TW202033837A - Plating chuck - Google Patents

Abstract

The present invention discloses a plating chuck for retaining a substrate in a plating process. The substrate includes a gap region and a graph region adjacent to the gap region. The plating chuck includes a cover plate which is configured to cover the gap region of the substrate. When the substrate is plated, an electric field in the gap region is shielded. Moreover, the portion covered by the cover plate is adjacent to the graph region of the substrate, and the plating chuck further includes a protection shield having a bottom wall upward extended therefrom a side wall having a top outward extended therefrom a top wall, wherein the bottom wall protrudes horizontally to form the cover plate.

Description

Electroplating chuck

The present invention relates to an electroplating device for depositing a metal thin film on a substrate, and more specifically, to an electroplating chuck for holding the substrate during an electroplating process, which can improve the uniformity of the plating layer near the notch area on the substrate.

In the manufacturing process of semiconductor devices, electroplating is a commonly used method for depositing metal thin films on substrates. In particular, in advanced packaging technology, electroplating is usually used to form copper pillars and solder joints on the substrate to realize the interconnection of the wafer substrate. The reason is that electroplating has the advantages of simple process, low cost, and easy mass production.

In the mass production of wafer-level packaging, the product substrate provided has a notch area on its edge. The notch area is covered with photoresist, so the notch area is not conductive, so it cannot be electroplated during the electroplating process. Although the notch area cannot be plated is not a problem for the notch area, the problem is that the lack of plating in the notch area will cause the pattern area adjacent to the notch area to be over-plated, and eventually cause the plated pillar height of the pattern area adjacent to the notch area to be higher than the target value. .

Two typical notched areas are shown in Figure 19A and Figure 19B. Specifically, FIG. 19A illustrates that the substrate 513 has an arched notch area. 5131 and a pattern area 5132 adjacent to the notch area 5131. FIG. 19B shows that the substrate 713 has a substantially square notch area 7131 and a pattern area 7132 adjacent to the notch area 7131. During the electroplating process, since the notch area 5131,7131 cannot be electroplated, the electric field of the pattern area 5132,7132 will increase, resulting in that the amount of electrodeposition in the pattern area 5132,7132 is higher than that of other pattern areas on the substrate 513,713. Therefore, The height of the plated pillars at the pattern areas 5132 and 7132 exceeds the process requirements. As shown in FIG. 20A, FIG. 20A reveals the basic principle of why the pattern area adjacent to the notch area is over-plated. Since the notch area 2031 is non-conductive, during the electroplating process, power lines are transmitted from the dummy anode 2001 corresponding to the notch area 2031 to the pattern area 2032 adjacent to the notch area 2031, resulting in excessive plating of the pattern area 2032.

Therefore, the gist of the present invention is to provide an electroplating chuck for holding a substrate in an electroplating process. The substrate includes a notch area and a pattern area adjacent to the notch area. The electroplating chuck includes a cover plate configured to cover the notch area of the substrate to shield the electric field in the notch area when the substrate is electroplated.

During the electroplating process, the present invention uses the cover plate to cover the notch area of the substrate. Therefore, the power line of the virtual anode corresponding to the notch area is masked, which reduces the influence on the pattern area adjacent to the notch area, thereby further reducing The plating thickness of the pattern area adjacent to the notch area improves the uniformity of the substrate plating. Preferably, the cover plate also covers part of the area adjacent to the gap The pattern area reduces the electric field of the pattern area adjacent to the notch area, thereby reducing the plating thickness of the pattern area adjacent to the notch area.

