CN204966467U

CN204966467U - Novel year dish of RTA

Info

Publication number: CN204966467U
Application number: CN201520674113.XU
Authority: CN
Inventors: 黄涛
Original assignee: Lattice Power Jiangxi Corp
Current assignee: Jingneng Optoelectronics Co ltd
Priority date: 2015-09-02
Filing date: 2015-09-02
Publication date: 2016-01-13
Anticipated expiration: 2025-09-02

Abstract

The utility model provides a novel year dish of RTA, it includes a plurality of set units that carry that are used for placing the wafer, and places a slice wafer in set unit of every year, wherein, it includes in the unit to carry the dish: one carries the dish frame and one sets up and carrying the inside ring channel of dish frame or setting up a plurality of years dish strong points that are used for bearing the weight of the wafer in carrying the dish frame separately with wafer size is mated, and every carries dish strong point and uses the frame that carries the dish frame as fulcrum towards the inside extension of carrying the dish frame. Owing to carry the quartzy RTA year dish that the dish designed into support form or fretwork form with the current solid RTA of siC for the area of plane that the wafer was placed to whole year dish is reduced, has solved and has used RTA equipment to carry out the problem that the pollution was easily introduced to ann in -process to the wafer, has promoted the technology yield greatly.

Description

The novel load plate of a kind of RTA

Technical field

The utility model relates to field of mechanical technique, espespecially a kind of RTA load plate.

Background technology

At present, RTA (RapidThermalAnnealing, RTA) equipment is widely used in semiconductor and LED (LightEmittingDiode, light-emitting diode) chip manufacturing industry, for performing rta technique.

In existing RTA equipment, as shown in Figure 1, RTA carrying disc structure is all generally the SiC of monoblock (carborundum) wafer is placed on load plate unit quartz holder being formed and places wafer, namely in load plate unit, bottom is all solid, although this design good heat resistance, but difficulty of processing is large, and cost is high, and the electric property of product can be caused unstable; Especially SiC easily introduces and pollution of circulation, affect common product process yields, and owing to carrying out in the process of annealing at use RTA equipment, the wafer outward appearance be placed on RTA load plate is normal, thus the pollution introduced in annealing process is not easily found, only can embody exception from crystal column surface whiting/yellowing after alloy in Ag (silver) technique, thus owing to polluting, to result in product bad in RTA technique to allow people recognize, the RTA technique of current Ag is about 4% because polluting the rework rate caused.

Utility model content

For the problems referred to above, the utility model aims to provide a kind of brand-new RTA load plate, and original solid load plate unit is arranged to rack form or hollow out form by it, not only reduces cost, decreases pollution simultaneously.

The technical scheme that the utility model provides is as follows:

The novel load plate of a kind of RTA, the novel load plate of described RTA comprises multiple load plate unit for placing wafer, and places wafer described in a slice in each described load plate unit;

Described load plate unit comprises: a load plate frame and mated with described wafer size is arranged on the cannelure of described load plate frame inside or point is located at for carrying multiple load plate strong points of described wafer in described load plate frame, each described load plate strong point with the frame of described load plate frame for the inside of fulcrum towards described load plate frame extends.

In the technical program, the above-mentioned load plate frame mated with wafer size specifically refers to load plate edge frame distance and mates with the central diameter of wafer, and namely wafer can just in time be placed in load plate frame.

Preferably, described load plate unit is arranged in array in the novel load plate of described RTA.

Preferably, in each described load plate unit, at least comprise 3 load plate strong points, and each described strong point is separately positioned on the wafer that the frame of described load plate frame is placed in described load plate unit with carrying.

Preferably, each described load plate comprises 4 load plate strong points, and each described load plate strong point is separately positioned on the position of described load plate frame central axis.

Preferably, each described load plate unit adopts quartz material to be prepared from.

