CN220703837U - Insoluble anode copper electroplating equipment - Google Patents
Insoluble anode copper electroplating equipment Download PDFInfo
- Publication number
- CN220703837U CN220703837U CN202322248987.6U CN202322248987U CN220703837U CN 220703837 U CN220703837 U CN 220703837U CN 202322248987 U CN202322248987 U CN 202322248987U CN 220703837 U CN220703837 U CN 220703837U
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- CN
- China
- Prior art keywords
- anode
- electroplating
- insoluble
- roller
- utility
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- 238000009713 electroplating Methods 0.000 title claims abstract description 65
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 29
- 229910052802 copper Inorganic materials 0.000 claims abstract description 15
- 239000010949 copper Substances 0.000 claims abstract description 15
- 238000007747 plating Methods 0.000 claims description 32
- 238000005096 rolling process Methods 0.000 claims 3
- 239000012212 insulator Substances 0.000 claims 2
- 239000000463 material Substances 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 5
- 238000009434 installation Methods 0.000 abstract 2
- 239000004744 fabric Substances 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 238000005282 brightening Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000003014 ion exchange membrane Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
The utility model discloses an insoluble anode copper electroplating device, which belongs to the technical field of copper electroplating devices, and particularly relates to an insoluble anode copper electroplating device, which comprises an electroplating tank, wherein an electroplating tank is arranged in the electroplating tank, an installation plate is arranged above the electroplating tank, a rotating disc is arranged on the installation plate, a positive electrode joint is arranged at the top of the rotating disc, the lower part of the rotating disc is connected with a roller, an insulating rod is arranged on the roller, an electroplating anode is arranged on the insulating rod, the electroplating anode comprises a plate anode, a curved anode, a cylindrical anode and a netlike anode, various electroplating anodes can be arranged through the insulating rod arranged on the roller, the plate anode, the curved anode, the cylindrical anode and the netlike anode can be oppositely arranged with the anode according to requirements, and the electroplating effect on materials with different shapes can be improved.
Description
Technical Field
The utility model relates to the technical field of electrolytic copper plating equipment, in particular to insoluble anode electrolytic copper plating equipment.
Background
The construction of the electrode must be designed and used to accommodate the various configurations of the cell, but is based on the design of the electrolytic structure. Most commonly flat electrodes, round and curved electrodes are also commonly used. The metal surface treatment process uses rectangular and linear electrodes. When gas is generated, the electrodes are preferably expanded by net-like, punching-expanded metal net, porous plate, or the like in order to rapidly discharge bubbles between the electrodes.
CN201822072529.0 in the prior art discloses an insoluble anodic copper plating apparatus comprising a power supply, a plating anode, a plating tank body, and a plating rack for fixing a pre-plated copper; the electroplating bath body is filled with electroplating liquid, the electroplating anode is connected with the anode of a power supply, the cathode of the power supply is connected with an electroplating hanger, and an electroplating electric field is formed between the pre-plated copper piece and the electroplating anode; at least one layer of polyester fiber cloth used for completely separating the electroplating anode and the electroplating hanger is arranged in the electroplating bath body and at a position close to the electroplating anode. According to the utility model, the oxygen is separated from the brightening agent by the barrier property of the polyester fiber cloth, so that the consumption of the brightening agent is greatly reduced; on the other hand, polyester fiber cloth is different from the conventionally used ion exchange membrane, and does not affect the distribution of electric lines of force in the plating solution by itself, so that the uniformity of the plating thickness of the plated part is ensured, but the anode of the above-mentioned insoluble anode copper plating equipment cannot be replaced and thus cannot be subjected to plating treatment for materials of different shapes, so that improvement is required.
Disclosure of Invention
This section is intended to outline some aspects of embodiments of the utility model and to briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section as well as in the description summary and in the title of the application, to avoid obscuring the purpose of this section, the description summary and the title of the utility model, which should not be used to limit the scope of the utility model.
The present utility model has been made in view of the problems existing in the existing insoluble anodic copper plating apparatus.
Therefore, the object of the present utility model is to provide an insoluble anode copper plating apparatus, in which a plurality of plating anodes can be mounted by an insulating rod provided on a drum, and a plate-shaped anode, a curved anode, a cylindrical anode and a mesh anode can be provided as needed to face the anode, thereby improving the plating effect of materials of different shapes, and greatly increasing the practicality compared with the prior art.