100‧‧‧Substrate holding device

101‧‧‧Cup chuck

102‧‧‧Chuck plate

103‧‧‧Vertical drive

104‧‧‧Angle control drive device

105‧‧‧Cardan shaft

106‧‧‧Rotary drive device

107‧‧‧Gas pipeline

108‧‧‧O-ring

109‧‧‧Fixed ring

110‧‧‧screw

111‧‧‧Seal

112‧‧‧Contact ring

113‧‧‧Substrate

200‧‧‧Plating Chuck

201‧‧‧Conductive ring

202‧‧‧Press plate

301‧‧‧droplets

513‧‧‧Substrate

713‧‧‧Substrate

1011‧‧‧Base

1012‧‧‧Receiving space

1013‧‧‧Edge

1014‧‧‧Support

1015‧‧‧Groove

1016‧‧‧First screw hole

1021‧‧‧Slot

1111‧‧‧Bottom

1112‧‧‧Outer wall

1113‧‧‧Protrusion

1114‧‧‧Inner Wall

1115‧‧‧Lip seal

1116‧‧‧Fixed part

1121‧‧‧Main body

1122‧‧‧First Finger

1123‧‧‧Second Finger

1124‧‧‧Second screw hole

2011‧‧‧Finger Shape

2021‧‧‧Slope

2031‧‧‧Gap area

2032‧‧‧Graphic area

2040‧‧‧Shield

2041‧‧‧Bottom wall

2042‧‧‧Sidewall

2043‧‧‧Top Wall

2044‧‧‧Cover plate

2045‧‧‧ Opening

2640‧‧‧Shield

2641‧‧‧Bottom Wall

2642‧‧‧Wall

2643‧‧‧Top Wall

2644‧‧‧Cover plate

2645‧‧‧Hole

2711‧‧‧Seal

3001‧‧‧Virtual anode

3011‧‧‧Seal

3031‧‧‧Gap area

3032‧‧‧Graphic area

3033‧‧‧Cover plate

5131‧‧‧Gap area

5132‧‧‧Graphic area

7131‧‧‧Gap area

7132‧‧‧Graphic area

27111‧‧‧Bottom wall

27112‧‧‧Outer Wall

27113‧‧‧Protrusion

27114‧‧‧Inner Wall

27115‧‧‧Lip seal

27116‧‧‧Fixed part

27117‧‧‧Cover plate

27118‧‧‧Opening

30111‧‧‧Bottom

30112‧‧‧Outer wall

30113‧‧‧Protrusion

30114‧‧‧Inner wall

30115‧‧‧Lip seal

30116‧‧‧Fixed part

30117‧‧‧Cover plate

30118‧‧‧Hole

Fig. 1 discloses a perspective view of the device for holding a substrate of the present invention.

Figure 2 discloses a top view of the substrate holding device of the present invention.

Fig. 3 discloses a cross-sectional view along A-A in Fig. 2.

Fig. 4 discloses a partial enlarged view of part D in Fig. 3.

Fig. 5 discloses a partial enlarged view of part H in Fig. 4.

Figure 6 discloses an exploded view of the cup-shaped chuck, contact ring and seal of the device.

Figure 7 discloses a perspective view of the seal of the device.

Figure 8 reveals a top view of the seal.

Fig. 9 reveals a cross-sectional view along B-B in Fig. 8.

Fig. 10 shows a partial enlarged view of part F in Fig. 9.

Figure 11 discloses a cross-sectional view of the contact ring of the device.

Fig. 12 discloses a partial enlarged view of part G in Fig. 11.

Figure 13 discloses a perspective view of a pressure plate and a conductive ring according to another embodiment of the present invention.

Figure 14 reveals a top view of the pressure plate and conductive ring.

Fig. 15 shows a cross-sectional view along C-C in Fig. 14.

Fig. 16 discloses a partial enlarged view of the J part in Fig. 15.

Figures 17a-17f reveal substrates of various shapes.

Figure 18 reveals the basic principle of hydrophobicity.

Figures 19A and 19B reveal two typical gap regions.

FIG. 20A reveals the basic principle why the pattern area adjacent to the notch area is over-plated in the prior art.

Figure 20B reveals the basic principle of the present invention.

Figure 21 reveals the effect comparison chart.

Figure 22 shows a bottom view of an electroplating chuck according to an embodiment of the invention.

Figure 23 discloses a cross-sectional view of the electroplating chuck.

Fig. 24 discloses a partial enlarged view of Fig. 23.

Figure 25 discloses a perspective view of the shield of the plating chuck.

Figure 26 discloses a perspective view of a shield according to another embodiment of the present invention.

Fig. 27 discloses a perspective view of a seal according to another embodiment of the present invention.

Figure 28 discloses a cross-sectional view of the seal shown in Figure 27.

Figure 29 discloses a partial enlarged view of Figure 28.

Figure 30 discloses a perspective view of a seal according to yet another embodiment of the present invention.

Figure 31 discloses a cross-sectional view of the seal shown in Figure 30.

Fig. 32 discloses a partial enlarged view of Fig. 31.

Figures 33A to 33H illustrate various shapes of cover plates of the present invention.

The present invention provides a substrate holding device for holding a substrate during substrate processing, for example, immersing the substrate in an electrolyte for electroplating. When the substrate is immersed in the electrolyte to electroplate the metal layer on the front surface of the substrate, the edges of the front surface of the substrate and the back surface of the substrate need to be protected to avoid contact with the electrolyte. Therefore, the difference from the prior art is that when the substrate is immersed in the electrolyte for electroplating, the The substrate holding device of the invention uses a seal to prevent the electrolyte from contacting the edge of the front surface of the substrate and the back of the substrate, and the seal is replaceable.

