TW202226448A - Cup-shaped chuck of substrate holding device, and substrate holding device - Google Patents
Cup-shaped chuck of substrate holding device, and substrate holding device Download PDFInfo
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- 239000000758 substrate Substances 0.000 title claims abstract description 129
- 238000007789 sealing Methods 0.000 claims abstract description 193
- 230000002093 peripheral effect Effects 0.000 claims abstract description 23
- 238000003825 pressing Methods 0.000 claims abstract description 18
- 239000011810 insulating material Substances 0.000 claims abstract description 10
- 238000009713 electroplating Methods 0.000 claims description 49
- 230000000903 blocking effect Effects 0.000 claims description 45
- 239000000463 material Substances 0.000 claims description 21
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 16
- 230000007797 corrosion Effects 0.000 claims description 11
- 238000005260 corrosion Methods 0.000 claims description 11
- 230000007423 decrease Effects 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 238000000034 method Methods 0.000 description 22
- 239000007788 liquid Substances 0.000 description 21
- 230000002209 hydrophobic effect Effects 0.000 description 19
- 239000000243 solution Substances 0.000 description 16
- 238000004140 cleaning Methods 0.000 description 14
- 238000012423 maintenance Methods 0.000 description 9
- 230000003746 surface roughness Effects 0.000 description 8
- 230000000694 effects Effects 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 229920001971 elastomer Polymers 0.000 description 4
- 229910052731 fluorine Inorganic materials 0.000 description 4
- 239000011737 fluorine Substances 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 3
- 239000002033 PVDF binder Substances 0.000 description 3
- 239000004809 Teflon Substances 0.000 description 3
- 229920006362 Teflon® Polymers 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 description 3
- 239000004800 polyvinyl chloride Substances 0.000 description 3
- 229920000915 polyvinyl chloride Polymers 0.000 description 3
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- -1 perfluoro Chemical group 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000002791 soaking Methods 0.000 description 2
- 239000004801 Chlorinated PVC Substances 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920002449 FKM Polymers 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 239000004813 Perfluoroalkoxy alkane Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- QCEUXSAXTBNJGO-UHFFFAOYSA-N [Ag].[Sn] Chemical compound [Ag].[Sn] QCEUXSAXTBNJGO-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000003570 air Substances 0.000 description 1
- 239000012080 ambient air Substances 0.000 description 1
- 229920000457 chlorinated polyvinyl chloride Polymers 0.000 description 1
- 230000009194 climbing Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 229920011301 perfluoro alkoxyl alkane Polymers 0.000 description 1
- 239000012994 photoredox catalyst Substances 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
- C25D17/08—Supporting racks, i.e. not for suspending
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/005—Contacting devices
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
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- Electroplating Methods And Accessories (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
本發明關於半導體電鍍技術領域,更具體地,關於一種電鍍時用於夾持基板的杯形夾盤及基板保持裝置。The present invention relates to the technical field of semiconductor electroplating, and more particularly, to a cup-shaped chuck and a substrate holding device for holding a substrate during electroplating.
固持基板的電鍍夾具是半導體電鍍設備的重要組成部分。電鍍夾具通常配置有接觸環和密封件,利用密封件使得電鍍液與接觸環隔離,避免接觸環與種子層接觸不良引起電鍍薄膜不均勻。因此,密封件的性能是保障電鍍工藝正常運行的關鍵因素。The electroplating fixture that holds the substrate is an important part of the semiconductor electroplating equipment. The electroplating fixture is usually equipped with a contact ring and a seal, and the seal is used to isolate the electroplating solution from the contact ring, so as to avoid the uneven electroplating film caused by poor contact between the contact ring and the seed layer. Therefore, the performance of the seal is a key factor in ensuring the normal operation of the electroplating process.
目前,電鍍夾具中的密封件在長期使用中依然存在不少問題。例如:1)如圖18所示,電鍍夾具採用全部包裹型密封件23,其暴露面積過大,外側面231以及底面233容易出現破損,尤其是在底面折彎部位232,密封件23破損後,電鍍液穿透密封件23與內部金屬基體22接觸會導致電流部分損失,使得基板上電鍍層厚度低於預定目標值,影響產品良率。2)密封件23內部包裹比較堅硬的金屬基體22,金屬基體22底部向上彎折形成支撐部221,其厚度只有1mm,很鋒利,密封件23包裹支撐部221形成密封唇部234,在電鍍工藝中,密封唇部234通過壓力與基板緊密接觸實現基板邊緣及背面密封,然而,密封唇部234長時間受力容易引起其老化破裂。3)電鍍夾具進行維護時需對接觸環25和密封件23進行清洗,然而現有電鍍夾具的內壓環24與接觸環25直接導電,且與外層金屬基體22之間無密封,採用線上噴射清洗或浸泡清洗時,清洗液或者電鍍液會沿著圖18所示箭頭滲透到電鍍夾具的內層,無法完成快速清洗和維護的目的,需要單獨拆散之後進行維護。At present, there are still many problems in the long-term use of the seals in the electroplating fixture. For example: 1) As shown in Figure 18, the electroplating fixture adopts all wrap-
本發明的目的是提供一種基板保持裝置的杯形夾盤,通過減小密封件的暴露面積,有效降低密封件的破損風險,此外,通過提高接觸環的安裝密封性,實現接觸環及密封件的線上清洗。The purpose of the present invention is to provide a cup-shaped chuck of a substrate holding device, which can effectively reduce the risk of damage to the seal by reducing the exposed area of the seal. online cleaning.
為了實現上述目的,本發明所提供的基板保持裝置的杯形夾盤,包括用於收容基板的杯形夾盤,杯形夾盤包括: 內壓環; 中間骨架,所述內壓環鎖緊在中間骨架的內周面; 密封件,所述密封件具有外端部、底部和內端部,所述密封件的外端部包覆至少部分中間骨架的外周面,密封件的底部包覆中間骨架的底部,並暴露於杯形夾盤的外部,密封件的內端部包覆至少部分中間骨架的內周面,通過內壓環將密封件的內端部壓緊在內壓環和中間骨架之間; 外壓環,所述外壓環採用絕緣材料,鎖緊在中間骨架的外周面,並通過外壓環將密封件的外端部壓緊在外壓環與中間骨架之間; 接觸環,所述接觸環位於密封件之上,並壓接在內壓環和中間骨架之間,內壓環與接觸環之間設置有密封圈。 In order to achieve the above object, the cup-shaped chuck of the substrate holding device provided by the present invention includes a cup-shaped chuck for accommodating a substrate, and the cup-shaped chuck includes: inner pressure ring; an intermediate frame, the inner pressure ring is locked on the inner peripheral surface of the intermediate frame; A seal, the seal has an outer end, a bottom and an inner end, the outer end of the seal covers at least part of the outer peripheral surface of the middle frame, the bottom of the seal covers the bottom of the middle frame, and is exposed to the Outside the cup-shaped chuck, the inner end of the seal covers at least part of the inner peripheral surface of the middle frame, and the inner end of the seal is pressed between the inner pressure ring and the middle frame by the inner pressure ring; an outer pressure ring, the outer pressure ring is made of insulating material, locked on the outer peripheral surface of the middle frame, and the outer end of the seal is pressed between the outer pressure ring and the middle frame through the outer pressure ring; The contact ring is located on the seal and is crimped between the inner pressure ring and the intermediate frame, and a sealing ring is arranged between the inner pressure ring and the contact ring.
