TWI786136B - Substrate holder and plating device - Google Patents

Abstract

A substrate holder for holding a substrate, comprising: a first holding member having a first opening for exposing a first surface of the substrate; The second holding member has a second opening for exposing the second surface of the substrate; the first holding member has at least one first external connection point, and the second holding member has a At least one second external connection point independent of the external connection points.

Description

Substrate holder and plating device

The invention relates to a substrate holder and a coating device.

Conventionally, wiring, bumps (protruding electrodes), and the like have been formed on the surface of a substrate such as a semiconductor wafer or a printed circuit board. Electrolytic plating is known as a method for forming such wiring, bumps, and the like. A plating device used in the electrolytic plating method includes a substrate holder that seals the end face of a circular or polygonal substrate and holds the surface (surface to be plated) exposed. In such a plating apparatus, when plating is performed on the surface of a substrate, a substrate holder holding a substrate is immersed in a plating solution.

Patent Document 1 describes a substrate jig used for plating both sides of a substrate. This substrate jig has a base part 1, a cover part 2, and a center part 3 composed of other components. The substrate is mounted on the base part 1 in a state where the center part 3 is overlapped, and the cover part 2 is further overlapped, so that the base part 1, the center part The part 3 and the cover part 2 are sandwiched and fixed by the clamp part 4 from both sides. When the current is supplied to the substrate, the current is supplied to the current-carrying ring 6 of the base part 1 from the current-carrying path provided on the arm part 14 of the base part 1 through one of the current-carrying rods 34 in the center part 3, and the current is supplied to the current-carrying ring 6 of the base part 1 through the other current-carrying rod 34 supplies current to the energization rings 6 of the cover part 2, and supplies current from each energization ring 6 to each surface of the substrate (Figs. 3 and 6).

Patent Document 2 discloses a substrate holder 70 for plating both sides of a substrate. The substrate holder 70 holds the substrate by sandwiching it between the first holding member 11 and the second holding member 12 provided with hangers 14 . When the current is supplied to the substrate, the current is supplied to each surface of the substrate through the conductive plate 22 and the conductive film plug 23 in the first holding member 11 . The conductive film plug 23 connected to one side of the substrate is connected to the terminal board 27 on one side of the hanger 14, and the conductive film plug 23 connected to the other side of the substrate is connected to the terminal on the other side of the hanger 14. Plate 28 is connected (ninth, tenth figure).

In addition, a configuration is described in which the upper edge of the square substrate is held by the first holding member 71 and the second holding member 72 , and current is supplied to each surface of the substrate from the terminal plates 78 and 79 on both sides of the first holding member 71 . This configuration is to supply current from the terminal plate 79 on one side of the first holding member 71 to one side of the substrate through the electrode contact 75, and from the other terminal plate 78 of the first holding member 71 through the contact 81 for power supply, and then through the electrode contact point 75. The spring contacts 82 and the electrode contacts 76 of the second holding member 72 are used to supply current to the other side of the substrate (figures 20 and 21).

Patent Document 3 describes a wafer carrier 100 in which two wafers are stacked and disposed, and the two surfaces exposed outside are simultaneously plated. The wafer carrier 100 includes: a non-conductive flange 120 sandwiching a wafer; and a hanger-shaped conductive flange 110 provided on the upper portion of the flange 120 . This configuration is to supply current from the conductor 426 and the contact point 427 arranged in the flange pieces 121 and 122 of the non-conductive flange 120 through the conductive flange 110 to each surface of the wafer through a plurality of pogo pins 428 .

[Prior Art Literature]

[Patent Document]

[Patent Document 1] International Publication No. 2014-076781

[Patent Document 2] Japanese Unexamined Patent Publication No. 2008-184692

[Patent Document 3] Specification of US Patent No. 8236151

In electrolytic plating, it is necessary to set a number of contacts (substrate contacts) suitable for the size of the substrate on the substrate jig, and to supply current to these substrate contacts. In addition, it is sometimes appropriate to connect each substrate contact to one or multiple external connection contacts with a separate current path. When the substrate size is large, the number of contacts and current paths tends to increase. However, when the number of contacts and current paths increases, the thickness of the substrate holder may increase. This kind of problem is particularly problematic on substrate holders that are plated on both sides of the substrate, but it can also occur when plating on one side of the substrate.

It is an object of the present invention to solve at least part of the above-mentioned problems.

The invention relates to a substrate holder, which is used for holding a substrate. The substrate holder includes: a first holding member having a first opening for exposing the first surface of the substrate; and a second holding member for sandwiching the substrate together with the first holding member. and hold, and have a second opening for exposing the second surface of the aforementioned substrate; the aforementioned first holding member has at least one first external connection contact, and the aforementioned second holding member has a contact with the aforementioned first external connection Independent at least one second external connection point.

A coating device of the present invention is provided with: a substrate holder, which is used to hold the substrate; a substrate loading and unloading part, which is used to load and unload the aforementioned substrate from the aforementioned substrate holder; and a plating tank, which is used to hold the aforementioned substrate. The aforementioned substrate holder is subjected to plating treatment. The aforesaid substrate holder of this coating device has: a first holding member, which has a first opening for exposing the first surface of the aforementioned substrate; Hold the aforementioned substrate together, and have a second opening for exposing the second surface of the aforementioned substrate; the aforementioned first holding member has at least one first external connection contact, and the aforementioned second holding member has a An external connection point independent of at least one second external connection point.

10, 10a, 10b, 10c‧‧‧plating tank

11‧‧‧substrate holder

101‧‧‧Platform

101a~101h‧‧‧Establishment components

103‧‧‧Control Department

105‧‧‧Loading stage

107‧‧‧Unloading the carrier

110A‧‧‧first holding member

110B‧‧‧Second holding member

111A‧‧‧First Body Department

111B‧‧‧Second body part

1110A‧‧‧First Body

1110B‧‧‧Second Body

112A‧‧‧First opening

112B‧‧‧Second opening

113A, 113B, 114A, 114B, 115A, 115B‧‧‧installation part

117A‧‧‧First substrate contact

117B‧‧‧Second board contact

118A, 118B, 119A, 119B‧‧‧seal holder

120A, 120B‧‧‧inside seal

121A‧‧‧outside seal

122‧‧‧Substrate transfer device

122A, 122B, 123A, 123B, 124A‧‧‧Screw

125‧‧‧conductive wire

126‧‧‧Pre-wetting tank

126A‧‧‧ditch

127A‧‧‧wiring path

128‧‧‧prepreg tank

130a‧‧‧First flushing tank

130b‧‧‧Second flushing tank

130c‧‧‧The third flushing tank

132‧‧‧spray tank

140‧‧‧Conveyor

141‧‧‧Conveyor

142‧‧‧fixed seat

150‧‧‧Wiring storage unit

150A‧‧‧The first wiring storage part

150B‧‧‧The second wiring storage part

151A‧‧‧First Cover

152A‧‧‧containment space

154A, 154B, 155A, 158A, 159A, 159B‧‧‧installation part

157A, 157B‧‧‧protruding part

160‧‧‧Arm

160A‧‧‧first arm

160B‧‧‧Second arm

161A‧‧‧The first external connection

161B‧‧‧The second external connection

162A, 162B‧‧‧External connection cover

163L, 163R‧‧‧positioning department

164A‧‧‧Engagement

164B‧‧‧Stenosis

165A‧‧‧Engagement

165B‧‧‧end

166A, 166B‧‧‧Installation Department

167‧‧‧bus bar

168‧‧‧External connection contacts

169‧‧‧Confirm the electrification device

170A‧‧‧Loading/Unloading Department

170B‧‧‧substrate placement department

170C‧‧‧Processing Department

170D‧‧‧Retainer Storage

170E‧‧‧Cleaning Department

173C‧‧‧Processing Department

180, 180A, 180B, 181, 181A, 181B, 191A, 191B‧‧‧installation part

192A, 192B‧‧‧wiring hole

193‧‧‧Bolts

194‧‧‧through hole

194a‧‧‧鍃hole

195‧‧‧Screw hole

200‧‧‧inner space

210A‧‧‧Protrusion

210B‧‧‧through hole

30A‧‧‧The first anode holder

30B‧‧‧Second Anode Holder

31A, 31B‧‧‧first and second anode

32A, 32B‧‧‧first and second anode shield

35A, 35B‧‧‧first and second blades

36A, 36B‧‧‧first and second intermediate masks

37‧‧‧External power supply

230‧‧‧terminal

240‧‧‧current supply part

250‧‧‧arm housing

410, 420‧‧‧Conductive Path Department

410L‧‧‧Left conductive path member

410R‧‧‧Right conductive path member

420L‧‧‧Left conductive path member

420R‧‧‧Right conductive path member

411L~415L, 411R~415R, 421L~425L, 421R~425R‧‧‧path piece

430‧‧‧conductive plate

440L, 440R‧‧‧external connection contact

1000‧‧‧Substrate loading and unloading device

1600‧‧‧Installation recess

1650A‧‧‧thin part

L‧‧‧Wiring

S‧‧‧plating liquid surface

W‧‧‧substrate

300‧‧‧Cycle mechanism

302‧‧‧Circulation pipeline

304‧‧‧Valve

306‧‧‧pump

308‧‧‧temperature control device

310‧‧‧Filter

The first figure is a schematic view showing an embodiment of a plating device.

The second panel A is a perspective view from the first side of the substrate holder.

The second Figure B is a perspective view from a second side of the substrate holder.

The third figure A is a perspective view of the first holding member and the second holding member in the open state of the substrate holder viewed from the first side.

The third figure B is a perspective view of the first holding member and the second holding member in the open state of the substrate holder viewed from the second side.

The fourth figure A is an exploded perspective view viewed from the first side of the first holding member.

The fourth figure B is an exploded perspective view viewed from the second side of the first holding member.

The fourth figure C is a perspective view of the wiring receiving part.

The fifth figure A is an exploded perspective view viewed from the first side of the second holding member.

The fifth figure B is an exploded perspective view viewed from the second side of the second holding member.

The sixth figure A is an enlarged perspective view of the vicinity of the arm part viewed from the first side in the state where the first arm part and the second arm part are meshed.

Figure 6B is an enlarged perspective view of the vicinity of the arm portion viewed from the second side in a state where the first arm portion and the second arm portion are meshed.

Figure 6 C is an enlarged perspective view of the vicinity of the arm portion viewed from the first side in a state in which the first arm portion and the second arm portion are opened.

Figure 6D is an enlarged perspective view of the vicinity of the arm portion viewed from the second side in a state in which the first arm portion and the second arm portion are opened.

The seventh figure A is a partial perspective perspective view of the first holding member for showing the path of the wiring from the first external connection part to the first body part.

The seventh figure B is a perspective view of the first body part in the connecting part of the first body part and the wiring receiving part.

The seventh figure C is a perspective view of the wiring accommodating part in the connecting part of the wiring accommodating part and the first body part viewed from the inside.

The seventh figure D is a perspective view of the wiring accommodating part in the connecting part of the wiring accommodating part and the first main body viewed from the outside.

The eighth figure is an enlarged plan view of the connecting part between the wiring receiving part and the main body part.

The eighth figure A is a sectional view of A-A of the eighth figure.

The eighth figure B is a cross-sectional view of B-B of the eighth figure where no wiring hole is formed.

The eighth figure C is a sectional view of C-C of the eighth figure at the part where the wiring hole is formed.

Figure 9 A is a front view viewed from the inside side of the first retaining member.

Figure 9B is a partially enlarged front view viewed from the inner side of the first holding member.

The ninth figure C shows the C-C sectional view of the ninth B figure of the second retaining member together with the first retaining member.

Figure 10 is a cross-sectional view of the first and second body parts showing the arrangement of screws for fixing the contacts of the substrate.

Figure 11 is a cross-sectional view of the first and second body portions showing the arrangement of the screws securing the seal holder for installing the inner seal.

Figure 12A is an enlarged perspective view of the external connection part in a state where the wiring cover is removed.

Figure 12B is an explanatory view of the current path in the first holding member.

Figure 12C is an explanatory view of the current path in the second holding member.

The twelfth figure D is a diagram showing the connection mode of each contact point of the external connection part when the power is confirmed.

Figure 12E is a diagram showing the connection mode of each contact point of the external connection part during the plating process.

FIG. 13A is a schematic diagram illustrating setting the substrate in the substrate placing part on the substrate holder.

FIG. 13B shows an example of a method for fixing a substrate holder.

Figure 14A is an enlarged perspective view near the positioning portion of the first holding member.

Figure 14B is an enlarged perspective view of the positioning portion of the second holding member.

Figure 15 is a side view schematically showing the composition of the plating tank.

Figure 16A is an enlarged perspective view of the vicinity of the positioning portion on the opposite side to the external connection portion of the first arm portion of the first holding member.

Figure 16B is an enlarged perspective view of the vicinity of the positioning portion on the side of the external connection portion of the first arm portion of the first holding member.

Fig. 17 is a perspective view viewed from the first side of the substrate holder of another embodiment.

Figure 18 is a perspective view of the first holding member and the second holding member in the open state of the substrate holder viewed from the first side.

Figure 19 is an exploded perspective view of the first holding member and the second holding member of the substrate holder.

Fig. 20 is a perspective view of a conductive path portion in another embodiment.

Figure 21 is an arrow view of the first holding member and the second holding member viewed from the side of the substrate holding surface.

Figure 22A is an enlarged view of the vicinity of the substrate contacts of the substrate holder.

Figure 22B is an enlarged view showing the vicinity of the substrate contact of the substrate holder in a state where a part of the substrate contact is removed.

Figure 23 is a cross-sectional view along line C-C of Figure 22B showing the second retaining member together with the first retaining member.

Figure 24 is an enlarged perspective view of the external connection part in the state where the external connection part cover is removed.

Figure 25 is a sectional view of the external connection part.

