CN202695403U - Vapor deposition semiconductor element bearing ring and bearing device with same - Google Patents
Vapor deposition semiconductor element bearing ring and bearing device with same Download PDFInfo
- Publication number
- CN202695403U CN202695403U CN 201220258032 CN201220258032U CN202695403U CN 202695403 U CN202695403 U CN 202695403U CN 201220258032 CN201220258032 CN 201220258032 CN 201220258032 U CN201220258032 U CN 201220258032U CN 202695403 U CN202695403 U CN 202695403U
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- China
- Prior art keywords
- semiconductor element
- ring
- element load
- evaporation
- carrying ring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 83
- 238000007740 vapor deposition Methods 0.000 title 1
- 238000001704 evaporation Methods 0.000 claims abstract description 95
- 230000008020 evaporation Effects 0.000 claims abstract description 95
- 230000000694 effects Effects 0.000 abstract description 7
- 238000007747 plating Methods 0.000 abstract 7
- 230000008901 benefit Effects 0.000 description 4
- 230000002950 deficient Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
Images
Landscapes
- Physical Vapour Deposition (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model relates to an evaporation plating semiconductor element carrier ring and have device that bears of this carrier ring, wherein evaporation plating semiconductor element carrier ring contains an annular wall that stands, and at least three support portion, support portion stands wall geometric centre from this annular wall bottom towards this annular and extends the setting, just support portion sets up at intervals each other, and the utility model discloses the device that bears with evaporation plating semiconductor element carrier ring contains a bearing device, a plurality of evaporation plating semiconductor element carrier ring, and this bearing device includes a backup pad, and a plurality of evaporation plating holes of seting up in this backup pad, evaporation plating semiconductor element carrier ring corresponds respectively the evaporation plating hole sets up, utilizes the support portion can reach the effect of bearing the wafer, and the area that shields that lets the wafer receive reduces by a wide margin.
Description
Technical field
The utility model relates to a kind of chip bearing ring, particularly relates to a kind of evaporation semiconductor element load-carrying ring and has the bogey of evaporation semiconductor element load-carrying ring.
Background technology
Fig. 1 and a kind of evaporation semiconductor element load-carrying ring 1 that Figure 2 shows that in the past, when evaporate process, semiconductor element such as wafer 5 grades is to adopt the back-Laying type mode to be positioned in this load-carrying ring 1, this kind back-Laying type load-carrying ring 1 is relatively simple compared to just putting formula load-carrying ring structure, therefore can increase the service life, and back-Laying type adopts vacuum slot gripping wafer 5, adopt the nickel sub-folder to get wafer 5 compared to the formula of just putting, can avoid scratch wafer 5 surfaces, only existing back-Laying type load-carrying ring 1 comprises a ring-type wall 11, a ring-type holder section 12, and location annular convex 13, the evaporation area of wafer 5 will be subject to covering of ring-type holder section 12, the namely surrounding area crested of wafer 5 whole circles can't evaporation, so that available areal extent is restricted on the wafer 5, can't take full advantage of wafer 5 areas.
Therefore, a kind of evaporation semiconductor element load-carrying ring 1 of the dead area can reduce evaporation the time is one of R﹠D target of at present relevant dealer.
This shows, above-mentioned existing a kind of evaporation semiconductor element load-carrying ring obviously still has inconvenience and defective, and demands urgently further being improved in structure and use.Therefore how to found a kind of evaporation semiconductor element load-carrying ring of new structure and have the bogey of this load-carrying ring, also becoming the current industry utmost point needs improved target.
Because the defective that above-mentioned existing a kind of evaporation semiconductor element load-carrying ring exists, the inventor is based on being engaged in for many years abundant practical experience and professional knowledge of this type of product design manufacturing, and the utilization of cooperation scientific principle, positive research and innovation in addition, to the evaporation semiconductor element load-carrying ring of founding a kind of new structure and the bogey with this load-carrying ring, can improve general existing a kind of evaporation semiconductor element load-carrying ring, make it have more practicality.Through constantly research, design, and through after repeatedly studying sample and improvement, finally create the utility model that has practical value.
Summary of the invention
The purpose of this utility model is, overcome the defective that existing a kind of evaporation semiconductor element load-carrying ring exists, and a kind of evaporation semiconductor element load-carrying ring of new structure is provided and has the bogey of this load-carrying ring, technical problem to be solved is the bogey that makes it a kind of evaporation semiconductor element load-carrying ring of the dead area can reduce evaporation the time is provided and have evaporation semiconductor element load-carrying ring.