通過採用絕緣外壓環,整體與密封件鎖緊,僅使密封件底部暴露,有利於減少密封件暴露面積及破損風險;通過在內壓環和中間骨架之間設置密封圈,有利於提高杯形夾盤的整體密封,避免電鍍液或清洗液滲入杯形夾盤內層。By using an insulating outer pressure ring, the whole is locked with the seal, and only the bottom of the seal is exposed, which is beneficial to reduce the exposed area of the seal and the risk of damage. The overall sealing of the cup-shaped chuck prevents the plating solution or cleaning solution from infiltrating the inner layer of the cup-shaped chuck.
較佳地,在所述基板保持裝置的杯形夾盤中,所述中間骨架的底部徑向水平向內形成水平支撐部,密封件的底部包裹水平支撐部,並於水平支撐部末端向上凸起形成密封唇部,密封唇部為一個或兩個以上,密封唇部用於與基板邊緣密封接觸。Preferably, in the cup-shaped chuck of the substrate holding device, the bottom of the intermediate frame forms a horizontal support portion radially and horizontally inward, and the bottom of the seal wraps the horizontal support portion and protrudes upward at the end of the horizontal support portion. A sealing lip portion is formed, and the sealing lip portion is one or more than two, and the sealing lip portion is used for sealing contact with the edge of the substrate.
密封唇部內部無硬質材料支撐,從而避免了密封唇部受壓時內層硬質支撐件對其的損傷,能夠延長密封件的使用壽命,同時,密封唇部徑向寬度可設計在1mm以下,以適應後續更窄的去邊工藝要求。密封唇部設置兩個以上時,能夠使密封件與基板邊緣之間形成多級密封,以實現更好的密封效果。There is no hard material support inside the sealing lip, so as to avoid the damage of the inner hard support when the sealing lip is pressed, which can prolong the service life of the seal. At the same time, the radial width of the sealing lip can be designed to be less than 1mm. In order to meet the subsequent narrower edge removal process requirements. When more than two sealing lips are provided, multi-stage sealing can be formed between the sealing element and the edge of the substrate, so as to achieve better sealing effect.
較佳地,在所述基板保持裝置的杯形夾盤中,當所述密封唇部為兩個以上時,兩個以上的密封唇部的高度相同。Preferably, in the cup chuck of the substrate holding device, when there are more than two sealing lips, the heights of the two or more sealing lips are the same.
較佳地,在所述基板保持裝置的杯形夾盤中,當所述密封唇部為兩個以上時,其中至少兩個密封唇部之間具有高度差。Preferably, in the cup chuck of the substrate holding device, when there are more than two sealing lips, at least two sealing lips have a height difference between them.
較佳地,在所述基板保持裝置的杯形夾盤中,密封唇部的高度沿徑向向內逐漸升高。Preferably, in the cup chuck of the substrate holding device, the height of the sealing lip gradually increases radially inward.
較佳地,在所述基板保持裝置的杯形夾盤中,密封唇部的高度沿徑向向內逐漸降低。Preferably, in the cup chuck of the substrate holding device, the height of the sealing lip gradually decreases radially inward.
較佳地,在所述基板保持裝置的杯形夾盤中,密封唇部的高度沿徑向呈高低交替排布。Preferably, in the cup-shaped chuck of the substrate holding device, the heights of the sealing lips are arranged alternately in the radial direction.
較佳地,在所述基板保持裝置的杯形夾盤中,當密封唇部為一個時,該一個密封唇部的徑向寬度不大於1mm,當密封唇部為兩個以上時,該兩個以上密封唇部的總徑向寬度不大於1mm。Preferably, in the cup-shaped chuck of the substrate holding device, when there is one sealing lip, the radial width of the one sealing lip is not more than 1 mm, and when there are more than two sealing lips, the two The total radial width of more than one sealing lip is not more than 1mm.
較佳地,在所述基板保持裝置的杯形夾盤中,當密封唇部為一個時,該一個密封唇部的徑向寬度為0.4mm~0.8mm,當密封唇部為兩個以上時,該兩個以上密封唇部的總徑向寬度為0.4mm~0.8mm。Preferably, in the cup-shaped chuck of the substrate holding device, when there is one sealing lip, the radial width of the one sealing lip is 0.4mm~0.8mm, and when there are more than two sealing lips , the total radial width of the two or more sealing lips is 0.4mm~0.8mm.
較佳地,在所述基板保持裝置的杯形夾盤中,所述密封件作為獨立配件與中間骨架可拆卸安裝。Preferably, in the cup-shaped chuck of the substrate holding device, the sealing member is detachably installed with the intermediate frame as an independent accessory.
較佳地,在所述基板保持裝置的杯形夾盤中,所述密封件通過粘合劑粘結在中間骨架上。Preferably, in the cup-shaped chuck of the substrate holding device, the sealing member is bonded to the intermediate frame by an adhesive.
較佳地,在所述基板保持裝置的杯形夾盤中,所述密封件與中間骨架的接觸面上形成有若干圈內密封凸起,相應地,中間骨架的表面開設有若干與內密封凸起相配合的密封槽。Preferably, in the cup-shaped chuck of the substrate holding device, several rings of inner sealing protrusions are formed on the contact surface of the sealing member and the intermediate frame. Correspondingly, the surface of the intermediate frame is provided with several inner seals. The protrusions match the sealing grooves.
多圈內密封凸起能夠在密封件和中間骨架之間形成多級密封,一旦密封件某處破損,多級密封能夠減少鍍液在杯形夾盤內層的擴散,減少鍍液對裝置的腐蝕。The multi-ring inner sealing protrusion can form a multi-stage seal between the seal and the intermediate skeleton. Once the seal is damaged somewhere, the multi-stage seal can reduce the diffusion of the plating solution in the inner layer of the cup-shaped chuck and reduce the impact of the plating solution on the device. corrosion.
較佳地,在所述基板保持裝置的杯形夾盤中,所述密封件與外壓環的接觸面形成有若干圈外密封凸起。Preferably, in the cup-shaped chuck of the substrate holding device, several rings of outer sealing protrusions are formed on the contact surface of the sealing member and the outer pressure ring.
