JP2008174767A - Tool for film deposition - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a tool for film deposition capable of forming a film deposition pattern with its entire periphery being connected in a frame shape or a ring shape. <P>SOLUTION: The tool for film deposition comprises a base member 20 capable of allowing a crystal wafer 10 to be arranged at least on one surface 22 and having the magnetic force by a magnet 21 embedded therein, and a magnetic mask member 30 which is arranged on one surface 22 of the base member 20 and arranged at the position of being attracted by the magnetic force of the magnet 21 embedded in the base member 20. When the crystal wafer 10 is arranged on the base member 20, the crystal wafer 10 can be interposed between the base member 20 and the mask member 30. The mask member 30 is smaller in contour than the crystal wafer in plan view, and a part of the crystal wafer 10 is exposed from the mask member 30 over the entire periphery. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a film forming jig for forming a film forming pattern on a film forming body.

Conventionally, a photolithography method has been generally used when processing a shape of a thin piezoelectric element plate. That is, a metal film is formed on the entire piezoelectric element plate by vapor deposition or sputtering, and a resist film is formed on the entire metal film. Next, the resist film is exposed and developed with a desired pattern to form a resist mask. Thereafter, the piezoelectric element plate is processed into the desired pattern by an etching process. Finally, the metal film and the resist film remaining on the piezoelectric element plate are peeled and removed. However, when the photolithography method as described above is employed, there is a problem that the number of devices used increases and the manufacturing process becomes complicated. Therefore, a method has been devised in which the piezoelectric element plate is simply processed by vapor deposition or sputtering instead of the photolithography method. For example, in Patent Document 1, in a method of manufacturing a piezoelectric element plate used for a piezoelectric vibrator, a piezoelectric element plate having a reinforcing part thicker than the vibrating part is processed around a vibrating part having a thin plate thickness. A method is disclosed. In this etching process of the piezoelectric element plate, a method is described in which a metal film is formed on the piezoelectric element plate by vapor deposition, and a portion of the piezoelectric element plate that is not covered with the metal film is etched. In Patent Document 1, a film forming jig is used when forming the metal film.
Specifically, the film forming jig disclosed in Patent Document 1 includes a spacer for housing a plurality of piezoelectric element plates, and a pattern that is disposed on both the front and back surfaces of the spacer and covers the vibrating portion of the piezoelectric element plate. Having a mask. The mask includes a circular hole portion that is slightly larger than the piezoelectric element plate, a covering portion that covers the vibrating portion of the piezoelectric element plate, and a bridge portion that connects the outer edge of the circular hole portion and the covering portion.

Japanese Patent Laid-Open No. 10-12944

The film-forming jig covers the vibrating part of the film-forming body with the covering part and is connected to the covering part in a state where the spacer and the mask are attached to the piezoelectric base plate (hereinafter referred to as the film-forming body). The bridge portion covers a part of the film formation target.
Thereby, the film-forming jig can form a film-forming pattern of the metal film on the film-formed body by vapor deposition, except for the portions covered with the covering portion and the bridge portion.

  However, since the film-forming jig has a bridge portion that holds the covering portion, a metal film is not formed under the bridge portion. Therefore, the entire circumference of the film-forming body is in a frame shape or a ring shape. The connected film formation pattern cannot be formed.

  An object of the present invention is to provide a film forming jig capable of forming a film forming pattern in which the entire circumference is connected in a frame shape or a ring shape, paying attention to the above-mentioned problems.

  In order to solve the above problems, a film forming jig according to the present invention is capable of disposing a film forming body on at least one surface, and has a base member having magnetic force by an embedded magnet, A magnetic mask member disposed on the one surface of the base member and at a position attracted by the magnetic force of the magnet embedded in the base member, and the film-forming body is disposed on the base member. In this case, a film-forming body can be interposed between the base member and the mask member, and the mask member has a smaller outer shape than the film-forming body when seen in a plan view. A part of the body is exposed from the mask member over the entire circumference.

According to the above, the film-forming jig is configured such that a part of the film formation object is in a plan view at a position where the mask member is attracted by the magnetic force of the base member on at least one surface of the base member. It can be arranged such that it is exposed over the entire outer periphery of the member and the film-deposited body is interposed between it and the base member.
As a result, in the film-forming jig, the mask member is held on the base member by the magnetic force of the base member. Thus, the mask member can be arranged so as to be exposed over the entire outer periphery of the mask member.
As a result, in the conventional film forming jig, there is a portion that cannot be formed by being covered with the bridge portion, and a film forming pattern in which the entire periphery is connected in a frame shape or a ring shape is formed on the film forming target. However, in the film forming jig of the present invention, the film forming pattern can be formed in a frame shape or a ring shape on the film forming target.
Moreover, the film-forming jig can prevent the mask member from being lifted from the film-forming body by the mask member being attracted to the base member via the film-forming body by the magnetic force of the base member. Thereby, the film-forming jig can form a film-forming pattern having no outline blur on the film-forming target.