The purpose of this utility model and to solve its technical problem be to adopt following technical scheme to realize.A kind of evaporation semiconductor element load-carrying ring according to the utility model proposes comprises: a ring-type wall, and a location annular convex, this location annular convex arrange towards extending away from this ring-type wall geometric center from this ring-type wall top; Wherein: this evaporation semiconductor element load-carrying ring also comprises at least three holder sections, and this ring-type wall bottom is extended towards this ring-type wall geometric center and arranged certainly, and described holder section is intervally installed.
The purpose of this utility model and solve its technical problem and can also be further achieved by the following technical measures.
Aforesaid evaporation semiconductor element load-carrying ring, the each other uniformly-spaced setting of wherein said holder section.
Aforesaid evaporation semiconductor element load-carrying ring, wherein said holder section top view is rectangular in fact.
Aforesaid evaporation semiconductor element load-carrying ring, wherein said holder section top view is in fact convex arc-shape.
The purpose of this utility model and solve its technical problem and also realize by the following technical solutions.
According to a kind of bogey with evaporation semiconductor element load-carrying ring that the utility model proposes, comprise: a bogey, and a plurality of evaporation semiconductor element load-carrying rings, this bogey comprises a supporting bracket, and a plurality of evaporation holes that are opened on this supporting bracket, described evaporation semiconductor element load-carrying ring respectively corresponding described evaporation hole arranges, described evaporation semiconductor element load-carrying ring comprises respectively a ring-type wall, and a location annular convex, this location annular convex arranges towards extending away from this ring-type wall geometric center from this ring-type wall top; Wherein: described evaporation semiconductor element load-carrying ring also comprises respectively at least three holder sections, and described holder section extends towards this ring-type wall geometric center from this ring-type wall bottom and arranges, and described holder section is intervally installed.
The purpose of this utility model and solve its technical problem and can also be further achieved by the following technical measures.
Aforesaid bogey with evaporation semiconductor element load-carrying ring, wherein said evaporation semiconductor element load-carrying ring also comprises respectively a plurality of fixed supports, and described fixed support is set up on the supporting bracket of this bogey.
Aforesaid bogey with evaporation semiconductor element load-carrying ring, wherein said each evaporation semiconductor element load-carrying ring respective amount are two fixed support.
Aforesaid bogey with evaporation semiconductor element load-carrying ring, the each other uniformly-spaced setting of wherein said holder section.
Aforesaid bogey with evaporation semiconductor element load-carrying ring, wherein said holder section top view is rectangular in fact.
Aforesaid bogey with evaporation semiconductor element load-carrying ring, wherein said holder section top view is in fact convex arc-shape.
The utility model compared with prior art has obvious advantage and beneficial effect.By above technology contents as can be known, for achieving the above object, the utility model provides a kind of evaporation semiconductor element load-carrying ring, comprises: a ring-type wall, and a location annular convex, this location annular convex arranges towards extending away from this ring-type wall geometric center from this ring-type wall top; Wherein: this evaporation semiconductor element load-carrying ring also comprises at least three holder sections, and described holder section extends towards this ring-type wall geometric center from this ring-type wall bottom and arranges, and described holder section is intervally installed.The described holder such as The section uniformly-spaced arranges each other.The described holder such as The section top view is rectangular in fact.The described holder such as The section top view is in fact convex arc-shape.The utlity model has the bogey of evaporation semiconductor element load-carrying ring, comprise: a bogey, and a plurality of evaporation semiconductor element load-carrying rings, this bogey comprises a supporting bracket, and a plurality of evaporation holes that are opened on this supporting bracket, described evaporation semiconductor element load-carrying ring respectively corresponding described evaporation hole arranges, described evaporation semiconductor element load-carrying ring comprises respectively a ring-type wall, and a location annular convex, this location annular convex arranges towards extending away from this ring-type wall geometric center from this ring-type wall top; Wherein: described evaporation semiconductor element load-carrying ring also comprises respectively at least three holder sections, described holder section extends towards this ring-type wall geometric center from this ring-type wall bottom and arranges, and described holder section is intervally installed, also comprise a plurality of fixed supports, described fixed support is set up on the supporting bracket of this bogey.Each evaporation semiconductor element load-carrying ring respective amount is two fixed support.The described holder such as The section uniformly-spaced arranges each other.The described holder such as The section top view is rectangular in fact.The described holder such as The section top view is in fact convex arc-shape.
By technique scheme, the utility model evaporation semiconductor element load-carrying ring and the bogey with this load-carrying ring have following advantages and beneficial effect at least: utilize described holder section can reach the effect of carrying wafer, allow the suffered dead area of wafer significantly reduce, really so that wafer area can more effectively be utilized, reach the purpose of this utility model.
