TW200835817A - Electroplating apparatus capable of carrying out electroplating onto local area of workpiece and its method - Google Patents

Electroplating apparatus capable of carrying out electroplating onto local area of workpiece and its method Download PDF

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TW200835817A
TW200835817A TW96106111A TW96106111A TW200835817A TW 200835817 A TW200835817 A TW 200835817A TW 96106111 A TW96106111 A TW 96106111A TW 96106111 A TW96106111 A TW 96106111A TW 200835817 A TW200835817 A TW 200835817A
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Taiwan
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workpiece
unit
plating
electroplating
anode
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TW96106111A
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Chinese (zh)
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TWI333987B (en
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Chun-Dao Zhong
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China Steel Corp
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Abstract

An electroplating apparatus capable of carrying out electroplating onto a local area of workpiece and its method, which comprises a plating tank unit, a leakage ceasing unit, and an anode unit. The plating tank is provided with a mutual closure function and can define an upper tank and a lower tank from a reservoir space. The lower edge of the upper tank is formed with an upper notch. The upper edge of the lower tank is formed with a lower notch corresponding to an upper notch. The shapes for the upper notch and the lower notch are conformed to the shape of desired electroplating part of the workpiece so that the workpiece can be accommodated. The leakage ceasing unit is installed between the upper tank and the lower tank, and between the workpiece and the upper notch and the lower notch. The anode unit is located inside the reservoir space to surround the outside of the desired electroplating area of the workpiece at intervals. When the anode unit and the workpiece respectively are electrical connected to the positive pole and the negative pole of the power supply, the local area of a large workpiece can be electroplated.

Description

200835817 九、發明說明: 【發明所屬之技術領域】 本發明是有關於一種電鑛裝置及其方法,特別是指 種可對工件局部區域進行電鍍之電鍍裝置及其方法。 【先前技術】 ^ 電鍍(Electroplating)已被廣泛地應用於修復已磨損的工 件表面’例如,硬鉻電鍍是使用於油壓紅和輥輪的表面處 理,而電鐘銅或是錄金屬則是常應用於填補工件的磨耗區 域,另外,電鍍銀也經常被應用於電路接點的工件上,以 確保良好的導電性能。就應用於工件表㈣補的電鐘方法 可分為浸鍍法和刷鍍法兩種形式。 浸鍍法即為-般常見的電鍍方式,其是將被鍍工件置 放於裝滿電鍍液的鍍槽中,並在該鍛槽中置放一欲鐘覆的 金屬板,令該金屬板連接正極且被鍍之工件連接負極,即 可對該工件進行電鍍。然而,浸鍍法適用的工件尺寸合受 到該鑛槽大小的限制,特別是對於體積龐大或是只需^部 區域電鍍的工件而言,更是難以滿足要求。 相對的,刷鍍法則較不限制工件的尺寸,主要是其並 非使用鍍槽的方式’而是將内置有電導體的毛刷連接到電 被鑛之工件連接到負極,將毛刷沾附電鍍液並 而要電鍍的區域,即可進行電鏟。雖然刷鍍法可適 5局部區域的電鑛’並且不會限制卫件的形狀和尺 、仁疋,在電鍍過程令,必須不斷地補充毛刷上 液’而難叫得均自_層厚度。 電鍍 5 200835817 【發明内容】 種可對工件局部區 之電鍍裝置及其方 、ΰ此,本發明之目的,即在提供一 域進行電鍍且不會限制玉件尺寸與重量 法,〇 ,包I是’本發明可對工件局部區域進行電鑛之電鑛裝置 3一鍍槽早兀、—止漏單元, 梓罝 險極早70,該鍍 槽早兀具有可相互鎖合並界定出一可200835817 IX. Description of the Invention: [Technical Field] The present invention relates to an electric ore device and a method thereof, and more particularly to an electroplating apparatus and method for electroplating a partial region of a workpiece. [Prior Art] ^ Electroplating has been widely used to repair worn workpiece surfaces. For example, hard chrome plating is used for surface treatment of oil red and roller, while electric copper or metal is It is often used to fill the wear area of the workpiece. In addition, electroplated silver is often applied to the workpiece of the circuit contacts to ensure good electrical conductivity. The electric clock method applied to the workpiece table (4) can be divided into two types: immersion plating method and brush plating method. The immersion plating method is a common plating method in which a workpiece to be plated is placed in a plating tank filled with a plating solution, and a metal plate to be coated is placed in the forging groove to make the metal plate The workpiece can be electroplated by connecting the positive electrode and the plated workpiece to the negative electrode. However, the size of the workpiece to which the immersion plating method is applied is limited by the size of the ore tank, and is particularly difficult for a workpiece that is bulky or requires only a portion of the plating. In contrast, the brush plating method does not limit the size of the workpiece, mainly because it is not using the plating method. Instead, the brush with the built-in electric conductor is connected to the workpiece of the electric ore to the negative electrode, and the brush is adhered to the plating. The electric shovel can be carried out in the area where the liquid is to be electroplated. Although the brush plating method can be suitable for 5 parts of the area of the electric mine 'and does not limit the shape and size of the guard, the core process, the need to constantly replenish the brush on the liquid' and it is difficult to call the thickness of the layer . Electroplating 5 200835817 SUMMARY OF THE INVENTION [Inventive] A plating apparatus for a partial area of a workpiece and the like, and the object of the present invention is to provide a domain for electroplating without limiting the size and weight of the jade piece, 〇, package I It is a 'electro-metal ore-concentrating device for electro-mining of a local area of the workpiece 3, a plating tank early, and a leak-stop unit, which is very early 70. The plating tank has an interlocking and early definition.