多圈外密封凸起設置,能夠增強外壓環與中間骨架及密封件之間的密封。此外,多圈內密封凸起和多圈外密封凸起還有利於密封件與中間骨架裝配時的定位,使得兩部件的裝配更加精準。The multi-circle outer sealing protrusions are arranged to enhance the sealing between the outer pressure ring, the intermediate frame and the sealing element. In addition, the multi-circle inner sealing protrusion and the multi-circle outer sealing protrusion are also conducive to the positioning of the seal when assembling the intermediate frame, so that the assembly of the two components is more accurate.
較佳地,在所述基板保持裝置的杯形夾盤中,所述密封件具有疏水性。Preferably, in the cup chuck of the substrate holding device, the seal is hydrophobic.
密封件進行疏水性處理能夠減少液體在其表面的附著,密封件疏水性處理可使用疏水性材料、或者參雜疏水性材料、或者表面塗覆或濺射疏水性薄膜、或者降低表面粗糙度,優選地,密封件表面粗糙度Ra小於10nm。The hydrophobic treatment of the seal can reduce the adhesion of liquid on its surface. The hydrophobic treatment of the seal can use hydrophobic materials, or mix hydrophobic materials, or surface coating or sputtering hydrophobic films, or reduce surface roughness, Preferably, the surface roughness Ra of the seal is less than 10 nm.
較佳地,在所述基板保持裝置的杯形夾盤中,所述外壓環的外表面設有阻擋部。Preferably, in the cup-shaped chuck of the substrate holding device, the outer surface of the outer pressure ring is provided with a blocking portion.
通過在外壓環的外側形成阻擋部,能夠增加液體沿著外壓環的外側壁向上爬升的阻力,並引導液體改變流向,斜向下甩入設置在電鍍腔內的集液槽,進而避免杯形夾盤旋轉時,液體甩出電鍍腔,污染工藝環境。By forming a blocking portion on the outer side of the outer pressure ring, the resistance of the liquid rising up along the outer side wall of the outer pressure ring can be increased, and the liquid can be guided to change its flow direction and slanted downward into the sump set in the electroplating chamber, thereby avoiding the cup When the chuck is rotated, the liquid is thrown out of the electroplating chamber, polluting the process environment.
較佳地,在所述基板保持裝置的杯形夾盤中,所述阻擋部至少包括上阻擋部和/或下阻擋部,上阻擋部數量為一個以上,下阻擋部的數量為一個以上,上阻擋部為形成於外壓環頂端的向下環凸,下阻擋部為形成於外壓環中下部的向外環凸。Preferably, in the cup-shaped chuck of the substrate holding device, the blocking portion includes at least an upper blocking portion and/or a lower blocking portion, the number of the upper blocking portion is more than one, and the number of the lower blocking portion is more than one, The upper blocking part is a downward annular protrusion formed on the top end of the outer pressure ring, and the lower blocking part is an outward annular protrusion formed at the middle and lower part of the outer pressure ring.
較佳地,在所述基板保持裝置的杯形夾盤中,所述外壓環的表面具有疏水性。Preferably, in the cup-shaped chuck of the substrate holding device, the surface of the outer pressing ring has hydrophobicity.
外壓環進行疏水性處理能夠減少液體在其表面的附著。具體地,外壓環採用疏水性材料,或者參雜疏水性材料,或者表面設置疏水性薄膜,或者表面粗糙度Ra小於10nm。The hydrophobic treatment of the outer pressure ring can reduce the adhesion of liquid on its surface. Specifically, the outer pressure ring adopts a hydrophobic material, or is mixed with a hydrophobic material, or a hydrophobic film is arranged on the surface, or the surface roughness Ra is less than 10 nm.
較佳地,在所述基板保持裝置的杯形夾盤中,所述外壓環與密封件的接觸面上形成有若干凸點,內壓環與密封件的接觸面上形成有若干凸點。Preferably, in the cup-shaped chuck of the substrate holding device, a number of bumps are formed on the contact surface of the outer pressure ring and the seal, and a number of bumps are formed on the contact surface of the inner pressure ring and the seal. .
外壓環和內壓環與密封件接觸面上的凸點設置,能夠提高相互接觸部件之間的密封效果。The arrangement of bumps on the contact surfaces of the outer pressure ring and the inner pressure ring and the seal can improve the sealing effect between the parts in contact with each other.
較佳地,在所述基板保持裝置的杯形夾盤中,所述外壓環的底部設有若干支撐點。Preferably, in the cup-shaped chuck of the substrate holding device, the bottom of the outer pressure ring is provided with several support points.
外壓環底部設置的若干支撐點,在裝置維護時能夠起到支撐作用,使密封件與工作臺保持一定間隔,減少密封件損傷或玷污。Several support points set at the bottom of the outer pressure ring can play a supporting role during the maintenance of the device, keep the seal and the worktable at a certain distance, and reduce the damage or contamination of the seal.
較佳地,在所述基板保持裝置的杯形夾盤中,所述內壓環的材質為導電耐腐蝕金屬,接觸環通過內壓環與電鍍電源電連通。Preferably, in the cup-shaped chuck of the substrate holding device, the material of the inner pressure ring is a conductive and corrosion-resistant metal, and the contact ring is electrically connected to the electroplating power source through the inner pressure ring.
較佳地,在所述基板保持裝置的杯形夾盤中,所述內壓環的材質為絕緣材料,中間骨架的材質為導電金屬,接觸環通過中間骨架與電鍍電源電連通。Preferably, in the cup-shaped chuck of the substrate holding device, the material of the inner pressure ring is insulating material, the material of the intermediate frame is conductive metal, and the contact ring is electrically connected to the electroplating power source through the intermediate frame.
採用中間骨架電連通接觸環和電鍍電源,內壓環無需同時滿足導電性和耐腐蝕性,僅需具有耐腐性,即內壓環可以採用絕緣材料(諸如如PVC、PTFE、PVDF等),從而擴大了內壓環的選材範圍,有利於降低成本和實現杯形夾盤的線上清洗。The intermediate skeleton is used to electrically connect the contact ring and the electroplating power supply. The inner pressure ring does not need to satisfy both conductivity and corrosion resistance, but only needs to have corrosion resistance, that is, the inner pressure ring can be made of insulating materials (such as PVC, PTFE, PVDF, etc.), Thereby, the material selection range of the inner pressure ring is expanded, which is beneficial to reduce the cost and realize the online cleaning of the cup-shaped chuck.
在本發明中,還提出了一種基板保持裝置,包括: 上述任一項所述的杯形夾盤,用於保持基板; 夾盤板,抵靠基板背面以使基板與杯形夾盤的密封件擠壓接觸; 夾盤板驅動裝置,用於驅動夾盤板抵靠或遠離基板背面; 角度驅動裝置,用於調整由杯形夾盤和夾盤板夾持的基板的角度; 旋轉驅動裝置,用於驅動由杯形夾盤和夾盤板夾持的基板旋轉;以及 垂直驅動裝置,用於驅動由杯形夾盤和夾盤板夾持的基板上升或下降。 In the present invention, a substrate holding device is also proposed, comprising: The cup chuck of any of the above, for holding a substrate; a chuck plate abutting the back of the substrate so that the substrate is in pressing contact with the seal of the cup chuck; A chuck plate driving device for driving the chuck plate against or away from the back of the substrate; Angle drive device for adjusting the angle of the substrate clamped by the cup chuck and the chuck plate; a rotary drive for driving rotation of the substrate clamped by the cup chuck and the chuck plate; and The vertical drive device is used to drive the substrate clamped by the cup chuck and the chuck plate to ascend or descend.