Hereinafter, embodiments of the coating device and the substrate holder used in the coating device will be described with reference to the drawings. In the drawings, the same or similar reference signs are attached to the same or similar elements, and repeated description of the same or similar elements will be omitted in the description of various embodiments. In addition, the features shown in various embodiments can be applied to other embodiments as long as they do not contradict each other. In addition, in this specification, the term "substrate" includes not only semiconductor substrates, glass substrates, and printed circuit boards, but also magnetic recording media, magnetic recording sensors, mirrors, optical elements and micromechanical elements, or partially fabricated integrated circuits. The substrate includes any shape (square, circular, etc.). In addition, expressions such as "front", "rear", "front", "rear", "upper", "lower", "left", "right", etc. are used in this manual, and these are shown for the convenience of explanation The positions and directions on the drawing paper shown as examples may be different in the actual arrangement when the device is used.

The first figure is a schematic view showing an embodiment of a plating device. As shown in the first figure, the plating apparatus has: a stand 101; a control unit 103 for controlling the operation of the plating apparatus; a loading/unloading portion 170A for loading and unloading a substrate W (refer to the second figure); Refer to FIG. 2 ) to place the substrate W on and remove the substrate W from the substrate holder 11 (machine room, substrate loading and unloading section) 170B; to plate the substrate W processing section (pre-processing chamber, plating chamber) 170C; a holder storage unit (temporary storage room) 170D for accommodating the substrate holder 11; and a cleaning unit 170E for cleaning and drying the plated substrate W. The plating apparatus of this embodiment is an electrolytic plating apparatus that metal-plates the first surface and the second surface of the substrate W by flowing an electric current in the plating solution. The first surface and the second surface are surfaces facing each other, and in this embodiment, they are the front surface and the back surface. In addition, the substrate W to be processed in this embodiment is a semiconductor package substrate or the like. In addition, a conductive layer composed of a seed layer or the like is formed on the front side and the back side of the substrate W, and a resist layer is further formed on the pattern surface forming region on the conductive layer, and a trench ( Trench) and connecting hole (Via). In this embodiment, a substrate having a through hole connecting the front surface and the back surface of the substrate (that is, a through-hole substrate) may be included as a processing object.

As shown in the first figure, the stand 101 is composed of a plurality of stand members 101a to 101h, and these stand members 101a to 101h can be connected to form a structure. The components of the loading/unloading part 170A are arranged on the first stage member 101a, the components of the substrate placement part 170B are arranged on the second stage member 101b, and the components of the processing part 170C are arranged on the third stage member 101c~the sixth stage member 101f , The elements of the holder storage unit 170D are disposed on the seventh stage member 101g and the eighth stage member 101h.

The loading/unloading section 170A is provided with: a loading stage 105 on which a cassette (not shown) for storing substrates W before plating is mounted; and a cassette (not shown) for receiving substrates W plated by the processing section 170C. The unloading carrier 107. Further, a substrate transfer device 122 composed of a transfer robot for transferring the substrate W is arranged in the loading/unloading section 170A.

The substrate transfer device 122 enters the cassette mounted on the loading stage 105, takes out the substrate W before plating from the cassette, and transfers the substrate W to the substrate placement unit 170B. The substrate placement unit 170B places the substrate W before plating on the substrate holder 11 , and takes out the substrate W after plating from the substrate holder 11 .

The processing unit 170C is equipped with: a pre-wetting tank 126, a pre-dipping tank 128, a first rinse tank 130a, a spray tank 132, a second rinse tank 130b, a first coating tank 10a, a second coating tank 10b, a third Rinsing tank 130c, third coating tank 10c. These grooves 126, 128, 130a, 132, 130b, 10a, 10b, 130c, 10c are arranged in this order. In the following description, the first coating tank 10a, the second coating tank 10b, and the third coating tank 10c will be combined, or referred to as the coating tank 10 with reference to any coating tank in these coating tanks. .

In the pre-wet tank 126 , the substrate W is immersed in pure water in preparation for pretreatment. In the pre-dip tank 128, the oxide film formed on the surface of the conductive layer such as the seed layer formed on the surface of the substrate W is removed by chemical etching. The first rinse tank 130a is used to clean the pre-soaked substrate W with a cleaning solution (such as pure water).

At least one plating tank 10 of the first plating tank 10a, the second plating tank 10b, and the third plating tank 10c coats both surfaces of the substrate W. In addition, in the embodiment shown in the first figure, there are three plating tanks 10 , but other embodiments may have any number of plating tanks 10 .

The second rinsing tank 130b is used to clean the substrate W coated with the first coating tank 10a or the second coating tank 10b together with the substrate holder 11 with a cleaning solution (such as pure water). The third rinsing tank 130c cleans the substrate W plated by the third coating tank 10c together with the substrate holder 11 with a cleaning solution (such as pure water). The blow tank 132 is used to remove the liquid from the substrate W after cleaning before and after the plating process.

The pre-wetting tank 126, the pre-dipping tank 128, the washing tanks 130a-130c, and the plating tanks 10a-10c are processing tanks in which a processing solution (liquid) can be stored. These processing tanks include a plurality of processing chambers storing the processing liquid, but are not limited to this embodiment, and these processing tanks may include a single processing chamber. In addition, at least a part of these processing tanks may be provided with a single processing chamber, and other processing tanks may be provided with a plurality of processing chambers.

The plating apparatus further includes a conveyor 140 that conveys the substrate holder 11 . The conveyor 140 is configured to be movable among the elements of the coating device. The conveyer 140 is provided with: the fixed base 142 extended in the horizontal direction from the board|substrate placement part 170B to the processing part 170C;

Each of these conveyors 141 has a movable part (not shown) for holding the substrate holder 11 , and constitutes capable of holding the substrate holder 11 . The conveyor 141 is configured to transfer the substrate holder 11 between the substrate placement unit 170B, the holder storage unit 170D, and the processing unit 170C, and further move the substrate holder 11 together with the substrate W up and down. For example, one of the conveyors 141 can dip the substrate W together with the substrate holder 11 into the plating solution in the plating tank 10 by lowering the substrate holder 11 holding the substrate W from the plating tank 10 . The moving mechanism of the conveyor 141 may, for example, be a combination of a motor and a rack and pinion pair. In addition, the embodiment shown in the first figure is provided with three conveyors, but any number of conveyors can also be used in other embodiments.

(substrate holder)

The second panel A is a perspective view from the first side of the substrate holder. The second Figure B is a perspective view from a second side of the substrate holder. The third figure A is a perspective view of the first holding member and the second holding member in the open state of the substrate holder viewed from the first side. The third figure B is a perspective view of the first holding member and the second holding member in the open state of the substrate holder viewed from the second side. The fourth figure A is an exploded perspective view viewed from the first side of the first holding member. The fourth figure B is an exploded perspective view viewed from the second side of the first holding member. The fourth figure C is a perspective view of the wiring receiving part. The fifth figure A is an exploded perspective view viewed from the first side of the second holding member. The fifth figure B is an exploded perspective view viewed from the second side of the second holding member.

The substrate holder 11 includes: a first holding member 110A having a first opening 112A; and a second holding member 110B having a second opening 112B. The substrate holder 11 holds the substrate W by sandwiching the substrate W between the first holding member 110A and the second holding member 110B. The first holding member 110A and the second holding member 110B respectively expose the surfaces to be plated on the first surface (front surface) and the second surface (back surface) of the substrate W through the first opening 112A and the second opening 112B, respectively. way to keep. In other words, the first opening portion 112A holds the substrate W by sandwiching only the outer peripheral portion of the substrate W from both sides. The substrate holder 11 includes an arm portion 160, and the arm portion 160 is conveyed while being held by the conveyor 141. In the following description, the side of the substrate holder 11 where the first surface (front) of the substrate W is exposed may be referred to as the first side, and the side where the second surface (back surface) of the substrate is exposed may be referred to as the second side. The second figure A shows that the first surface (surface) of the substrate W is exposed from the first opening 112A of the first holding member 110A. The second diagram B shows that the second surface (back surface) of the substrate W is exposed from the second opening 112B of the second holding member 110B.

The substrate holder 11 of the present embodiment is used to hold a square substrate W, but is not limited thereto, and may hold a circular substrate. At this time, the first opening 112A and the second opening 112B are also circular. Alternatively, the substrate W may be a polygonal substrate such as a hexagon. At this time, the first opening 112A and the second opening 112B are similarly polygonal.

110 A of 1st holding members are equipped with 111 A of 1st main body parts, 150 A of 1st wiring accommodating parts, and 160 A of 1st arm parts (3rd drawing A, 4th drawing A). The second holding member 110B includes a second main body portion 111B, a second wiring accommodating portion 150B, and a second arm portion 160B (third drawing A, fifth drawing A).

The first body part 111A and the second body part 111B together provide the body part 111 holding the substrate W (second figure A, third figure A). The first body portion 111A includes a first body 1110A formed with a first opening portion 112A, and constituent members such as seals and substrate contacts, which will be described later. The first main body 1110A has a plate-shaped member that becomes an outer side surface and an inner side surface and an inner side surface when the first holding member 110A and the second holding member 110B are engaged. Constituent components such as seals and substrate contacts are disposed on the inner side of the first body 1110A. The first body portion 111A has mounting portions 113A mounted on the mounting portion 155A of the first wire receiving portion 150A on both sides of the protruding portion 157A of the first wire receiving portion 150A (FIG. 4 A). Each mounting portion 113A protrudes on both sides of the protruding portion 157A of the first wiring accommodating portion 150A. Furthermore, the first main body portion 111A has a mounting portion 114A as a protruding portion mounted on the mounting portion 158A in the approximate central portion on the side of the first wiring accommodating portion 150A (fourth FIG. 4A ). The mounting portions 113A, 114A, and the mounting portions 155A, 158A are provided with mounting structures such as bolt holes. Attachment parts 113A and 114A are fixed to attachment parts 155A and 158A by fastening members such as bolts. The installation parts 113A and 114A of this embodiment are integrally formed with the first body 1110A.

The first wiring storage portion 150A provides a path through which a plurality of wirings L (current paths) pass, and also provides a wiring storage portion 150 that accommodates excess length of each wiring L (second diagram A, third diagram A). The first wiring storage portion 150A has a storage space 152A (figure 4C). The receiving space 152A provides a path through which a plurality of wires L (current paths) extending from the external connection portion 161A of the first arm portion 160A to the substrate contact point pass, and accommodates excess lengths of each wire L. The first wiring storage portion 150A has a first cover portion 151A that closes the storage space 152A. In this embodiment, each external connection point 168 and each substrate contact point 117 are connected by individual wiring L, and each external connection point 168 is connected to each substrate contact point by forming the length of each wiring L to be roughly the same length. The resistance value between 117 (the twelfth B figure) is uniform. This is to make the current flowing into each substrate contact 117 uniform. At this time, the distance between each external connection contact 168 and each substrate contact 117 is different according to the position of the substrate contact 117, and the wiring length is set according to the path with the largest distance. Therefore, according to the positions of the substrate contacts 117, excess wiring lengths are generated and accommodated in the first wiring accommodating portion 150A.

150 A of 1st wiring accommodating parts have two mounting parts 154A (4th figure A) which are mounted on the mounting part 166A of 160 A of 1st arm parts. Mounting structures such as bolt holes for mounting to the first arm portion 160A are provided in the mounting portion 154A. In addition, the first wiring accommodating portion 150A further includes: two mounting portions 155A respectively mounted on two mounting portions 113A of the first body portion 111A; and mounting portions 158A mounted on the mounting portion 114A of the first body portion 111A. Mounting structures such as bolt holes for mounting to the first wiring accommodating portion 150A are provided in the mounting portions 155A and 158A. The first wiring accommodating portion 150A is fixed to the first arm portion 160A and the first body portion 111A in each mounting portion by, for example, a screwing mechanism such as a bolt.

The first arm portion 160A together with the second arm portion 160B provides the portion held by the conveyor 141 and the arm portion 160 held in the plating bath (second A, third A). The first arm portion 160A includes an elongated plate-shaped member or a rod-shaped member. The first arm portion 160A has an external connection portion 161A, and an external connection portion cover 162A for protecting the external connection portion 161A and the wiring L. As shown in FIG. In addition, the first arm portion 160A has engaging portions 164A, 165A that are engaged with the second arm portion 160B of the second holding member 110B (third figure B). The first arm portion 160A and the second arm portion 160B are engaged with each other and positioned by the engaging portions 164A, 165A. In addition, the first arm portion 160A has two mounting portions 166A respectively corresponding to the two mounting portions 154A of the first wire receiving portion 150A (fourth figure A). As shown in Figures 4B and 6D, the engaging portion 165A has a thin portion 1650A extending toward the first body portion 111A than other portions (for example, the central portion) of the elongated plate-shaped member or rod-shaped member. In addition, a portion having approximately the same thickness as other portions (for example, a central portion) is provided in a flange shape on the first body portion 111A side of the thin portion 1650A. In addition, a block-shaped portion thicker than the thin portion is provided on the external connection portion 161A side of the thin portion 1650A. Therefore, the thin portion 1650A becomes a concave portion surrounded from three sides, and the end portion 165B of the second arm portion 160B can be engaged in the concave portion.

Figure 16A is an enlarged perspective view of the vicinity of the positioning portion on the opposite side to the external connection portion of the first arm portion of the first holding member. Figure 16B is an enlarged perspective view of the vicinity of the positioning portion on the side of the external connection portion of the first arm portion of the first holding member. As shown in Figures 16A and 16B, the first arm portion 160A has positioning portions 163R at both ends thereof for positioning the substrate holder 11 in the substrate placement portion 170B and the plating tank 10. , 163L. Each positioning part 163R, 163L has a positioning hole, and can position the substrate holder 11 by engaging with a positioning pin (not shown) provided in the substrate placement part 170B and the plating tank 10 . In addition, it is also possible to adjust the position of the substrate holder 11 in the left-right direction by making one positioning hole a long hole. Figure 16A shows the case where the positioning hole of the positioning portion 163L is formed as a long hole.