  In the film forming jig according to the above invention, the position of the mask member is fixed by a magnetic force generated between the magnet embedded in the base member and the mask member.

  In the film-forming jig according to the invention, the base member includes a base plate having a magnetic force by an embedded magnet, and a guide plate on which the film-formed body is positioned and arranged, and the mask The position of the member is fixed by a magnetic force generated between the magnet embedded in the base plate and the mask member.

According to the above, the base member of the film forming jig includes the base plate and the guide plate on which the film formation target body is positioned. Thereby, the film-forming jig can accurately position and arrange the film-forming body at a predetermined position of the base member.
In addition, the film forming jig once removes the guide plate from the base plate so that the magnetic force acting on the mask member attracted to the base plate via the guide plate and the film formation body is eliminated by the magnetic force of the base plate. Therefore, the mask member can be easily attached to and detached from the deposition target.

  The film-forming jig according to the present invention further includes a mask guide jig having a mask guide plate and a mask holding plate, the mask guide plate having a positioning portion for positioning the mask member, and the mask holding The plate has a magnetic force by an embedded magnet, and the mask member is held by the magnetic force.

  According to the above, the film-forming jig can be positioned with the mask member accurately positioned at a predetermined position by the mask guide jig.

  Hereinafter, with respect to embodiments of a film forming jig according to the present invention, a film forming jig for forming a film forming pattern such as a metal film on a quartz wafer as a film forming object by vapor deposition or sputtering is taken as an example. ,explain.

(First embodiment)
"Constitution"
FIG. 1 is a configuration diagram illustrating a schematic configuration of a film forming jig according to the first embodiment. FIG. 1A is a developed perspective view, and FIG. 1B is a cross-sectional view taken along line AA in FIG. For easy understanding of the configuration, FIG. 1 shows a state in which a crystal wafer is set.

As shown in FIG. 1, the film forming jig 1 according to the first embodiment includes a base member 20, a mask member 30, and a magnet 21.
The base member 20 has a magnet 21 embedded on one side. Thereby, the base member 20 has a magnetic force.

As shown in FIG. 1B, a crystal wafer 10 as a film formation target is disposed on one surface 22 of the base member 20.
The magnet 21 may be embedded on both surfaces of the base member 20. Further, the crystal wafer 10 may be disposed on the surface of the base member 20 on the magnet 21 side, or may be disposed on both surfaces of the base member 20.

The mask member 30 is made of a magnetic material and is made of, for example, stainless steel having magnetism, and is disposed on one surface 22 of the base member 20 at a position attracted by the magnetic force of the base member 20. The quartz crystal wafer 10 disposed on the base member 20 is interposed between the base member 20 and the mask member 30. The positions of the crystal wafer 10 and the mask member 30 are fixed by the magnetic force generated between the magnet 21 embedded in the base member 20 and the mask member 30.
The mask member 30 has a smaller outer shape than the quartz wafer 10 in plan view, and a part of the quartz wafer 10 is exposed from the mask member 30 over the entire circumference.

Note that the size of the outer shape of the mask member 30 is determined by the shape of a film formation pattern formed on the quartz wafer 10 described later.
Further, when the quartz wafers 10 are arranged on both sides of the base member 20, the mask members 30 are arranged on both sides of the base member 20 so that each quartz wafer 10 is interposed between the mask member 30 and the base member 20. Configure.

《Action ・ Effect》
Here, the operation and effect of the film forming jig 1 of the first embodiment will be described along the film forming pattern forming process in the processing method of the crystal wafer 10.

FIG. 2 is a cross-sectional view showing a film forming pattern forming process on a quartz wafer using a film forming jig. FIG. 3 is a perspective view of the crystal wafer after the film formation pattern is formed.
As shown in FIG. 2A, first, the crystal wafer 10 is placed on one surface 22 of the base member 20.

  The quartz wafer 10 is previously formed in a predetermined shape, thickness, and surface state. In the case of this embodiment, the quartz wafer 10 has a thickness of about 100 μm and the surface is mirror-finished. In addition, the thickness and surface state of the quartz wafer 10 are not limited to this, and are appropriately set according to the application.