較佳地,在所述基板保持裝置中,所述夾盤板包括基座,基座具有與基板的背面接觸的下表面,該下表面上開設有若干個排氣槽,基座的周緣上開設有與排氣槽連通的排氣孔。Preferably, in the substrate holding device, the chuck plate includes a base, the base has a lower surface in contact with the back surface of the substrate, the lower surface is provided with a plurality of exhaust grooves, and the peripheral edge of the base is An exhaust hole communicated with the exhaust groove is opened.
夾盤板上的排氣槽和排氣孔設置利於基板卸載時,夾盤板與基板的分離。The arrangement of the exhaust grooves and the exhaust holes on the chuck plate facilitates the separation of the chuck plate and the substrate when the substrate is unloaded.
較佳地,在所述基板保持裝置中,所述基座的下表面還設有朝基板方向凸出的接觸部,用以減少夾盤板與基板的接觸面積。Preferably, in the substrate holding device, the lower surface of the base is further provided with a contact portion protruding toward the substrate, so as to reduce the contact area between the chuck plate and the substrate.
本發明提出的基板保持裝置的杯形夾盤,一方面採用絕緣外壓環,整體與包覆有密封件的中間骨架鎖緊密封,使得密封件僅其底部暴露,大幅減少了密封件在電鍍液中的暴露面積,進而降低了密封件的破損風險,提升了裝置運行的可靠性;另一方面,內壓環與接觸環之間設置密封圈,使得接觸環的上下兩面均有可靠密封,在裝置維護時,尤其清理接觸環及密封件時,能有效阻隔處理液滲入杯形夾盤內層,無需拆解後再對各部件逐一維護,可實現線上清洗,提高了裝置維護的便捷性和效率,並降低了維護成本。The cup-shaped chuck of the substrate holding device proposed by the present invention adopts an insulating outer pressure ring, which is integrally locked and sealed with the intermediate frame covered with the sealing member, so that only the bottom of the sealing member is exposed, which greatly reduces the electroplating of the sealing member. The exposed area in the liquid reduces the risk of damage to the seal and improves the reliability of the device. During the maintenance of the device, especially when cleaning the contact ring and seals, it can effectively prevent the treatment liquid from infiltrating the inner layer of the cup-shaped chuck. It is not necessary to disassemble and then maintain each part one by one, which can realize online cleaning and improve the convenience of device maintenance. and efficiency, and reduce maintenance costs.
為詳細說明本發明的技術內容、構造特徵、所達成目的及效果,下面將結合實施例並配合圖式予以詳細說明。In order to describe the technical content, structural features, achieved objects and effects of the present invention in detail, the following will be described in detail with reference to the embodiments and the drawings.
圖1和圖2示出了本發明一實施中的基板保持裝置。基板保持裝置包括杯形夾盤11、夾盤板12、夾盤板驅動裝置13、角度驅動裝置14、旋轉驅動裝置16以及垂直驅動裝置等部件。杯形夾盤11中心形成穿透的容置空間110,容置空間110用於盛放基板10。夾盤板驅動裝置13通過萬向軸15連接夾盤板12,用以驅動夾盤板12上升和下降。具體地,參見圖3,夾盤板12由夾盤板驅動裝置13提升至遠離杯形夾盤11的基板裝載/卸載位置;當基板10由傳送機械手放入容置空間110後,參見圖4和圖5,夾盤板12由夾盤板驅動裝置13驅動向下運動使其抵靠在基板10的背面從而將基板10夾持在杯形夾盤11和夾盤板12之間。通常,基板保持裝置通過支撐板17連接到垂直驅動裝置(圖未示出),垂直驅動裝置驅動由杯形夾盤11和夾盤板12夾持的基板10上升或下降。角度驅動裝置14用於調整由杯形夾盤11和夾盤板12夾持的基板10在進入電鍍液的過程中基板10的角度,減少氣泡對電鍍工藝的影響。旋轉驅動裝置16用於電鍍工藝中驅動由杯形夾盤11和夾盤板12夾持的基板10旋轉,可以理解的是,當夾盤板12由夾盤板驅動裝置13提升至遠離杯形夾盤11而對杯形夾盤11進行清洗時,旋轉驅動裝置16也可以驅動杯形夾盤11旋轉。1 and 2 illustrate a substrate holding device in an embodiment of the present invention. The substrate holding device includes components such as a
參見圖5和圖6,杯形夾盤11包括內壓環111、中間骨架112和外壓環113,其中,內壓環111鎖緊在中間骨架112的內周面,外壓環113鎖緊在中間骨架112的外周面。外壓環113採用絕緣材料,在電鍍工藝中可以直接接觸電鍍液,不存在漏電問題,另外,外壓環113具有一定硬度,以便對其他部件起到支撐作用。具體地,外壓環113可選用PEEK、PVC、PVDF、PFA、CPVC、PE或PC等材料。5 and 6 , the cup-shaped
圖9示出了中間骨架的局部斷面圖。中間骨架112具有側壁1121,側壁1121的上端徑向向外延伸形成第一安裝台1122,側壁1121的下端徑向向內延伸形成第二安裝台1123,第二安裝台1123的端部斜向內延伸形成中間骨架112的底部,中間骨架112的底部末端徑向水平向內延伸形成水平支撐部1124,其中,第二安裝台1123、中間骨架112的底部以及水平支撐部1124作為中間骨架112的頭部,其表面包覆有密封件114,密封件114將在後文詳細介紹。再次參見圖5和圖6,外壓環113的內側壁上部形成第一臺階1131,外壓環113的內側壁下部形成第二臺階1132。當中間骨架112安裝於外壓環113內時,中間骨架112的第一安裝台1122壓緊在外壓環113的第一臺階1131上,中間骨架112的第二安裝台1123壓緊在外壓環113的第二臺階1132上。如圖9所示,中間骨架112的第一安裝台1122上表面間隔開設有若干個第一定位槽1125。內壓環111的上部設有若干個第一定位塊1111(如圖8所示),當內壓環111安裝於中間骨架112內時,內壓環111的第一定位塊1111壓緊在中間骨架112的第一定位槽1125內,內壓環111的下部壓緊在中間骨架112的第二安裝台1123上。Figure 9 shows a partial cross-sectional view of the intermediate skeleton. The
外壓環113的外表面設有阻擋部,用於防止杯形夾盤旋轉時,工藝液體,例如電鍍液沿外壓環113的外表面斜向上飛濺。該阻擋部至少包括上阻擋部和/或下阻擋部,上阻擋部數量為一個以上,下阻擋部的數量為一個以上,上阻擋部為形成於外壓環113頂端的向下環凸,下阻擋部為形成於外壓環113中下部的向外環凸。The outer surface of the
圖16(a)示出的外壓環113具有一個下阻擋部1133,該下阻擋部1133為形成於外壓環113中下部的向外環凸,其截面輪廓可以呈圓弧、橢圓弧、抛物線或矩形等任意可阻礙液體沿外壓環113外表面爬升或引導液體向下流動的形狀。在圖16(a)中,下阻擋部1133位於外壓環113的最下部,即與外壓環113的底面齊平,當然,可以理解地,在其他實施例中,下阻擋部1133高於外壓環113的底面,位於外壓環113的中下部,如圖16(b)所示。當杯形夾盤11旋轉時,下阻擋部1133的存在會增加液體沿著外壓環113的外側壁向上爬升的阻力,具體地,液體隨杯形夾盤11旋轉時將會沿圖16(a)實線箭頭斜向下甩入設置在電鍍腔內的集液槽,而不會沿著外壓環113的外側壁向上爬坡,進而沿圖16(a)虛線箭頭斜向上甩出電鍍腔,污染工藝環境。The
在其他實施例中,外壓環可設置兩個以上下阻擋部,可以更有效地阻止杯形夾盤旋轉時,液體沿外壓環的外側壁斜向上甩出。圖16(c)示出了外壓環113的下部具有兩個下阻擋部1133,兩個下阻擋部1133沿外壓環113的外表面上下排布,當然,可以理解地,在其他實施例中,下阻擋部1133的數量可以根據具體工藝要求確定,如下阻擋部1133數量還可設置為三個、四個或四個以上。兩個以上的下阻擋部1133的向外凸出寬度可以相同,也可以不同,例如,兩個以上的下阻擋部1133的向外凸出寬度可以自下向上逐漸增大,也可以自下向上逐漸減小。In other embodiments, the outer pressure ring can be provided with two or more upper and lower blocking parts, which can more effectively prevent the liquid from being thrown out obliquely upward along the outer side wall of the outer pressure ring when the cup chuck rotates. FIG. 16( c ) shows that the lower part of the
圖16(d)示出了另一外壓環的示意圖。外壓環113還具有上阻擋部1134,其為形成於外壓環113頂端的向下環凸,用於改變液體流向,使沿外壓環113的外側壁斜向上流動的液體經過上阻擋部1134時,液體順著向下凸起的上阻擋部1134斜向下流動。當杯形夾盤11旋轉時,即使部分液體越過下阻擋部1133爬升至外壓環113的頂部,也會被形成於外壓環113頂端的上阻擋部1134攔截,並在離心力作用下,斜向下甩入電鍍腔內設置的集液槽中,如圖16(d)實線箭頭所示,進而達到避免液體飛濺出電鍍腔,污染工藝環境的目的。在本實施例中,上阻擋部1134與外壓環113的外周面的夾角θ介於80°~120°之間,較佳地為90°。Figure 16(d) shows a schematic diagram of another outer pressure ring. The
在另一實施例中,上阻擋部1134的數量還可以為兩個以上(圖未示出),如兩個、三個、四個,兩個以上的上阻擋部1134沿徑向自內向外排布。兩個以上的上阻擋部1134的向下凸出高度可以相同,也可以不同,例如,兩個以上的上阻擋部1134的向下凸出高度可以自內向外逐漸升高,也可以自內向外逐漸降低。In another embodiment, the number of the
為減少電鍍液在外壓環113表面上的附著,外壓環113表面進行疏水性處理,例如降低外壓環113表面粗糙度,在本實施例中,外壓環113表面粗糙度Ra小於10nm,較佳的,外壓環113表面粗糙度Ra小於2nm;或者在外壓環113表面塗覆或濺射疏水性薄膜(諸如PTFE塗層);或者外壓環113採用疏水性材料,或者參雜疏水性材料製成。In order to reduce the adhesion of the electroplating solution on the surface of the
基板保持裝置還包括密封件114和接觸環115,其中,接觸環115通常具有安裝部和指部,安裝部壓緊在內壓環111和中間骨架112之間,將接觸環115安裝固定在杯形夾盤11中,指部的末端在電鍍工藝中與基板10的邊緣種子層接觸以向基板導電。如圖5和圖6所示,密封件114包覆在中間骨架112的內周面、底部以及外周面,在密封件114之上依次安裝有接觸環115和密封圈116,並由內壓環111壓緊在中間骨架112上,利用密封圈116密封杯形夾盤11的內層空間,與此同時,由密封件114和密封圈116在接觸環115上下兩側同時形成密封,從而有效避免電鍍結束後對杯形夾盤11的線上清洗或浸泡時清洗液或浸泡液滲入杯形夾盤11內部,即進入內壓環111和中間骨架112之間。其中,密封圈116可採用O型密封圈。The substrate holding device further includes a sealing
在本實施中,密封件114作為獨立配件,可以通過開模或注塑等工藝一體成型,與中間骨架112可拆卸安裝。具體地,密封件114整體包覆在中間骨架112的頭部,其兩端通過內壓環111和外壓環113鎖緊固定在中間骨架112上,在密封件114多次使用出現磨損,密封性能降低時,通過簡單地將杯形夾盤11拆開便可取下已破損的密封件,隨後更換新的密封件便可使設備重新投入使用,這能夠降低密封件更換的操作難度和成本。當然,在其他實施例中,為使得密封件114與中間骨架112的安裝更加牢固貼合,密封件114可以通過粘合劑粘結在中間骨架112上。In this embodiment, the sealing