Above-mentioned explanation only is the general introduction of technical solutions of the utility model, for can clearer understanding technological means of the present utility model, and can be implemented according to the content of specification, and for above-mentioned and other objects, features and advantages of the present utility model can be become apparent, below especially exemplified by preferred embodiment, and the cooperation accompanying drawing, be described in detail as follows.
Description of drawings
Fig. 1 is the cutaway view of a kind of evaporation semiconductor element load-carrying ring in the past;
Fig. 2 is the unserviceable vertical view of surrounding area crested of in the past evaporation semiconductor element load-carrying ring;
Fig. 3 is the vertical view of the first preferred embodiment of the utility model evaporation semiconductor element load-carrying ring;
Fig. 4 is the vertical view of the second preferred embodiment of the utility model evaporation semiconductor element load-carrying ring;
Fig. 5 is the partial perspective view of the first preferred embodiment that the utlity model has the bogey of evaporation semiconductor element load-carrying ring.
Embodiment
Be to reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the utility model, below in conjunction with accompanying drawing and preferred embodiment, to according to the evaporation semiconductor element load-carrying ring that the utility model proposes and its embodiment of bogey, structure, feature and the effect thereof with this load-carrying ring, be described in detail as follows.
Consult Fig. 3 and Fig. 5, the utility model evaporation semiconductor element load-carrying ring 2 and have the first preferred embodiment of the bogey 3 of evaporation semiconductor element load-carrying ring 2, this bogey 3 with evaporation semiconductor element load-carrying ring 2 comprises a bogey 3, a plurality of evaporation semiconductor element load-carrying ring 2, and a plurality of fixed supports 4.
This bogey 3 comprises a supporting bracket 31, and a plurality of evaporation holes 32 that are opened on this supporting bracket 31, and it is tabular and be used for being set up in vacuum evaporation equipment that this bogey 3 generally is arc surface.
A plurality of evaporation semiconductor element load-carrying rings 2 respectively corresponding described evaporation hole 32 arrange, and each evaporation semiconductor element load-carrying ring 2 comprises a ring-type wall 21, at least three holder sections 22, and a location annular convex 23.
Described holder section 22 extends towards these ring-type wall 21 geometric centers from these ring-type wall 21 bottoms and arranges, and described holder section 22 is intervally installed, and this location annular convex 23 arranges towards extending away from these ring-type wall 21 geometric centers from these ring-type wall 21 tops.
Described fixed support 4 is set up on the supporting bracket 31 of this bogey 3 and is fixing with described evaporation semiconductor element load-carrying ring 2.
In this first preferred embodiment, the quantity of described holder section 22 is three, and described holder section 22 uniformly-spaced arranges each other, and described holder section 22 top views are rectangular in fact.
Each evaporation semiconductor element load-carrying ring 2 respective amount is two fixed support 4, utilizes screwed lock to be fixed on the supporting bracket 31 of this bogey 3.
Utilize described fixed support 4 that described evaporation semiconductor element load-carrying ring 2 is installed on the supporting bracket 31 of this bogey 3, and the holder section 22 that sees through this evaporation semiconductor element load-carrying ring 2 reaches the effect of carrying wafer 5, just can reach the carrying effect when being three because of the quantity of described holder section 22, so that wafer 5 suffered dead areas significantly reduce, really so that wafer 5 areas can more effectively be utilized, reach the purpose of this utility model.
On the practice, this bogey 3 also can not have described fixed support 4, also can reach the purpose of this utility model.
Consult Fig. 4, the utility model evaporation semiconductor element load-carrying ring 2 and have second preferred embodiment of bogey 3 of evaporation semiconductor element load-carrying ring 2 and this first preferred embodiment member and assembling mode roughly the same, difference is in this second preferred embodiment, and described holder section 22 top views are in fact convex arc-shape.
In sum, three holder sections 22 that see through this evaporation semiconductor element load-carrying ring 2 reach the effect of carrying wafer 5, so that wafer 5 suffered dead areas significantly reduce, allow wafer 5 areas more effectively be utilized, so really can reach the purpose of this utility model.
The above, it only is preferred embodiment of the present utility model, be not that the utility model is done any pro forma restriction, although the utility model discloses as above with preferred embodiment, yet be not to limit the utility model, any those skilled in the art, within not breaking away from the technical solutions of the utility model scope, when the structure that can utilize above-mentioned announcement and technology contents are made a little change or be modified to the equivalent embodiment of equivalent variations, but every content that does not break away from technical solutions of the utility model, any simple modification that foundation technical spirit of the present utility model is done above embodiment, equivalent variations and modification all still belong in the scope of technical solutions of the utility model.