1 to 6 show the substrate holding device 100 of the present invention. The substrate holding device 100 includes a cup-shaped chuck 101 and a chuck plate 102. The cup-shaped chuck 101 includes a cup-shaped base 1011, and the base 1011 encloses a penetrating receiving space 1012. The base 1011 has a bottom wall, an outer surface of the side wall, and an inner surface of the side wall. The inner surface of the side wall of the base 1011 is inclined, which is beneficial for loading the substrate 113. The upper end of the base 1011 extends outward to form a rim 1013. The inner surface of the side wall of the base 1011 protrudes upwards obliquely to form a supporting portion 1014 which is located at the lower end of the base 1011. When the substrate 113 is put into the receiving space 1012, the supporting part 1014 carries the substrate 113. A groove 1015 is opened at the lower end of the base 1011. The cup-shaped chuck 101 is made of metal or carbonized fiber material, such as stainless steel, titanium, tantalum, aluminum alloy and so on.

The chuck plate 102 is connected to the vertical driving device 103 through a universal shaft 105. The vertical driving device 103 drives the chuck plate 102 to rise or fall. When the substrate 113 is loaded into the receiving space 1012 and supported by the supporting portion 1014, the vertical driving device 103 drives the chuck plate 102 to descend and press on the back of the substrate 113, and therefore, the substrate 113 is held by the cup-shaped chuck 101 and the chuck plate 102. Clamping. The front surface of the substrate 113 is exposed for processing. After the process is finished, the vertical driving device 103 drives the chuck plate 102 to rise, the chuck plate 102 leaves the back of the substrate 113, and then the substrate 113 is taken out of the receiving space 1012. The vertical driving device 103 may be a cylinder or a motor. The side of the chuck plate 102 in contact with the back of the substrate 113 is provided with a plurality of slots 1021. When the chuck plate 102 leaves the back of the substrate 113, air can easily enter the chuck plate 102 and the substrate 113 through the slots 1021 The space between the back surfaces allows the substrate 113 to be easily separated from the chuck plate 102. In order to make the substrate 113 more easily detach from the chuck plate 102, nitrogen gas can be vented to the back of the substrate 113 through a gas pipe 107 provided in the universal joint shaft 105. The chuck plate 102 is made of materials such as polypropylene (PP), polyvinylidene fluoride (PVDF), polyether ether ketone (PEEK), or polyethylene terephthalate (PET).

An O-shaped sealing ring 108 is provided between the chuck plate 102 and the cup-shaped chuck 101. When the chuck plate 102 is lowered by the vertical driving device 103 to clamp the substrate 113, the O-shaped sealing ring 108 acts as a buffer effect. In addition, when the substrate 113 is immersed in the electrolyte for electroplating, the O-ring 108 can prevent the electrolyte from entering the receiving space 1012. In order to meet different process requirements, the substrate holding device 100 further includes an angle control driving device 104 and a rotation driving device 106. When the chuck plate 102 and the cup chuck 101 fix the substrate 113 for process processing, the angle control driving device 104 drives the chuck plate 102 and the cup chuck 101 to incline by an angle. When the chuck plate 102 and the cup chuck 101 fix the substrate 113 for process processing, the rotation driving device 106 drives the chuck plate 102 and the cup chuck 101 to rotate.