The second holding member 110B includes a second main body portion 111B, a second wiring accommodating portion 150B, and a second arm portion 160B (third drawing A, fifth drawing A). Since the configuration of the second body part 111B and the second wiring receiving part 150B is roughly the same as that of the first body part 111A and the first wiring receiving part 150A, detailed descriptions are omitted, and the same numbers and English characters are marked in the same configuration. The symbol shown by the letter B.

The second arm portion 160B includes an elongated plate-shaped member or a rod-shaped member. The second arm portion 160B has an external connection portion 161B, and an external connection portion cover 162B for protecting the external connection portion 161B and the wiring L. In addition, the second arm portion 160B has two mounting portions 166B respectively corresponding to the two mounting portions 154B of the second wire receiving portion 150B (FIG. 5 A). The second arm portion 160B is fixed to the mounting portion 154B of the second wire receiving portion 150B through the mounting portion 166B, for example, by a screwing mechanism such as a bolt. In addition, the second arm portion 160B has a narrow portion 164B narrower than other portions between the two mounting portions 166B.

The sixth figure A is an enlarged perspective view of the vicinity of the arm part viewed from the first side in the state where the first arm part and the second arm part are meshed. Figure 6B is an enlarged perspective view of the vicinity of the arm portion viewed from the second side in a state where the first arm portion and the second arm portion are meshed. Figure 6 C is an enlarged perspective view of the vicinity of the arm portion viewed from the first side in a state in which the first arm portion and the second arm portion are opened. Figure 6D is an enlarged perspective view of the vicinity of the arm portion viewed from the second side in a state in which the first arm portion and the second arm portion are opened.

As shown in Figures 6 A to D, the engaging portion 164A of the first arm portion 160A engages with the upper surface and end surface of the external connection portion cover 162B of the second arm portion 160B (Figure 6A, Figure 6B) . The end portion 165B on the opposite side to the external connection portion cover 162B of the second arm portion 160B is engaged with the concave portion of the engaging portion 165A of the first arm portion 160A (FIG. 6B). At this time, the engaging portion 165A of the first arm portion 160A is shaped to fit the end portion 165B of the second arm portion 160B from the vertical direction and the end surface side. Therefore, the first arm portion 160A and the second arm portion 160B are engaged with each other in a state where the first arm portion 160A overlaps the second arm portion 160B as a whole. That is, in the engaged state of the first holding member 110A and the second holding member 110B, the first arm portion 160A and the second arm portion 160B move toward the first and second body portions 111A, 111B from the first and second body portions 111A, 111B. The directions of the arm portions 160A, 160B are aligned. That is, in the first arm portion 160A and the second arm portion 160B, spaces above and below the substrate holder 11 are allocated respectively, and the upper and lower perches are separated. With this configuration, it is possible to suppress or prevent an increase in the size of the substrate holder 11 in the thickness direction.

In addition, at the part of the narrow portion 164B of the second arm portion 160B, a gap is formed between the first arm portion 160A and the second arm portion 160B to form the claws of the conveyor 141 (for holding the substrate for holding). The retraction space of the claw of device 11).

In addition, as shown in Figures 6 A to D, when engaging the first arm portion 160A and the second arm portion 160B, the first and second external connecting portions 161A, 161A, 161B are arranged on opposite sides in the width direction of the substrate holder 11 so as not to interfere with each other. That is, the first and second external connection portions 161A, 161B are located at the left and right ends of the substrate holder 11 , in other words, located at the left and right ends of the support arm portion 160 . In the plating tank 10, since the first surface and the second surface of the substrate W can be fed from the left and right ends of the arm portion 160 of the substrate holder 11, it is better to concentrate the external connection parts on the arm than to concentrate the external connection parts. The shape of one end of the portion 160 can prevent the thickness of the substrate holder 11 from increasing.

The seventh figure A is a partial perspective perspective view of the first holding member for showing the path of the wiring from the first external connection part to the first body part. The seventh figure B is a perspective view of the first body part in the connecting part of the first body part and the wiring receiving part. The seventh figure C is a perspective view of the wiring accommodating part in the connecting part of the wiring accommodating part and the first body part viewed from the inside. The seventh figure D is a perspective view of the wiring accommodating part in the connecting part of the wiring accommodating part and the first main body viewed from the outside. In addition, although the following description describes the route configuration of the wiring L of the first holding member 110A, the same applies to the route of the wiring L of the second holding member 110B.

As shown in FIG. 7A, a plurality of wires L connected to the first external connection part 161A pass through the storage space 152A inside the first wire receiving part 150A (FIG. 4C), and then pass through the opening of the first main body part 111A. The wiring hole 116A (seventh drawings A and B) is introduced into the first body part 111A. The wiring hole 116A is a tapered hole formed by processing, and is provided corresponding to each wiring L. As shown in FIG. A plurality of wiring holes 192A corresponding to each wiring L are provided on the thick portion of the first main body portion 111A side of the first wiring receiving portion 150A (Fig. Lead out to the first body portion 111A side. The wiring L sent out from the plurality of wiring holes 192A is introduced into the first body portion 111A through the corresponding wiring hole 116A (FIG. 7B) of the first body portion 111A.

The eighth figure is an enlarged plan view of the connecting part between the wiring receiving part and the main body part. The eighth figure A is a sectional view of A-A of the eighth figure. The eighth figure B is a cross-sectional view of B-B of the eighth figure where no wiring hole is formed. The eighth figure C is a sectional view of C-C of the eighth figure at the part where the wiring hole is formed.

As shown in FIG. 8 and FIG. 8A, the first main body portion 111A has a mounting portion 114A that is generally thin in the center in the width direction. The mounting portion 114A has a step formed by a thinner portion on the inner surface (the surface on the second holding member 110B side) and the outer surface (the surface on the opposite side to the second holding member 110B) than other parts of the first body portion 111A. department. The first wiring accommodating portion 150A has mounting portions 158A and 159A forming a concave portion corresponding to the shape of the step portion of the mounting portion 114A of the first body portion 111A. For example, bolt holes (not shown) are formed in the mounting portion 114A of the first body portion 111A and the mounting portion 158A of the first wiring receiving portion 150A, and the mounting portion 114A and the mounting portion 158A are fixed by bolts. The configurations of the second main body portion 111B and the second wiring accommodating portion 150B of the second holding member 110B are also the same.

Because this structure is an umbrella structure in which the mounting portion 159A of the first wiring accommodating portion 150A overlaps the outer side of the mounting portion 114A of the first body portion 111A, it can suppress or prevent the plating solution from flowing from the outer side of the first holding member 110A. The side invades the inner space 200 between the first holding member 110A and the second holding member 110B. Similarly, since the mounting portion 159B of the second wiring accommodating portion 150B overlaps the outer surface of the mounting portion 114B of the second body portion 111B, the umbrella structure can suppress or prevent the plating solution from flowing from the outer surface of the second holding member 110B. The side (the side opposite to the first holding member 110A) invades the inner space 200 . In other words, the umbrella structure can suppress or prevent the plating solution from intruding into the inner space 200 of the substrate holder 11 through the liquid paddle or the like.

As shown in FIG. 8 and FIG. 8B, the first body portion 111A has a mounting portion 115A in a portion where the wiring hole 116A is not formed except the mounting portion 114A. The mounting portion 115A has a stepped portion formed of a thinner portion whose thickness is smaller than that of other portions of the first body portion 111A on the outer surface (the surface opposite to the second holding member 110B). The first wiring accommodating portion 150A has a mounting portion 191A composed of a flange portion corresponding to the shape of the step portion of the mounting portion 115A of the first body portion 111A. When the first holding member 110A is engaged with the second holding member 110B, the mounting portion 191A of the first wiring receiving portion 150A is engaged with the stepped portion of the mounting portion 115A of the first body portion 111A. The configurations of the second main body portion 111B and the second wiring accommodating portion 150B of the second holding member 110B are also the same.

Because this structure is an umbrella structure in which the mounting portion 191A of the first wiring accommodating portion 150A overlaps the outer surface of the mounting portion 115A of the first body portion 111A, it can suppress or prevent the plating solution from flowing from the outer surface of the first holding member 110A. The side invades the inner space 200 of the substrate holder 11 . Similarly, since the mounting portion 191B of the second wiring accommodating portion 150B overlaps the outer surface of the mounting portion 115B of the second main body portion 111B, the umbrella structure can be suppressed or prevented from flowing from the outer surface of the second holding member 110B. The side invades the inner space 200 of the substrate holder 11 . In other words, the umbrella structure can suppress or prevent the plating solution from intruding into the inner space 200 of the substrate holder 11 through the liquid paddle or the like.

As shown in the eighth figure C, the position C-C in the eighth figure is that a wiring hole 192A and a wiring hole 116A are respectively provided in the first wiring receiving part 150A and the first main body part 111A. The connection structure between the first wiring receiving portion 150A and the first main body portion 111A is the same as that in the eighth B figure. The wiring L passes through the wiring hole 192A from the storage space 152A of the first wiring receiving portion 150A, and then passes through the wiring hole 116A of the first main body portion 111A. The configurations of the second main body portion 111B and the second wiring accommodating portion 150B of the second holding member 110B are also the same.

Since this structure is an umbrella structure in which the mounting portion 191A of the first wiring accommodating portion 150A overlaps the outer side of the mounting portion 115A of the first body portion 111A, it can suppress or prevent the plating solution from flowing from the outer side of the first holding member 110A. The side invades the inner space 200 of the substrate holder 11 . Similarly, since the mounting portion 191B of the second wiring accommodating portion 150B overlaps the outer side surface of the mounting portion 115B of the second body portion 111B, the plating solution can be suppressed or prevented from flowing from the outer side of the second holding member 110B. The side invades the inner space 200 of the substrate holder 11 . In other words, the umbrella structure can suppress or prevent the plating solution from intruding into the inner space 200 of the substrate holder 11 through the liquid paddle or the like.

As described above with reference to the eighth figure to the eighth C figure, the first body part 111A and the first wiring accommodating part 150A have the wall part (mounting part) of the first wiring accommodating part 150A overlapping the first wiring accommodating part 150A from the outside in the connecting part. The umbrella structure of the wall part (mounting part) of the main body part 111A. This structure can suppress or prevent the plating solution from entering the wiring hole 192A and the wiring hole 192A through the inner space 200 from the outer side of the first holding member 110A through the connecting portion of the first body portion 111A and the first wiring accommodating portion 150A, and/or through the inner space 200 . Wiring hole 116A. Similarly, the second body part 111B and the second wiring accommodating part 150B have a wall part (mounting part) of the second wiring accommodating part 150B overlapping the wall part (mounting part) of the second body part 111B from the outside in the connecting part. umbrella construction. This configuration can suppress or prevent the plating solution from entering the wiring hole 192B and the wiring hole 192B through the inner space 200 from the outer side of the second holding member 110B through the connecting portion of the second body portion 111B and the second wiring accommodating portion 150B, and/or through the inner space 200 . wiring hole 116B. Since this configuration can protect the wiring L from intrusion of the plating solution, a sealing member for sealing the wiring hole 192 and the wiring hole 116 can be omitted.

In addition, in this embodiment, when the substrate holder 11 is arranged in the plating tank 10, the connecting portion between the first main body portion 111A and the first wiring accommodating portion 150A and the connecting portion between the second main body portion 111B and the second wiring accommodating portion 150B are used. The positions of the connecting parts are arranged so that the connecting parts are located above the plating liquid surface S (Fig. 8A to Fig. 8C). In other words, the plating liquid surface S is higher than the holding position of the substrate W, and is higher than the connecting portion between the first main body portion 111A and the first wiring accommodating portion 150A, and the connection between the second main body portion 111B and the second wiring accommodating portion 150B. The substrate holder 11 is configured in a downward manner. Therefore, due to the umbrella structure in the connecting portion of the first body portion 111A and the first wiring accommodating portion 150A, and the connecting portion of the second body portion 111B and the second wiring accommodating portion 150B, the connecting portion is separated from the arrangement of the plating solution. , can more effectively suppress or prevent the plating solution from invading the wiring hole 192 and the wiring hole 116 . Since this configuration can protect the wiring L from intrusion of the plating solution, a sealing member for sealing the wiring hole 192 and the wiring hole 116 can be omitted.

In addition, in this embodiment, when the substrate holder 11 is arranged in the plating tank 10, the first and second wirings are arranged so that the first and second wiring accommodating parts 150A, 150B are located above the plating liquid surface S. Storage parts 150A, 150B. Since this structure is close to both sides of the main body 111 and the first and second wiring accommodating parts 150A and 150B are arranged above the space where the paddles are arranged, the dimensions in the thickness direction of the first and second wiring accommodating parts 150A and 150B are not easy. restricted.

Figure 9 A is a front view viewed from the inside side of the first retaining member. Figure 9B is a partially enlarged front view viewed from the inner side of the first holding member. The ninth figure C shows the C-C sectional view of the ninth B figure of the second retaining member together with the first retaining member.

The ninth figure A and the ninth figure B are illustrated by taking the first holding member 110A as an example. In addition, the same explanation applies to the second holding member 110B except that it does not have an outer seal. As shown in FIG. 9A, the first holding member 110A has a plurality of substrate contacts 117A around the first opening 112A. This embodiment exemplifies the case where 18 substrate contacts 117A are provided, but any number of substrate contacts can be provided according to the size of the substrate W, the magnitude of the plating current, and the like. Each substrate contact 117A is connected to the external connection portion 161A through each wiring L (3rd FIG. 3A ).

