CN204792782U - LED high density supporting structure - Google Patents
LED high density supporting structure Download PDFInfo
- Publication number
- CN204792782U CN204792782U CN201520171816.0U CN201520171816U CN204792782U CN 204792782 U CN204792782 U CN 204792782U CN 201520171816 U CN201520171816 U CN 201520171816U CN 204792782 U CN204792782 U CN 204792782U
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- group
- chip
- high density
- supporting structure
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Abstract
The utility model discloses a LED high density supporting structure, including the base plate, be equipped with a plurality of on the base plate according to rectangle array distribution's chip, per two classify as a set ofly in the chip, and the group is greater than two interval between every group with interval between the group, and the interval between every line is equal, interval distribution has a plurality of quad slit on the last lower frame of base plate, is equipped with the round hole between the adjacent quad slit, and the last lower frame marginating compartment of base plate is equipped with a plurality of V -arrangement groove. The utility model discloses structural design is novel, through change go with row between interval and quad slit and round hole cooperation use, can effectively increase the quantity of chip in the unit area, improve the stability among chip and the support assembly process, assurance processingquality.
Description
technical field:
The utility model relates to LED field, particularly relates to a kind of LED high density supporting structure.
background technology:
There is certain defect in the structural design of the support of surface mount type LED product in the market, most employing rectangular array, but between row with row, spacing is equal, spacing is equal between the column and the column, namely equidistant between single chips, this design make of the same area between wafer support quantity relatively less, cause the wasting of resources.In addition, chip with bracket assembled together time air-flow through causing stability in the course of processing relative poor, to processing bring larger trouble.
utility model content:
In order to make up prior art problem, the purpose of this utility model is to provide a kind of LED high density supporting structure, and novel in structural design effectively can increase the quantity of chip in unit are, improves the stability in chip and bracket assembled process, ensures crudy.
The technical solution of the utility model is as follows:
LED high density supporting structure, comprise substrate, it is characterized in that: described substrate is provided with several chips distributed according to rectangular array, and in chip, every two are classified as one group, spacing between group and group is greater than the spacing of two row often between group, and the spacing often between row is equal; The upper and lower side frame of substrate is intervally distributed with several square openings, is provided with circular hole between adjacent square opening, the upper and lower side frame marginating compartment of substrate is provided with several V-shaped grooves.
Described LED high density supporting structure, is characterized in that: be distributed with two square openings and a circular hole between two V-shaped grooves often adjacent in several described V-shaped grooves.
Described LED high density supporting structure, is characterized in that: the described Liang Lie chip center often between group is apart from being generally 3.8 ~ 4.0mm, and Liang Hang chip center is apart from being generally 3.3 ~ 3.6mm.
The utility model has the advantages that:
The utility model novel in structural design, by change between row and row spacing and square opening and circular hole with the use of, effectively can increase the quantity of chip in unit are, improve chip and the stability in bracket assembled process, guarantee crudy.
accompanying drawing illustrates:
Fig. 1 is structural representation of the present utility model.
embodiment:
See accompanying drawing:
LED high density supporting structure, comprises substrate 1, and substrate 1 is provided with several chips 2 distributed according to rectangular array, and in chip 2, every two are classified as one group, and the spacing between group and group is greater than the spacing of two row often between group, and the spacing often between row is equal; The upper and lower side frame of substrate 1 is intervally distributed with several square openings 3, is provided with circular hole 4 between adjacent square opening 3, the upper and lower side frame marginating compartment of substrate 1 is provided with several V-shaped grooves 5.
Be distributed with two square openings 3 and a circular hole 4 between two V-shaped grooves 5 often adjacent in several V-shaped grooves 5, generally as location hole, improve the stability in chip and bracket assembled process, ensure crudy.
Liang Lie chip center often between group, apart from being generally 3.8 ~ 4.0mm, generally selects 3.9mm, and Liang Hang chip center, apart from being generally 3.3 ~ 3.6mm, generally selecting 3.41mm, effectively can increase the quantity of chip in unit are.
Claims (3)
1. a LED high density supporting structure, comprise substrate, it is characterized in that: described substrate is provided with several chips distributed according to rectangular array, and in chip, every two are classified as one group, spacing between group and group is greater than the spacing of two row often between group, and the spacing often between row is equal; The upper and lower side frame of substrate is intervally distributed with several square openings, is provided with circular hole between adjacent square opening, the upper and lower side frame marginating compartment of substrate is provided with several V-shaped grooves.
2. LED high density supporting structure according to claim 1, is characterized in that: be distributed with two square openings and a circular hole between two V-shaped grooves often adjacent in several described V-shaped grooves.
3. LED high density supporting structure according to claim 1, is characterized in that: the described Liang Lie chip center often between group is 3.3 ~ 3.6mm apart from being 3.8 ~ 4.0mm, Liang Hang chip center distance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520171816.0U CN204792782U (en) | 2015-03-25 | 2015-03-25 | LED high density supporting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520171816.0U CN204792782U (en) | 2015-03-25 | 2015-03-25 | LED high density supporting structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204792782U true CN204792782U (en) | 2015-11-18 |
Family
ID=54532777
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520171816.0U Expired - Fee Related CN204792782U (en) | 2015-03-25 | 2015-03-25 | LED high density supporting structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204792782U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104766857A (en) * | 2015-03-25 | 2015-07-08 | 安徽中威光电材料有限公司 | LED high-density support structure |
-
2015
- 2015-03-25 CN CN201520171816.0U patent/CN204792782U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104766857A (en) * | 2015-03-25 | 2015-07-08 | 安徽中威光电材料有限公司 | LED high-density support structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151118 Termination date: 20160325 |