間的-上槽體與一下槽體 %鍍液之儲液空 μ ^ 卜㈣該上槽體的下緣形成有至少_ 夫口’該下槽體的上緣形成有對應該上缺σ的下缺口, 该上、下缺Π的形狀是符合該工件欲電鍍部位的外形而可 使該工件設置於其中。該止漏單元是介於該鍍槽單元之上 '下槽體之間’及該上、下槽體之上、下缺σ與該工件之 間’該陽極單元是位於該鏟槽單S之儲液空間内並間隔地 環繞於該工件之欲電鍍區域的外圍,t該陽極單元與該工 件分別與電源之正、負極電連接時,.即可對該工件表面進 行電鍍。 本發明可對工件局部區域進行電鍍之電鍛方法,依序 包含-陽極定位步驟、-鍍槽組裝步驟、—貯液電鑛步驟 ,及一排液拆解步驟。該陽極定位步驟是將一陽極單元裝 設於該工件欲㈣之外圍並與之㈣I該鍍槽組裝步驟 是將一上、下槽體結合鎖固,而形成一包圍該陽極單元並 可容置電鍍液的儲液空間,該上槽體形成有二的上缺口, 該下槽體上形成有二分別對應該二上缺口的下缺口該二 上、下缺口的形狀是符合該工件欲電鍍部位的外形。該貯 6 200835817 液電鍍步驟是將電鍍液抽送至 k至邊儲液空間中,並令該陽極 單元與一電源之正極電連接,品— t 包逆接,而該工件與該電源之負極電 連接,即可對該工件表面進行電鑛。該排液拆解步驟是將 電鍍液抽出’並拆下該上、下槽體與該陽極單元。 本發明之功效在於藉由組合式的鍍槽單元設計,並配 合該止漏單元與陽極單元,而能直接移至該工件之局部區 域進行電鍍,構成可移動式的f鍍裝置,可適合於體型大 或是重量重的被鍍工件。The upper-upper tank and the lower tank body% of the liquid plating liquid μ ^ 卜 (4) the lower edge of the upper tank body is formed with at least _ husband's upper edge of the lower tank body formed with corresponding σ The lower notch, the shape of the upper and lower defects is such that the shape of the workpiece to be plated is adapted to allow the workpiece to be disposed therein. The leakage stop unit is located between the 'lower tank body' on the plating tank unit and above and below the upper and lower tank bodies, and between the lower portion σ and the workpiece. The anode unit is located in the shovel single S. The liquid storage space is circumferentially spaced around the periphery of the workpiece to be plated, and when the anode unit and the workpiece are electrically connected to the positive and negative electrodes of the power source, the surface of the workpiece can be plated. The invention relates to an electric forging method for electroplating a local region of a workpiece, which comprises an anode positioning step, a plating tank assembly step, a liquid storage electroplating step, and a liquid discharging step. The anode positioning step is to install an anode unit on the periphery of the workpiece (4) and the (4) I plating tank assembly step is to combine an upper and lower tank body to form a surrounding and can accommodate the anode unit. a liquid storage space of the plating solution, the upper tank body is formed with two upper notches, and the lower tank body is formed with two lower notches respectively corresponding to the two upper notches. The shape of the upper and lower notches is in conformity with the workpiece to be plated. The shape. The storage 6 200835817 liquid plating step is to pump the plating solution to the k to the side liquid storage space, and electrically connect the anode unit to the positive pole of a power source, and the product is reversely connected, and the workpiece is electrically connected to the negative pole of the power source. , the surface of the workpiece can be electro-mine. The draining and disassembling step extracts the plating solution and removes the upper and lower tanks and the anode unit. The utility model has the advantages that the combined plating unit design and the leakage stopping unit and the anode unit can be directly moved to a local area of the workpiece for electroplating to form a movable f plating device, which is suitable for A large or heavy workpiece that is plated.