As shown in FIG. 9B, the first body portion 111A is provided on the inner side of the first body 1110A: an inner seal 120A, a seal holder 118A for installing the inner seal 120A, an outer seal 121A, and a seal holder for installing the outer seal 121A. Seal holder 119A. A wiring path 127A through which the wiring L passes is formed between the seal holder 118A and the seal holder 119A. Each substrate contact 117A is secured to the seal holder 118A outside the inner seal 120A by screws 122A. The seal holder 118A is fixed to the first body 1110A with the inner seal 120A sandwiched between the first body 1110A (FIG. 9C). The sealing holder 118A of this embodiment is fixed to the first body 1110A by means of screws 123A (Fig. 9B). The portion where the screw 123A is arranged has a hole in the substrate contact 117A, and is configured so that the screw 123A does not contact the substrate contact 117A. The seal holder 119A is fixed to the first body 1110A in a state of sandwiching the outer seal 121A with the first body 1110A (FIG. 9C). The seal holder 119A of this embodiment is fixed to the first body 1110A by means of screws 124A (Fig. 9B).

Each wiring L extends to the vicinity of the corresponding substrate contact 117A, and the coating on the front end side is removed to expose the conductive line 125 (FIG. 9B). The conductive wire 125 of the wiring L is introduced into the groove 126A (the ninth figure C) of the sealing holder 118A, and the conductive wire 125 of the wiring L and the substrate contact 117A are fixed to the seal by the screw 122A (the ninth figure B). The device 118A is fastened. Thereby, the wiring L is electrically connected to the corresponding substrate contact 117A. In addition, FIG. 9C shows the portion where the conductive wire 125 of the wiring L and the substrate contact 117B are fastened to the sealing holder 118A by the screw 122B in the second body portion 111B of the second holding member 110B. As shown in FIG. 9C, the second body portion 111B has the same configuration as the first body portion 111A except that it does not have an outer seal and its seal holder. In other embodiments, an outer seal may be provided in the second body portion 111B.

As shown in FIG. 9C, the area to be plated (on the side of the first and second openings 112A, 112B) of the substrate W and the inner peripheries of the first and second body parts 111A, 111B are sealed by the inner seal 120 between the side ends. In addition, since the outer seal 121A of the first holding member 110A is tightly sealed to the inner surface of the second body portion 111B of the second holding member 110B, the space between the first and second body portions 111A, 111B is sealed on the outer peripheral side. As a result, the internal space between the first and second body parts 111A, 111B is sealed by the inner seals 120A, B and the outer seal 121A, and the substrate contacts 117 and the cables L are protected from intrusion of the plating solution.

Figure 10 is a cross-sectional view of the first and second body parts showing the arrangement of screws for fixing the contacts of the substrate. Figure 11 is a cross-sectional view of the first and second body portions showing the arrangement of the screws securing the seal holder for installing the inner seal. As shown in FIG. 10 , the screws 122A for fixing the substrate contacts 117A and the screws 122B for fixing the substrate contacts 117B are arranged without overlapping each other when the first holding member 110A and the second holding member 110B are engaged. Avoiding the interference between the screw 122A of the first holding member 110A and the screw 122B of the second holding member 110B can make the first holding member 110A and the second holding member 110B closer. In addition, as shown in FIG. 11, the screw 123A fixing the sealing holder 118A and the screw 123B fixing the sealing holder 118B are arranged without overlapping each other when the first holding member 110A and the second holding member 110B are engaged. Avoiding the interference between the screw 123A of the first holding member 110A and the screw 123B of the second holding member 110B can make the first holding member 110A and the second holding member 110B closer. As a result, avoiding interference between the screws 122A, 123A of the first holding member 110A and the screws 122B, 123B of the second holding member 110B can bring the first holding member 110A closer to the second holding member 110B.

Figure 12A is an enlarged perspective view of the external connection part with the external connection part cover removed. Here, the first external connection portion 161A of the first holding member 110A is taken as an example for illustration, but the second external connection portion 161B of the second holding member 110B also has the same structure. The first external connection portion 161A has a number of individual external connection contacts 168 corresponding to the number of substrate contacts 117A of the first holding member 110A. In this embodiment, nine of each of the eighteen substrate contacts 117A are arranged in two rows. In the following description, in Figure 12A, the proximal end of the paper corresponds to the inner side of the substrate holder, and the far end of the paper corresponds to the outer side of the substrate holder. In the first external connection portion 161A, a bus bar 167 is provided inside the plurality of substrate contacts 117A. Each external connection contact 168 is connected to the corresponding substrate contact 117A through a separate wiring L, and is electrically insulated from each other. When confirming energization, as shown in FIG. 12D, each contact point 230 of the confirmation energization device 169 abuts against the individual external connection contact point 168 and is electrically connected. In addition, during the plating process, as will be described later, the external connection contacts 168 are electrically short-circuited to supply the same potential (FIG. 12E). In other embodiments, two or more wiring lines L may be connected to one external connection contact 168, and the other ends of these two or more wiring lines may be connected to different board contact points 117A, respectively. In addition, a plurality of external connection contacts 168 may be connected to a plurality of lines L, and these lines L may be connected to one substrate contact.

Figure 12B is an explanatory view of the current path in the first holding member. Figure 12C is an explanatory view of the current path in the second holding member. The first holding member 110A supplies current from each external connection contact 168 of the first external connection portion 161A to each substrate contact 117A according to the path indicated by the arrow (FIG. 12B). The second holding member 110B supplies current from each external connection contact 168 of the second external connection portion 161B to each substrate contact 117B according to the path indicated by the arrow (FIG. 12C). In each of the external connection contacts 168 of the first holding member 110A and the second holding member 110B, and the substrate contacts 117A and 117B, a common potential is supplied during the plating process, and when power is confirmed, part or all of the external connection contacts are connected. Point 168 supplies different potentials.

The twelfth figure D is a diagram showing the connection mode of each contact point of the external connection part when the power is confirmed. It is confirmed that the energization process is performed in a state where the substrate W is sandwiched between the substrate holders 11 in the substrate placement unit 170B (first figure). The terminal 230 for checking the energization device 169 is arranged in the substrate placement portion 170B. The external connection portion 161A of this embodiment has nine external connection contacts 168 arranged in two rows (see Fig. 12A). The energization confirmation process is performed when each external connection contact 168 of the external connection part 161A is not in contact with the bus bar 167 and is in contact with the terminal 230 of the energization confirmation device 169 (12D FIG.). It is confirmed that each terminal 230 of the power supply device 169 can supply an individual potential to the corresponding external connection contact 168 , and the current between any two external connection contacts 168 can be measured. In addition, a plurality of external connection contacts 168 can be regarded as a group, and the current between the external connection contacts 168 can be measured for each group.

For example, as shown in FIG. 12A, three contacts in each row facing each other are regarded as a group, and are divided into three groups I, II, and III to perform the confirmation energization process. One example is to measure the current by applying a potential difference between the terminals 230 connected to the three external connection contacts 168 of the near-end row of group I and the terminals 230 connected to the three external connection contacts 168 of the far-end row. Next, a potential difference is applied between the terminals 230 connected to the three external connection contacts 168 of the near-end row of the group II and the terminals 230 connected to the three external connection contacts 168 of the far-end row to measure the current. Next, a potential difference is applied between the terminals 230 connected to the three external connection contacts 168 of the near-end row of Group III and the terminals 230 connected to the three external connection contacts 168 of the far-end row to measure the current.

For example, when the near-end terminal 230 is at a high potential and the far-end terminal 230 is at a low potential, the group I is connected to the near-end terminal 230 and the three external connection contacts 168 of the group I near-end row. The wiring L of 3 contacts, the substrate contact 117A connected to these wiring L, the seed layer of the first surface (surface) of the substrate W, the substrate contact 117A connected to the terminal 230 at the far end, the wiring L, the remote The three external connection points 168 and the terminals 230 of the terminals flow. Similarly, the current flowing between the external connection contacts 168 on the first and second sides of the other two groups II and III is measured. As a result, when the measured value of the current is within the specified range, it is determined that the external connection contact 168, the wiring L, the substrate contact 117, and the substrate W of the external connection part 161A are all normal, and the substrate holder 11 is transported to the processing part 173C ( Figure 1) Plating treatment is performed. In addition, when the measured value of the current exceeds the specified range, it indicates that there is an abnormality in the external connection contact 168 of the external connection part 161A, the wiring L, the substrate contact 117 or the substrate W, and the substrate W is taken out from the substrate holder 11, and the substrate is removed. The holder 11 is returned to the holder storage section 170D (first figure).

In addition, the number of external connection points included in each group is not limited, and the number of external connection points may be different between groups. In addition, the current can also be measured by applying a potential difference between the external connection points 168 at the proximal end or the distal end. In addition, the number of external connection contacts included in each group may be two, and each of the two external connection contacts 168 may measure the current. By measuring the current between the external connection contacts 168 in each group, it is easy to find the abnormal part.

The same confirmation energization device 169 is also provided in the second external connection portion 161B of the second holding member 110B, and the same confirmation energization process is performed on the second surface (back surface) of the substrate W.

Figure 12E is a diagram showing the connection mode of each contact point of the external connection part during the plating process. The substrate holder 11 accommodates and holds the arm portion 160 in the arm accommodating portion 250 of the plating tank 10 . One arm receiving portion 250 is disposed on each side of the plating tank, and the substrate holder 11 can be suspended by supporting both ends of the arm portion 160 with the arm receiving portion 250 . The current supply part 240 is disposed in the arm housing part 250 , and the external connection parts 161A and 161B are provided on the current supply part 240 . At this time, each external connection contact 168 is pressed against the current supply part 240 by the weight of the first and second external connection parts 161A, 161B or an additional actuator, and contacts the bus bar 167. out of shape. As a result, all the external connection contacts 168 are electrically short-circuited by the current supply part 240 and the bus bar 167 . In this state, when a potential is supplied from the external power source 37 (FIG. 15 ) to the current supply unit 240, all the contacts 168 are supplied with the same potential. During the plating process, the current flows from the external power supply 37 through the anode 31A (31B), the plating solution, the seed layer on the surface (back surface) of the substrate W, the substrate contact 117A (117B), the wiring L, the first and the second external Each external connection point 168 of the connection part 161A ( 161B ) flows on the path returning to the external power supply 37 . The bus bar 167 is provided to make the short circuit between the external connection contacts 168 more reliable. In addition, different currents may flow into the current supply part 240 in contact with the first external connection part 161A and the current supply part 240 in contact with the second external connection part 161B.

FIG. 13A is a schematic diagram illustrating setting the substrate in the substrate placing part on the substrate holder. Fig. 13A includes the first holding member 110A and the second holding member 110B, and schematically shows each configuration. The substrate loading and unloading device 1000 is arranged in the substrate placing unit 170B (first figure). The substrate handling apparatus 1000 includes a rotation apparatus 1100 and a workstation 1200 . The rotation device 1100 attaches, detaches or mounts the substrate W to the second holding member 110B while holding the second holding member 110B of the substrate holder 11 in a roughly horizontal posture, and holds the second holding member 110B in a roughly vertical direction. In the standing state, the substrate W is sandwiched between the first holding member 110A and the second holding member 110B held by the workstation 1200 . Thereby, the substrate W can be attached to and detached from the substrate holder 11 . For example, the workstation 1200 may be constituted by a stationary station for suspending the substrate holder 11 , and a support device for supporting the substrate holder 11 held on the stationary station toward the rotating device 1100 side. The aforesaid confirming power-on device can be provided, for example, at the part where the first and second external connection parts 161A, 161B of the arm part 160 of the substrate holder 11 of the workstation 1200 are placed.

The substrate holder 11 before mounting the substrate is separated into a first holding member 110A and a second holding member 110B. The first holding member 110A is arranged on the workstation 1200 in an upright state, and the second holding member 110B is arranged on the rotating device 1100 in a roughly horizontal state. on the stage. In this state, the substrate W held by the robot arm of the transfer device 122 is set on the second holding member 110B on the rotation device 1100 . Then, the stage of the rotation device 1100 is rotated to move the second holding member 110B to a substantially vertical state, and in this state, the second holding member 110B is pressed against the first holding member to engage (fix) the first holding member 110A and the first holding member 110A. The second holding member 110B holds the substrate W by the first holding member 110A and the second holding member 110B. In this state, the aforementioned power-on confirmation process is executed. When it is confirmed that the result of the energization treatment is good, the substrate holder 11 holding the substrate W is transported by the conveyor 141 to the processing unit 170C (the first figure) for plating treatment. When it is confirmed that the result of the energization process is defective, the substrate W is taken out from the substrate holder 11, and the substrate holder 11 is returned to the holder storage unit 170D (the first figure).

When unloading the substrate W from the substrate holder 11 , in the workstation 1200 , the second holding member 110B is unloaded from the first holding member 110A together with the substrate W by the rotating device 1100 . Then, as shown in FIG. 13A, the second holding member 110B is turned into a roughly horizontal posture, and the robot arm of the transfer device 122 carries out the substrate W.

Here, the case where the first holding member 110A and the second holding member 110B are engaged in an upright state is described, but the first holding member 110A and the second holding member 110B may be engaged in a horizontal state.

FIG. 13B shows an example of a method for fixing a substrate holder. The first holding member 110A and the second holding member 110B can be fixed by any fixing method. For example, as shown in FIG. 13B, the first holding member 110A and the second holding member 110B can be fixed by a screwing mechanism such as a bolt. In this example, a screw hole 195 is provided in the first body 1110A of the first holding member 110A, and a through hole 194 is provided in the second body 1110B of the second holding member 110B, and the first holding member 110A is tightened by a bolt 193 with the second holding member 110B. In addition, in this example, a shank hole 194a is provided corresponding to the through hole 194, and the head of the bolt 193 is arranged in the shank hole 194a. Thereby, the thickness of the substrate holder 11 can be reduced. The first holding member 110A and the second holding member 110B are suitably fixed at plural places by bolts 193 . In addition, a clamp may be provided on one of the first holding member 110A and the second holding member 110B to fix the first holding member 110A and the second holding member 110B to each other. When using any fixing method, an actuator or the like may be provided in the substrate handling apparatus 1000, and an automatic fixing method may be used.