Claims (10)
1. evaporation semiconductor element load-carrying ring comprises: a ring-type wall, and a location annular convex, this location annular convex arrange towards extending away from this ring-type wall geometric center from this ring-type wall top; It is characterized in that: this evaporation semiconductor element load-carrying ring also comprises at least three holder sections, and this ring-type wall bottom is extended towards this ring-type wall geometric center and arranged certainly, and described holder section is intervally installed.
2. evaporation semiconductor element load-carrying ring according to claim 1 is characterized in that: the each other uniformly-spaced setting of described holder section.
3. evaporation semiconductor element load-carrying ring according to claim 1 is characterized in that: described holder section top view is rectangular in fact.
4. evaporation semiconductor element load-carrying ring according to claim 1 is characterized in that: described holder section top view is in fact convex arc-shape.
5. bogey with evaporation semiconductor element load-carrying ring, comprise: a bogey, and a plurality of evaporation semiconductor element load-carrying rings, this bogey comprises a supporting bracket, and a plurality of evaporation holes that are opened on this supporting bracket, described evaporation semiconductor element load-carrying ring respectively corresponding described evaporation hole arranges, described evaporation semiconductor element load-carrying ring comprises respectively a ring-type wall, and a location annular convex, this location annular convex arranges towards extending away from this ring-type wall geometric center from this ring-type wall top; It is characterized in that: described evaporation semiconductor element load-carrying ring also comprises respectively at least three holder sections, and described holder section extends towards this ring-type wall geometric center from this ring-type wall bottom and arranges, and described holder section is intervally installed.
6. the bogey with evaporation semiconductor element load-carrying ring according to claim 5, it is characterized in that: described evaporation semiconductor element load-carrying ring also comprises respectively a plurality of fixed supports, and described fixed support is set up on the supporting bracket of this bogey.
7. the bogey with evaporation semiconductor element load-carrying ring according to claim 6, it is characterized in that: each evaporation semiconductor element load-carrying ring respective amount is two fixed support.
8. the bogey with evaporation semiconductor element load-carrying ring according to claim 5 is characterized in that: the each other uniformly-spaced setting of described holder section.
9. the bogey with evaporation semiconductor element load-carrying ring according to claim 5 is characterized in that: described holder section top view is rectangular in fact.
10. the carrying dress with evaporation semiconductor element load-carrying ring according to claim 5 is characterized in that: described holder section top view is in fact convex arc-shape.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100212292U TWM416869U (en) | 2011-07-05 | 2011-07-05 | Evaporation semiconductor device carrying ring and loading device having evaporation semiconductor device carrying ring |
| TW100212292 | 2011-07-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202695403U true CN202695403U (en) | 2013-01-23 |
Family
ID=46449149
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220258032 Expired - Fee Related CN202695403U (en) | 2011-07-05 | 2012-05-31 | Vapor deposition semiconductor element bearing ring and bearing device with same |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN202695403U (en) |
| TW (1) | TWM416869U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104282603A (en) * | 2013-07-11 | 2015-01-14 | 北大方正集团有限公司 | Wafer bearing disc and big beam injection equipment |
| CN105002472A (en) * | 2015-07-03 | 2015-10-28 | 苏州工业园区纳米产业技术研究院有限公司 | Wafer fixing device for evaporator |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103668101B (en) * | 2012-09-21 | 2015-12-16 | 无锡华润华晶微电子有限公司 | Be deposited as the wafer mounting apparatus used in film device |
-
2011
- 2011-07-05 TW TW100212292U patent/TWM416869U/en not_active IP Right Cessation
-
2012
- 2012-05-31 CN CN 201220258032 patent/CN202695403U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104282603A (en) * | 2013-07-11 | 2015-01-14 | 北大方正集团有限公司 | Wafer bearing disc and big beam injection equipment |
| CN104282603B (en) * | 2013-07-11 | 2017-10-03 | 北大方正集团有限公司 | A kind of chip-bearing disc and big line injection device |
| CN105002472A (en) * | 2015-07-03 | 2015-10-28 | 苏州工业园区纳米产业技术研究院有限公司 | Wafer fixing device for evaporator |
Also Published As
| Publication number | Publication date |
|---|---|
| TWM416869U (en) | 2011-11-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20171117 Address after: Lee Garden Building No. 33 Hongkong Tongluowan 19 Chinese Hysan Avenue, room 1907 Patentee after: Hongkong poly macro Co., Ltd. Address before: Hsinchu Science Industrial Park, Taiwan, China, No. three, 3 industrial East Road, Hsinchu, China Patentee before: Lextar Electronics Corp. |
|
| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130123 Termination date: 20180531 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |