first body 11 and a second body 12, wherein the first body 11 and the second body 12 are openably mounted together, such as a snap-fit connection, and the mounting cavity 102 is formed between the first body 11 and the second body 12 to facilitate mounting of the substrate 600. Preferably, the exposed hole 101 is formed on both sides of the clamp body 10, and specifically, the exposed hole 101 includes at least one first exposed hole 1011 and at least one second exposed hole 1012, wherein the first exposed hole 1011 is formed on the first body 11 and is communicated with the mounting cavity 102, and the second exposed hole 1012 is formed on the second body 12 and is communicated with the mounting cavity 102. Therefore, after the substrate 600 is mounted in the mounting cavity 102 of the fixture body 10, one side of the substrate 600 is exposed to the first exposing hole 1011, and the other side of the substrate 600 is exposed to the second exposing hole 1012, so that both sides of the substrate 600 can be coated with a film or coated with a film at the same time.

Accordingly, the shielding member 20 includes at least a first shielding member 21 and at least a second shielding member 22, wherein the first shielding member 21 is disposed between the first body 11 and one side of the substrate 600 and is used for correspondingly shielding the electronic component 610 without film plating on the side surface of the substrate 600, and the second shielding member 22 is disposed between the second body 12 and the other side of the substrate 600 and is used for correspondingly shielding the electronic component 610 without film plating on the other side surface of the substrate 600, so as to satisfy the requirement of simultaneous film plating on both sides of the substrate 600 and ensure that the electronic component 610 without film plating on both side surfaces of the substrate 600 cannot be plated with the film or film layer.

It should be noted that the first shielding member 21 and the second shielding member 22 can cooperatively shield the same electronic component 610 on the surface of the substrate 600, such as the electronic component 610 located at the side of the substrate 600, but not limited thereto.

Alternatively, the fixture body 10 may be provided with the exposure hole 101 only on one side thereof, so that the corresponding side of the substrate 600 can be coated, which is suitable for the case where the substrate 600 is coated on only one side. Or after one side of the base material 600 is coated, the base material 600 is reversely mounted in the mounting cavity 102 of the fixture body 10, and coating is performed again, so that the other side of the base material 600 is also coated, thereby meeting the requirement that both sides of the base material 600 are coated.

Alternatively, when only one side surface of the substrate 600 has the electronic component 600 without a plating film, the first shielding member 21 is implemented as the electronic component 610 without a plating film, which is disposed between the first body 11 and the side of the substrate 600 and shields the side surface of the substrate 600, and the second shielding member 22 may not be disposed between the second body 11 and the other side of the substrate 600, or the second shielding member 22 does not shield a portion of the other side surface of the substrate 600 or an electronic component which needs to be plated, thereby implementing a plating film requirement of the substrate 600.

Preferably, the first body 11 and the second body 12 of the clamp body 10 are made of a hard material, such as a metal material, wherein the first body 11 and the second body 12 have a relatively strong hardness and are not easily bent or deformed, wherein the first body 11 and the second body 12 are mutually fastened and fixed in a snap fit manner, wherein the base material 600 is received in the mounting cavity 102 between the first body 11 and the second body 12, so as to protect the base material 600 from bending damage, deformation or damage of the base material 600 under external impact, and the like.

Preferably, the first shielding member 21 and the second shielding member 22 of the shielding member 20 are made of a flexible material, such as a silicone material, wherein the first shielding member 21 and the second shielding member 22 are respectively disposed on two sides of the substrate 600 and clamped and fixed by the first body 11 and the second body 12 of the fixture body 10, so as to play a role of buffering and protecting the substrate 600, and simultaneously maintain the relative stability of the substrate 600 during coating, prevent the substrate 600 from shifting or shaking relatively during coating, and be not easy to damage the substrate 600, so as to ensure the reliability of coating. That is, the first shielding member 21 further plays a role of buffering protection between the first body 11 and the substrate 600, and the second shielding member 22 further plays a role of buffering protection between the second body 12 and the substrate 600, that is, the first shielding member 21 and the second shielding member 22 play a role of shielding both sides of the substrate 600 and simultaneously protect the substrate 600 from being damaged.

It should be noted that the first shield 21 and the second shield 22 of the shield 20 are respectively flatly attached to the surface of the substrate 600, wherein the first body 11 of the fixture body 10 is flatly attached to the first shield 21, and wherein the second body 12 is flatly attached to the second shield 22, so as to ensure that the substrate 600 is uniformly stressed, prevent stress concentration, and prevent the substrate 600 from bending or damaging, etc. Further, the surfaces of the two sides of the fixture main body 10 are flat, so that the fixture main body 10 can be kept stable when being placed in the vacuum coating cavity of the coating equipment, and meanwhile, the base material 600 is ensured to be stable and not easy to shake to affect coating and the like.

Therefore, the fixture body 10 and the shielding member 20 of the coating fixture 10 can be disassembled and assembled repeatedly, so that a plurality of substrates 600 can be assembled on the coating fixture 10 repeatedly, coating can be realized without replacing a new sticker for coating each time, cost is saved, performance of the electronic component 610 is not affected after coating, production efficiency is improved, mass production requirements are met, and meanwhile, the cost is low, the durability is high, and the recycling performance is good.

As shown in fig. 4 and fig. 9, the surface of the substrate 600 further comprises at least one second component 605, wherein the second component 605 comprises at least one electronic component to be plated with a thin film, such as a circuit interface component, e.g., an adapter, a USB interface, etc. Further, the film 700 (the first film 701 or the second film 702) includes the thinner film 7011 and the thicker film 7012 (taking the first film 701 as an example) integrally connected, wherein the thinner film 7011 is plated on the second part 605 of the substrate 600. In other words, the thickness of the thinner film layer 7011 is less than the thickness of the thicker film layer 7012 of the first film layer 701, i.e., the thickness of the thinner film layer 7011 on the surface of the second component 605 is less than the thickness of the thicker film layer 7012 on the surface of the first component 604. Further, in order not to affect the electrical connection performance of the second member 605 such as the circuit interface element, the thickness of the thin film layer 7011 prepared on the surface of the second member 605 is within a predetermined range.

Further, the electronic component 610 on the surface of the substrate 600 is selected from a group consisting of: one or more of at least one electronic component 611 requiring coating, at least one electronic component 612 requiring no coating, at least a portion of the electronic component 613 coating, and at least one electronic component 614 coating thinner films. That is, wherein the electronic component 611 to be coated and the portion 6131 of the partially coated electronic component 613 are both located in the first part 604 to be coated with the thicker film layer 7012, wherein the electronic component 612 to be coated and the portion 6132 of the partially coated electronic component 613 are both located in the no-coating position 603, and wherein the electronic component 614 to be coated is located in the second part 605 to be coated with the thinner film layer 7011.

Further, the shutter 20 further comprises at least one shutter body 210 (the shutter body 210 preferably comprises at least one first shutter body 211 and at least one second shutter body 212), wherein the first shutter 21 comprises the first shutter body 211, wherein the second shutter 22 comprises the second shutter body 212, wherein the first shutter 21 and the second shutter 22 of the shutter 20 further comprise, respectively, a member selected from the group consisting of: at least one combination of a complete shielding portion 23, at least one partial shielding portion 24 and at least one floating shielding portion 25, wherein the complete shielding portion 23 is adapted to cover or wrap the non-film-coated electronic component 612 at the non-film-coating position 603 to achieve complete shielding, the partial shielding portion 24 is adapted to cover or wrap the non-film-coated portion 6132 of the partially-film-coated electronic component 613 to achieve partial shielding, and the floating shielding portion 25 is adapted to maintain the film-coating gap D1 between the thinner-film-coated electronic component 614 of the second component 605 to form floating shielding, so as to coat the thinner-film layer 7011 on the surface of the thinner-film-coated electronic component 614.

It is understood that the shielding member 20 can be preset to have a structure of one or a combination of more of the full shielding portion 23, the partial shielding portion 24 and the floating shielding portion 25 for different types of the substrate 600. In other words, if the substrate 600 only includes the electronic component 612 requiring no coating and the electronic component 611 requiring coating, the shielding member 20 is preset to have the complete shielding portion 23, and may or may not have the partial shielding portion 24 and the floating shielding portion 25. That is, the structure of the shield 20 can be preset according to the type of the base material 600, and is not limited thereto.