Figure 14A is an enlarged perspective view near the positioning portion of the first holding member. Figure 14B is an enlarged perspective view of the positioning portion of the second holding member. The first holding member 110A has a protrusion (positioning pin) 210A as a positioning portion in the first body 1110A of the first body portion 111A. The second holding member 110B has a through hole 210B in the second body 1110B of the second body portion 111B as a positioning portion. The protruding portion 210A is fixed to the first body 1110A by fastening members such as bolts. The protruding portion 210A can also be fixed to the first body 1110A by other fixing means, and can also be integrally formed with the first body 1110A. A plurality of protrusions 210A and through-holes 210B are respectively provided in the first main body 111A and the second main body 111B. When the first holding member 110A and the second holding member 110B are engaged, each through-hole 210B can be inserted and fitted into each of the through-holes 210B. protrusion 210A. Thereby, positioning between the first holding member 110A and the second holding member 110B is performed. In addition, the through hole 210B may be provided in the first holding member 110A, and the protrusion 210A may be provided in the second holding member 110B.

Fig. 15 is a side view schematically showing the composition of the plating tank 10. In the plating process, the first anode holder 30A is arranged to face the first surface (surface) of the substrate W, and the second anode holder 30B is arranged to face the second surface (back surface) of the substrate W. The first anode holder 30A has an anode cover (not shown) for adjusting the electric field between the first anode 31A and the substrate W. As shown in FIG. The anode cover is, for example, a roughly plate-shaped member made of a dielectric material, and is arranged on the surface of the first anode holder 30A opposite to the substrate holder 11 . The anode shield has an opening at a roughly central portion through which the current flowing between the first anode 31A and the substrate W passes, and the diameter or side length of the opening is preferably smaller than the diameter or side length of the first anode 31A. In addition, the anode cover can also form an adjustable opening diameter or side length. For example, if a plurality of throttling vanes are arranged on the opening, the opening diameter or side length can be enlarged or reduced by the same structure as the aperture mechanism of the camera. The configuration of the second anode holder 30B is also the same as that of the first anode holder 30A.

A first intermediate mask 36A is provided between the first anode holder 30A and the substrate holder 11 . In addition, a second intermediate mask 36B is provided between the second anode holder 30B and the substrate holder 11 . These first and second intermediate shields 36A, 36B adjust the opening diameters or The side length is used to adjust the electric field between the first and second anodes 31A, 31B and the substrate W. In one embodiment, a moving mechanism can be connected to the first intermediate mask 36A and the second intermediate mask 36B, and the distance between the substrate W and the first intermediate mask 36A, and the distance between the substrate W and the second intermediate mask 36B can be changed. the distance between. In addition, when an insoluble anode is used, since the plating metal needs to be continuously replenished in the plating solution, a mechanism for replenishing the plating metal can also be provided in the circulation mechanism described later.

A first paddle 35A for stirring the plating solution near the first surface of the substrate W is provided between the first anode holder 30A and the substrate holder 11 . In addition, a second paddle 35B for stirring the plating solution near the surface to be plated of the substrate W is provided between the second anode holder 30B and the substrate holder 11 . These paddles 35A, 35B may be, for example, substantially rod-shaped members, and may be installed in the plating treatment tank facing the vertical direction. The paddles 35A, 35B are configured to be able to move horizontally along the surface to be plated of the substrate W by a drive device not shown. In addition, the paddles 35A, 35B may also be provided with a plurality of longitudinal slits in the plate-shaped member.

The first anode 31A is connected to the external power source 37 through the wiring inside the first anode holder 30A. Furthermore, as described above, the first external connection portion 161A of the first holding member 110A exposing the first surface (surface) of the substrate W of the substrate holder 11 is connected to the external power source 37 . When a voltage is supplied from the external power supply 37 between the first anode 31A and the first external connection portion 161A of the substrate holder 11, the substrate W passing through the first anode 31A, the plating solution, and the substrate holder 11 from the external power supply 37 is The seed layer on the first surface of the first surface, the first external connection portion 161A (the first holding member 110A) and the path returning to the external power supply 37 flow a plating current. It is connected to the external power supply 37 through the wiring in the second anode 31B and the second anode holder 30B. Furthermore, as described above, the second external connection portion 161B of the second holding member 110B exposing the second surface (surface) of the substrate W of the substrate holder 11 is connected to the external power source 37 . When a voltage is supplied from the external power supply 37 between the second anode 31B and the second external connection portion 161B of the substrate holder 11, the substrate W passing through the second anode 31B, the plating solution, and the substrate holder 11 from the external power supply 37 is The plating current flows in the path returning to the external power supply 37 from the seed layer on the second surface of the second external connection portion 161B (second holding member 110B).

The plating apparatus according to the embodiment shown in FIG. 15 includes a circulation mechanism 300 for circulating the plating solution between the plating tank 10 and the outer tank 16 . The circulation mechanism 300 includes a circulation line 302 that connects the outer tank 16 that accommodates the plating solution overflowing from the plating tank 10 , and the plating tank 10 . The circulation pipeline 302 is provided with a valve 304 to open and close the circulation pipeline 302 . The valve 304 can be, for example, a solenoid valve, and the opening and closing of the circulation pipeline 302 can also be controlled by the control unit 103 (see FIG. 1 ). The circulation pipeline 302 is provided with a pump 306 , and the plating solution can be circulated from the outer tank 16 to the coating tank 10 through the circulation pipeline 302 by the pump 306 . The circulation line 302 is provided with a temperature control device 308 to control the temperature of the plating solution passing through the circulation line 302 . For example, a thermometer (not shown) may be installed in the coating tank 10, and the temperature control device 308 may be controlled by the control unit 103 according to the temperature of the coating solution measured by the thermometer. The circulation line 302 is provided with a filter 310 to remove solid matter from the plating solution passing through the circulation line 302 .

In this embodiment, the first holding member 110A and the second holding member 110B are respectively provided with a first external connection portion 161A and a second external connection portion 161B which are independent of each other. Thereby, the first external connection part 161A, the wiring L, and the current path for the first surface of the substrate W formed by the substrate contact 117A can be connected with the second external connection part 161B, the wiring L, and the substrate contact 117B. The current paths for the second surface of the substrate W are distributed to the first and second holding members 110A and 110B, respectively. As a result, an increase in the thickness of the substrate holder can be suppressed, and a space for providing a current supply path to the first surface and the second surface of the substrate can be ensured. This is effective when the number of wires increases due to the size of the board, or when the diameter of the wires increases due to the magnitude of the current. In addition, the double-sided plated substrate is particularly effective because the number of wirings is generally twice that of the single-sided plated substrate. In addition, since current can be independently supplied to the first surface and the second surface of the substrate, it is possible to independently control plating specifications such as the plating thickness of each surface.

In addition, the above describes the substrate holder for double-side plating, but even in the substrate holder for single-side plating, it is also possible to set the first outer parts independent of each other in the first holding member and the second holding member. The connection part and the second external connection part. When a connection path is provided to connect the current paths respectively provided in the first holding member and the second holding member, current can be supplied to the surface to be plated from both the first and second external connection portions of the first and second holding members. At this time, the current path for the first surface of the substrate can be allocated to the first and second holding members to secure a space for setting the current supply path. Even in substrate holders for single-sided plating, it is still effective when the number of wires and the diameter of wires increase due to the size of the substrate, the magnitude of the current, etc.

(Other implementation forms)

Fig. 17 is a perspective view viewed from the first side of the substrate holder of another embodiment. Figure 18 is a perspective view of the first holding member and the second holding member in the open state of the substrate holder viewed from the first side. Figure 19 is an exploded perspective view of the first holding member and the second holding member of the substrate holder.

Since the substrate holder 11 of other embodiments has roughly the same configuration as the substrate holder 11 described above in FIG. 2A and the like, the same reference numerals are assigned to the same configuration, and detailed descriptions are omitted. In this embodiment, instead of the wiring L composed of cables, a plurality of substrate contacts 117 and external connection contacts 161A, 161B are connected by conductive path portions 410, 420 (see FIG. 20 ) having larger cross-sectional areas. . Thereby, the wiring accommodating part 150 (the first wiring accommodating part 150A, the second wiring accommodating part 150B) can be omitted, and the size and cost of the substrate holder can be reduced. In addition, when it is applied to a substrate holder for single-side plating, a conductive path portion may be provided on one of the first holding member or the second holding member.

As shown in FIG. 17 and FIG. 18 , the substrate holder 11 includes a main body 111 , left and right mounting portions 180 , a central mounting portion 181 , and an arm portion 160 . The substrate holder 11 is divided into a first holding member 110A having a first opening 112A; and a second holding member 110B having a second opening 112B. The first holding member 110A includes a first body portion 111A, left and right mounting portions 180A, a central mounting portion 181A, and a first arm portion 160A (see Figures 18 and 19). The second holding member 110B includes: a second main body portion 111B, left and right mounting portions 180B, a central mounting portion 181B, and a second arm portion 160B (FIG. 18, FIG. 19 ).

The first body part 111A is mounted on the first arm part 160A via the mounting part 181A in the center between the left and right mounting parts 180A and the left and right mounting parts 180A. The left and right installation parts 180A and the central installation part 181A are respectively fixed to the first body part 111A and the first arm part 160A by bolts or other tightening mechanisms, thereby fixing the first body part 111A to the first arm part 160A .

The first arm portion 160A includes an elongated plate-shaped member or a rod-shaped member. The first arm portion 160A has: an external connection portion 161A; and an external connection portion cover 162A for protecting the external connection portion 161A and the conductive path portion 410 . In addition, the first arm portion 160A has positioning portions 163R, 163L at both ends thereof for positioning the substrate holder 11 in the substrate placement portion 170B and the plating tank 10 as described above.

The second holding member 110B includes: a second main body portion 111B, left and right mounting portions 180B, a central mounting portion 181B, and a second arm portion 160B (FIG. 18, FIG. 19 ). Since the composition of the second body part 111B and the mounting parts 180B and 181B is the same as that of the first body part 111A and the mounting parts 180A and 181A, detailed description is omitted, and the same structure is marked with the same number and the letter B. The displayed symbol.

The second arm portion 160B includes an elongated plate-shaped member or a rod-shaped member. The second arm part 160B has: an external connection part 161B; and an external connection part cover 162B for protecting the external connection part 161B and the conductive path part 420 . Similar to the previous embodiment, when engaging the first arm portion 160A and the second arm portion 160B, the first and second external connection portions 161A, 161B of the first and second arm portions 160A, 160B are not aligned with each other. The means of interference is arranged on the opposite side of the substrate holder 11 in the left-right direction.

Fig. 20 is a perspective view of a conductive path portion in another embodiment. Figure 21 is an arrow view of the first holding member and the second holding member viewed from the side of the substrate holding surface. In FIG. 20, reference numeral 410 denotes a conductive path portion disposed on the first holding member 110A, and reference numeral 420 denotes a conductive path portion disposed on the second holding member 110B. In addition, the case where the conductive path part 410 (conductive path part 420 ) has two systems of the left conductive path member 410L ( 420L) and the right conductive path member 410R ( 420R) is described here, but the conductive path part 410 may also be integrated. Or a conductive path member of a system composed of a plurality of path pieces.

Each conductive path portion 410, 420 is made of a material having a low resistance value such as copper (for example, oxygen-free copper). This embodiment, as shown in the twentieth figure, is formed of a plate-shaped member. By forming each conductive path portion 410, 420 into a plate shape, an increase in the thickness of the substrate holder can be suppressed. In addition, each conductive path portion 410 , 420 can also be formed into a rod shape, which is easy to process along the path. In addition, each conductive path part 410, 420 may also be coated with a chemical-resistant resin (such as PFA) in addition to the contact point and the conduction part with other wiring.

Since the conductive path part 410 and the conductive path part 420 have similar structures, the following uses the conductive path part 410 as an example for illustration.

The conductive path portion 410 includes a left conductive path member 410L and a right conductive path member 410R. The left conductive path member 410L and the right conductive path member 410R are separated from each other and electrically insulated within the first holding member 110A. In addition, in other embodiments, the left conductive path member 410L and the right conductive path member 410R may be short-circuited with each other in the first holding member 110A, or may be formed as an integral member.

The left conductive path member 410L and the right conductive path member 410R each have a configuration in which a plurality of path pieces (here, five path pieces) are connected. In addition, the left conductive path member 410L and the right conductive path member 410R may be integrally formed respectively, may be configured to connect five or less path pieces, or may be configured to connect six or more path pieces.

The left conductive path member 410L includes a first path piece 411L, a second path piece 412L, a third path piece 413L, a fourth path piece 414L, and a fifth path piece 415L, and is formed by connecting them. The right conductive path member 410R includes a first path piece 411R, a second path piece 412R, a third path piece 413R, a fourth path piece 414R, and a fifth path piece 415R, and is formed by connecting them.

The first path piece 411L, the second path piece 412L of the left conductive path member 410L and the first path piece 411R, the second path piece 412R of the right conductive path member 410R extend parallel to each other in a separated state. The third path piece 413L, the fourth path piece 414L, and the fifth path piece 415L of the left conductive path member 410L are disposed on the left half of the first body portion 111A (FIG. 21). The third path piece 413R, the fourth path piece 414R, and the fifth path piece 415R of the right conductive path member 410R are disposed on the right half of the first body portion 111A (see FIG. 21 ). The fifth path piece 415R of the right conductive path member 410R is separated from the fifth path piece 415L of the left conductive path member 410L as shown in FIG. 21 . Thus, by dividing the conductive path member with the right conductive path member 410R and the left conductive path member 410L, when the substrate is held on the substrate holder 11 by the substrate placement portion 170B (first figure), the right conductive path member 410R and the left conductive path member 410R are separated. A potential difference is applied between the left conductive path member 410L, and the current flows in the path of the left conductive path member 410L→substrate (seed layer)→right conductive path member 410R (or reversed), and it is possible to judge that the substrate is held when the resistance value is abnormal. There is an abnormal power-on test of the device 11 or the substrate.

