CN105002472A - Wafer fixing device for evaporator - Google Patents
Wafer fixing device for evaporator Download PDFInfo
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- CN105002472A CN105002472A CN201510387415.3A CN201510387415A CN105002472A CN 105002472 A CN105002472 A CN 105002472A CN 201510387415 A CN201510387415 A CN 201510387415A CN 105002472 A CN105002472 A CN 105002472A
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- wafer
- evaporator
- securing element
- mounting apparatus
- resilient securing
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a wafer fixing device for an evaporator. A wafer is fixed onto a support through a wafer ring. An annular concave platform for placing the wafer is formed on the inner circle of the wafer ring. Several elastic fixing parts which can rotate around fixed points are positioned at intervals on the outer circle of the wafer ring. Compression members on the elastic fixing parts act on circumferential edge of the wafer surface in an elastic compression form so as to fix the wafer relative to the annular concave platform. According to the fixing device, the wafer edge fixing mode replaces a middle fixing mode so as to omit a metal cover at the back of the wafer. Thus, the whole fixing device is simple and light. Without locknuts during installation, installation is time-saving and labor-saving, and fittings for cleaning are reduced. By the multi-point fixing mode, stability of the wafer is enhanced. The device provided by the invention can meet requirements for wafer fixing during wafer face and backside evaporation. In addition, wafer installation procedure is greatly simplified, and work efficiency is enhanced.
Description
Technical field
The present invention relates to a kind of semiconducter device stationary installation, particularly relate to a kind of evaporator wafer mounting apparatus, belong to semiconductor device fabrication accessory field.
Background technology
In semiconductor manufacturing industry, a kind of common depositing metal conductive film preparation technique is evaporation process, in this technique, the evaporator of widespread use is the MARK 50 type evaporator that CHA INDUSTRIES company of the U.S. produces, this evaporator is operationally be fixed on by wafer on circular support to make it around stationary shaft rotation, and circular support also revolves round the sun along guide rail simultaneously.For existing installation, original design can only do crystal face evaporation, to be fixed on the ring groove 2 li on support by the crystal face 101 of wafer 1 towards target, then to withstand the crystalline substance back of the body 102 of wafer with the back shroud of band shell fragment 3, with this, wafer is fixed (shown in Figure 1).But if brilliant back of the body evaporation, by conductive film deposits at wafer rear, then need crystalline substance to facing away from target, backwards, now maximum problem is exactly how wafer clamps to crystal face.This is because crystal face is towards back shroud, but now crystal face can not use spring shell fragment top, otherwise can destroy the active parts on wafer.
For above-mentioned technical problem; at present in the crystalline substance back of the body evaporation process of Mark 50; generally in order to protect crystal face not by the damage of shell fragment; usually the mode installing baffle plate additional is taked; namely be installed to when wafer after in the ring shaped slot on support; install the thin slice 4 of an arc again additional, protect wafer to withstand crystal face in the process of wafer at shell fragment 3 with this thin slice 4 and be not damaged.Thin slice is a very thin arc metal plate, and only at edge contact wafer, unsettled in the middle of it, the spring loaded shell fragment 3 be arranged on back shroud withstands the thin slice of protruding arc, and thin slice pushes down wafer, reaches the object of fixing wafer, in detail as shown in Figure 2.But adopt arc thin slice described in this kind of mode to push down wafer, and then withstand wafer with the shell fragment on bonnet, there is following defect: (1) installs loaded down with trivial details, waste time and energy, especially the first step is after installing wafer, arc thin slice is pressed on wafer, and then the back shroud of mounting strap shell fragment, and back shroud needs to lock by special nut, because nut diameter is comparatively large, thinner thickness, thus more difficult when locking, simultaneously because installation parts is more, there is the risk that wafer frontside is scraped off; (2) whole system complex structure, parts are many, and cost is higher, and during follow-up maintenance maintenance, the parts of cleaning are also more, and maintenance cost is also very high; (3) only rely on the elastic force of a shell fragment when wafer is fixed, need to fix wafer and sheet metal simultaneously, there is the risk that wafer comes off, the reliability of whole system is not high.