In this embodiment, the complete shielding portion 23, the partial shielding portion 24 and the floating shielding portion 25 are integrally connected, wherein the complete shielding portion 23 of the shielding member 20 corresponds to the position of the electronic component 612 without film plating of the substrate 600, wherein the partial shielding portion 24 corresponds to the position of the electronic component 6132 without film plating of the electronic component 613 with film plating of the substrate 600, and wherein the floating shielding portion 25 corresponds to the position of the electronic component 614 with film plating of the substrate 600. That is, the shielding member 20 of the coating fixture 100 can simultaneously shield a plurality of the electronic components 610 that do not need to be coated integrally, while other electronic components 610 that need to be coated are not shielded, so as to meet the coating requirement.

Specifically, the first shielding member 21 has the first shielding body 211, wherein the first shielding body 211 forms the first through hole 2011, and wherein the complete shielding portion 23, the partial shielding portion 24 and the suspended shielding portion 25 are integrally formed on the first shielding body 211. The second shielding member 22 has the second shielding body 221, wherein the second shielding body 221 forms the second through hole 2012, and wherein the complete shielding portion 23, the partial shielding portion 24 and the floating shielding portion 25 are integrally formed on the second shielding body 221.

That is, when the substrate 600 is mounted in the mounting cavity 102 of the coating fixture 100, the complete shielding portion 23 just covers or wraps the electronic component 612 without coating, the partial shielding portion 24 just covers or wraps the electronic component 613 without coating, and the floating shielding portion 25 just keeps the coating gap D1 between the electronic component 614 with thinner coating.

During film coating, since the electronic component 611 to be film coated and the portion 6131 of the electronic component 613 to be film coated are not shielded by the shielding member 20, a certain amount of plasma is deposited on the electronic component 611 to be film coated and the portion 6131 of the electronic component 613 to be film coated, so as to form the thick film 7012 with a certain thickness. The non-coating portions 6132 of both the non-coated electronic component 612 and the partially coated electronic component 613 are blocked, resulting in no plasma being deposited and no coating or film being formed on the surface. The suspension shielding portion 25 is suspended above the thinner film-plated electronic component 614 and has a certain distance D1 from the thinner film-plated electronic component 614, so that the suspension shielding portion 25 reduces the deposition rate of the plasma on the surface of the thinner film-plated electronic component 614, thereby reducing the thickness of the plated film on the surface of the thinner film-plated electronic component 614, i.e., forming the thinner film layer 7011, and the thinner film layer 7011 with different thicknesses can be plated according to the preset distance of the plating gap.

It is worth mentioning that by presetting the height of the coating gap D1, the deposition rate of the plasma deposited on the surface of the thinner film coated electronic component 614 is correspondingly changed, so that the surface of the thinner film coated electronic component 614 is coated with the thinner film layer 7011 with a preset thickness. Accordingly, for a plurality of thinner film plated electronic components 614, the corresponding plating gaps D1 between each thinner film plated electronic component 614 and the plurality of suspended shielding portions 25 of the shielding member 20 can be preset respectively, so that the plating equipment can meet the requirements of plating the plurality of electronic components 610 on the surface of the substrate 600 with different thicknesses by one-time plating, reduce the plating frequency, save labor and time, improve the plating efficiency, and prolong the service life of the plating equipment.

In the embodiment, the distance between the complete shielding portion 23 of the shielding member 20 and the position 603 of the substrate 600 where no coating is required is between 0 mm and 1mm, and a gap of partial penetration can be allowed between the complete shielding portion 23 and the position 603 where no coating is required during the coating process, but the performance of the electronic component at the position 603 where no coating is required is not affected. Accordingly, the thickness of the thinner film layer 7011 should be no greater than 250nm in order not to affect the electrical connection performance of the circuit interface element. Alternatively, when the plating gap D1 between the floating shield portion 25 of the shield 20 and the thinner-film-plated electronic component 614 of the second part 605 of the substrate 600 is 0.5mm, the thickness of the plating film between the circuit interface component of the substrate 600, such as the USB interface, and the floating shield portion 25, i.e., the thickness of the thinner-film layer 7011, may be preferably controlled to be between 50nm and 150 nm. Or the coating gap D1 is within the range of 0.2-0.8 mm. The upper side of the first part 604 of the substrate 600 may not be shielded by the shielding member 20, and optionally, the upper side of the first part 604, i.e. the thickness of the thicker film 7012, is generally between 250nm and 1000nm, preferably between 350nm and 400nm, so that the surface of the first part 604 can still be prepared with a film with a desired thickness. It will be understood by those skilled in the art that the above data ranges are only illustrative of the present embodiment and are not intended to limit the present invention.