The first path piece 411L is disposed in the body of the first arm portion 160A in the eighteenth figure in a manner extending from the external connecting portion 161A to the connecting portion of the central mounting portion 181A. Figure 19 shows a state in which one end of the first path piece 411L is exposed in the mounting recess 1600 provided on the first arm portion 160A. The other end of the first path piece 411L is connected to an external connection contact 440L in the external connection portion 161A (FIG. 24).

As shown in FIG. 19, the second path piece 412L is arranged in the mounting portion 181A so as to extend inside the central mounting portion 181A. One end of the first arm part 160A side of the second path piece 412L is exposed at one end of the mounting part 181A (same as the second path piece 412R of the nineteenth figure), and one end of the mounting part 181A is connected to the first arm part. When the mounting recess 1600 of 160A is fitted, it contacts with one end of the first path piece 411L disposed in the first arm portion 160A, and is electrically connected to the first path piece 411L. When the mounting portion 181A is fixed to the first arm portion 160A with bolts or other tightening members, the first path piece 411L and the second path piece 412L are also locked together with bolts to be fixed to each other. The other end of the second path piece 412L protrudes from the other end of the mounting portion 181A. When the mounting portion 181A is installed on the first body portion 111A, it is inserted into the opening of the first body 1110A and connected to the third path piece 413L. One end (Figure 21). The second path piece 412L and the third path piece 413L are also fixed to each other by fastening members such as screws and bolts (with the third path piece 413R and the fourth path piece 414R of the twenty-second A figure and the twenty-second B figure). connection as well).

The third path piece 413L, the fourth path piece 414L, and the fifth path piece 415L are arranged in the left half of the substrate holding surface side of the first body 1110A of the first body portion 111A as shown in FIG. 21 . The third path piece 413L is disposed along the upper side of the first opening 112A on the side close to the first arm portion 160A. One end of the third path piece 413L is connected to the other end of the second path piece 412L near the center of the first holding member 110A. The other end of the third path piece 413L is connected to one end of the fourth path piece 414L with a screw 416 near the upper corner of the first opening 112A (with the third path in the twenty-second A figure and the twenty-second B figure). The connection between the path slice 413R and the fourth path slice 414R is the same). The fourth path piece 414L is arranged along the left side of the first opening 112A from the proximal end to the distal end of the first arm portion 160A. The other end of the fourth path piece 414L is connected to one end of the fifth path piece 415L near the lower corner of the first opening 112A with screws or other tightening members (compared with the twenty-second A and twenty-second B figures). The connection between the third path slice 413R and the fourth path slice 414R is the same). The fifth path piece 415L is disposed along the lower side of the first opening 112A from the distal end of the first arm portion 160A. The other end of the fifth path piece 415L terminates in a state separated from the fifth path piece 415R in the vicinity of the central portion of the first holding member 110A.

The path pieces 411R to 415R of the right conductive path member 410R are roughly arranged in the same manner as the path pieces 411L to 415L of the left conductive path member 410L. However, the third path piece 413R, the fourth path piece 414R, and the fifth path piece 415R of the right conductive path member 410R are in the first body 1110A, and the third path piece 413L, the fourth path piece 413L, and the fourth path piece of the left conductive path member 410L are in the first body 1110A. 414L and the fifth path piece 415L are disposed on the opposite side (half of the right side) to the first opening 112A.

The first path piece 411R is arranged in the main body of the first arm portion 160A in FIG. 18 so as to extend from the external connecting portion 161A to the connecting portion with the central mounting portion 181A. Figure 19 shows a state where one end of the first path piece 411R is exposed in the installation recess 1600 provided on the first arm portion 160A. The other end of the first path piece 411R is connected to the external connection contact 440R in the external connection portion 161A (FIG. 24).

As shown in FIG. 19, the second path piece 412R is arranged in the mounting portion 181A so as to extend inside the central mounting portion 181A. One end of the first arm portion 160A side of the second path piece 412R is exposed at one end of the mounting portion 181A (same as the second path piece 412L of the nineteenth figure), and one end of the mounting portion 181A is fitted into the first mounting portion 181A. When the recessed portion 1600 of the arm portion 160A is installed, it is in contact with one end of the first path piece 411R disposed in the first arm portion 160A, and is electrically connected to the first path piece 411R. When the mounting portion 181A is fixed to the first arm portion 160A by fastening members such as bolts, the first path piece 411R and the second path piece 412R are also fixed together by bolts to fix each other. The other end of the second path piece 412R protrudes from the other end of the mounting portion 181A. When the mounting portion 181A is mounted on the first body portion 111A, it is inserted into the opening of the first body 1110A and connected to one end of the third path piece 413R. Connection (21st figure). The second path piece 412R and the third path piece 413R are also fixed to each other by fastening members such as screws and bolts (with the third path piece 413R and the fourth path piece 414R of the twenty-second A figure and the twenty-second B figure). connection as well).

The third path piece 413R, the fourth path piece 414R, and the fifth path piece 415R are arranged in the right half of the substrate holding surface side of the first body 1110A of the first body portion 111A as shown in FIG. 21 . The third path piece 413R is disposed along the upper side of the first opening 112A on the side close to the first arm portion 160A. One end of the third path piece 413R is near the central portion of the first holding member 110A, and is connected to the other end of the second path piece 412R. The other end of the third path piece 413R is connected to one end of the fourth path piece 414R with a screw 416 near the upper corner of the first opening 112A (with the third path in Fig. 22A and Fig. 22B). The connection between the slice 413R and the fourth path slice 414R is the same). The fourth path piece 414R is disposed along the right side of the first opening 112A from the proximal end to the distal end of the first arm portion 160A. The other end of the fourth path piece 414R is connected to one end of the fifth path piece 415R with screws or other tightening members near the lower corner of the first opening portion 112A (compared with Fig. 22A and Fig. 22B). The connection between the third path slice 413R and the fourth path slice 414R is the same). The fifth path piece 415R is disposed along the lower side of the first opening 112A from the distal end of the first arm portion 160A. The other end of the fifth path piece 415R terminates in a state separated from the fifth path piece 415L in the vicinity of the central portion of the first holding member 110A.

As mentioned above, the first path piece 411L, R is inserted into the first arm portion 160A, the second path piece 412L, R is inserted into the mounting portion 181A, and the third to fifth path pieces 413L, R, 414L, R, 415L, R After the first body part 111A is inserted, the first arm part 160A, the mounting part 181A, and the first body part 111A are combined with each other. Therefore, the formation of each conductive path member can be easily performed.

Since the configuration of the conductive path part 420 is roughly the same as that of the conductive path part 410, the symbols 410 and 411 related to the conductive path part 410 are replaced with 420 and 421 to indicate the corresponding configuration, and detailed description is omitted. Each path piece of the left conductive path member 420L and the right conductive path member 420R is in the second holding member 110B, includes the second body 1110B of the second body portion 111B from the external connection portion 161B, and is connected to the left conductive path of the conductive path portion 410. The path pieces of the member 410L and the right conductive path member 410R are arranged in the same manner (see FIG. 19, FIG. 21, FIG. 22A, FIG. 22B, FIG. 24, and FIG. Five Figures).

Figure 22A is an enlarged view of the vicinity of the substrate contacts of the substrate holder. Figure 22B is an enlarged view showing the vicinity of the substrate contact of the substrate holder in a state where a part of the substrate contact is removed. Figure 23 is a cross-sectional view along line C-C of Figure 22B showing the second retaining member together with the first retaining member.

As shown in FIG. 23, the conductive path portion 410 and the conductive path portion 420 are arranged in a space sealed by the inner seals 120A, 120B and the outer seal 121A. The seal holder 118A for fixing the inner seal 120A is fixed to the first body 1110A by screws 123 (FIG. 22A).

As shown in Figure 22A and Figure 22B, each path piece 413R, 414R of the conductive path part 410 is fixed to the first body 1110A by screws 416 in the state of overlapping each end, and the other Some parts are fixed on the first body 1110A by screws 417 . The screws 417 are equally arranged along the length direction of each path piece, and press each path piece uniformly along the length direction. In other words, each path piece can be replaced individually by removing the screws 416 , 417 . For example, when the processing liquid leaks from the substrate holder 11, there is a portion that is easily affected by the processing liquid depending on the posture of the substrate holder 11 in the processing tank. When the substrate holder is placed in the plating tank in an upright position, the treatment liquid tends to accumulate near the lowermost part of the substrate holder when leakage of the treatment liquid occurs. Therefore, when the processing liquid leaks and only the path pieces near the bottom of the substrate holder come into contact with the processing liquid, there is no need to replace the entire conductive path parts 410, 420 (or the conductive path members 410L, 410R, 420L, 420R). Only replace the path piece that has come into contact with the treatment fluid. Compared with replacing the entire substrate holder, or the entire conductive path portion (or each conductive path member), the cost can be reduced.

A plurality of substrate contacts 117A are connected to the right conductive path member 410R of the conductive path portion 410 by screws 122A. In other words, by removing the screw 122A, each substrate contact 117A can be individually replaced from the conductive path portion 410 . By replacing a part of the contacts of the substrate, the substrate holder can continue to be used, which can reduce the cost of maintenance and replacement of the substrate holder. For example, when the processing liquid leaks, depending on the posture of the substrate holder 11 in the processing tank, by replacing only a part of the substrate such as the substrate contact (for example, the lowermost part of the above-mentioned substrate holder) that is likely to come into contact with the processing liquid, Contacts can reduce costs compared to replacing the entire substrate holder 11 or the entire substrate contact.

Here, the right conductive path member 410R of the conductive path portion 410 is described, but the left conductive path member 410L of the conductive path portion 410, the right conductive path member 420R, and the left conductive path member 420L of the conductive path portion 420 are similarly arranged.

Figure 24 is an enlarged perspective view of the external connection part in the state where the external connection part cover is removed. Figure 25 is a sectional view of the external connection part. One end of the right conductive path member 410R (first path piece 411R) of the conductive path portion 410 is in the external connection portion 161A, and the external connection contact 440R is screwed together with the conductive plate 430, and electrically connected to the external connection contact 440R. sexual connection. The first path piece 411R can be detached from the external connection contact 440R by removing the screw. The external connection contact 440R has a plurality of thin pieces (nine pieces in this case), and is a thin-piece contact in which the base end side of each thin-piece portion is integrated. One end of the left conductive path member 410L (first path piece 411L) of the conductive path portion 410 is in the external connection portion 161A, the external connection contact 440L is screwed together with the conductive plate 430, and is electrically connected to the external connection contact 440L. sexual connection. The first path piece 411L can be detached from the external connection contact 440L by removing the screw. The external connection contact 440L has a plurality of thin pieces (nine pieces in this case), and is a thin-film contact in which the base ends of the thin pieces are integrated. When the substrate holder 11 is disposed in the plating tank, as shown in FIG. 25, each thin piece of the external connection contact 440R and the external connection contact 440L is in contact with the bus bar 167, and is electrically shorted through the bus bar 167. . In addition, during the conduction test, as in FIG. 12D, each thin piece portion of the external connection contact 440R and the external connection contact 440L is separated from the bus bar 167 . Therefore, each contact point 230 of the confirming energization device 169 is respectively connected to the external connection contact point 440R and the external connection contact point 440L, and through the external connection contact point 440R, the right conductive path member 410R, the substrate contact point, the substrate W, and the substrate contact point. Points, the left conductive path member 410L, and the external connection contact 440L flow current, and a conduction test can be performed. The same applies to the conductive path portion 420 .

In addition, the case where the external connection contact 440R and the external connection contact 440L are respectively provided for the right conductive path member 410R and the left conductive path member 410L is described here, however, when the conductive path part 410 is used as one system, the External connection contacts as an integral component. In addition, the external connection portion 161B of the second holding member 110B is also configured in the same manner.

The substrate holder of the above embodiment includes at least one substrate contact, at least one external contact, and a conductive path member connecting them, and the conductive path member and/or the substrate contact are replaceably provided. Therefore, when the conductive path member and/or the substrate contact contacts with the plating solution to cause corrosion or metal precipitation, the conductive path member and/or the substrate contact can be replaced. Therefore, by replacing the conductive path member and/or the substrate contact, the substrate holder can continue to be used, reducing the cost required for maintenance and replacement of the substrate holder. In particular, since the conductive path member is divided into a plurality of path pieces, only the part that needs to be replaced can be replaced. In addition, only a part of the substrate contacts can be replaced. For example, when the processing liquid leaks, according to the posture of the substrate holder in the processing tank, by replacing only the substrate contacts and/or path pieces that are easily exposed to the processing liquid (when the substrate holder is in a vertical posture, it is the substrate holder A portion of the substrate contacts and/or path pieces, etc., can reduce costs compared to replacing the entire substrate holder, the entire conductive path member, or the entire substrate contact.

By consolidating the wiring for a plurality of substrate contacts 117 into conductive path parts, a large cross-sectional area of each conductive path part can be ensured (one example is a part of 10-20 cables), and the per unit length of each conductive path part can be reduced The wiring resistance. Thereby, the difference of voltage drop in the path from the external connection part to each contact point of the first substrate can be reduced. As a result, the plating current flowing through each first substrate contact can be made uniform, and the plating film thickness can be made uniform. In addition, since the wiring to the plurality of first substrate contacts is integrated into each conductive path portion, the size of the wiring to the plurality of first substrate contacts can be reduced, or cable wiring can be omitted.

At least the following aspects can be grasped from the above-described embodiments.

The first aspect relates to a substrate holder for holding a substrate. The substrate holder includes: a first holding member having a first opening for exposing the first surface of the substrate; and a second holding member for sandwiching the substrate together with the first holding member. and held, and has a second opening for exposing the second surface of the aforementioned substrate. The first holding member has: at least one first substrate contact, which is used to supply current to the first surface of the aforementioned substrate; at least one first external connection contact; and at least one first wiring, which The at least one first substrate contact is electrically connected to the at least one first external connection contact. The second holding member has: at least one second substrate contact for supplying current to the second surface of the aforementioned substrate; at least one second external connection contact; and at least one second wiring for It is electrically connected to the at least one second substrate contact and the at least one second external connection contact. The aforementioned at least one first external connection contact is electrically independent from the aforementioned at least one second external connection contact. The term "electrically independent" means that they are electrically insulated from each other within the substrate holder.