Referring to FIGS. 7 to 10, the sealing member 111 of the substrate holding device 100 is illustrated. The seal 111 includes a bottom 1111, an outer wall 1112, and an inner wall 1114. The top end of the outer wall 1112 is provided with a protrusion 1113. The inner wall 1114 is curved to form a lip seal 1115. The end of the inner wall 1114 connected with the lip seal portion 1115 extends horizontally to form a fixing portion 1116. The seal 111 wraps the cup-shaped chuck 101. Specifically, as shown in FIGS. 4 and 5, the bottom 1111 of the sealing member 111 wraps the bottom wall of the base 1011 of the cup-shaped chuck 101, and the outer wall 1112 of the sealing member 111 The outer surface of the side wall of the base portion 1011 of the cup-shaped chuck 101 is wrapped, and the lip-shaped seal portion 1115 wraps the support portion 1014 of the cup-shaped chuck 101. The fixing portion 1116 of the sealing member 111 is located in the groove 1015 of the cup-shaped chuck 101. In order to fix the seal 111 and the cup-shaped chuck 101 together, a fixing ring 109 is provided at the bottom of the edge 1013 of the cup-shaped chuck 101. The fixing ring 109 squeezes the protrusion 1113 of the sealing member 111, and then the fixing ring 109 is fixed to the bottom of the edge 1013 of the cup-shaped chuck 101 by a plurality of screws 110. The thickness of the sealing member 111 is 0.1 mm-2 mm, preferably 0.3 mm-1 mm. During the wet process, the lip seal portion 1115 of the seal 111 seals the edge of the front surface of the substrate 113 so that the chemical liquid cannot touch the edge of the front surface of the substrate 113 and the back surface of the substrate 113. Therefore, after the wet process is completed, the edges of the front surface of the substrate 113 and the back surface of the substrate 113 are dry. In addition, since the sealing member 111 wraps the cup-shaped chuck 101, the sealing member 111 protects the cup-shaped chuck 101 and prevents the cup-shaped chuck 101 from contacting the chemical liquid, and prevents the cup-shaped chuck 101 from being corroded by the chemical liquid. With the protection of the sealing member 111, the substrate 113 carried by the substrate holding device 100 can be immersed in a chemical liquid for processing, such as electroplating. In order to prevent the chemical liquid from corroding the fixing ring 109 and the screw 110, the liquid level of the chemical liquid is lower than the fixing ring 109.

The sealing element 111 is integrally formed, and the material of the sealing element 111 can be rubber, such as fluorine rubber, silicon rubber, or nitrile rubber. The material of the sealing member 111 can also be plastic, such as polytetrafluoroethylene. The material used to manufacture the sealing member 111 is soft and has a certain hardness, and the hardness of the material is 20-70 detected by the durometer, preferably 40-60. The material of the sealing member 111 is hydrophobic, and the surface roughness of the material is Ra<8μm. As shown in Figure 18, when the contact angle Φ between the droplet 301 and the substrate 313 is greater than 90°, the substrate 313 has It is hydrophobic, and the contact angle Φ is related to the surface roughness of the material. When the surface roughness of the material increases, the contact angle Φ becomes smaller. If the surface of the material is too rough, larger than 8μm, the sealing effect will deteriorate. Therefore, in order to achieve a good sealing effect, the surface roughness of the material is preferably less than 5μm.

The inner wall 1114 of the sealing member 111 is inclined at a certain angle α relative to the horizontal plane, and α is less than 90°. When the substrate 113 needs to be immersed in the electrolyte for electroplating, the substrate holding device 100 carries the substrate 113, and then the substrate holding device 100 moves from the loading or unloading position to the process position. The substrate 113 is completely immersed in the electrolyte. During the electroplating process, the substrate holding device 100 rotates at a speed of 3-200 rpm. When the substrate 113 is immersed in the electrolyte, air can be discharged along the inner wall 1114 of the sealing member 111. On the other hand, during the electroplating process, hydrogen gas will be generated on the front surface of the substrate 113, and air bubbles can be discharged along the inner wall 1114 of the sealing member 111. Otherwise, air or air bubbles will cause the problem of voids in the deposited metal.

When the substrate holding device 100 is used to plate a metal layer on the front surface of the substrate 113, the contact ring 112 is used to conduct current. As shown in FIGS. 11 and 12, the contact ring 112 includes a main body portion 1121, a plurality of first finger portions 1122 and a plurality of second finger portions 1123. In order to install the contact ring 112, the lower end of the base 1011 of the cup-shaped chuck 101 is detachable. In order to explain more clearly, in this article, the lower end of the base 1011 of the cup-shaped chuck 101 is named the base. The bottom of the base is provided with a plurality of first screw holes 1016, and the main body portion 1121 of the contact ring 112 is provided with a plurality of second screw holes 1124. A plurality of screws 114 pass through the first screw hole 1016 and the second screw hole 1124 to fix the main body 1121 of the contact ring 112 and the base of the cup chuck 101 and the base 1011 of the cup chuck 101 together. Multiple first fingers 1122 contacts the seed layer at the front edge of the substrate 113, and the contact point is located less than 2 mm from the outer edge of the substrate 113. During the electroplating process, the substrate 113 is connected to the power electrode, and current is conducted through the contact ring 112. The cup chuck 101 is made of a conductive material to conduct current. The plurality of second finger portions 1123 press the fixing portion 1116 of the sealing member 111 to fix the fixing portion 1116 of the sealing member 111 in the groove 1015 of the cup-shaped chuck 101 to prevent the sealing member 111 from being removed from the cup-shaped chuck 101 Fall off. The first finger portion 1122 and the second finger portion 1123 are alternately arranged. For a 300mm substrate, the number of first finger portions 1122 should not be less than 200. If the number of the first fingers 1122 is too small, the current distribution on the substrate 113 will be uneven, and the deposition rate on the substrate 113 will be uneven. The contact ring 112 is made of conductive materials, such as stainless steel, copper, titanium, iridium, tantalum, gold, silver, platinum, and other similar alloys. The contact ring 112 may also be made of stainless steel, titanium, tantalum, or aluminum with platinum coating or gold coating. The contact ring 112 can also be made of other highly conductive materials. Preferably, the contact ring 112 is made of spring steel.

As shown in FIGS. 17a-17f, the shape of the substrate 113 may be a circle, an ellipse, a triangle, a square, a rectangle, an octagon, and the like. Correspondingly, the cup-shaped chuck 101 and the chuck plate 102 are designed to match the shape of the base plate 113.

To assemble the seal 111 and the contact ring 112, first, remove the base from the base 1011 of the cup chuck 101, and then the lip seal portion 1115 of the seal 111 wraps the support portion 1014 of the cup chuck 101 and seals The fixing portion 1116 of the piece 111 is located in the groove 1015 of the cup-shaped chuck 101. Use multiple screws to fix the main body portion 1121 of the contact ring 112 to the bottom of the cup chuck 101 On the seat, the second finger portion 1123 of the contact ring 112 presses the fixing portion 1116 of the sealing member 111 into the groove 1015 of the cup-shaped chuck 101. Then, a plurality of screws 114 pass through the first screw hole 1016 on the cup chuck 101 and the second screw hole 1124 on the contact ring 112 to fix the base and the base 1011 of the cup chuck 101 together. Subsequently, the bottom 1111 and the outer wall 1112 of the sealing member 111 respectively wrap the outer surface of the bottom wall and the side wall of the base 1011 of the cup-shaped chuck 101. Finally, the fixing ring 109 is fixed to the bottom of the edge 1013 of the cup-shaped chuck 101 by a plurality of screws 110, and the fixing ring 109 presses the protrusion 1113 of the sealing member 111.

The electroplating process using the substrate holding device 100 includes the following steps:

Step 1: Move the substrate holding device 100 to the loading or unloading position.

Step 2: The vertical driving device 103 drives the chuck plate 102 to rise.

Step 3: Load the substrate 113 on the lip seal portion 1115 of the sealing member 111, and the substrate 113 is exposed from the front face downward.

Step 4: The vertical driving device 103 drives the chuck plate 102 to lower and clamp the substrate 113, the lip seal portion 1115 of the seal 111 seals the edge of the front surface of the substrate 113, and the first fingers 1112 of the contact ring 112 contact the substrate 113 The seed layer at the front edge.

Step 5: The angle control driving device 104 drives the chuck plate 102 and the cup-shaped chuck 101 to incline at a certain angle.

Step 6: The rotation driving device 106 drives the chuck plate 102 and the cup-shaped chuck 101 to rotate at a preset rotation speed, and at the same time, the substrate holding device 100 moves to the process position where the substrate 113 is immersed in the electrolyte.

Step 7: The angle control driving device 104 drives the chuck plate 102 and the cup-shaped chuck 101 to rotate, so that the chuck plate 102 and the cup-shaped chuck 101 maintain a vertical state.

Step 8: Turn on the power, and plate a metal layer on the front surface of the substrate 113.

Step 9: After the electroplating process is completed, the substrate holding device 100 moves to the washing position, and then rotates at a high speed to wash away the electrolyte on the surface of the substrate 113.

Step 10: The substrate holding device 100 is moved to the unloading position, nitrogen gas is supplied to the back of the substrate 113, the vertical driving device 103 drives the chuck plate 102 to rise, and then the substrate 113 is removed from the lip seal 1115 of the seal 111.

In summary, the substrate holding device 100 of the present invention uses the sealing member 111 to wrap the cup-shaped chuck 101. When the substrate holding device 100 is used to hold the substrate 113 and the substrate 113 is immersed in the electrolyte for electroplating, the sealing member 111 protects the substrate The edge of the front of 113, the back of the substrate 113 and the contact ring 112 in the cup-shaped chuck 101 prevent the edge of the front of the substrate 113, the back of the substrate 113 and the contact ring 112 in the cup-shaped chuck 101 from contacting the electrolyte. The sealing member 111 is soft, and the hardness of the material made of the cup-shaped chuck 101 is higher than that of the sealing member 111. When the sealing member 111 wraps the cup-shaped chuck 101, the cup-shaped chuck 101 will not be deformed. Therefore, after the substrate 113 is clamped, the sealing member 111 gently seals the substrate surface without causing damage to the substrate surface. The seal 111 has a good sealing effect. In addition, the thickness of the sealing member 111 is relatively thick, and therefore, the service life of the sealing member 111 is long. In addition, after the substrate holding device 100 is used for a period of time, only the contact ring 112 and the sealing member 111 need to be replaced, and no other parts of the substrate holding device 100 need to be replaced, which reduces the production cost.

As shown in FIGS. 13 to 16, in another specific embodiment, a conductive ring 201 for conducting current and a pressing plate 202 for fixing the seal 111 are provided. The combined function of the conductive ring 201 and the pressure plate 202 is the same as the function of the contact ring 112. Therefore, the combination of the conductive ring 201 and the pressure plate 202 can replace the contact ring 112. When electroless plating is performed, the conductive ring 201 may be omitted. The conductive ring 201 includes a plurality of finger portions 2011 contacting the front edge of the substrate 113, and the pressing plate 202 has a slope 2021 that matches the finger portion 2011 of the conductive ring 201. In order to install the seal 111, first remove the base from the base 1011 of the cup chuck 101, and then the lip seal portion 1115 of the seal 111 wraps the support portion 1014 of the cup chuck 101 and the fixed portion of the seal 111 1116 is located in the groove 1015 of the cup-shaped chuck 101. The first set of screws fix the pressure plate 202 and the base of the cup-shaped chuck 101 together, and the pressure plate 202 fixes the fixing portion 1116 of the seal 111 in the groove 1015 of the cup-shaped chuck 101. Then, the second set of screws fix the base of the cup-shaped chuck 101, the pressing plate 202, and the conductive ring 201 with the base 1011 of the cup-shaped chuck 101. Subsequently, the bottom 1111 and the outer wall 1112 of the sealing member 111 respectively wrap the outer surface of the bottom wall and the side wall of the base 1011 of the cup-shaped chuck 101. Finally, the fixing ring 109 is fixed to the bottom of the edge 1013 of the cup-shaped chuck 101 by a plurality of screws 110, and the fixing ring 109 presses the protrusion 1113 of the sealing member 111.

Referring to FIG. 20B, FIG. 20B reveals the basic principle of the present invention. In order to improve the uniformity of the plating near the notch area of the substrate, the cover plate is configured to cover the notch area of the substrate and mask the electric field in the notch area when the substrate is electroplated. As shown in FIG. 20B, during the electroplating process, because the cover plate 3033 is configured to cover the notch area 3031 of the substrate, the power lines emitted by the virtual anode 3001 corresponding to the notch area 3031 are shielded, which weakens the impact on the adjacent notch area. The influence of the pattern area 3032 of 3031, therefore, reduces the thickness of the plating layer of the pattern area 3032 adjacent to the notch area 3031, and improves the uniformity of the substrate plating. Preferably, the cover plate 3033 also covers a portion of the pattern area 3032 adjacent to the notch area 3031 to reduce the electric field of the pattern area 3032, thereby reducing the thickness of the plating layer of the pattern area 3032. Refer to Figure 21, which is an effect comparison diagram. In FIG. 21, line 1 corresponds to the plating data of the substrate without the notch area, so that the entire substrate is electroplated during the electroplating process. The height of the plating pillars of the entire substrate without the notch area is uniform. Line 2 corresponds to the substrate with the notch area but there is no cover plate to cover the notch area during the electroplating process. The height of the plating column in the pattern area adjacent to the notch area gradually increases. Line 3 corresponds to the substrate with the notch area and the electroplating material with the cover plate covering the notch area during the electroplating process. The height of the plated pillars in the pattern area adjacent to the notch area is reduced to approach line 1. It can be seen from Figure 21 that the electroplating effect with a cover plate is significantly better than that without a cover plate.

With reference to FIGS. 22 to 25, an electroplating chuck according to an embodiment of the present invention is disclosed. The electroplating chuck 200 is similar to the device 100. The main difference between the electroplating chuck 200 and the device 100 is that the electroplating chuck 200 includes a shield 2040. The structure of the electroplating chuck 200 similar to that of the device 100 will not be described in detail below. Next, the shield 2040 will be mainly introduced.