Accordingly, in the step S10, the method includes the steps of:

s11, forming the thicker film 7012 on the first part 604 of the substrate 600, wherein the position 603 of the substrate 600 where no coating is needed is shielded by the substrate 600 without forming the film 700.

In the step S11, the first member 604 is not shielded by the plating jig 100, wherein the no-plating position 603 is completely shielded by the shield 20 of the plating jig 100.

Further, the step S10 further includes, concurrently with the step S11, the steps of:

s12, forming the thin film layer 7011 on the second member 605 of the substrate 600.

In step S12, the second member 605 is kept away from the floating shielding portion 25 of the plating jig 100 by the plating gap D.

Therefore, the coating method can be used for respectively coating the thicker film layer 7012 and the thinner film layer 7011 on different positions of the surface of the base material 600 through one-time coating, so that the coating efficiency is improved, and the coating time is saved.

Alternatively, the complete shielding portion 23, the partial shielding portion 24 and the floating shielding portion 25 may be disposed between the fixture body 10 and the substrate 600 independently from each other, and the complete shielding portion 23 corresponds to the position of the electronic component 612 without film plating of the substrate 600, wherein the partial shielding portion 24 corresponds to the position of the electronic component 6132 without film plating of the electronic component 613 of the substrate 600, and the floating shielding portion 25 corresponds to the position of the electronic component 614 with film plating of the substrate 600.

Optionally, the first shielding member 21 and the second shielding member 22 can cooperatively shield the same electronic component 610 of the substrate 600. Specifically, the substrate 600 has at least one common shielding electronic element 615, wherein the common shielding electronic element 615 is located at a side or a hole edge of the substrate 600, wherein the common shielding electronic element 615 is configured as a USB connector or a socket, etc., wherein the first shielding member 21 has at least one first shielding portion 212, wherein the second shielding member has at least one second shielding portion 222, wherein the first shielding portion 212 is located at a side or a hole edge of the first shielding body 211 of the first shielding member 21 and exactly corresponds to a position of the common shielding electronic element 615, and wherein the second shielding portion 222 is located at a side or a hole edge of the second shielding body 221 of the second shielding member 22 and exactly corresponds to a position of the common shielding electronic element 615. The first shielding part 212 and the second shielding part 222 cooperatively cover or wrap the common shielding electronic element 615, so that the common shielding electronic element 615 cannot be coated. Or, during shielding, the first shielding portion 212 and the second shielding portion 222 are just correspondingly spliced with each other to cover the common shielding electronic element 615, that is, the combined area of the first shielding portion 212 and the second shielding portion 222 is greater than or equal to the area of the common shielding electronic element 615 where no film is required, so as to achieve shielding and meet the film coating requirement.

Further, the structural size of the fixture body 10 can be preset, wherein the height and the shape of the installation cavity 102 can be preset, and wherein the shape size and the thickness of the shielding member 20 can be preset, so that the substrates 600 with different thicknesses or sizes can be fittingly installed in the installation cavity 102 and kept fixed, thereby enabling the coating fixture 100 to be suitable for the coating requirements of the substrates with different thicknesses or sizes.

In another embodiment of the present invention, the coating method can coat the thicker film layer 7012 and the thinner film layer 7011 on the surface of the substrate 600 by multiple times of coating. For example, the coating method comprises the step of coating the first part 604 with the thicker film layer 7012 and the second part 605 with the thinner film layer 7011 by two coating processes, wherein the thicker film layer 7012 comprises a first film layer 70121 and a second film layer 70122 which are integrally laminated, wherein the portion of the second film layer 70122 which is not covered by the first film layer 70121 forms the thinner film layer 7011, and the second film layer 70122 is between the surface of the substrate 600 and the first film layer 70121. Alternatively, the first film layer 70121 is between the surface of the substrate 600 and the second film layer 70122, wherein the portion of the first film layer 70121 not covered by the second film layer 70122 forms the thinner film layer 7011.

Specifically, the coating method comprises the following steps:

s50, forming the first film layer 70121 on the surface of the first part 604 of the substrate 600 by the second part 605 of the substrate 600 being shielded by the complete shielding part 23 of the coating fixture 100 and being put into the coating chamber 510 of the coating apparatus 500 together for the first coating, wherein the second part 605 is not coated with the first film layer 70121; and

s60, placing the second part 605 of the substrate 600 into the coating chamber 510 of the coating apparatus 500 again for the second coating process without being shielded by the coating fixture 100, and forming the second film 70122 on the surface of the first film 70121 and the surface of the second part 605 of the first part 604.