In the first form, since the first and second external connection contacts, the first substrate contacts and the second substrate contacts, the first wiring and the second wiring are independently provided in the first and second holding members, it is possible to The paths for supplying current to the first surface and the second surface of the substrate are assigned to the first and second holding members, respectively. This suppresses an increase in the thickness of the substrate holder and secures a space for providing a current supply path to the first surface and the second surface of the substrate. In addition, since current can be independently supplied to the first surface and the second surface of the substrate, it is possible to independently control plating specifications such as the plating thickness of each surface.

In addition, current can be supplied to the first surface of the substrate from at least one first external connection contact via at least one first wiring and at least one first substrate contact. By adjusting the length of the first wiring, the resistance value between at least one first substrate contact and at least one first external connection contact can be adjusted. Likewise, current can be supplied to the second surface of the substrate from at least one second external connection contact via at least one second wiring and at least one second substrate contact. By adjusting the length of the second wiring, the resistance value between at least one second substrate contact and at least one second external connection contact can be adjusted.

In the above-mentioned embodiment, the first holding member and the second holding member each have a plurality of substrate contact points, which are respectively arranged along the outer periphery of the substrate, for example, and are in contact with the substrate for supplying current to the substrate. In addition, the substrate contacts that come into contact with the substrate for supplying current to the substrate may be one substrate contact integrally connected to each other along the outer periphery of the substrate.

The second form is the substrate holder of the first form, wherein the first holding member has: a plurality of the first substrate contacts; a plurality of the first external connection contacts; and a plurality of the first wirings, which are electrical Sexually connect the aforementioned plurality of first substrate contacts and the aforementioned plurality of aforementioned first external connection contacts.

One first substrate contact and one external connection contact may correspond one-to-one, and may be connected by one first wiring. In addition, two or more first wirings may be connected to one first external connection contact, and the other ends of the two or more first wirings may be connected to different first substrate contacts. In addition, a plurality of external connection contacts may be connected to a plurality of first wirings, and these first wirings may be connected to one substrate contact. In addition, two or more of these connection methods may be combined.

In the second form, the resistance value between at least one first substrate contact and at least one first external connection contact can be adjusted by adjusting the length of each first wiring. For example, by making the lengths of the first wirings the same, the resistance value between at least one first substrate contact and at least one first external connection contact can be made uniform. In addition, by applying a potential difference between a part of the first wiring and the other part of the first wiring with the substrate held in the substrate holder state, it is possible to confirm energization before the plating process.

The third aspect is the substrate holder of the second aspect, wherein the first holding member has a first arm portion, the at least one first external connection contact is arranged on the first arm portion, and the second holding member has a The second arm part, the at least one second external connection point is arranged on the second arm part, the at least one first external connection point and the at least one second external connection point are located on the substrate holder The left and right ends.

In the third aspect, when the substrate holder is installed in the plating tank, power can be fed to the first surface and the second surface of the substrate from the left and right ends of the arm portion, so it is easier to concentrate the external contacts on the arm portion. The shape of one side end can prevent the thickness of the substrate holder from increasing.

The fourth aspect is the substrate holder of the first aspect, wherein the first holding member has a first arm portion, and on both sides of the first arm portion are respectively provided with the substrate holder for positioning the substrate holder in the plating tank. The first and second positioning parts.

In the fourth aspect, since the positioning portions on both sides of the arm portion are provided on the first holding member, even if the meshing state of the first holding member and the second holding member deviates, the positional relationship between the positioning portions on both sides will not be affected.

The fifth aspect is the substrate holder of the first aspect, wherein the first holding member has a first body portion having the first opening, and the second holding member has a second body portion having the second opening. The opening, the aforementioned first body portion and the aforementioned second body portion have positioning structures engaging with each other.

Since the fifth aspect has a positioning structure between the first and second body parts, the positioning accuracy of the substrate with respect to the first and second holding members is improved.

A sixth aspect is the substrate holder of the first aspect, wherein the first holding member has: a first body portion having the first opening portion; and a first arm portion provided on the first body portion One end side; the aforementioned second holding member has: a second body portion, which has the aforementioned second opening portion; and a second arm portion, which is set on one end side of the aforementioned second body portion; When the member is engaged with the second holding member, the first arm portion and the second arm portion are aligned in a direction from the first and second body portions toward the first and second arm portions.

In the sixth aspect, since the first arm portion and the second arm portion are arranged in a row in the surface direction of the substrate holder, an increase in the thickness of the arm portion can be suppressed. Thereby, the overall thickness when arranging a plurality of substrate holders can be reduced.

The seventh aspect is the substrate holder of the first aspect, wherein the first holding member has: a first body portion having the first opening portion and the at least one first substrate contact point; a first arm portion , which has at least one first external connection point; and a first wiring receiving part, which is arranged between the first main body part and the first arm part, and is used to accommodate the at least one first Excess length of wiring.

In the seventh aspect, when the length of at least one first wiring is adjusted to adjust the resistance value between at least one first substrate contact and at least one first external connection contact, at least one first wiring is redundant. length, but the excess length of the first wiring can be accommodated in the first wiring accommodating part. In addition, in the case of individually connecting a plurality of first substrate contacts with a plurality of first wirings, in order to adjust the resistance value between the plurality of first substrate contacts and at least one first external connection contact, each first Depending on the length of the wiring, an excess length of the first wiring will be generated depending on the position of the contact point on the first substrate, but such excess length of the first wiring can be accommodated in the first wiring accommodating portion. For example, the length of the first wiring is adjusted so that the resistance values between the plurality of first substrate contacts and at least one first external connection contact are uniform. In addition, in order to adjust the amount of current to a specific substrate contact point, the length of the first wiring can also be changed by changing the resistance value.

The eighth aspect is the substrate holder of the seventh aspect, wherein the first wiring receiving portion is integrally formed with a first mounting portion for mounting the first wiring receiving portion on the first arm portion.

In the eighth aspect, there is no need to separately provide a first attachment portion for attaching the first wiring accommodating portion to the first arm portion. The number of combined parts can be reduced, and changes in the combined body can be suppressed.

The ninth aspect is the board holder of the eighth aspect, wherein the first wiring receiving portion has a first protruding portion protruding toward the first main body portion, and the first main body portion has two second protruding portions, which are It protrudes from both sides of the first protruding part of the first wiring receiving part.

The ninth form avoids mainly accommodating the storage space for the first wiring in the first wiring storage section, and the first main body can be mounted on the thick part of the first wiring storage section, thereby improving the rigidity of the first holding member.

The tenth aspect is the substrate holder of the seventh aspect, wherein at the connecting portion of the first wiring accommodating portion and the first main body portion, on the side of the outer surface of the substrate holder, the wall of the aforesaid first wiring accommodating portion is on the side of the aforementioned first wiring accommodating portion. The outer sides of the walls of a body overlap.

In the tenth aspect, since the wall of the first wiring accommodating part is arranged outside the wall of the first main body part on the outer surface of the substrate holder, the wall of the first wiring accommodating part becomes an umbrella structure, therefore, it is possible to suppress or prevent The plating liquid penetrates into the inside of the substrate holder by liquid paddles and the like. Suppressing or preventing the plating solution from invading the inside of the substrate holder can omit the arrangement and sealing of wiring holes in the substrate holder.

The eleventh aspect is the substrate holder of the seventh aspect, wherein the connecting portion of the first wiring accommodating portion and the first main body portion is located at a lower position than the plating solution when the substrate holder is placed in the plating tank. The way above the surface constitutes the aforementioned first holding member.

The eleventh aspect further suppresses or prevents the plating solution from invading into the substrate holder, and can omit arrangement and sealing of wiring holes in the substrate holder.

The twelfth aspect is the substrate holder of the first aspect, wherein the first holding member has a first substrate contact for supplying current to the first surface of the substrate, and the second holding member has a second substrate The contacts are used to supply current on the second surface of the substrate, the first contact fixing part for fixing the contacts of the first substrate in the first holding member, and the second contact fixing part for fixing the contacts of the second substrate. The second contact fixing portion where the substrate contacts are fixed in the second holding member does not overlap with each other when the first holding member and the second holding member are engaged.

The twelfth aspect prevents interference between the first contact fixing portion and the second contact fixing portion, and can suppress or prevent an increase in the thickness of the substrate holder.

The thirteenth aspect is the substrate holder of the twelfth aspect, wherein the first holding member has a first sealing holder provided outside the first opening, and the second holding member has a second sealing holder , which is arranged outside the second opening, the first and second substrate contacts are mounted on the first and second sealing holders by the first and second contact fixing parts respectively, for a first seal holder fixing portion for fixing the first seal holder in the first holding member, and a second seal holder fixing portion for fixing the second seal holder in the second holding member , in a state where the first holding member and the second holding member are engaged with each other so as not to overlap each other.

The thirteenth aspect prevents interference between the first seal holder fixing portion and the second seal holder fixing portion, and can suppress or prevent an increase in the thickness of the substrate holder.

The fourteenth form is the substrate holder of the first form, wherein the first holding member has a first seal provided around the first opening, and the second holding member has a second seal provided on the periphery of the first opening. Around the second opening, at least one of the first holding member and the second holding member is provided with an outer seal further outside the first seal and the second seal.

In the fourteenth aspect, the outer seal provided on at least one of the first holding member and the second holding member can protect the substrate contact from the outside of the substrate holder together with the first and second seals.

A fifteenth aspect is the substrate holder of the first aspect, wherein the first and second openings are rectangular.

The fifteenth aspect can provide a substrate holder for a substrate having a rectangular shape that tends to increase in size.

A sixteenth aspect provides a coating device comprising: a substrate holder for holding a substrate; a substrate attachment and detachment unit for attaching and detaching the substrate to the substrate holder; and a plating tank for holding the substrate. The aforementioned substrate holder of the aforementioned substrate is subjected to plating treatment; and a conveyer for conveying the aforementioned substrate holder. The substrate holder of this coating device has: a first holding member having a first opening for exposing the first surface of the substrate; and a second holding member sandwiching the first holding member together with the first holding member The aforementioned substrate is held, and has a second opening for exposing the second surface of the aforementioned substrate. The first holding member has: at least one first substrate contact, which is used to supply current to the first surface of the aforementioned substrate; at least one first external connection contact; and at least one first wiring, which The at least one first substrate contact is electrically connected to the at least one first external connection contact. The second holding member has: at least one second substrate contact for supplying current to the second surface of the aforementioned substrate; at least one second external connection contact; and at least one second wiring for It is electrically connected to the at least one second substrate contact and the at least one second external connection contact. The aforementioned at least one first external connection contact is electrically independent from the aforementioned at least one second external connection contact.

Sixteenth Form Since the first and second external connection contacts, the first substrate contacts and the second substrate contacts, the first wiring and the second wiring are respectively provided on the first and second holding members, the The paths for supplying current to the first surface and the second surface of the substrate are distributed to the first and second holding members, respectively. Thereby, in the plating apparatus, the increase in the thickness of the substrate holder can be suppressed, and a space for providing a current supply path to the first surface and the second surface of the substrate can be ensured. In addition, since current can be independently supplied to the first surface and the second surface of the substrate, it is possible to independently control plating specifications such as the plating thickness of each surface.

A seventeenth aspect provides a substrate holder for holding a substrate, and includes: a first holding member having a first opening for exposing the first surface of the substrate; and a second holding member that is Used to clamp and hold the aforementioned substrate together with the aforementioned first holding member; the aforementioned first holding member has: a first external connection portion; at least one first substrate contact, which is in contact with the aforementioned first surface of the aforementioned substrate, Used to supply current to the aforementioned first surface of the aforementioned substrate; and a first conductive path member, which is connected to the aforementioned first external connection portion and the aforementioned at least one contact point of the first substrate; the aforementioned first conductive path member may be The first substrate contact is detachably installed, the first conductive path member is arranged in the space sealed by the first holding member and the second holding member, and is detachably mounted on the body of the first holding member.

This aspect prevents the first conductive path member from coming into contact with the processing liquid when the substrate holder is placed in the processing tank. In addition, since the at least one first substrate contact is detachably attached to the first conductive path member, replacement of the at least one first substrate contact is easy. Therefore, by replacing a part of the first substrate contacts, the substrate holder can continue to be used, and the cost of maintenance and replacement of the substrate holder can be reduced. For example, when the processing liquid leaks, according to the posture of the substrate holder in the processing tank, by replacing only a part of the substrate such as the substrate contacts that are easily exposed to the processing liquid (when the substrate holder is in a vertical posture, it is the bottom side of the substrate holder) contact, which reduces costs compared to replacing the entire substrate holder or the entire first substrate contact.

In addition, the substrate holder is provided with at least one substrate contact, at least one external contact, and a conductive path member connecting them, and the conductive path member is replaceably provided. In this way, when the conductive path member is corroded or metal is deposited due to contact with the plating solution, the conductive path member can be replaced. Therefore, the substrate holder can be continued to be used by replacing the conductive path member, and the cost of maintenance and replacement of the substrate holder can be reduced.

In addition, in the case of using the first conductive path member connected to a plurality of first substrate contacts, the wiring accommodating portion can be omitted, thereby achieving miniaturization and cost reduction of the substrate holder. In addition, by integrating the wiring for a plurality of substrate contacts into a conductive path member, the cross-sectional area of the conductive path member can be ensured to be increased, and the wiring resistance per unit length of the conductive path member can be reduced. Thereby, the difference of voltage drop on the path from the external connection part to each contact point of the first substrate can be reduced. As a result, the plating current flowing through each first substrate contact can be made uniform, and the plating film thickness can be made uniform. In addition, since the wiring to the plurality of first substrate contacts is integrated into a conductive path member, the size of the wiring up to the plurality of first substrate contacts can be reduced, or cable wiring can be omitted.