The novel load plate of the RTA provided by the utility model, can bring following beneficial effect:

In the utility model, existing RTA load plate is designed to rack form or hollow out form, and changes existing SiC material into quartz material, greatly reduce the cost of RTA load plate like this, from existing 20,000/only to control 2,000/only; Have again, owing to solid for existing SiC RTA load plate to be designed to the quartzy RTA load plate of rack form or hollow out form, the area of plane making whole load plate place wafer reduces, solve in the process using RTA equipment to anneal to wafer and easily introduce the problem polluted, greatly improve process yields.

Accompanying drawing explanation

Below by clearly understandable mode, accompanying drawings preferred implementation, is further described above-mentioned characteristic, technical characteristic, advantage and implementation thereof.

Fig. 1 is the structural representation of existing RTA load plate;

Fig. 2 is the structural representation of RTA novel load plate when load plate unit comprises cannelure in the utility model;

Fig. 3 is the load plate cellular construction schematic diagram that the utility model comprises 3 load plate strong points;

Fig. 4 is the structural representation of RTA novel load plate when load plate unit comprises 4 load plate strong points in the utility model.

Drawing reference numeral illustrates:

1.RTA load plate, 2. load plate unit, 3. the load plate strong point, 4. cannelure.

Embodiment

In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, contrast accompanying drawing is illustrated embodiment of the present utility model below.Apparently, accompanying drawing in the following describes is only embodiments more of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings, and obtain other execution mode.

The utility model provides the novel load plate of a kind of RTA, with existing RTA load plate 1 unlike, the load plate 1 that the utility model provides comprises multiple load plate unit 2 be made up of quartz material for placing load plate, in the process of real work, places a wafer in each load plate unit 2.Wherein, comprise respectively in each above-mentioned load plate unit 2: a load plate frame and mated with wafer size is arranged on the cannelure 4 of described load plate frame inside or point is located at for carrying multiple load plate strong points 3 of wafer in load plate frame, each load plate strong point 3 with the frame of load plate frame for the inside of fulcrum towards load plate frame extends.In simple terms, what the load plate unit 2 said here presented is a kind of rack form or hollow out form, and cannelure 4 is set in load plate frame or the load plate strong point 3 is set on the frame of load plate frame, in use, cannelure 4 or the load plate strong point 3 is utilized to carry wafer, the novel load plate of the RTA be made up of these rack forms like this, not only cheap, can not pollution be introduced simultaneously.For the shape size of the above-mentioned load plate strong point 3, here we all do not do concrete restriction, as, rectangle, strip, circle, triangle etc. can be used, even these load plate strong points 3 itself also can be hollow, as long as the object of firm support wafer can be realized in theory, can.As for the cannelure 4 be arranged in load plate unit 2, we do not limit equally to the concrete shape etc. of this cannelure 4, as long as the placement wafer that it can be firm and ensure it is the form of hollow out, are all included in content of the present utility model.

Furthermore, the novel load plate of the RTA provided to enable the utility model is annealed to more wafer once simultaneously, and load plate unit 2 is arranged in array in the novel load plate of RTA.We know, because the size of wafer is had any different, as existing 2 cun of wafers, 4 cun of wafers, 6 cun of wafers etc., the size of load plate unit 2 will change according to the size of wafer naturally, thus, in practical operation, the quantity of load plate unit 2 also will change, as, when using RTA equipment to anneal to 2 cun of wafers, then load plate unit can with the array format arrangement of 4 × 4, analogize like this, when RTA equipment is annealed to 4 cun of wafers, load plate unit can with the array format arrangement etc. of 2 × 2, of course, the number of load plate unit itself also will be determined according to the model of RTA equipment, above we say 4 × 4 array format arrangement, the array format arrangement etc. of 2 × 2 is all exemplary explanation, specifically to change according to actual conditions, the mode of array arrangement even can not be used to arrange.