密封件114可以選用氟橡膠(諸如全氟或者含氟橡膠)、矽橡膠等,硬度計檢測的硬度在50~90。具體地,密封件114根據不同的工藝應用可採用不同的材料,例如,在電鍍銅時可以採用密封性好且硬度較低的半含氟橡膠(如Viton氟橡膠),而在電鍍鎳或金等高溫電鍍工藝中,可採用全氟橡膠。在其他實施例中,通過對密封件114進行疏水性處理以使密封件114具有疏水性,減少電鍍液在密封件114表面上附著。密封件114可採用多種方式進行疏水性處理,例如:1)密封件114採用疏水性材料(如特氟龍);2)在密封件114表面做疏水性塗層(如特氟龍塗層);3)在密封件114內參雜疏水性材料(如參雜特氟龍);4)降低密封件114表面粗糙度,如密封件表面粗糙度Ra小於10nm,較佳地,小於2nm。The sealing
圖10示出了密封件的局部斷面圖。密封件114具有內端部1141、外端部1142和底部1143。參見圖6,內端部1141包覆在中間骨架112的內周面,並由內壓環111壓緊在中間骨架112的第二安裝台1123上表面,外端部1142包覆在中間骨架112的外周面,並由外壓環113的第二臺階1132鎖緊在中間骨架112的第二安裝台1123下表面,密封件114的底部1143包裹中間骨架112的底部,並向上彎折包裹中間骨架112的水平支撐部1124。參見圖10,密封件114在水平支撐部1124末端向上凸出形成密封唇部1144。密封唇部1144部位的厚度大於密封件114其他部位。當基板10裝載至杯形夾盤11後,夾盤板12下壓基板10的背面,以使基板10邊緣與密封唇部1144緊密貼合實現基板邊緣及背面密封。在本實施例中,密封唇部1144內部無金屬支撐且厚度增加,能夠有效延長密封件114的使用壽命,另外,密封唇部1144由於內部無金屬支撐,其徑向寬度僅由密封唇部1144自身寬度決定,可設計至1mm以下,較佳地,密封唇部1144徑向寬度為0.4mm~0.8mm,最優地,徑向寬度為0.8mm。密封唇部1144具有1mm以下的徑向寬度,可減小密封件114與基板10密封接觸時的壓邊寬度,能夠滿足後續越來越窄的去邊工藝要求。Figure 10 shows a partial cross-sectional view of the seal. The
在另一實施例中,密封件具有兩個以上密封唇部。密封唇部具有一定彈性,在夾盤板壓力作用下能夠產生略微形變,以使密封件的兩個以上密封唇部同時與基板密封接觸,實現杯形夾盤和基板之間的多級密封,達到更好的邊緣密封效果。兩個以上的密封唇部沿徑向內外分佈,密封唇部具有相同高度,或至少兩個密封唇部之間具有高度差,具體地,密封唇部沿徑向向內逐漸升高,或者沿徑向向內逐漸降低,或者沿徑向呈高低交替排布。此外,兩個以上密封唇部的總徑向寬度不大於1mm,較佳地,兩個以上密封唇部的總徑向寬度為0.4mm~0.8mm。In another embodiment, the seal has more than two sealing lips. The sealing lip has a certain elasticity, and can be slightly deformed under the pressure of the chuck plate, so that more than two sealing lips of the seal are in sealing contact with the substrate at the same time to achieve multi-stage sealing between the cup-shaped chuck and the substrate. To achieve better edge sealing effect. Two or more sealing lips are distributed radially inward and outward, and the sealing lips have the same height, or at least two sealing lips have a height difference between them. Gradually decrease radially inward, or alternately arrange high and low along the radial direction. In addition, the total radial width of the two or more sealing lips is not greater than 1 mm, and preferably, the total radial width of the two or more sealing lips is 0.4 mm˜0.8 mm.
圖17(a)~圖17(c)示出了具有兩個密封唇部的密封件的局部示意圖,兩個密封唇部沿徑向內外分佈,分別為內密封唇部1144a和外密封唇部1144b。參見圖17(a),內密封唇部1144a和外密封唇部1144b的高度相等,高度h約為0.3mm~0.5mm。參見圖17(b),內密封唇部1144a的高度h2大於外密封唇部1144b的高度h1,例如,內密封唇部1144a的高度h2為0.4mm,外密封唇部1144b的高度h1為0.35mm。參見圖17(c),內密封唇部1144a的高度h2小於外密封唇部1144b的高度h1,例如,內密封唇部1144a的高度h2為0.35mm,外密封唇部1144b的高度h1為0.4mm。Figures 17(a) to 17(c) show a partial schematic view of a seal with two sealing lips, which are distributed radially inward and outward, respectively an
圖17(a)~圖17(c)中內密封唇部1144a和外密封唇部1144b的徑向寬度之和不大於1mm,即a+b≤1mm,內密封唇部1144a的徑向寬度a和外密封唇部1144b徑向寬度b可以相同也可以不相同,較佳地,內密封唇部1144a的徑向寬度a小於外密封唇部1144b徑向寬度b,具體地,如圖17(c)所示,外密封唇部1144b的徑向寬度b為0.6mm,內密封唇部1144a的徑向寬度a為0.2mm。In Figures 17(a) to 17(c), the sum of the radial widths of the
在本實施中,外壓環113採用絕緣材料,具體地,包括其側面全部以及底部採用絕緣材料,並且外壓環113整體從外側與密封件114鎖緊密封,使得密封件114的暴露面積大幅減少,工藝時僅其底部1143暴露在電鍍液中,能夠有效降低密封件破損風險。In this embodiment, the
再次參見圖10,密封件114與外壓環113的接觸面形成有多圈外密封凸起1146,用於增強密封件114與外壓環113之間的密封。密封件114與中間骨架112接觸面形成有多圈內密封凸起1145,當密封件114包覆到中間骨架112,並由內壓環111和外壓環112鎖緊後,內密封凸起1145嵌入中間骨架112表面開設的密封槽1128內,一方面能夠實現密封件114與中間骨架112的緊密裝配,另一方面又能在密封件114內部形成多級密封,增強密封件114與中間骨架112之間的密封效果。當密封件114的底部1143發生破損時,多圈內密封凸起1145能夠有效阻止滲入的電鍍液在杯形夾盤11內部擴散,減少電鍍液對杯形夾盤11內部的腐蝕,從而可以通過簡單的更換密封件114使得基板保持裝置重新正常運行,有利於降低裝置的維護時間及成本。Referring to FIG. 10 again, the contact surface between the