Next, as shown in FIG. 2B, the mask member 30 is seen on the quartz wafer 10 in plan view so that a part of the quartz wafer 10 is exposed with a predetermined width over the entire circumference of the mask member 30. Deploy.
In this state, the mask member 30 is attracted and fixed to one surface 22 of the base member 20 by the magnetic force of the magnet 21 embedded in the base member 20.

  Next, a metal film such as Cr / Au is formed on the film forming jig 1 by a vapor deposition apparatus or a sputtering apparatus (not shown) to form a film forming pattern.

Next, after removing the mask member 30, the crystal wafer 10 is removed from the base member 20.
Through the above formation process, as shown in FIG. 3, the crystal wafer 10 is formed with the film-forming pattern 11 that is connected to the outer periphery of the central portion 12 covered with the mask member 30 in a frame shape. Yes.

As described above, the film forming jig 1 of the first embodiment can form the frame-shaped film forming pattern 11 on the crystal wafer 10.
Further, in the film forming jig 1 of the first embodiment, the mask member 30 is not lifted from the crystal wafer 10 because the mask member 30 is attracted to the one surface 22 of the base member 20, and the crystal A film formation pattern 11 having no outline blur can be formed on the wafer 10.

For example, the following crystal wafer 10 can be etched using the film forming pattern 11 formed on the crystal wafer 10 by the film forming jig 1 described above.
4A and 4B show a crystal wafer in an etching process, where FIG. 4A is a cross-sectional view before etching, and FIG. 4B is a cross-sectional view after etching.

As shown in FIG. 4A, first, a film formation pattern 11 is formed on the crystal wafer 10 using the above-described method. Thereafter, a corrosion resistant film 13 such as a Cr / Au film is formed on each surface of the quartz wafer 10 other than the surface on which the film formation pattern 11 is formed.
As a result, the crystal wafer 10 is masked by the film formation pattern 11 and the corrosion-resistant film 13 except for the central portion 12 of the crystal wafer 10.

Next, the crystal wafer 10 is immersed in an etching solution such as hydrofluoric acid or hydrofluoric acid and ammonium fluoride, and the central portion 12 is etched until the thickness becomes several tens of μm to several μm.
Thereby, as shown in FIG.4 (b), the center part 12 of the crystal wafer 10 can be etched to thickness of several tens of micrometers-several micrometers. In the present embodiment, the crystal wafer 10 is etched so that the thickness of the central portion 12 is 4 μm to 8 μm. Further, as described above, the wall surface 15 of the quartz wafer 10 is etched substantially smoothly because the film formation pattern 11 is not blurred and its contour 14 is sharply formed.

Next, the quartz wafer 10 is immersed in a strip solution to peel off the film forming pattern 11 and the corrosion-resistant film 13, and after peeling, the quartz wafer 10 is washed with pure water and dried.
Thereby, it is possible to obtain the crystal wafer 10 in which the central portion 12 is thin.

(Second Embodiment)
Next, a film forming jig according to a second embodiment will be described with reference to the drawings.
FIG. 5 is a configuration diagram showing a schematic configuration of the film forming jig of the second embodiment. FIG. 5A is a developed perspective view, and FIG. 5B is a cross-sectional view taken along the line BB in FIG. 5A. FIG. 5 shows a state in which a crystal wafer is set for easy understanding of the configuration. Also, the same reference numerals are given to common parts with the first embodiment.

"Constitution"
As shown in FIG. 5, the film forming jig 101 according to the second embodiment includes a base member 120, a mask member 30, and a mask guide jig 130.
The base member 120 includes a base plate 121, a guide plate 122, and a plurality of magnets 123.
The base plate 121 has a plurality of magnets 123 embedded in the surface on the guide plate 122 side. Thereby, the base plate 121 has magnetic force.

  The guide plate 122 has a recess 124 slightly larger than the outer dimension of the crystal wafer 10 in order to position the crystal wafer 10. The quartz wafer 10 is positioned by being disposed in the recess 124.

  As in the first embodiment, the mask member 30 is made of a magnetic material and is made of, for example, stainless steel having magnetism, and is arranged at a position attracted by the magnetic force of the magnet 123.

Note that a mask guide jig 130 is used when the mask member 30 is disposed.
The mask guide jig 130 includes a mask guide plate 131, a mask holding plate 132, and a magnet 134.