【實施方式】 有關本發明之前述及其他技術内容、特點與功效,在 以下配合參考圖式之_個較佳實施例的詳細說明中,將可 清楚的呈現。 如圖1、2、3所示’本發明可對工件局部區域進行電 鍍之電鍍襄置的較佳實施例,適用於—大型的工件卜例如 是鋼鐵廢心電鍍鋅鋼片生產線的導電輥軸,其體積龐大 且重量超過10噸。該電鍍裝置包含一鍍槽單元2、一止漏 早元3、一陽極單元4、一打風管5, 以及一洩液單元6。 該鍍槽單元2具有可相互鎖合並界定出一可容置電鑛 液之儲液空間20的一上槽體21與一下槽體22。該上槽體 21概呈矩形框體,其兩相反側板壁的下緣分別形成有一上 缺口 211。該下槽體22的上緣形成有二分別對應該二上缺 口 211的下缺口 22卜該二上、下缺口 211、221組合後的 形狀是符合該工件丨欲電鍍部位的截面外形,該工件丨可 穿伸過所述的上、下缺口 211、221。應說明的是,該工件 7 200835817 1也可以不穿伸出該鍍槽單元2外,此時,該上、下槽體 21、22只需設有一個上、下缺口 211、221即可使用。 該止漏單元3具有二介於該鍍槽單元2之上、下槽體 21、22間的墊片31,及二分別位於該二上、下缺口中並貼 觸該工件1表面的止漏環在該較佳實施例中,所述的 墊片31與止漏環32為橡膠材質所製成,當然也可以是其 他的抗酸驗軟性材質所製成。The above and other technical contents, features and effects of the present invention will be apparent from the following detailed description of the preferred embodiments. As shown in Figures 1, 2, and 3, the preferred embodiment of the present invention is capable of electroplating a partial region of a workpiece, and is suitable for a large-sized workpiece such as a conductive roller shaft of a steel waste electro-galvanized steel sheet production line. It is bulky and weighs over 10 tons. The plating apparatus comprises a plating tank unit 2, a leak stop early element 3, an anode unit 4, a blowpipe 5, and a liquid discharge unit 6. The plating tank unit 2 has an upper tank body 21 and a lower tank body 22 which are mutually lockable and define a liquid storage space 20 for accommodating the electric mineral liquid. The upper trough body 21 has a rectangular frame body, and upper edges of the opposite side wall walls are respectively formed with an upper notch 211. The upper edge of the lower trough body 22 is formed with two lower notches 22 respectively corresponding to the two upper notches 211. The shape of the upper and lower notches 211 and 221 is combined to conform to the cross-sectional shape of the workpiece to be electroplated. The 丨 can be worn through the upper and lower notches 211, 221. It should be noted that the workpiece 7 200835817 1 may not protrude beyond the plating tank unit 2. At this time, the upper and lower tank bodies 21 and 22 only need to have one upper and lower gaps 211 and 221 to be used. . The leak stopping unit 3 has two spacers 31 interposed between the plating tank unit 2 and the lower tank bodies 21 and 22, and two leaking holes respectively located in the upper and lower notches and contacting the surface of the workpiece 1. Ring In the preferred embodiment, the gasket 31 and the leak stop ring 32 are made of rubber material, and of course, other acid-resistant soft materials can be used.