As shown in FIG. 25, the shield 2040 has a bottom wall 2041, a side wall 2042 extending upward from the bottom wall 2041, a top wall 2043 extending outward from the top of the side wall 2042. The bottom wall 2041 protrudes horizontally to form a cover 2044. In one embodiment, an opening 2045 is provided on the cover 2044. The opening 2045 is a long narrow Of the incision. The opening 2045 is close to the bottom wall 2041. The shield 2040 may be made of plastic, rubber, or metal with an insulating coating.

When assembling, the bottom wall 2041 of the shield 2040 abuts against the bottom 1111 of the seal 111 and wraps a part of the bottom 1111 of the seal 111, for example, wraps about two-thirds of the bottom 1111 of the seal 111. The side wall of the shield 2040 2042 abuts against the outer wall 1112 of the seal 111. The top wall 2043 of the shield 2040 is close to the edge 1013 of the cup-shaped chuck 101 and is fixed to the edge 1013 of the cup-shaped chuck 101 by a plurality of fixing members such as screws. In this way, the top wall 2043 of the shield 2040 can replace the fixing ring 109 to press the protrusion 1113 of the seal 111 to fix the seal 111. Therefore, in this embodiment, the fixing ring 109 can be eliminated. The cover plate 2044 of the shield 2040 is configured to cover the notch area of the substrate 213, and the electroplating chuck 200 holds the substrate 213 for the electroplating process. There is a certain distance between the base plate 213 and the cover plate 2044 of the shield 2040, which is greater than the deformation amount of the cover plate 2044, so as to prevent the cover plate 2044 from contacting the base plate 213. The distance is 0.5 mm to 8 mm, preferably 4 mm.

During electroplating, the cover plate 2044 of the shield 2040 covers the notch area of the substrate 213, so the power lines from the virtual anode corresponding to the notch area of the substrate 213 are masked, reducing the influence on the pattern area of the notch area adjacent to the substrate 213. Therefore, the thickness of the plating layer in the pattern area adjacent to the notch area of the substrate 213 is further reduced, and the uniformity of the plating layer on the substrate 213 is improved. Preferably, the cover 2044 of the shield 2040 also covers part of the pattern area adjacent to the notch area to reduce the electric field in the pattern area, thereby reducing the plating thickness of the pattern area. The electroplating solution between the substrate 213 and the cover plate 2044 of the shield 2040 forms a flowing electroplating solution through the opening 2045 of the shield 2040. Due to plating chuck 200 has a cover plate 2044 to cover the notch area of the substrate 213. During the electroplating process, the shield 2040 with the cover plate 2044 rotates with the electroplating chuck 200. The electroplating chuck 200 holding the substrate 213 rotates at a constant speed or a non-constant speed during the electroplating process of the substrate, and the electroplating effect will not be affected.

Referring to FIG. 26, a shield 2640 according to another embodiment of the present invention is disclosed. The shield 2640 includes a bottom wall 2641, a side wall 2642 extending upward from the bottom wall 2641, a top wall 2643 extending outward from the top of the side wall 2642. The bottom wall 2641 protrudes horizontally to form a cover 2644. In this embodiment, the cover plate 2644 is provided with a plurality of holes 2645. The cover plate 2644 of the shield 2640 covers the notch area of the substrate during the substrate electroplating process. Preferably, the cover 2644 of the shield 2640 also covers a portion of the graphic area adjacent to the notch area of the substrate. The electroplating solution between the substrate and the cover plate 2644 of the shield 2640 passes through the plurality of holes 2645 on the shield 2640 to form a flowing electroplating solution. The shield 2640 may be made of plastic, rubber, or metal with an insulating coating.

Referring to Figs. 27 to 29, another embodiment of the present invention is disclosed. The seal 2711 of the electroplated chuck is disclosed. The sealing member 2711 includes a bottom 27111, an outer wall 27112, and an inner wall 27114. The top end of the outer wall 27112 is provided with a protrusion 27113. The inner wall 27114 is curved to form a lip seal 27115. The end of the inner wall 27114 connected with the lip seal 27115 extends horizontally to form a fixed portion 27116. The inner wall 27114 protrudes horizontally to form a cover plate 27117. In this embodiment, the cover 27117 is provided with an opening 27118. The opening 27118 is a long and narrow incision. The opening 27118 is close to the inner wall 27114. There are other methods to form the cover 27117. The cover plate 27117 of the desired shape can be horizontally fixed on the inner wall 27114 with glue. During the electroplating process, the cover plate 27117 covers the substrate The gap area. Preferably, the cover 27117 also covers part of the pattern area adjacent to the notch area of the substrate. The electroplating solution between the substrate and the cover 27117 passes through the opening 27118 to form a flowing electroplating solution.