After the step S50 is finished, that is, after the first plating is finished, the worker needs to take the substrate 600 and the plating jig 100 out of the plating chamber 100, remove the complete shielding portion 23 of the plating jig 100 for shielding the first member 604, and put the substrate into the plating chamber 100 again for the second plating, that is, perform the step S60. After the step S60 is finished, the worker needs to take out and disassemble the substrate 600 and the plating jig 100 to obtain the final plated product.

That is, the portion of the first film layer 70121 that is laminated with the second film layer 70122 forms the thicker film layer 7012, wherein the portion of the first film layer 70121 that is not laminated with the second film layer 70122 forms the thinner film layer 7011.

It is understood that the materials and thicknesses of the first film layer 70121 and the second film layer 70122 can be preset to be the same or different materials or thicknesses, respectively, according to the parameters of the coating apparatus or the settings of the reaction raw materials in the steps S50 and S60, respectively, without limitation.

Alternatively, the step S50 can be replaced by:

s51, performing a first coating by placing the second part 605 of the substrate 600 into the coating chamber 510 of the coating apparatus 500 without being shielded by the coating fixture 100, and simultaneously forming the first film layer 70121 on the surface of the first part 604 and the surface of the second part 605.

Wherein the step S60 is replaced by:

s61, forming the second film layer 70122 on the surface of the first film layer 70121 of the first part 604 of the substrate 600 by the second part 605 of the substrate 600 being shielded by the complete shielding part 23 of the coating fixture 100 and being placed into the coating chamber 510 of the coating apparatus 500 again for the second coating, wherein the surface of the first film layer 70121 of the second part 605 is not coated with the second film layer 70122.

In other words, in the steps S50 and S60, the coating jig 100 shields the second part 605 at the time of first film layer to form the first film layer 70121 on the surface of the first part 604 alone, and then, at the time of second coating, the second part 605 is not shielded by the coating jig 100 to form the second film layer 70122 on the surface of the first film layer 70121 and the second part 605 of the second part 604 at the same time, so that the surface of the second part 605 is coated with only the second film layer 70122 to form the thin film layer 7011, and the surface of the first part 604 is coated with both side films (the first film layer 70121 and the second film layer 70122) to form the thick film layer 7012. As can be seen, the thinner film layer 7011 is significantly thinner than the thicker film layer 7012.

In the steps S51 and S61, the second component 605 is not shielded by the coating jig 100 during the first coating to form the first film layer 70121 on the surface of the second component 604 and the second component 605 at the same time, and then the coating jig 100 shields the second component 605 during the second coating to form the second film layer 70122 on the surface of the first film layer 70121 of the first component 604 separately to complete the coating, thereby achieving the same effect.

It should be noted that, in the coating method, a masking object such as a sticker or an adhesive tape may be used to replace the coating fixture 100 to mask the substrate 600, and the thicker film layer 7012 may be prepared on the surface of the first component 604 of the substrate 600, and the thinner film layer 7011 may be prepared on the surface of the second component 605, which is not limited herein.

Optionally, the plating method further comprises a deplating step, wherein the deplating step comprises: the portion of the film layer 700 on the surface of the substrate 600 is deplated to form the film-free region (the first film-free region 710 or the second film-free region 720) on the surface of the substrate 600. Alternatively, the deplating step may be performed by a frosting process or the like, that is, after the plating is finished, a worker can remove the portion of the film layer 700 plated on the surface of the substrate 600 by the deplating process, so as to form the film-free region for exposing the position of the surface of the substrate 600 where the plating is not needed, or an electronic component or the like.

In this embodiment, the coating jig 100 further includes a set of fixing members 30, wherein the fixing members 30 are fastenably mounted to the jig main body 10, and in particular, the fixing members 30 are fastenably mounted between the first main body 11 and the second main body 12, wherein the fixing members 30 move between a fastened state and a disassembled state. In the fastened state, the height of the mounting cavity 102 is reduced, wherein the fixing member 30 provides a force to keep the first body 11 and the second body 12 relatively fixed for clamping and fixing the substrate 600 to the mounting cavity 102. In the disassembled state, the mounting cavity is opened, the force is removed, and the first body 11 and the second body 12 can be separated from each other, so as to disassemble or assemble the substrate 600 to the mounting cavity 102.

Preferably, the fixing members 30 are implemented in at least four shapes and are symmetrical to each other, wherein the fixing members 30 are respectively disposed at four corners of the fixture body 10, so that the fixture body 10 can be uniformly stressed in the fastened state, thereby ensuring that the base material 600 is uniformly stressed and preventing the base material 600 from being bent or damaged due to too concentrated stress. Alternatively, the fixing member 30 may be implemented in 6, even more, etc., without limitation.

Further, each of the first shielding member 21 and the second shielding member 22 of the shielding member 20 has at least one first positioning portion 26, wherein the substrate 600 has at least one second positioning portion 620, wherein the first positioning portion 26 corresponds to the position of the second positioning portion 620, wherein the first positioning portion 26 and the second positioning portion 620 are used for being cooperatively fixed, so that the shielding member 20 fits to the substrate 600 exactly, the complete shielding portion 23 of the shielding member 20 fits to or covers the electronic component 612 without film plating exactly, the partial shielding member 24 fits to or covers the part 6132 without film plating of the electronic component 613 exactly, and the suspended shielding member 25 fits to and maintains the film plating gap D1 between the electronic component 614 with film plating, so that the first shielding member 21 and the second shielding member 22 can be quickly positioned and mounted to the substrate The two sides of the material 600 can be shielded, so that the dislocation is prevented, the installation efficiency is improved, the coating failure is prevented, and the process efficiency is improved.

Preferably, the first positioning portions 26 are implemented as positioning holes and are at least two in number, wherein each of the first positioning portions 26 is spaced apart from each other and located at different positions of the shielding member 20 (the first shielding member 21 or the second shielding member 22), such as a peripheral position or an intermediate position, and the like, wherein the second positioning portions 620 are implemented as positioning posts and are the same in number as the first positioning portions 26, and wherein each of the second positioning portions 620 is adapted to be detachably fixed to the first positioning portion 26 so as to achieve positioning and installation.

Further, the second main body 12 has at least one third positioning portion 123, wherein the second shielding member 22 further has a fourth positioning portion 223, wherein the third positioning portion 123 corresponds to the fourth positioning portion 223, wherein the third positioning portion 123 and the fourth positioning portion 223 are used for being cooperatively fixed, so that the second shielding member 22 is just fittingly attached to the second main body 12 and just located on the inner wall of the mounting cavity 102, thereby facilitating the rapid installation of the second shielding member 22 in the mounting cavity 102 of the second main body 12, and the substrate 600 is rapidly positioned and installed in the second main body 12 to prevent misalignment.

Preferably, the third positioning portions 123 are implemented as positioning posts, and the number of the positioning posts is at least two and the positioning posts are spaced from each other and located at different positions of the second main body 12, such as the circumferential position or the middle position, etc., wherein the fourth positioning portions 223 are implemented as positioning holes and the number of the positioning posts is the same as that of the third positioning portions 123, and each of the third positioning portions 123 is fittingly detachably fixed to the fourth positioning portion 223, so as to achieve positioning and installation.

Further, the first body 11 can be positioned and installed on the second body 12 by means of the fixing member 30, and the substrate 600 is clamped and fixed to prevent dislocation. Of course, the positioning portion may be disposed between the first main body 11 and the first shielding member 21 for positioning and installation, and is not limited herein.

Alternatively, the first shielding member 21 can be pre-positioned and fixed, such as adhered to the first main body 11, and the second shielding member 22 can be pre-positioned and fixed, such as adhered or buckled to the second main body 12, and during film coating, the substrate 600 is only positioned and installed between the first main body 11 and the second main body 12 and the corresponding electronic component 610 is shielded by the first shielding member 21 and the second shielding member 22, so that the installation steps are reduced, and the installation rate is increased.

It is understood that the inner wall of the mounting cavity 102 may be implemented as a concave structure and have a shape and size just matching the shape and size of the second shield 22 and the first shield 21, wherein the inner wall of the mounting cavity 102 further plays a role of positioning and fixing the second shield 22 and the second shield 21, that is, the shape of the mounting cavity 102 matches the shape of the shield 20, wherein the inner wall of the mounting cavity 102 can also play a role of positioning the shield 20. It can be understood that the coating fixture 100 can be used for quickly positioning and installing the substrate 600, is simple and convenient to operate, has low technical requirements on workers, only needs to be positioned and installed, unifies standards, and improves production efficiency.