In order to solve the technical problems, according to one aspect of the present utility model, the following technical solutions are provided:
an insoluble anodic copper plating apparatus comprising a plating cell;
the electroplating device comprises an electroplating tank, wherein an electroplating bath is arranged in the electroplating tank, a mounting plate is arranged above the electroplating bath, a rotating disc is mounted on the mounting plate, a positive electrode joint is mounted at the top of the rotating disc, the lower part of the rotating disc is connected with a roller, an insulating rod is mounted on the roller, an electroplating anode is mounted on the insulating rod, and the electroplating anode comprises a plate anode, a curved anode, a cylindrical anode and a netlike anode.
As a preferable embodiment of the insoluble anode copper plating apparatus according to the utility model, wherein: and mounting plates are arranged on two sides of the electroplating bath.
As a preferable embodiment of the insoluble anode copper plating apparatus according to the utility model, wherein: the rotary disc is connected to the mounting plate in a rotary mode, and a roller is fixedly connected to the lower portion of the rotary disc.
As a preferable embodiment of the insoluble anode copper plating apparatus according to the utility model, wherein: a plurality of insulating rods are arranged on the roller, and the insulating rods are uniformly distributed.
As a preferable embodiment of the insoluble anode copper plating apparatus according to the utility model, wherein: the electroplating anode also comprises a linear anode and a porous plate anode.
As a preferable embodiment of the insoluble anode copper plating apparatus according to the utility model, wherein: and an electroplating cathode is arranged on the roller at the other side.
Compared with the prior art, the utility model has the beneficial effects that: the insulating rod arranged on the roller can be used for installing various electroplating anodes, the plate-shaped anode, the curved anode, the cylindrical anode and the net-shaped anode can be oppositely arranged with the anode according to the requirements, and the electroplating effect can be achieved on materials with different shapes, so that the practicability is greatly improved compared with the prior art.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the following detailed description of the embodiments of the present utility model will be given with reference to the accompanying drawings, which are to be understood as merely some embodiments of the present utility model, and from which other drawings can be obtained by those skilled in the art without inventive faculty. Wherein:
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a schematic perspective view of a drum according to the present utility model;
fig. 3 is a schematic top view of the present utility model.
In the figure; 100 electroplating tanks, 110 electroplating tanks, 120 mounting plates, 130 rotating plates, 140 positive electrode joints, 150 rollers, 160 insulating rods, 170 electroplating anodes, 171 plate-shaped anodes, 172 curved-surface anodes, 173 cylindrical anodes, 174 net-shaped anodes and 180 electroplating cathodes.
Detailed Description
In order that the above objects, features and advantages of the utility model will be readily understood, a more particular description of the utility model will be rendered by reference to the appended drawings.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present utility model, but the present utility model may be practiced in other ways other than those described herein, and persons skilled in the art will readily appreciate that the present utility model is not limited to the specific embodiments disclosed below.
Next, the present utility model will be described in detail with reference to the drawings, wherein the sectional view of the device structure is not partially enlarged to general scale for the convenience of description, and the drawings are only examples, which should not limit the scope of the present utility model. In addition, the three-dimensional dimensions of length, width and depth should be included in actual fabrication.
For the purpose of making the objects, technical solutions and advantages of the present utility model more apparent, embodiments of the present utility model will be described in further detail below with reference to the accompanying drawings.