Referring to FIG. 30 to FIG. 32, yet another embodiment of the present invention is disclosed. The seal 3011 of the electroplated chuck is disclosed. The sealing member 3011 includes a bottom 30111, an outer wall 30112, and an inner wall 30114. A protrusion 30113 is provided on the top end of the outer wall 30112. The inner wall 30114 is bent to form a lip seal 30115. The end of the inner wall 30114 connected to the lip seal portion 30115 extends horizontally to form a fixing portion 30116. The inner wall 30114 protrudes horizontally to form a cover plate 30117. In this embodiment, the cover plate 30117 is provided with a plurality of holes 30118. During the electroplating process, the cover plate 30117 covers the notch area of the substrate. Preferably, the cover plate 30117 also covers part of the pattern area adjacent to the notch area of the substrate. The electroplating solution between the substrate and the cover plate 30117 passes through the plurality of holes 30118 to form a flowing electroplating solution.

Referring to FIGS. 33A to 33H, cover plates of different shapes are disclosed. In these figures, the black parts indicate the cover plates. It can be seen from these figures that the cover plate can be symmetrical or asymmetrical about the axis passing through the center of the substrate and the gap of the substrate. The side of the cover plate farther from the notch area of the substrate is a straight line or arc, and the side of the cover plate closer to the notch area of the substrate is a straight line or a broken line or an arc. The shape of the cover is adjusted according to the shape of the notch.

Since the present invention uses the cover plate to cover the notch area of the substrate, during the electroplating process, the cover plate rotates along with the electroplating chuck. The electroplating chuck that holds the substrate rotates at a uniform or non-uniform speed during the electroplating process, and the electroplating effect will not be affected.

In summary, the present invention has been described in detail through the above-mentioned embodiments and related drawings, and the related technology has been disclosed in detail, so that those skilled in the art can implement it accordingly. The above-mentioned embodiments are only used to illustrate the present invention, not to limit the present invention. The scope of rights of the present invention should be defined by the scope of the patent application of the present invention. As for the change in the number of elements described herein or the replacement of equivalent elements, all should still belong to the scope of the present invention.

100‧‧‧Substrate holding device

101‧‧‧Cup chuck

102‧‧‧Chuck plate

103‧‧‧Vertical drive

104‧‧‧Angle control drive device

1012‧‧‧Receiving space

Claims (13)

An electroplating chuck for holding a substrate. The substrate includes a notch area and a pattern area adjacent to the notch area. The electroplating chuck includes a cover plate configured to cover the notch area of the substrate and mask the notch area when the substrate is electroplated Electric field. According to the electroplating chuck according to claim 1, the cover plate covers a portion of the pattern area adjacent to the notch area of the substrate. The electroplating chuck according to claim 1, further comprising a shield including a bottom wall, a side wall extending upward from the bottom wall, and a top wall extending outward from the top of the side wall, the bottom wall protruding horizontally to form a cover plate. According to the electroplating chuck according to claim 3, an opening is provided on the cover plate. According to the electroplating chuck according to claim 3, the cover plate is provided with a plurality of holes. The electroplating chuck according to claim 1, further comprising a sealing member, the sealing member includes a bottom, an outer wall and an inner wall, the inner wall is bent to form a lip-shaped seal, and the inner wall protrudes horizontally to form a cover plate. According to the electroplating chuck according to claim 6, an opening is provided on the cover plate. According to the electroplating chuck according to claim 6, the cover plate is provided with a plurality of holes. According to the electroplating chuck according to claim 1, the shape of the cover plate is adjusted according to the shape of the notch area. According to the electroplating chuck according to claim 1, the side of the cover plate farther from the notch area of the substrate is a straight line or arc, and the side of the cover plate closer to the notch area of the substrate is a straight line, a broken line or an arc. According to the electroplating chuck according to claim 1, the cover plate is symmetrical or asymmetrical about an axis passing through the center of the substrate and the gap of the substrate. According to the electroplating chuck according to claim 1, there is a certain distance between the substrate and the cover plate, and the distance is greater than the deformation amount of the cover plate, so as to prevent the cover plate from contacting the substrate. According to the electroplating chuck according to claim 1, the material of the cover plate may be plastic, rubber, or metal with an insulating coating.

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