名陽極單元4是位於該鍍槽單元2之儲液空間2〇内, 該陽極單元4具有-設置於該下槽體22上且呈蔞空狀的陽 極籃4卜及-設置於該陽極藍41上並間隔地環繞於該工件 \之㈣鍍區域外圍的陽極塊42。在該較佳實施例中該 陽極籃41是鈦金屬所製成,而該陽極塊42是銀金屬所製 成,當然也可以是銅金屬所製成。 该打風管5是部分浸入該儲液空間2〇中,並具有一位 於㈣極單元4之陽極籃41下緣的水平管段51、-自該水 平官段51沿著該陽極籃41往上延伸的弧管段52,及一自 該弧管段52向上延伸並露出該儲液空間2()的外露管段^ :該水平管段51上形成有多數個出氣孔5ιι。當藉由將空 孔自為外路官段53打人,並從所述的出氣孔511散逸時, 會形成氣泡以攪拌電鍍液。 〇洩液單it 6具有-連接該鍍槽單元 =通該儲液空間2。的…、—連細放間= 儲液^6362 ’及—可承接自該排液f 62所排放之電鑛液的 错液槽63,藉此可控制電鍍液的㈣。 8 200835817 如圖4所示,並配合圖〗,本發明可對工件局部區域進 灯電鑛之電録方法的較佳實施例,依序包含_表面清潔步 驟81、陽極定位步驟82、一鍍槽組裝步驟、一貯液電 鑛步驟84,及一排液拆解步驟85。 百先,執行該表面清潔步驟81,清潔在該工件i欲電 鍍區域的表面。先用脫脂劑清洗該工件1欲電鍍區域的表 面再以水將脫脂劑沖洗乾淨。之後再以細砂紙研磨此一 P:的表面,使其呈現平滑,並再用脫脂劑與水加以清洗 。當然,若該部位的表面的磨損程度不大,則可視情況決 定是否研磨該工件i。 接著,執行該陽極定位步驟82,先將該陽極單元4之 陽極籃4!裝設於該工件丨欲電鍍之外圍並與之相間隔,之 後再將該陽極塊42圍繞在該陽極籃4〗上。 而後,執行該鍍槽組裝步驟83,將該上、下槽體21、 22往該工件1之欲電鍍區域靠合,並在該上、下槽體21、 22的接合處置放該二橡膠製的墊片31,利用多數根螺絲並 -/累帽,牙過该上、下槽體2 j、22兩側緣,而將其上下 鎖口固疋,形成一包圍該陽極籃41並可容置電鍍液的儲液 工=20。將該打風管5部分插置於該儲液空間如並靠抵在 該陽極籃41上。同時,使該二止漏環32穿套於該工件j 上,並分別對應於該上、下槽體21、22之二上、下缺口 211、221中。如此,利用所述的墊片31與止漏環32,可防 止電鍍液從接合處洩漏。 接著,執行該貯液電鍍步驟84,將電鍍液抽送至該儲 9 200835817 液空間2G巾’例如是使用手提絲浦之類的抽水設備,並 至少溢過該陽極籃41。令該陽極單元4之陽極籃41盘一希 源例如整流器)的正極電連接,而該工件i則是電連接: 電源7之負極,啟動該電源7 ’調整適當的電流,即可對节 工件1表面進行電鍍。依據電流的大小、電鑛的面積計算 出電鑛時間,當獲得麗的鍍層厚度時,例如30微米(㈣) ,:關閉該電源7。應注意的是,在電鍍的過程中,會產生The anode unit 4 is located in the liquid storage space 2 of the plating tank unit 2, and the anode unit 4 has an anode basket 4 disposed on the lower tank 22 and having a hollow shape, and is disposed on the anode blue 41 surrounds and surrounds the anode block 42 at the periphery of the (four) plating region of the workpiece. In the preferred embodiment, the anode basket 41 is made of titanium metal, and the anode block 42 is made of silver metal, and of course copper metal. The air duct 5 is partially immersed in the liquid storage space 2, and has a horizontal pipe section 51 located at the lower edge of the anode basket 41 of the (four) pole unit 4, and upwards from the horizontal section 51 along the anode basket 41. An extended arc pipe segment 52, and an exposed pipe segment extending upward from the arc pipe segment 52 and exposing the liquid storage space 2 (): the horizontal pipe segment 51 is formed with a plurality of air outlet holes 5 ιι. When the hole is made to be a person from the outer road portion 53 and dissipated from the air outlet hole 511, air bubbles are formed to agitate the plating solution. The sputum discharge unit it 6 has - connects the plating tank unit = through the liquid storage space 2. The ..., the thin chamber = the liquid storage ^6362' and - can receive the wrong liquid tank 63 of the electric ore discharged from the liquid discharge f 62, thereby controlling the plating liquid (4). 8 200835817 As shown in FIG. 4, and in conjunction with the drawings, the present invention can be applied to a preferred embodiment of the electro-recording method for the local area of the workpiece, including the surface cleaning step 81, the anode positioning step 82, and a plating. The tank assembly step, a liquid storage ore step 84, and a drain disassembly step 85. First, the surface cleaning step 81 is performed to clean the surface of the workpiece i to be electroplated. The surface of the workpiece to be plated is first cleaned with a degreaser and the degreaser is rinsed with water. The surface of this P: is then ground with fine sandpaper to make it smooth and then cleaned with degreaser and water. Of course, if the degree of wear of the surface of the portion is not large, it is possible to determine whether or not to grind the workpiece i. Then, the anode positioning step 82 is performed, first, the anode basket 4! of the anode unit 4 is installed on the periphery of the workpiece and is spaced apart from the workpiece, and then the anode block 42 is surrounded by the anode basket 4 on. Then, the plating tank assembly step 83 is performed to press the upper and lower tank bodies 21 and 22 toward the desired plating area of the workpiece 1, and the two rubbers are placed in the joint treatment of the upper and lower tank bodies 21 and 22. The gasket 31 uses a plurality of screws and/or a tired cap to pass the upper and lower sides of the upper and lower tanks 2 j and 22, and the upper and lower locks are fixed to form a casing surrounded by the anode basket 41. The liquid storage of the plating solution = 20. The portion of the air duct 5 is inserted into the liquid storage space, for example, against the anode basket 41. At the same time, the two leakage preventing rings 32 are sleeved on the workpiece j and correspond to the upper and lower notches 211 and 221 of the upper and lower grooves 21 and 22, respectively. Thus, by using the spacer 31 and the leak stop ring 32, it is possible to prevent the plating solution from leaking from the joint. Next, the stock plating step 84 is performed, and the plating solution is pumped to the reservoir. The liquid space 2G towel is, for example, a pumping device such as a hand-held wire, and overflows at least the anode basket 41. The anode of the anode unit 4 of the anode unit 4 is electrically connected to the anode of the source, for example, the rectifier, and the workpiece i is electrically connected: the anode of the power source 7 is activated, and the power source 7' is adjusted to adjust the appropriate current. 1 The surface is plated. The electro-minening time is calculated according to the magnitude of the current and the area of the electric ore. When the thickness of the coating is obtained, for example, 30 micrometers ((4)), the power source 7 is turned off. It should be noted that during the electroplating process,