Summary of the invention
For solving the problems of the technologies described above, the object of this invention is to provide a kind of evaporator wafer mounting apparatus, this device can complete the fixing of wafer simple and easy, reliable, efficiently, and is not only applicable to crystal face evaporation and is equally also applicable to brilliant back of the body evaporation.
Technical scheme of the present invention is:
A kind of evaporator wafer mounting apparatus, comprise one in hemispheric support, spaced apartly on this support be provided with several through holes, each through hole is installed with a wafer central, the inner ring of this wafer central forms the annular concave platform for placing wafer, and on wafer central outer ring, positioned at intervals is provided with several resilient securing element that can rotate around its point of fixity, and this resilient securing element is formed with casting die, described casting die elasticity compresses the circumferential edges that formula acts on crystal column surface and fixes to make wafer opposed annular concave station.
Its further technical scheme is:
Described wafer central is threaded connection part and is fixed on through hole, and the external diameter of described wafer central outer ring is less than the diameter of through hole, and diameter wafer is greater than the internal diameter of wafer central annular concave platform and diameter wafer is less than the internal diameter of wafer central outer ring.
On described wafer central, uniform intervals is formed with several locating platforms, and the upper surface of this locating platform is lower than the upper surface of described annular concave platform, and described resilient securing element pivot location is arranged on this locating platform.
Described resilient securing element also comprises fixed part, and this fixed part and described casting die are integral type structure.
Be provided with drive-connecting shaft, this drive-connecting shaft is fed through the fixed part of resilient securing element and is detachablely fixed on described locating platform, and described resilient securing element can rotate on locating platform around this drive-connecting shaft.
Described resilient securing element is the one in metal clips, wire of spring and elasticity thimble.
Described metal clips is anti-Z-type structure, and the base of this anti-Z-type structure extends to form casting die towards wafer central center, and the top margin of this anti-Z-type structure extends to form fixed part in wafer central center dorsad obliquely.
Described casting die elasticity compresses formula when acting on the circumferential edges of crystal column surface, and the contact length of this casting die and crystal column surface circumferential edges is 1.5 ~ 2.5mm.
Described resilient securing element is 3 ~ 8.
By such scheme, the present invention at least has the following advantages: wafer is fixed on support by wafer central by this stationary installation, the inner ring of wafer central forms the annular concave platform for placing wafer, on wafer central outer ring, positioned at intervals is provided with several resilient securing element that can rotate around its point of fixity, this resilient securing element is formed with casting die, and casting die elasticity compresses the circumferential edges that formula acts on crystal column surface and fixes to make wafer opposed annular concave station; This stationary installation replaces middle fixing mode in the mode that crystal round fringes is fixed, the metal cover board at wafer rear can be saved, make whole stationary installation succinctly light, during installation also without the need to set nut so can be time saving and energy saving, and the accessory that need clean also reduces to some extent; The mode that this device adopts multiple spot fixing, adds the reliability that wafer is fixing, in addition because resilient securing element is fixing, so also do not have other factors causing wafer to damage in the process of installing wafer.The requirement that when this device can not only meet crystal face crystalline substance back of the body evaporation, wafer is fixing, and the flow process that enormously simplify that wafer installs, improve working efficiency.
Above-mentioned explanation is only the general introduction of technical solution of the present invention, in order to better understand technique means of the present invention, and can be implemented according to the content of specification sheets, coordinates accompanying drawing to be described in detail as follows below with preferred embodiment of the present invention.