In order to position the mask member 30, the mask guide plate 131 is formed with a recess 133 as a positioning portion that is slightly larger than the outer dimension of the mask member 30.
The recess 133 is formed on a surface of the mask guide plate 131 that faces the recess 124 of the guide plate 122.

The mask holding plate 132 has a plurality of magnets 134 embedded in a surface facing the mask guide plate 131. Thereby, the mask holding plate 132 has a magnetic force.
The mask holding plate 132 attracts and holds the mask member 30 disposed in the recess 133 of the mask guide plate 131 by its magnetic force.

  Thereby, when the crystal wafer 10 is arranged on the guide plate 122, the mask guide plate 131 causes the mask member 30 to be exposed so that a part of the crystal wafer 10 is exposed from the mask member 30 over the entire circumference in plan view. Can be positioned.

《Action ・ Effect》
Here, the operation and effect of the film forming jig 101 of the second embodiment will be described along the forming process of the film forming pattern 11 in the processing method of the crystal wafer 10 as in the first embodiment.

6 and 7 are cross-sectional views illustrating a film forming pattern forming process on a quartz wafer using a film forming jig. Note that in FIGS. 6 and 7, a film forming material attached to the film forming jig during film formation is omitted.
As shown in FIG. 6A, first, the crystal wafer 10 is placed in the recess 124 of the base member 120. The quartz wafer 10 is positioned by the recess 124.

  Next, the mask member 30 is disposed in the recess 133 of the mask guide plate 131, and the mask holding plate 132 in which the magnet 134 is embedded is disposed on the mask guide plate 131. Thereafter, as shown in FIG. 6B, the mask guide jig 130 is placed on the base member 120. The mask member 30 is attracted to the magnetic force of the mask holding plate 132 through the mask guide plate 131.

Next, the mask holding plate 132 of the mask guide jig 130 is removed. Thereby, as shown in FIG. 6C, the magnetic force of the mask holding plate 132 does not act on the mask member 30. Therefore, the mask member 30 is attracted only by the magnetic force of the base plate 121 and comes into contact with the crystal wafer 10.
Thus, the mask member 30 is accurately arranged at a position where a part of the crystal wafer 10 is exposed from the mask member 30 over the entire circumference in plan view.

  Next, the mask guide plate 131 of the mask guide jig 130 is removed, and the mask member 30 and part of the crystal wafer 10 are exposed.

Next, as shown in FIG. 6D, a film pattern 11 is formed by depositing a metal film such as Cr / Au from above the film-forming jig 101 using a vapor deposition apparatus or a sputtering apparatus (not shown). To do.
Thereby, the film-forming pattern 11 is formed over the entire circumference of the quartz wafer 10 outside the portion covered with the mask member 30.

  Further, since the mask member 30 is attracted to the base member 120 via the crystal wafer 10 and the guide plate 122, the mask member 30 is not lifted from the crystal wafer 10, and the film formation pattern 11 has a boundary with the mask member 30. The portion is formed without the outline blur.

  Next, as shown in FIG. 7A, the mask guide jig 130 is placed on the base member 120 again.

  Next, the base plate 121 of the base member 120 is removed. 7B, the mask member 30 is attracted to the concave portion 133 of the mask guide plate 131 by the magnetic force of the mask holding plate 132 because the magnetic force of the base plate 121 does not work.

Next, the mask guide jig 130 is removed from the guide plate 122. As a result, the mask member 30 is removed from the quartz wafer 10 while being attracted to the mask holding plate 132. Therefore, no jig other than the mask guide jig 130 is required to remove the mask member 30, and the mask member 30 can be easily removed. Then, as shown in FIG. 7C, the quartz wafer 10 on which the film formation pattern 11 is formed is exposed.
Next, the crystal wafer 10 is taken out from the recess 124 of the guide plate 122 of the base member 120.

  As a result of the above-described forming process, the crystal wafer 10 is formed with a film-forming pattern 11 having a frame-like outer periphery on the outside of the central portion 12 covered with the mask member 30, as shown in FIG. ing.

As described above, the film forming jig 101 according to the second embodiment can form the frame-shaped film forming pattern 11 on the crystal wafer 10 as in the first embodiment.
Further, the film forming jig 101 of the second embodiment can form the film forming pattern 11 without the outline blur on the crystal wafer 10 as in the first embodiment.