The utility model provides the following technical scheme: in the use process of the insoluble anode copper electroplating equipment, various electroplating anodes can be installed through the insulating rods arranged on the roller, and the plate-shaped anode, the curved anode, the cylindrical anode and the net-shaped anode can be oppositely arranged with the anode according to the requirements, so that the electroplating effect of materials with different shapes can be improved, and compared with the prior art, the practicability is greatly improved;
FIGS. 1 to 3 are schematic views showing the structure of a first embodiment of an insoluble anodic copper plating apparatus of the present utility model, referring to FIGS. 1 to 3, the insoluble anodic copper plating apparatus of the present embodiment has a main body portion including a plating bath 100;
the electroplating tank 100 is internally provided with an electroplating tank 110, an installing plate 130 is arranged above the electroplating tank 110, a rotating disc 130 is arranged on the installing plate 130, positive connectors 140 are arranged at the top of the rotating disc 130, the lower side of the rotating disc 130 is connected with a roller 150, an insulating rod 160 is arranged on the roller 150, an electroplating anode 170 is arranged on the insulating rod 160, the electroplating anode 170 comprises a plate-shaped anode 171, a curved anode 172, a cylindrical anode 173 and a netlike anode 174, the installing plates 130 are arranged on two sides of the electroplating tank 110, the rotating disc 130 is rotationally connected with the installing plate 130, a roller 150 is fixedly connected below the rotating disc 130, a plurality of insulating rods 160 are arranged on the roller 150, the insulating rods 160 are uniformly distributed, the electroplating anode 170 also comprises a linear anode and a porous plate anode, an electroplating cathode 180 is arranged on the roller 150 on the other side, the electroplating tank 100 is used for arranging the electroplating tank 100 and the installing plate 130, the installing plate 130 is used for bearing the rotating disc 130 and the rotating disc 150, the rotating disc 130 is used for bearing the positive connectors 140, the positive connectors 140 are used for being connected with a power supply and are connected with the corresponding electroplating anode 170, the roller 150 is used for installing the insulating rod 160, and the insulating rod 160 is used for bearing the cathode 170, and the insulating rod 160 is matched for carrying the electroplating anode 170 is used for carrying the electroplating anode 170;
referring to fig. 1 to 3, the insoluble anode copper plating apparatus of the present embodiment has the specific working principle that a plurality of plating anodes 170 can be installed through the insulating rod 160 provided on the drum 150, and a plate anode 171, a curved anode 172, a cylindrical anode 173 and a mesh anode 174 can be provided to face the anodes as required, thereby improving the plating effect of materials of different shapes, and greatly increasing the practicality compared with the prior art.
Although the utility model has been described hereinabove with reference to embodiments, various modifications thereof may be made and equivalents may be substituted for elements thereof without departing from the scope of the utility model. In particular, the features of the disclosed embodiments may be combined with each other in any manner as long as there is no structural conflict, and the exhaustive description of these combinations is not given in this specification merely for the sake of omitting the descriptions and saving resources. Therefore, it is intended that the utility model not be limited to the particular embodiment disclosed, but that the utility model will include all embodiments falling within the scope of the appended claims.
Claims (6)
1. Insoluble anode copper electroplating equipment, its characterized in that: comprises an electroplating tank (100);
electroplating bath (110) have been seted up in electroplating bath (100), electroplating bath (110) top is provided with mounting panel (120), install rolling disc (130) on mounting panel (120), positive electrode joint (140) are installed at rolling disc (130) top, rolling disc (130) below is connected with cylinder (150), install insulator spindle (160) on cylinder (150), install electroplating anode (170) on insulator spindle (160), electroplating anode (170) are including platelike positive pole (171), curved surface positive pole (172), drum positive pole (173) and netted positive pole (174).
2. The insoluble anodic copper plating apparatus according to claim 1, wherein: mounting plates (120) are arranged on two sides of the electroplating tank (110).
3. The insoluble anodic copper plating apparatus according to claim 1, wherein: the rotary disc (130) is rotatably connected to the mounting plate (120), and a roller (150) is fixedly connected to the lower portion of the rotary disc (130).
4. The insoluble anodic copper plating apparatus according to claim 1, wherein: a plurality of insulating rods (160) are arranged on the roller (150), and the insulating rods (160) are uniformly distributed.
5. The insoluble anodic copper plating apparatus according to claim 1, wherein: the electroplating anode (170) also includes a wire anode and a perforated plate anode.
6. The insoluble anodic copper plating apparatus according to claim 1, wherein: and an electroplating cathode (180) is arranged on the other side of the roller (150).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322248987.6U CN220703837U (en) | 2023-08-21 | 2023-08-21 | Insoluble anode copper electroplating equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322248987.6U CN220703837U (en) | 2023-08-21 | 2023-08-21 | Insoluble anode copper electroplating equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220703837U true CN220703837U (en) | 2024-04-02 |
Family
ID=90435846
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322248987.6U Active CN220703837U (en) | 2023-08-21 | 2023-08-21 | Insoluble anode copper electroplating equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220703837U (en) |
-
2023
- 2023-08-21 CN CN202322248987.6U patent/CN220703837U/en active Active
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