Optionally, the fixture main body 10 has three mounting cavities 102 for respectively mounting three substrates 600, so as to implement simultaneous coating on the three substrates 600, thereby improving production efficiency. Of course, the number of the mounting cavities 102 can also be implemented as two, four, five, six or even more, and is not limited herein.

It is understood that the shape structures of the three substrates 600 may be different, wherein the first mounting cavity 1021, the second mounting cavity 1022 and the third mounting cavity 1023 correspond to the corresponding shape and size of the substrate 600 respectively. Accordingly, the shielding members 20 are also implemented in three, wherein the electronic components 610 of three substrates 600 are respectively shielded by the corresponding shielding members 20, and each of the shielding members 20 and the corresponding substrate 600 are clamped and fixed by the first body 11 and the second body 12 of the same fixture body 10. Since the number of the base materials 600 is increased, in order to ensure that the base materials 600 are uniformly stressed when being clamped by the clamp main body 10, the fixing members 30 are implemented in six, wherein four fixing members 30 are respectively arranged at four corners of the clamp main body 10, and the other two fixing members 30 are respectively arranged at the clamp main body 10 and correspond to diagonal positions of the middle base material 600, so as to ensure that the middle base material 600 is uniformly stressed.

It is worth mentioning that the shape and structure of the coating fixture 100 are preferably flat, such as a plate-type structure, and have uniform specifications, so as to be conveniently placed in the mounting cavity 510 of the coating apparatus 500 in a large batch. Further, a rack can be placed in the installation cavity 510 of the coating apparatus 500, wherein the coating jigs 100 are sequentially placed on the rack in a large batch, wherein the coating jigs 100 can be placed on the rack in such a manner that the substrate 600 is uniformly coated, so as to ensure that the substrate 600 can be uniformly coated. Further, the bracket is rotatably installed in the installation cavity 510, wherein the bracket drives the coating fixture 100 to rotate uniformly, so that each substrate 600 rotates uniformly in the installation cavity 510, thereby ensuring that each substrate 600 is coated uniformly, and meeting the requirement of uniform coating.

It should be noted that the coating method of the present invention can be applied to the coating process of the main board or the sub-board of various mobile phone projects in the market, and the mass production verification is performed, and the market repair rate of the damage of the main board or the sub-board of the mobile phone caused by the coating quality or the water inflow is greatly reduced, and the market adaptability is good.

It will be appreciated by persons skilled in the art that the embodiments of the invention described above and shown in the drawings are given by way of example only and are not limiting of the invention. The advantages of the present invention have been fully and effectively realized. The functional and structural principles of the present invention have been shown and described in the examples, and any variations or modifications of the embodiments of the present invention may be made without departing from the principles.

Claims

1. A film coating method is characterized by comprising the following steps:

2. The plating method according to claim 1, wherein the thickness of the thinner film layer is not more than 250 nm.

3. The method of claim 1, providing a coating gap between at least one suspended shield of a coating fixture and the second portion of the substrate, wherein the substrate is mounted to the coating fixture such that the thicker film layer and the thinner film layer are formed simultaneously.

4. The plating method according to claim 3, further comprising the step of: and forming at least one uncoated area on the position of the surface of the substrate, which is shielded by the coating clamp.

5. The plating method according to claim 1, wherein the thinner film layer is formed of a first film layer, wherein the thicker film layer is formed of the first film layer and a second film layer.

6. The plating method according to claim 5, comprising the steps of: A. forming the second film layer on the surface of the first part of the substrate by primary coating, wherein the surface of the second part of the substrate is shielded by a coating clamp and cannot be coated; and B, simultaneously forming the first film layer on the surface of the first film layer on the substrate and the surface of the second part through coating again.

7. The plating method according to claim 5, comprising the steps of: a1, simultaneously forming the first film layer on the surface of the first part and the surface of the second part of the substrate through primary coating; and B, forming the second film layer on the first film layer on the surface of the first part of the base material by coating again, wherein the surface of the second part of the base material is shielded by a coating clamp and cannot be coated.

8. The plating method according to any one of claims 2 to 4, which prepares a film on a surface of a substrate by a plating apparatus, comprising the steps of: a. mounting the substrate on the coating clamp and placing the substrate in a coating cavity of the coating equipment; b. performing negative pressure generation operation on the coating cavity; and c, preparing a film layer on the surface of the substrate in a chemical vapor deposition mode.

9. The plating method according to claim 8, wherein the plating jig has a plurality of mounting cavities, and wherein a plurality of substrates are mounted in the respective mounting cavities.

10. The method according to claim 8, wherein the coating fixture comprises a fixture body and at least one shielding member, wherein the shielding member is disposed on the fixture body, wherein the fixture body has at least one mounting cavity for mounting at least one substrate, wherein the shielding member corresponds to a position of the surface of the substrate to be shielded, and after mounting, the shielding member correspondingly shields the position of the surface of the substrate to be shielded.

11. The plating method according to claim 10, wherein the jig main body comprises a first main body and a second main body, wherein the first main body and the second main body are openably fitted together with the installation cavity formed therebetween, wherein the shielding member is provided on an inner wall of the installation cavity, wherein the jig main body has at least one exposed hole, wherein the exposed hole communicates with the installation cavity.

12. The plating method according to claim 11, wherein the shielding member comprises at least a first shielding member and at least a second shielding member, wherein the first shielding member is disposed on the first body for shielding a position to be shielded on one side of the substrate, and wherein the second shielding member is disposed on the second body for shielding a position to be shielded on the other side of the substrate.

13. The plating method according to claim 10, wherein the shielding member comprises at least one first positioning portion, wherein the first positioning portion corresponds to at least one second positioning portion of the substrate, and when the substrate is mounted, the first positioning portion and the second positioning portion are fixed in position, so that the shielding member can be matched to shield the position of the substrate to be shielded.

14. The plating method according to claim 13, wherein the jig main body comprises at least a third positioning portion, wherein the shielding member further comprises at least a fourth positioning portion, wherein the third positioning portion corresponds to the fourth positioning portion in position, and when the jig main body is mounted, the third positioning portion and the fourth positioning portion are fixedly positioned, so that the jig main body and the shielding member are fixedly mounted.

15. The plating method according to claim 14, wherein the plating jig further comprises a set of fixing members, wherein the fixing members are fastenably mounted to the jig main body and move between a fastened state in which the height of the mounting chamber is reduced, and a disassembled state in which the force is removed, wherein the mounting chamber can be opened so that the substrate can be disassembled, and the fixing members provide a force to hold the substrate fixed.

16. The plating method according to claim 8, wherein the second member is a circuit interface element of an electronic product.

17. A membrane layer, wherein the membrane layer forms a substrate and comprises a thicker membrane layer formed on a surface of a first component of the substrate and a thinner membrane layer formed on a surface of a second component of the substrate, wherein the thickness of the thicker membrane layer is greater than the thickness of the thinner membrane layer.

18. The film layer of claim 17 wherein the thickness of the thinner film layer is no greater than 250 nm.

19. The film of claim 17, wherein the film has at least one film hole, wherein the film hole is located at a position of the substrate where no film is to be applied to form a film-free region.

20. The film layer of claim 19, wherein the thicker film layer and the thinner film layer are integrally formed.

21. The film of claim 20 wherein the film comprises a first film and a second film, wherein the portion of the first film that is laminated to the second film forms the thicker film, and wherein the portion of the first film that is not laminated to the second film forms the thicker film.

22. The film layer of any one of claims 17 to 21, wherein the film layer is selected from the group consisting of: the coating comprises one or more of an organic silicon nano protective film layer, an organic silicon hard nano protective film layer, a composite structure high-insulation hard nano protective film layer, a high-insulation nano protective film layer with a modulation structure, a plasma polymerization film layer, a gradient increasing structure liquid-proof film layer, a gradient decreasing structure liquid-proof film layer, a film layer with controllable crosslinking degree, a waterproof click-through resistant film layer, a low-adhesion corrosion resistant film layer, a liquid-proof film layer with a multilayer structure, a polyurethane nano film layer, an acrylamide nano film layer, an anti-static liquid-proof nano film layer, an epoxy nano film layer, a high-transparency low-color-difference nano film layer, a high-adhesion aging resistant nano film layer, a silicon-containing copolymer nano film layer and a polyimide nano film layer.