Furthermore, in the utility model, in each described load plate unit 2, at least comprise 3 load plate strong points 3, more by the quantity of the load plate strong point 3 arranged in load plate frame, place wafer more firm; 3 load plate strong points 3 just can make wafer be placed in load plate unit 2 comparatively stably again, and therefore limit the number of load plate unit 2 here more than 3, can also be 3,4,5 specifically, 6 even more.We know, when the load plate strong point 3 reaches some, will form a ring along the inside casing of load plate frame, but this structure is inconvenient to pick and place wafer in practical operation, thus the number of the load plate strong point can not unconfinedly increase, but the number regardless of the load plate strong point has how many, as long as finally a breach can be formed in load plate frame conveniently pick and place wafer, be all included in content of the present utility model.In addition, when the size of the load plate strong point 3 is enough large/enough long, then there will be the different load plate strong points 3 interconnective situation in load plate frame, now whole load plate unit 2 just defines the structure of a hollow out, like this, as long as each load plate strong point 3 does not finally form solid structure, no matter be present with rack form or present with hollow out form, be all included in content of the present utility model.

Be illustrated in figure 2 the structural representation of RTA novel load plate when load plate unit 2 in the utility model comprises cannelure 4, in figure with load plate unit 2 for the array format arrangement of 4 × 4, use cannelure 4 supporting wafer to be briefly described in load plate unit 2 to working as.With existing RTA load plate unlike, in this embodiment, when wafer is placed on and this cannelure 4 is annealed, the below of wafer is not solid but hollow, so just avoids the pollution that solid RTA load plate unit is introduced greatly.

For another form of implementation in the utility model, namely load plate unit 2 comprises load plate frame, the load plate strong point 3 is set in load plate frame in the situation carrying wafer, load plate frame here can be as shown in figure 3 or 4 for rectangle frame, also can be circular frame etc., in fact, in actual production, we do not limit the concrete shape of above said load plate frame here, can be arbitrary shapes, as long as can be used for placing wafer, be just included in content of the present utility model.

Be illustrated in figure 3 load plate unit 2 structural representation comprising 3 load plate strong points 3, as can be seen from the figure, these 3 load plate strong points are separately positioned on three limits in load plate frame to carry the load plate be placed in load plate unit 2.Be noted that, for these 3 load plate strong points 3 particular location we do not limit, in Fig. 2, we just show schematically load plate unit 2 structure chart comprising 3 load plate strong points 3, as long as the placement wafer that the arrangement position of these 3 load plate strong points 3 can be firm, is just included in content of the present utility model.

As shown in Figure 4, be the structural representation of RTA novel load plate when load plate unit 2 in the utility model comprises 4 load plate strong points 3, and in this embodiment, each load plate strong point 3 is separately positioned on the center of load plate frame.

It should be noted that above-described embodiment all can independent assortment as required.The above is only preferred implementation of the present utility model; it should be pointed out that for those skilled in the art, under the prerequisite not departing from the utility model principle; can also make some improvements and modifications, these improvements and modifications also should be considered as protection range of the present utility model.

Claims

1. the novel load plate of RTA, is characterized in that, the novel load plate of described RTA comprises multiple load plate unit for placing wafer, and places wafer described in a slice in each described load plate unit;

2. the novel load plate of RTA as claimed in claim 1, is characterized in that: described load plate unit is that row are arranged in the novel load plate of described RTA.

3. the novel load plate of RTA as claimed in claim 1 or 2, it is characterized in that: in each described load plate unit, at least comprise 3 load plate strong points, and each described strong point is separately positioned on the wafer that the frame of described load plate frame is placed in described load plate unit with carrying.

4. the novel load plate of RTA as claimed in claim 3, it is characterized in that: each described load plate comprises 4 load plate strong points, each described load plate strong point is separately positioned on the position of described load plate frame central axis.

5. the novel load plate of RTA as described in claim 1 or 2 or 4, is characterized in that: each described load plate unit adopts quartz material to be prepared from.