Accompanying drawing explanation
Fig. 1 is the fixed form of wafer when carrying out crystal face evaporation in prior art;
Fig. 2 is the fixed form of wafer when carrying out brilliant back of the body evaporation in prior art;
Fig. 3 is the stereographic map structural representation of stationary installation of the present invention;
Fig. 4 is the vertical view of stationary installation of the present invention;
Fig. 5 is the structural representation of wafer central in stationary installation of the present invention;
Wherein:
1-wafer; 101-crystal face;
The 102-crystalline substance back of the body; 2-ring groove;
3-shell fragment; 4-thin slice;
5-support; 6-through hole;
7-wafer central; 701-annular concave platform;
702-wafer central outer ring; 703-locating platform;
8-resilient securing element; 801-casting die;
802-fixed part; 9-drive-connecting shaft.
Embodiment
Below in conjunction with accompanying drawing 3 to accompanying drawing 5 and embodiment, be described in further detail the specific embodiment of the present invention, following examples for illustration of the present invention, but are not used for limiting the scope of the invention.
A kind of evaporator wafer mounting apparatus, comprise one in hemispheric support 5, this support 5 also can be referred to as planet carrier, spaced apartly on this support 5 be provided with several through holes 6, for better implementing present method, through hole 6 described in this specific embodiment is in offering along support 5 radial section even circumferential interval and described through hole 6 symmetrical expression arrangement between two.
Above-mentioned each through hole 6 is installed with a wafer central 7, wafer central 7 described in this specific embodiment can be threaded connection part such as the parts such as screw and be fixed on through hole 6 place.The inner ring of this wafer central forms the annular concave platform 701 for placing wafer, and positioned at intervals is provided with several resilient securing element 8 that can rotate around its point of fixity on wafer central outer ring 702, this resilient securing element is formed with casting die 801, described casting die elasticity compresses the circumferential edges that formula acts on crystal column surface and fixes to make wafer opposed annular concave station.The external diameter of wafer central outer ring 702 is greater than the diameter of through hole 6, and diameter wafer is greater than the internal diameter of wafer central annular concave platform 701 and diameter wafer is less than the internal diameter of wafer central outer ring 702, to ensure that wafer can be placed in wafer central smoothly.
On described wafer central 7, uniform intervals is formed with several locating platforms 703, the upper surface of this locating platform is lower than the upper surface of described annular concave platform 701, described resilient securing element 8 pivot location is arranged on this locating platform, resilient securing element 8 comprises aforesaid casting die 801 and fixed part 802, and this fixed part and casting die are integral type structure.Be provided with drive-connecting shaft 9, this drive-connecting shaft 9 is fed through the fixed part 802 of resilient securing element and is detachablely fixed on described locating platform 703, and described resilient securing element 8 can rotate on locating platform around this drive-connecting shaft.
Described resilient securing element 8 is the one in metal clips, wire of spring and elasticity thimble, this specific embodiment Elastic fixing part 8 adopts metal clips, this metal clips is for having elastic foil, its concrete structure is anti-Z-type structure, the base of this anti-Z-type structure extends to form casting die 801 towards wafer central center, is used for pushing down and fixes wafer; The top margin of this anti-Z-type structure extends to form fixed part 802 in wafer central center dorsad obliquely, fixed part 802 is fixedly arranged on locating platform 703 by drive-connecting shaft 9, and enable metal clips on locating platform, carry out free rotation around drive-connecting shaft by rotating this fixed part, can arrange according to the size of locating platform the angle that this metal clips rotates, common metal shell fragment rotational angle is suitable for meeting that metal clips turns to and push down wafer and leave and discharge wafer.
In technical scheme of the present invention, the quantity of resilient securing element (metal clips namely in this specific embodiment) can be revised voluntarily according to different wafer sizes, as for 6 inch wafer, general employing 3 metal clips are implemented to fix, and for 8 inch wafer, 4 metal clips then can be adopted to implement the fixing of wafer, and generally this resilient securing element 8 is set to 3 ~ 8.In addition when casting die 801 elasticity compress formula act on the circumferential edges of crystal column surface time, the contact length of this casting die and crystal column surface circumferential edges is 1.5 ~ 2.5mm, mainly consider reliable and efficient, reduce the impact on wafer effective member simultaneously to greatest extent.