有害氣體’因此,可在該鍍槽單& 2的上方設置—抽氣設 備9,以抽離產生的氣體。 之後,執行該排液拆解步驟85,打開該洩液單元6之 、肢閥6卜使電鍍液排出該儲液空間2〇,經該排液管Q 而流入該儲液槽63儲放,可供下次使用。卸下螺絲與螺帽 ’拆解該上 ' 下㈣21、22 ’取下該陽極藍41、陽極塊42 ’再以清水清洗該工件1之電鑛區域的表面,完成該工件i 的電鍍作業。 3藉由组合式的鍍槽單元2設計,並配合該止漏單元3 與陽極單70 4’而能直接移至該卫件丨之局部區域進行電鑛 ’構成可移動式的電鍍裝置,適合體型大重量重的被鍍工 件同0守,利用J哀狀的陽極塊42,並配合該打風管5的攪 拌作用,可使鍍層厚度更為均勻。#由該驗單元6的設 置,可使電鍍液的排放與儲存較為容易,讓作業更方便。 歸納上述,本發明可對工件局部區域進行電鍍之電鍍 裝置及其方法,是利用組合式的設計,可將該鍍槽單元2 直接組裝於該工件1上,無須移動該工件i,可適用於大型 10 200835817 且僅需局部電鍍的工件i。透過該陽極塊42與打風管5的 設計,能使鍍層均勻,利用該洩液單元6,可讓作業更為方 便,故確實能達到本發明之目的。Harmful gas ' Therefore, a pumping device 9 can be provided above the plating tank & 2 to extract the generated gas. Thereafter, the draining and disassembling step 85 is performed, and the limb valve 6 of the liquid discharge unit 6 is opened to discharge the plating solution into the liquid storage space 2, and flows into the liquid storage tank 63 through the liquid discharge tube Q to be stored. Available for next use. Remove the screws and nuts 'Remove the upper 'lower (4) 21, 22' to remove the anode blue 41, the anode block 42' and clean the surface of the electro-metal area of the workpiece 1 with clean water to complete the plating operation of the workpiece i. 3 is designed by the combined plating tank unit 2, and can be directly moved to a partial area of the guard member to carry out the electroplating of the leakage preventing unit 3 and the anode unit 70 4' to form a movable plating device, suitable for The workpiece with a large weight and a heavy weight is kept at the same time, and the anode block 42 of the J-shaped shape is used, and the stirring effect of the wind-driven tube 5 is matched to make the thickness of the plating layer more uniform. # By the setting of the inspection unit 6, the discharge and storage of the plating solution can be made easier, which makes the operation more convenient. In summary, the present invention can be applied to a plating apparatus and a method for electroplating a partial area of a workpiece by using a combined design, and the plating unit 2 can be directly assembled on the workpiece 1 without moving the workpiece i, and is applicable to Large 10 200835817 and only partially electroplated workpiece i. Through the design of the anode block 42 and the air duct 5, the plating layer can be made uniform, and the liquid discharge unit 6 can be used to make the operation more convenient, so that the object of the present invention can be achieved.

惟以上所述者,僅為本發 能以此限定本發明實施之範圍 範圍及發明說明内容所作之簡 屬本發明專利涵蓋之範圍内。 【圖式簡單說明】 明之較佳實施例而已,當不 ’即大凡依本發明申請專利 單的等效變化與修飾,皆仍 "1是一立體分解圖,說明本發明可對工件局部區域 行電鍍之電鍍裝置之較佳實施例; 一 用以輔助說明圖1 ; ,說明本發明之電鍍裝置的使用 圖2是一組合立體圖, 圖3是一剖面側視圖 態樣;及 圖 電鍍之 —疋一流程圖,說明本發明可對工件局部區域進行 電鍍方法之較佳實施例。However, it is to be understood that the scope of the invention and the scope of the invention are limited to the scope of the invention. BRIEF DESCRIPTION OF THE PREFERRED EMBODIMENT(S) The preferred embodiment of the present invention, when not equivalent to the equivalent variation and modification of the patent application form of the present invention, is still an exploded view showing the local area of the workpiece. A preferred embodiment of a plating apparatus for electroplating; an aid for explaining FIG. 1; illustrating the use of the electroplating apparatus of the present invention; FIG. 2 is a combined perspective view, FIG. 3 is a cross-sectional side view; BRIEF DESCRIPTION OF THE DRAWINGS A preferred embodiment of the present invention for electroplating a partial region of a workpiece is illustrated.