由於依靠兩個平面貼合壓緊難以實現完全密封,內壓環111和外壓環113與密封件114的擠壓面設有若干凸點(圖未示出),通過凸點設計,使得內壓環111和外壓環113鎖緊時能與密封件114接觸面完全貼合,提高各部件之間的密封性。Since it is difficult to achieve complete sealing by pressing two planes together, the pressing surfaces of the
參見圖11,外壓環113的底部加工有凸點1137,當杯形夾盤11需要維修時,外壓環113底部的凸點1137能夠起到支撐作用,以使密封件114保持懸空,不與維修工作臺接觸,從而避免損傷密封件114或玷污密封件114的表面,在本實施例中,外壓環113底部凸點1137高度約為1mm。Referring to FIG. 11 , the bottom of the
在本實施例中,內壓環111採用導電材料,通常為導電金屬,接觸環115通過內壓環111與電鍍電源實現電連通。在另一實施例中,內壓環111和中間骨架112均採用導電材料,通常為導電金屬,電鍍電源與中間骨架112直接連通,中間骨架112經內壓環111與接觸環115實現電連通。由於多個工藝循環後,需要對杯形夾盤11進行維護,常會使用到硫酸、硝酸、錫銀退鍍液及各種表面活性劑等處理液,此時,內壓環111不可避免會與處理液接觸,因此,內壓環111不僅需要具有導電性,還需要具有耐腐性,對材質選擇的要求較高,需要採用導電耐腐蝕金屬,如鈦、鈦合金、不銹鋼等昂貴金屬材料,這將會增加製造及維護成本。In this embodiment, the
較佳地,在其他實施例中,中間骨架112採用導電材料,一般採用導電金屬,接觸環115通過中間骨架112與電鍍電源實現電連通,由於中間骨架112由密封件114及密封圈116密封,無論在電鍍工藝中還是裝置清洗時,中間骨架112均不與處理液接觸,不存在被處理液腐蝕的風險,因此,中間骨架112的材質僅需滿足導電性能即可,相對內壓環111作為電連接部件,降低了對材料的選擇要求,採用普通導電金屬即可,能夠有效降低製造及維護成本。此時,內壓環111僅需要具有耐腐蝕性即可,可採用耐腐性的絕緣材料,不再局限於耐腐蝕的導電材料,從而擴大了內壓環111的選材範圍,有利於降低成本和實現杯形夾盤11的線上清洗,在本實施例中,內壓環111可採用PVC、PEEK、PTFE、PVDF、PP等。Preferably, in other embodiments, the
參見圖7和圖8,杯形夾盤11的裝配過程如下。7 and 8, the assembly process of the
步驟一:將密封件114包覆在中間骨架112的頭部,即密封件114包覆在中間骨架112的第二安裝台1123、底部以及水平支撐部1124。Step 1: wrap the
步驟二:將包覆有密封件114的中間骨架112裝配到外壓環113內。外壓環113和中間骨架112的接觸面可以設有多個定位件,如圖8所示,外壓環113的內側壁開設有第二定位槽1135,中間骨架112的外側壁設有與第二定位槽1135配合的第二定位塊1120。Step 2: Assemble the
步驟三:將接觸環115安裝至中間骨架112上,其指部用於與基板邊緣上的種子層接觸進行導電。為便於裝配,參見圖9,中間骨架112的第二安裝台1123上設有若干定位柱1129,以便接觸環115沿定位柱1129安裝至中間骨架112的第二安裝台1123上,並位於密封件114之上。Step 3: Install the
步驟四:接觸環115安裝後,將內壓環111安裝到中間骨架112上,並壓住接觸環115。內壓環111周緣形成的第一定位塊1111搭接在中間骨架112頂部的第一定位槽1125內,在內壓環111的下表面安裝有密封圈116,當內壓環111與中間骨架112鎖緊時,密封圈116固定在內壓環111和接觸環115之間。Step 4: After the
步驟五:多個螺絲117穿過內壓環111上的第一螺絲孔1112和中間骨架112上的第二螺絲孔1126,將內壓環111鎖緊在中間骨架112的內周面,並使內壓環111的底部自上而下依次將密封圈116、接觸環115以及密封件114的內端部1141壓緊在中間骨架112的第二安裝台1123上;多個螺絲118穿過中間骨架112上的第三螺絲孔1127和外壓環113上的第四螺絲孔1136,將外壓環113鎖緊在中間骨架112的外周面,並將密封件114的外端部1142壓緊在外壓環113和中間骨架112之間。Step 5: A plurality of
圖12和圖13示出了本實施中夾盤板的透視圖。夾盤板12包括基座121,基座121具有基板10接觸的下表面,該下表面上開設有若干個排氣槽122,基座121的周緣上開設有與排氣槽122連通的排氣孔125。當夾盤板12壓在基板10背面時,通過夾盤板12周緣上設置的排氣孔125,使得基板10背面壓力與環境氣壓相等,從而利於電鍍工藝結束後基板10與夾盤板12分離,避免夾盤板12與基板10之間存在微負壓,將基板10吸附在夾盤板12上,影響基板10卸載操作。12 and 13 show perspective views of the chuck plate in this embodiment. The
再次參見圖13,基座121的下表面還設有朝基板10方向凸出的接觸部,具體地,接觸部可以為凸出於基座121下表面的若干接觸凸塊123,以及基座121的下邊緣形成的接觸環凸124。如圖14和圖15,接觸凸塊123和接觸環凸124的凸出高度相同,當夾盤板12與基板10接觸時,僅接觸凸塊123和接觸環凸124與基板10背面相接觸,而基座121的下表面其餘部分不與基板10接觸,一方面能夠減少夾盤板12與基板10的接觸面積,減少基板10背面的劃傷及玷污,另一方面利於基板10背面壓力與環境壓力相等以方便基板10卸載時與夾盤板12分離。Referring again to FIG. 13 , the lower surface of the
綜上所述,本發明通過上述實施方式及相關圖式說明,己具體、詳實的揭露了相關技術,使本領域的技術人員可以據以實施。而以上所述實施例只是用來說明本發明,而不是用來限制本發明的,本發明的權利範圍,應由本發明的申請專利範圍來界定。至於本文中所述元件數目的改變或等效元件的代替等仍都應屬於本發明的權利範圍。To sum up, the present invention has been described in detail and in detail through the above-mentioned embodiments and related drawings, so that those skilled in the art can implement it accordingly. The above-mentioned embodiments are only used to illustrate the present invention, rather than to limit the present invention, and the scope of rights of the present invention should be defined by the scope of the application for patent of the present invention. Changes in the number of elements described herein or substitution of equivalent elements should still fall within the scope of the present invention.