For the fixation problem of ultra-thin wafers, such as need fixed thickness lower than the wafer of 200 microns, because too thin so be easy to clip broken, only metal clips slightly need be made an amendment for this kind of wafer, fragment rate can be greatly reduced, namely the front end on anti-for metal clips Z-type structure base can be widened, thinning, reducing pressure by increase with the contact area of wafer can realize.Above-mentioned principle is equally applicable to the structural improvement of wire of spring and elasticity thimble.
When adopting device of the present invention to carry out evaporation, no matter be crystal face evaporation or brilliant back of the body evaporation, the fixed part 802 of resilient securing element 8 (metal clips namely in this specific embodiment) first rotates to an angle around drive-connecting shaft 9 by the first step, make wafer 1 can put into wafer central smoothly, and by the annular concave platform of wafer alignment wafer central; When carrying out crystal face evaporation and placing wafer, can use and inhale the auxiliary placement that pen carries out wafer; When carrying out crystalline substance back of the body evaporation, clip can be used to carry out the auxiliary placement of wafer.Secondly, second step is that the fixed part of turnable elastic fixing part 8 (metal clips namely in this specific embodiment) makes casting die 801 elasticity compress formula to act on crystal column surface; To the wafer of different thickness in this step, operation is slightly different: if the thickness of wafer is thicker, needs resilient securing element 8 (metal clips namely in this specific embodiment) to lift a little a bit and then rotates and push down wafer; If the thinner thickness of wafer, then need the front end of the casting die 802 of resilient securing element 8 (metal clips namely in this specific embodiment) to press down a bit a little, and then rotate the edge to crystal column surface.When resilient securing element 8 elasticity compresses the edge of crystal column surface, then wafer is fixed on wafer central, without the need to mounting rear cover plate again.
Technical scheme of the present invention only adopts a sleeve fixture mechanism just can take into account fixing wafer in crystal face evaporation process and brilliant back of the body evaporation process, and without the need to changing any accessory in stationary installation.In addition this stationary installation when fixing wafer because of without the need to installing bonnet again, the quality of whole support (planet carrier) is made to alleviate about 1/3rd, thus the speed of wafer handling in evaporation process and efficiency are promoted greatly: when such as described in employing prior art, device carries out evaporation, the general 30s of one wafer is installed before evaporation, 8 need about 240s consuming time, install fixing back shroud and need 80s consuming time, install hook and need 35s consuming time, whole process needs 355s consuming time; And when adopting stationary installation of the present invention to carry out the installation of wafer, every wafer is installed and only needs 25s, install hook 25s consuming time, need altogether 225s consuming time, installation rate can improve nearly 37%.Moreover, device of the present invention is used to make the fixing more effective of wafer, this is because be only that employing shell fragment withstands in the middle of wafer to the fixing of wafer in prior art, limited strength and some position single, likely there will be the situation that wafer rocks, and device of the present invention adopts multiple spot clamping to fix, strength is even, clamping dynamics is adjustable, greatly enhances the stability that wafer is fixing.
The above is only the preferred embodiment of the present invention; be not limited to the present invention; should be understood that; for those skilled in the art; under the prerequisite not departing from the technology of the present invention principle; can also make some improvement and modification, these improve and modification also should be considered as protection scope of the present invention.
Claims (9)
1. an evaporator wafer mounting apparatus, comprise one in hemispheric support (5), this support (5) is above spaced apart is provided with several through holes (6), it is characterized in that: each through hole is installed with a wafer central (7), the inner ring of this wafer central forms the annular concave platform (701) for placing wafer, and wafer central outer ring (702) upper positioned at intervals is provided with several resilient securing element (8) that can rotate around its point of fixity, this resilient securing element is formed with casting die (801), described casting die elasticity compresses the circumferential edges that formula acts on crystal column surface and fixes to make wafer opposed annular concave station.
2. evaporator wafer mounting apparatus according to claim 1, it is characterized in that: described wafer central (7) is threaded connection part and is fixed on through hole (6) place, and the external diameter of described wafer central outer ring (702) is greater than the diameter of through hole (6), diameter wafer is greater than the internal diameter of wafer central annular concave platform (701) and diameter wafer is less than the internal diameter of wafer central outer ring (702).
3. evaporator wafer mounting apparatus according to claim 1, it is characterized in that: the upper uniform intervals of described wafer central (7) is formed with several locating platforms (703), the upper surface of this locating platform is lower than the upper surface of described annular concave platform (701), and described resilient securing element (8) pivot location is arranged on this locating platform.
4. evaporator wafer mounting apparatus according to claim 1, is characterized in that: described resilient securing element (8) also comprises fixed part (802), and this fixed part and described casting die (801) are integral type structure.
5. the evaporator wafer mounting apparatus according to claim 3 or 4, it is characterized in that: be provided with drive-connecting shaft (9), this drive-connecting shaft (9) is fed through the fixed part (802) of resilient securing element and is detachablely fixed on described locating platform (703), and described resilient securing element (8) can rotate on locating platform around this drive-connecting shaft.
6. evaporator wafer mounting apparatus according to claim 4, is characterized in that: described resilient securing element (8) is metal clips, one in wire of spring and elasticity thimble.
7. evaporator wafer mounting apparatus according to claim 6, it is characterized in that: described metal clips is anti-Z-type structure, the base of this anti-Z-type structure extends to form casting die (801) towards wafer central center, and the top margin of this anti-Z-type structure extends to form fixed part (802) in wafer central center dorsad obliquely.
8. evaporator wafer mounting apparatus according to claim 6, it is characterized in that: described casting die (801) elasticity compresses formula when acting on the circumferential edges of crystal column surface, and the contact length of this casting die and crystal column surface circumferential edges is 1.5 ~ 2.5mm.
9. evaporator wafer mounting apparatus according to claim 1, is characterized in that: described resilient securing element (8) is 3 ~ 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510387415.3A CN105002472A (en) | 2015-07-03 | 2015-07-03 | Wafer fixing device for evaporator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510387415.3A CN105002472A (en) | 2015-07-03 | 2015-07-03 | Wafer fixing device for evaporator |
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| Publication Number | Publication Date |
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| CN105002472A true CN105002472A (en) | 2015-10-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510387415.3A Pending CN105002472A (en) | 2015-07-03 | 2015-07-03 | Wafer fixing device for evaporator |
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| CN (1) | CN105002472A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106637125A (en) * | 2017-01-09 | 2017-05-10 | 京东方科技集团股份有限公司 | Substrate bearing mechanism and application method thereof, and evaporation device |
| CN107267948A (en) * | 2017-06-20 | 2017-10-20 | 武汉华星光电技术有限公司 | Support member and filming equipment |
| CN109890732A (en) * | 2016-10-27 | 2019-06-14 | 康宁股份有限公司 | Method and apparatus for consolidated article |
| CN110646430A (en) * | 2019-10-29 | 2020-01-03 | 太极半导体（苏州）有限公司 | Wafer inspection tool |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109890732A (en) * | 2016-10-27 | 2019-06-14 | 康宁股份有限公司 | Method and apparatus for consolidated article |
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| CN107267948A (en) * | 2017-06-20 | 2017-10-20 | 武汉华星光电技术有限公司 | Support member and filming equipment |
| CN110646430A (en) * | 2019-10-29 | 2020-01-03 | 太极半导体（苏州）有限公司 | Wafer inspection tool |
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Application publication date: 20151028 |
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