11 200835817 【主要元件符號說明】 1 + …工件 5 11 “…… 出氣孔 "鍍槽單元 ^ »»»»»»¥$· 1瓜管段 2 0… …儲液空間 ΦΧΐ-ΚΌ-ΚΦΚ 。外露管段 1 * ^ *κ -上槽體 S->S*>K*S*5 。洩液單元 h上缺口 1 S*S»S»ft« …;食放閥 «· :i -> X < s φ …下槽體 ¥«·ΚΦ»->Χ·ϊ -排液管 2 21 4… "下缺口 &儲液槽 frK->SO««S …止漏單元 Χ*ί:·>«·ίΧ<ι·Κ -電源 1 « ·> S ί· .γ V' ¢: "墊片 8 1 0 ® p $ ‘> ·, -表面清潔步驟 >*0 S ΐ S 5> “止漏環 8 2 Λ i> S * S ί· S : -陽極定位步驟 SOK-frS-iSO· …陽極單元 $ $ Λ: « S > K « S { *鍍槽組裝步驟 4 1 3 * * * * * ^ "陽極籃 <r ft * A ·> S * ί -貯液電鍍步驟 4 2 s * χ > X c· X "陽極塊 $ $ <· X ·0 H > K > : -排液拆解步驟 ^ίί·$·>5ί·ίί "打風管 $ S95«49!S令: "抽氣設備 1 » s 〇 a « x φ …水平管段 1211 200835817 [Description of main component symbols] 1 + ... workpiece 5 11 "... vents " plating tank unit ^ »»»»»»¥$· 1 melon pipe section 2 0... ...liquid storage space ΦΧΐ-ΚΌ-ΚΦΚ. Exposed pipe section 1 * ^ *κ - upper tank S->S*>K*S*5. Notch 1 on draining unit h S*S»S»ft« ...; food discharge valve «· :i - > X < s φ ... lower tank body ««·ΚΦ»->Χ·ϊ - drain pipe 2 21 4... "lower notch & reservoir chr->SO««S...stop leak Unit Χ*ί:·>«·ίΧ<ι·Κ -Power 1 « ·> S ί· .γ V' ¢: "shims 8 1 0 ® p $ '> ·, - Surface cleaning steps >*0 S ΐ S 5> "Threak stop ring 8 2 Λ i> S * S ί · S : - Anode positioning step SOK-frS-iSO · Anode unit $ $ Λ: « S > K « S { * Plating tank assembly step 4 1 3 * * * * * ^ " anode basket <r ft * A ·> S * ί - liquid storage plating step 4 2 s * χ > X c· X " anode block $ $ <· X ·0 H > K > : - Discharge Disassembly Steps ^ίί·$·>5ί·ίί "Wind Tube $ S95«49!S Order: "Pumping Equipment 1 » s a «x φ ... horizontal pipe section 12

Claims (1)