10:基板 11:杯形夾盤 110:容置空間 111:內壓環 1111:第一定位塊 1112:第一螺絲孔 112:中間骨架 1120:第二定位塊 1121:側壁 1122:第一安裝台 1123:第二安裝台 1124:水平支撐部 1125:第一定位槽 1126:第二螺絲孔 1127:第三螺絲孔 1128:密封槽 1129:定位柱 113:外壓環 1131:第一臺階 1132:第二臺階 1133:下阻擋部 1134:上阻擋部 1135:第二定位槽 1136:第四螺絲孔 1137:凸點 114:密封件 1141:內端部 1142:外端部 1143:底部 1144:密封唇部 1144a:內密封唇部 1144b:外密封唇部 1145:內密封凸起 1146:外密封凸起 115:接觸環 116:密封圈 117:螺絲 118:螺絲 12:夾盤板 121:基座 122:排氣槽 123:接觸凸塊 124:接觸環凸 125:第一定位槽 13:夾盤板驅動裝置 14:角度驅動裝置 15:萬向軸 16:旋轉驅動裝置 17:支撐板 22:金屬基體 221:支撐部 23:密封件 231:外側面 232:底面折彎部位 233:底面 234:密封唇部 24:內壓環 25:接觸環 10: Substrate 11: Cup Chuck 110: Accommodating space 111: inner pressure ring 1111: The first positioning block 1112: The first screw hole 112: Intermediate Skeleton 1120: Second positioning block 1121: Sidewall 1122: The first installation table 1123: Second Mounting Table 1124: Horizontal support 1125: The first positioning slot 1126: Second screw hole 1127: Third screw hole 1128: Seal groove 1129: Positioning Post 113: External pressure ring 1131: The first step 1132: Second step 1133: Lower Block 1134: Upper Block 1135: Second positioning slot 1136: Fourth screw hole 1137: bump 114: Seals 1141: Inner end 1142: Outer end 1143: Bottom 1144: Sealing lip 1144a: Inner sealing lip 1144b: Outer sealing lip 1145: Inner seal bulge 1146: Outer seal protrusion 115: Contact Ring 116: sealing ring 117: Screws 118: Screws 12: Chuck plate 121: Pedestal 122: exhaust slot 123: Contact bump 124: Contact ring convex 125: The first positioning slot 13: Chuck plate drive device 14: Angle drive device 15: Cardan shaft 16: Rotary drive 17: Support plate 22: Metal matrix 221: Support Department 23: Seals 231: outer side 232: Bottom bending part 233: Underside 234: Sealing lip 24: Internal pressure ring 25: Contact Ring
圖1揭示了本發明基板保持裝置的透視圖; 圖2揭示了本發明基板保持裝置的另一透視圖; 圖3揭示了本發明基板保持裝置的剖面圖; 圖4揭示了本發明基板保持裝置的另一剖面圖; 圖5揭示了圖4中A處局部放大圖; 圖6揭示了圖5中部分元件的放大圖; 圖7揭示了本發明中杯形夾盤的透視圖; 圖8揭示了本發明中杯形夾盤的爆炸圖; 圖9揭示了本發明中中間骨架的局部斷面圖; 圖10揭示了本發明中密封件的局部斷面圖; 圖11揭示了本發明中外壓環的透視圖; 圖12揭示了本發明中夾盤板的透視圖; 圖13揭示了本發明中夾盤板的另一透視圖; 圖14揭示了本發明中夾盤板的剖面圖; 圖15揭示了圖14中B處局部放大圖; 圖16(a)至圖16(d)揭示了不同形式的外壓環的示意圖; 圖17(a)至圖17(c)揭示了不同形式的密封件的局部示意圖; 圖18揭示了現有技術中電鍍夾具的部分元件放大圖。 Figure 1 discloses a perspective view of the substrate holding device of the present invention; Figure 2 discloses another perspective view of the substrate holding device of the present invention; Figure 3 discloses a cross-sectional view of the substrate holding device of the present invention; Fig. 4 discloses another cross-sectional view of the substrate holding device of the present invention; Fig. 5 discloses the partial enlarged view of A in Fig. 4; Figure 6 discloses an enlarged view of some of the elements in Figure 5; Figure 7 discloses a perspective view of the cup chuck of the present invention; Figure 8 discloses an exploded view of the cup chuck in the present invention; Figure 9 discloses a partial cross-sectional view of the intermediate frame of the present invention; Figure 10 discloses a partial cross-sectional view of the seal of the present invention; Figure 11 discloses a perspective view of the outer pressure ring of the present invention; Figure 12 discloses a perspective view of the chuck plate of the present invention; Figure 13 discloses another perspective view of the chuck plate of the present invention; Figure 14 discloses a cross-sectional view of the chuck plate of the present invention; Fig. 15 discloses a partial enlarged view at B in Fig. 14; Figures 16(a) to 16(d) reveal schematic diagrams of different forms of external pressure rings; Figures 17(a) to 17(c) reveal partial schematic views of different forms of seals; Figure 18 discloses an enlarged view of some elements of a prior art electroplating fixture.
11:杯形夾盤 11: Cup Chuck
110:容置空間 110: Accommodating space
12:夾盤板 12: Chuck plate
13:夾盤板驅動裝置 13: Chuck plate drive device
14:角度驅動裝置 14: Angle drive device
17:支撐板 17: Support plate
Claims (24)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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CN202011502680.9 | 2020-12-18 | ||
CN202011502680.9A CN114645311A (en) | 2020-12-18 | 2020-12-18 | Cup-shaped chuck of substrate holding device and substrate holding device |
Publications (1)
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TW202226448A true TW202226448A (en) | 2022-07-01 |
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TW110147599A TW202226448A (en) | 2020-12-18 | 2021-12-17 | Cup-shaped chuck of substrate holding device, and substrate holding device |
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US (1) | US20240035189A1 (en) |
EP (1) | EP4265825A1 (en) |
JP (1) | JP2023553742A (en) |
KR (1) | KR20230121870A (en) |
CN (1) | CN114645311A (en) |
TW (1) | TW202226448A (en) |
WO (1) | WO2022127515A1 (en) |
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CN115142104B (en) * | 2022-07-28 | 2024-04-26 | 福州一策仪器有限公司 | Electroplating device, multichannel electroplating device group and electroplating reaction system |
KR102526481B1 (en) * | 2023-01-31 | 2023-04-27 | 하이쎄미코(주) | Cup cell for wafer plating |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
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US7935231B2 (en) * | 2007-10-31 | 2011-05-03 | Novellus Systems, Inc. | Rapidly cleanable electroplating cup assembly |
US9512538B2 (en) * | 2008-12-10 | 2016-12-06 | Novellus Systems, Inc. | Plating cup with contoured cup bottom |
JP5237924B2 (en) * | 2008-12-10 | 2013-07-17 | ノベルス・システムズ・インコーポレーテッド | Base plate and electroplating apparatus |
JP6633756B2 (en) * | 2015-12-04 | 2020-01-22 | エーシーエム リサーチ (シャンハイ) インコーポレーテッド | Substrate holding device |
CN111032923B (en) * | 2017-08-30 | 2021-12-28 | 盛美半导体设备(上海)股份有限公司 | Electroplating device |
SG11202001662SA (en) * | 2017-09-07 | 2020-03-30 | Acm Res Shanghai Inc | Plating chuck |
JP7256027B2 (en) * | 2019-02-20 | 2023-04-11 | 株式会社荏原製作所 | Substrate holder and plating apparatus equipped with the substrate holder |
-
2020
- 2020-12-18 CN CN202011502680.9A patent/CN114645311A/en active Pending
-
2021
- 2021-11-19 KR KR1020237024370A patent/KR20230121870A/en unknown
- 2021-11-19 WO PCT/CN2021/131846 patent/WO2022127515A1/en active Application Filing
- 2021-11-19 US US18/258,448 patent/US20240035189A1/en active Pending
- 2021-11-19 JP JP2023537175A patent/JP2023553742A/en active Pending
- 2021-11-19 EP EP21905444.2A patent/EP4265825A1/en active Pending
- 2021-12-17 TW TW110147599A patent/TW202226448A/en unknown
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EP4265825A1 (en) | 2023-10-25 |
WO2022127515A1 (en) | 2022-06-23 |
JP2023553742A (en) | 2023-12-25 |
CN114645311A (en) | 2022-06-21 |
US20240035189A1 (en) | 2024-02-01 |
KR20230121870A (en) | 2023-08-21 |
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