Furthermore, in the film forming jig 101 of the second embodiment, the crystal wafer 10 can be accurately positioned and arranged on the base member 120 by the guide plate 122 of the base member 120.
In addition, the film forming jig 101 of the second embodiment uses the mask guide jig 130 so that the mask member 30 can be accurately positioned and disposed at a position facing the crystal wafer 10. is there.

The preferred embodiments of the present invention have been described in detail above. However, as will be apparent to those skilled in the art, the present invention can be implemented by adding various changes and modifications to the above embodiments within the technical scope thereof.
For example, in the film forming jig 101 of the second embodiment, the mask member 30 is attached to and detached from the crystal wafer 10 using the mask guide jig 130, but the present invention is not limited to this. The mask member 30 may be directly attached to and detached from the crystal wafer 10 without using 130.

  At this time, the guide plate 122 is once removed from the base plate 121 before the quartz wafer is attached or detached. Then, the magnetic force acting on the mask member 30 does not work, and the mask member 30 can be easily attached and detached.

In the second embodiment, the case of the single crystal wafer 10 and the single mask member 30 has been exemplified. However, the present invention is not limited to this, and a plurality of crystal wafers 10 and a plurality of mask members 30 may be used. Good.
According to this, the film-forming jig 101 can collectively form the film-forming pattern 11 on each of the plurality of crystal wafers 10.

  In the first and second embodiments, the crystal wafer 10 and the mask member 30 have a rectangular outer shape, but an outer shape such as a circle, an ellipse, or a polygon is appropriately set according to the manufacturing method or application. .

  In the first and second embodiments, the deposition target is the quartz wafer 10, but the present invention is not limited to this. For example, lithium tantalate, lithium niobate, quartz, silicon, borosilicate glass, etc. Good.

A thin quartz wafer manufactured by the film-forming jig of the present invention can be processed into an optical component. For example, it can be applied to a liquid crystal projector and used as a high viewing angle film.
The thin quartz wafer manufactured by the film-forming jig of the present invention can be used for a quartz crystal resonator. For example, it can be processed into a vibrating piece that vibrates in a thickness-slip mode.

The block diagram which shows schematic structure of the jig | tool for film-forming in the 1st Embodiment of this invention. Sectional drawing which shows the formation process of the film-forming pattern using the jig | tool for film-forming in the 1st Embodiment of this invention. The perspective view which shows the film-forming pattern which concerns on the 1st, 2nd embodiment of this invention. Sectional drawing which shows the state before and behind the etching of a crystal wafer. The block diagram which shows schematic structure of the jig | tool for film-forming in the 2nd Embodiment of this invention. Sectional drawing which shows the formation process first half of the film-forming pattern using the film-forming jig | tool in the 2nd Embodiment of this invention. Sectional drawing which shows the formation process latter half of the film-forming pattern using the film-forming jig in the second embodiment of the present invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Jig for film-forming, 10 ... Quartz wafer as film-forming body, 11 ... Film-forming pattern, 20 ... Base member, 21 ... Magnet, 22 ... One side of base member, 30 ... Mask 101: Jig for film formation, 120 ... Base member, 121 ... Base plate, 122 ... Guide plate, 123 ... Magnet, 124 ... Recessed portion of guide plate, 130 ... Mask guide jig, 131 ... Mask guide plate , 132... Mask holding plate, 133... Concave portion as a positioning portion of the mask guide plate, 134.

Claims (4)

In a film-forming jig for forming a film-forming pattern on a film-forming body,
A base member capable of disposing a film-forming body on at least one surface and having magnetic force by an embedded magnet;
A magnetic mask member disposed on the one surface of the base member at a position attracted by the magnetic force of a magnet embedded in the base member;
When the deposition target is disposed on the base member, the deposition target can be interposed between the base member and the mask member;
The mask member has an outer shape smaller than that of the deposition target in plan view, and a part of the deposition target is exposed from the mask member over the entire circumference. .   The film forming jig according to claim 1, wherein the position of the mask member is fixed by a magnetic force generated between the magnet embedded in the base member and the mask member. The base member includes a base plate having a magnetic force by an embedded magnet;
A guide plate on which the deposition target is positioned and arranged,
The film forming jig according to claim 1, wherein the position of the mask member is fixed by a magnetic force generated between the magnet embedded in the base plate and the mask member. The film forming jig according to any one of claims 1 to 3, further comprising a mask guide jig having a mask guide plate and a mask holding plate,
The mask guide plate has a positioning part for positioning the mask member,
The film-forming jig, wherein the mask holding plate has a magnetic force by an embedded magnet and holds the mask member by the magnetic force.

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