200835817 -、申請專利範圍: -種可對卫件局部區域進行電鍍之電鍍裝置,包含: 梦、夜:=!元,具有可相互鎖合並界定出-可容置電 鐵液之儲液空間的一 緣形成有至少-上缺 槽體,該上槽體的下 上缺口的下缺該下槽體的上緣形成有對應該 命聲邮 、口,該上、下缺口的形狀是符合該工件欲 屯、又σ位的外形而可使該工件設置於其中; …止漏單元,介於該鑛槽單元之上、下槽體之間, 一卜槽體之上、下缺口與該工件之間;以及 地環之!於該鑛槽單元之儲液空間内並間隔 該工件分別與電源μ㈣域的外圍,當該陽極單元與 ♦面進 > 怎…迅"、之正、負極電連接時,即可對該工件 表面進行電鍍。 ,τ 2. 2:請__第1項所料對工件局《域進行電 ::電;裝置,其中,該鍍槽單元之上槽體形成有:: ,該止漏單元具有二介於該上、上缺口的下缺口 二分別位於該上、下缺口中 g之間的墊片,及 ,觸該工件的止漏環。 .依據申請專利範圍第〗項所 鍍之電«置,其中,該_單_件局部區域進行電 梦,及” 早7"具有-蔞空狀的陽極 ▲及-权置於該陽極籃上並環繞 域的陽極塊。 什ι奴電鍍區 4.依據申請專利範圍第3項所述可 鍍之電鍍裝置,其中,該陽極單:局㈣進行電 早兀之%極塊是選自銀與 13 200835817 銅金屬其中之一所製成,該陽極籃是鈦金屬所製成。 5·依據申請專利範圍第1項所述可對工件局部區域進行電 鐘之電鑛裝置’更包含一部分浸入該儲液空間中的打風 管,該打風管上形成有多數個出氣孔,藉由將空氣打入 該打風管並從所述的出氣孔散逸,可形成氣泡以攪拌電 鍍液。 6·依據申請專利範圍第1項所述可對工件局部區域進行電 鍍之電鍍裝置,更包含一連接該鍍槽單元之下槽體底部 的洩液單元,該洩液單元具有一連通該儲液空間的洩放 閥,及一連接該洩放閥的排液管,藉以控制電鍍液的排 放。 7.依據申請專利範圍第6項所述可對工件局部區域進行電 鍵之電鑛裝置,該岐單元更具有__可承接自該排液: 所排放之電鍍液的儲液槽。200835817 -, the scope of application for patents: - A plating device that can electroplate a local area of the guard, including: Dream, Night: =! Yuan, with a lockable and decoupling - can accommodate the liquid storage space of the electric iron An upper edge is formed with at least a upper missing groove body, and an upper edge of the lower upper notch of the upper groove body is formed with an upper edge corresponding to the sound, and the shape of the upper and lower notches conforms to the workpiece The workpiece may be disposed in the shape of the σ position; the leakage stop unit is located between the upper and lower tanks, and the upper and lower gaps of the groove and the workpiece And the ground ring! In the liquid storage space of the ore unit and the workpiece is separated from the periphery of the power supply μ (four) domain, when the anode unit and ♦ face into the > how ... fast, "right", negative When connected, the surface of the workpiece can be plated. , τ 2. 2: Please __ Item 1 is required to perform electricity on the workpiece field:: electricity; device, wherein the tank body above the plating tank is formed with :::, the leak stop unit has two The lower notch 2 of the upper and upper notches are respectively located between the upper and lower notches, and the leakage ring of the workpiece. According to the scope of the patent application scope, the electricity is set, in which the _ single_partial area is used for electric dreams, and "early 7" has - hollowed out anode ▲ and - right on the anode basket And the anode block surrounding the domain. The smelting electroplating zone 4. The electroplating electroplating device according to the third application of the patent application, wherein the anode single: the fourth (4) electric premature electrode is selected from the group consisting of silver and 13 200835817 One of copper metal, which is made of titanium metal. 5. The electric ore device that can make electric clock to the local area of the workpiece according to the first paragraph of the patent application's a wind pipe in the liquid storage space, the air pipe is formed with a plurality of air outlet holes, and by blowing air into the air blowing pipe and dissipating from the air outlet hole, bubbles can be formed to stir the plating solution. The electroplating apparatus capable of electroplating a partial area of the workpiece according to the first aspect of the patent application, further comprising a liquid discharge unit connected to the bottom of the tank body under the plating tank unit, the liquid discharge unit having a liquid communication space Relief valve, and a connection The discharge pipe of the bleed valve is used to control the discharge of the plating solution. 7. The electric ore device capable of performing a key switch on a local area of the workpiece according to the scope of claim 6 of the patent application, the 岐 unit has a __ Drain: The reservoir of the plating solution that is discharged. 依據申請專利範圍第2項所述可對工件局部區域進行電 鍍之電鏟裝置,其中,該陽極單元具有—簍空狀的陽極 籃,及一設置於該陽極籃上並環繞於該工件之欲電鍍區 域的陽極塊。 9·依據申請專利範圍第8項所述可對工件局部區域進行電 鍵之電鍍裝置,其中,該陽極單元之陽極塊是選自銀與 銅金屬其中之一所製成,該陽極籃是鈦金屬所製成。 10·依據申請專利範圍第9項所述可對工件局部區域進行電 鍵之電鐘裝置,更包含-部分浸人該館液空間中的打風 管,該打風管上形成有多數個出氣孔,藉由將空氣打入 14 200835817 該打風管並從所述的出氣孔散逸,可形成氣泡以攪拌電 鍍液。 包 11.依據申請專利範圍第10項所述可對工件局部區域進行電 鍍之電鍍裝置,更包含一連接該鍍槽單元之下槽體底= 的泡液單元,該浪液單元具有一連通該儲液空間的茂^ 闊,及一連接該洩放閥的排液管,藉以控制電鍍液的排 放0 12·依據申請專利範圍第n項所述可對工件局部區域進行電 鍍之電鍍衣置,n夜單元更具有—可承接自該排液管 所排放之電鍵液的儲液槽。 13.-種可ft工件局部區域進行t鍍之電鍍方法,依序包含 下列步驟: 一陽極定位步驟,將一陽極單元裝設於該工件欲電 鐘之外圍並與之相間隔;An electric shovel apparatus capable of electroplating a partial area of a workpiece according to the second aspect of the patent application, wherein the anode unit has a hollowed-out anode basket, and a desire to be disposed on the anode basket and surround the workpiece The anode block of the plating area. 9. The electroplating apparatus capable of performing electric key bonding on a local area of the workpiece according to item 8 of the patent application scope, wherein the anode block of the anode unit is made of one of silver and copper metal, and the anode basket is titanium metal. Made. 10. The electric clock device capable of performing a key switch on a local area of the workpiece according to item 9 of the patent application scope, and further comprising: a portion of the air blowing tube in the liquid space of the working chamber, wherein the air blowing tube is formed with a plurality of air outlet holes By blowing air into the air duct of 14 200835817 and dissipating from the air outlet, air bubbles may be formed to agitate the plating solution. A plating apparatus capable of electroplating a partial area of a workpiece according to claim 10, further comprising a bubble unit connected to a bottom of the tank unit under the plating unit, the liquid unit having a communication The liquid storage space is wide, and a drain pipe connected to the bleed valve is used to control the discharge of the plating solution. 0 12 · Electroplating coating can be performed on a part of the workpiece according to the nth item of the patent application scope. The n-night unit further has a liquid storage tank capable of receiving the electric-key liquid discharged from the liquid discharge pipe. 13. An electroplating method for t-plating a partial region of a ft workpiece, comprising the following steps in sequence: an anode positioning step of mounting an anode unit on a periphery of the workpiece to be separated from the clock; 、-鍍槽組裝步驟,將一上、下槽體結合鎖固,而形 成-包圍該陽極單元並可容置電鍍液的儲液空間,該上 槽體形成有二的上缺口,該下样許 為卜僧篮上形成有二分別對應 該二上 、下缺口的形狀是符合該 該二上缺口的下缺口 工件欲電鑛部位的外形; 一貯液電鍍步驟 並令該陽極單元與— 電源之負極電連接, 一排液拆解步驟 槽體與該陽極單元。 ’將電鐘液抽送至該儲液空間中, 電源之正極電連接’而該工件與該 即可對該工件表面進行電鍍·,以及 ,將電鍍液排出,再拆下該上、下 15 200835817 14. 依據申請專利範圍第13項所述可對工件局部區域進行電 鍍之電鍍方法,其中,在該鍍槽組裝步驟中,還將 風管置於該儲液空間中。 15. 依據以專利_第13項所料對I件局耗域進 鍍之電鍍方法,其中,在該鍍槽組裝步驟中,將塾片置 於:上::槽體之接合處,同時,將二止漏環設置於該 16 :據申:=中並貼合該工件表面,防正電鍍㈣漏。 .依據“專利範圍第13項所 鍍之電鍍方法,更包含件局Μ域進仃電 清潔步驟,該表面清潔步驟:::定位步驟之前的表面 的表面。 疋 > 潔在該工件欲電鍍區域 17.依據申請專利範圍f 鍍之電鍍方法,龙由 、斤达可對工件局部區域進行電 /、〒’在該表 、主 工件欲電鍍區域的主 τ卸〉月缄步驟中,還研磨該 _的表面,使其平滑。And a plating tank assembly step, the upper and lower tank bodies are combined and locked to form a liquid storage space surrounding the anode unit and accommodating the plating liquid, and the upper tank body is formed with two upper gaps, and the sample is formed. The shape of the two upper and lower notches respectively formed on the basket is a shape conforming to the position of the lower notch of the workpiece on the second upper notch; a liquid storage step and the anode unit and the power supply The negative electrode is electrically connected, and a liquid disassembling step is performed in the tank body and the anode unit. 'Pumping the electric bell liquid into the liquid storage space, the positive electrode of the power supply is electrically connected', and the workpiece and the surface of the workpiece can be electroplated, and the electroplating solution is discharged, and then the upper and lower parts are removed. 200835817 14. An electroplating method capable of electroplating a partial region of a workpiece according to claim 13 of the patent application, wherein in the plating tank assembly step, the air duct is also placed in the liquid storage space. 15. According to the plating method of the one-piece local consumption in the patent _13, wherein in the plating assembly step, the cymbal is placed on: the joint of the tank: at the same time, The second leak-stop ring is set in the 16: in accordance with the application: = and fits the surface of the workpiece to prevent electroplating (four) leakage. According to the electroplating method of the thirteenth patent range, the electroplating method is further included, the surface cleaning step::: the surface of the surface before the positioning step. 疋> Area 17. According to the plating method of the patent application range f, the dragon can be used to electrically discharge the local area of the workpiece, and in the table, the main τ unloading step of the main workpiece to be plated, and also grind The surface of the _ makes it smooth. 1616
TW96106111A 2007-02-16 2007-02-16 Electroplating apparatus capable of carrying out electroplating onto local area of workpiece and its method TW200835817A (en)

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CN111032925A (en) * 2017-09-07 2020-04-17 盛美半导体设备(上海)股份有限公司 Electroplating chuck
TWI791785B (en) * 2019-03-06 2023-02-11 大陸商盛美半導體設備(上海)股份有限公司 Plating chuck

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Publication number Priority date Publication date Assignee Title
CN105350038B (en) * 2014-08-22 2017-11-07 王元谷 Local electroplating device and selective plating method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111032925A (en) * 2017-09-07 2020-04-17 盛美半导体设备(上海)股份有限公司 Electroplating chuck
US11469134B2 (en) 2017-09-07 2022-10-11 Acm Research (Shanghai) Inc. Plating chuck
TWI791785B (en) * 2019-03-06 2023-02-11 大陸商盛美半導體設備(上海)股份有限公司 Plating chuck

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