The eighteenth aspect is the substrate holder of the seventeenth aspect, wherein the first holding member has a plurality of first substrate contacts, and further has a second conductive path member connected to the first external connection portion, and At least one of the plurality of first substrate contacts is separated from the first conductive path member.

In this form, the first conductive path member and the second conductive path member are formed by dividing the conductive path, and by applying a potential difference between the first conductive path member and the second conductive path member while the substrate is held in the substrate holder , It is possible to confirm the energization before the plating process. In addition, by allocating a plurality of first substrate contacts to the first and second conductive path members, it is possible to suppress the difference in path length from the external connection part to each first substrate contact. For example, by allocating the first substrate connection contacts in the symmetrical halves of the first holding member to the first and second conductive path members, the path lengths from the external connection to the respective first substrate contacts can be made different. Much the same. In addition, each conductive path member is replaceable.

A nineteenth aspect is the substrate holder of the eighteenth aspect, wherein at least one of the first conductive path member and the second conductive path member can be divided into a plurality of path pieces.

In this form, each path piece can be replaced. For example, when the processing liquid leaks from the substrate holder, there are parts that are easily affected by the processing liquid depending on the posture of the substrate holder in the processing tank. When the substrate holder is placed in the plating tank in an upright position, the treatment liquid tends to accumulate near the lowermost part of the substrate holder when leakage of the treatment liquid occurs. Therefore, when the processing liquid leaks and only the path piece near the lowermost part of the substrate holder contacts the processing liquid, instead of replacing the entire conductive path member, only the path piece contacted with the processing liquid can be replaced. Costs can be reduced compared to replacing the entire substrate holder, or the entire conductive path member. Furthermore, by forming individual path pieces and then combining them, conductive path members can be manufactured inexpensively.

A twentieth aspect is the substrate holder of the seventeenth aspect, wherein the aforementioned first conductive path member is in the shape of a plate or a rod.

By forming the first conductive path member into a plate shape, an increase in the thickness of the substrate holder can be suppressed. By forming the first conductive path member into a rod shape, the shape processing along the curved conductive path is easy.

The second aspect is the substrate holder of any one of the seventeenth to twentieth aspects, wherein the second holding member has a second opening for exposing the second surface of the substrate, and has: at least 1 second substrate contact, which is in contact with the aforementioned second surface of the aforementioned substrate, for supplying current to the aforementioned second surface of the aforementioned substrate; a second external connection; and a third conductive path member, which is connected to The aforementioned second external connection portion is connected to the aforementioned at least one second substrate contact; the aforementioned second substrate contact is detachably installed in the aforementioned third conductive path member.

This aspect can achieve the effect described in the above-mentioned aspect in each holding member of the substrate holder for double-side plating treatment.

The second aspect provides a plating device, which is equipped with: a substrate holder for holding a substrate; a substrate loading and unloading part for loading and unloading the substrate from the substrate holder; and a plating tank for Plating treatment is performed on the aforementioned substrate holder holding the aforementioned substrate. The substrate holder includes: a first holding member having a first opening for exposing the first surface of the substrate; and a second holding member for clamping the substrate together with the first holding member. And keep. The aforementioned first holding member has: a first external connection portion; at least one first substrate contact, which is in contact with the aforementioned first surface of the aforementioned substrate, and is used to supply current to the aforementioned first surface of the aforementioned substrate; and a first A conductive path member, which is connected to the first external connection part and the at least one first substrate contact; the first conductive path member is detachably mounted on the first substrate contact, and the first conductive path member It is arranged in the space sealed by the first holding member and the second holding member, and is detachably mounted on the body of the first holding member. This form can achieve the same effect as the seventeenth form.

The embodiments of the present invention have been described above based on some examples, but the embodiments of the invention described above are for the sake of easy understanding of the present invention and are not intended to limit the present invention. The present invention can be changed and improved without departing from the gist thereof, and the present invention of course includes equivalents thereof. For example, the shape of the large substrate is not limited to a rectangle, it can also be a square, and can also be other polygonal shapes, such as pentagon or hexagon. In addition, of course, the present invention can also be applied to a substrate loading and unloading device that loads and unloads a circular substrate to a substrate holder. In addition, within the scope of solving at least a part of the above-mentioned problems, or achieving at least a part of the effects, the elements described in the scope of the claims and the specification can be combined or omitted arbitrarily.

This application claims priority based on Japanese Application Patent No. 2017-126582 filed on June 28, 2017 and Japanese Application No. 2018-079388 filed on April 17, 2018. Including the specification, scope of patent application, and abstract of the Japanese application No. 2017-126582 filed on June 28, 2017, and Japanese application No. 2018-079388 filed on April 17, 2018 The disclosed content is fully incorporated into this application by reference.

All of the specifications, claims, and abstracts of International Publication No. 2014-076781 (Patent Document 1), Japanese Patent Application Laid-Open No. 2008-184692 (Patent Document 2), and US Patent No. 8236151 (Patent Document 3) are included The disclosed content is fully incorporated into this application by reference.

11‧‧‧substrate holder

110A‧‧‧first holding member

111A‧‧‧First Body Department

111B‧‧‧Second body part

1110A‧‧‧First Body

1110B‧‧‧Second Body

112A‧‧‧First opening

112B‧‧‧Second opening

150A‧‧‧The first wiring storage part

150B‧‧‧The second wiring storage part

160A‧‧‧first arm

160B‧‧‧Second arm

161A‧‧‧The first external connection

161B‧‧‧The second external connection

162A, 162B‧‧‧External connection cover

163L, 163R‧‧‧positioning unit

164A‧‧‧Engagement

164B‧‧‧Stenosis

165B‧‧‧end

Claims (21)

A substrate holder, which is used to hold a substrate, and has: a first holding member, which has a first opening for exposing the first surface of the substrate; and a second holding member, which is used for The first holding member holds the aforementioned substrate together, and has a second opening for exposing the second surface of the aforementioned substrate; the aforementioned first holding member has: at least one first substrate contact, which is used for The aforementioned first surface of the aforementioned substrate supplies current; at least one first external connection contact; and at least one first wiring, which is electrically connected to the aforementioned at least one first substrate contact and the aforementioned at least one first outer Connection contacts; the aforementioned second holding member has: at least one second substrate contact for supplying current to the aforementioned second surface of the aforementioned substrate; at least one second external connection contact; and at least one first contact Two wirings, which are electrically connected to the at least one second substrate contact and the at least one second external connection contact; wherein, the at least one first external connection contact is connected to the at least one second external connection The contacts are electrically independent. Such as the substrate holder of claim 1 of the patent scope, wherein the aforementioned first holding member has: A plurality of the aforementioned first substrate contacts; a plurality of the aforementioned first external connection contacts; and a plurality of the aforementioned first wirings, which are electrically connected to the aforementioned plurality of the aforementioned first substrate contacts and the aforementioned plurality of the aforementioned first external connections contact. The substrate holder according to item 1 of the scope of the patent application, wherein the first holding member has a first arm portion, the at least one first external connection point is arranged on the first arm portion, and the second holding member has a The second arm part, the at least one second external connection point is arranged on the second arm part, the at least one first external connection point and the at least one second external connection point are located on the substrate holder The left and right ends. The substrate holder according to item 1 of the scope of the patent application, wherein the first holding member has a first arm portion, and on both sides of the first arm portion are respectively provided for positioning the substrate holder in the coating tank The first and second positioning parts. Such as the substrate holder of claim 1, wherein the first holding member has a first body portion, the first body portion has the first opening portion, the second holding member has a second body portion, and the second body portion has a second body portion. The main body part has the aforementioned second opening part, and the aforementioned first main body part and the aforementioned second main body part have positioning structures engaged with each other. Such as the substrate holder of claim 1 of the patent scope, wherein the aforementioned first holding member has: The first body part has the first opening part; and the first arm part is arranged on one end side of the first body part; the second holding member has: the second body part has the aforementioned The second opening; and the second arm part, which is arranged on one end side of the second body part; wherein, when the first holding member is engaged with the second holding member, the first arm part and the second holding member are engaged. The second arm parts are arranged in a direction from the first and second body parts toward the first and second arm parts. Such as the substrate holder of claim 1 of the patent scope, wherein the first holding member has: a first body portion having the first opening portion and at least one first substrate contact; a first arm portion , which has at least one first external connection point; and a first wiring receiving part, which is arranged between the first main body part and the first arm part, and is used to accommodate the at least one first Excess length of wiring. The substrate holder according to claim 7 of the patent application, wherein the first wiring receiving portion is integrally formed with the first mounting portion for mounting the first body portion on the first arm portion. The substrate holder according to claim 8 of the patent scope, wherein the first wiring receiving part has a first protruding part protruding toward the first main body part, The first body part has two second protruding parts protruding from both sides of the first protruding part of the first wiring receiving part. Such as the substrate holder of claim 7 of the scope of the patent application, wherein the connecting portion of the first wiring receiving part and the first body part is on the side of the outer surface of the substrate holder, and the wall of the first wiring receiving part is on the side of the aforementioned first wiring receiving part. The outer sides of the walls of a body overlap. Such as the substrate holder of item 7 of the scope of the patent application, wherein the connecting part of the first wiring receiving part and the first body part is positioned at a lower level than the plating liquid level when the substrate holder is placed in the plating tank The way above constitutes the aforementioned first holding member. Such as the substrate holder of claim 1, wherein the first holding member has a first substrate contact for supplying current to the first surface of the substrate, and the second holding member has a second substrate contact point, which is used to supply current on the second surface of the aforementioned substrate, the first contact fixing part used to fix the contact of the first substrate in the first holding member, and the first contact fixing part used to fix the contact of the second substrate The second contact fixing portion where the contact is fixed in the second holding member does not overlap with each other when the first holding member and the second holding member are engaged. The substrate holder according to claim 12 of the patent application, wherein the first holding member has a first sealing holder, which is arranged outside the first opening, The second holding member has a second sealing holder, which is arranged on the outside of the second opening, and the first and second substrate contacts are respectively mounted on the aforementioned first and second contact fixing parts. The first and second seal holders, the first holder fixing portion for fixing the first seal holder in the first holding member, and the second seal holder for fixing the second seal holder in the second holding member The internally fixed second holder fixing portion does not overlap with each other in a state where the first holding member and the second holding member are engaged. Such as the substrate holder of claim 1, wherein the first holding member has a first seal, which is arranged around the first opening, and the second holding member has a second seal, which is arranged around the first opening. Around the second opening, at least one of the first holding member and the second holding member is provided with an outer seal further outside the first seal and the second seal. The substrate holder as claimed in claim 1 of the patent application, wherein the aforementioned first and second openings are rectangular. A coating device comprising: a substrate holder for holding a substrate; a substrate loading and unloading unit for loading and unloading the substrate from the substrate holder; a plating tank for holding the substrate for the substrate The holder is subjected to plating treatment; and the conveyor is used to transport the aforementioned substrate holder; the aforementioned substrate holder has: The first holding member has a first opening for exposing the first surface of the substrate; and the second holding member holds the substrate together with the first holding member and has a first opening for exposing the first surface of the substrate. The second opening on the second surface of the substrate; the first holding member has: at least one first substrate contact, which is used to supply current to the first surface of the substrate; at least one first external connection Contacts; and at least one first wiring, which is electrically connected to the at least one first substrate contact and the at least one first external connection contact; the second holding member has: at least one second substrate Contacts, which are used to supply current to the aforementioned second surface of the aforementioned substrate; at least one second external connection contact; and at least one second wiring, which is electrically connected to the aforementioned at least one second substrate contact and the at least one second external connection point; wherein, the at least one first external connection point is electrically independent from the at least one second external connection point. A substrate holder for holding a substrate, comprising: a first holding member having a first opening for exposing a first surface of the substrate; and The second holding member is used to clamp and hold the substrate together with the first holding member; the first holding member has: a first external connection portion; at least one first substrate contact, which is connected to the substrate The aforementioned first surface contact is used to supply current to the aforementioned first surface of the aforementioned substrate; and a first conductive path member is connected to the aforementioned first external connection part and the aforementioned at least one first substrate contact point; the aforementioned The first substrate contact is detachably installed in the first conductive path member, the first conductive path member is arranged in a space sealed by the first holding member and the second holding member, and is detachably mounted on the first holding member. The body of the first holding member, the second holding member has a second opening, which is used to expose the second surface of the aforementioned substrate, and has: at least one second substrate contact, which is in contact with the aforementioned substrate of the aforementioned substrate The second surface, used to supply current to the second surface of the substrate; the second external connection part; and the second conductive path member, which is connected between the second external connection part and the at least one second substrate contact ; Wherein, the aforementioned second substrate contacts are detachably installed in the aforementioned second conductive path member. If the substrate holder of item 17 of the patent scope is applied for, Wherein the first holding member has a plurality of first substrate contacts, and further has a third conductive path member, which is connected to the first external connection part and at least one of the plurality of first substrate contacts, and Separated from the aforementioned first conductive path member. As the substrate holder of claim 18, wherein at least one of the first conductive path member and the third conductive path member can be divided into a plurality of path pieces. As the substrate holder of claim 17, wherein the aforementioned first conductive path member is in the shape of a plate or a rod. A coating device comprising: a substrate holder for holding a substrate; a substrate loading and unloading unit for loading and unloading the substrate from the substrate holder; and a plating tank for holding the substrate The aforementioned substrate holder is subjected to plating treatment; the aforementioned substrate holder is provided with: a first holding member having a first opening for exposing the first surface of the aforementioned substrate; and a second holding member for use with The aforementioned first holding member holds the aforementioned substrate together; the aforementioned first holding member has: a first external connection portion; at least one first substrate contact, which is in contact with the aforementioned first surface of the aforementioned substrate, for The aforementioned first surface of the aforementioned substrate is supplied with current; and The first conductive path member is connected to the first external connection part and the at least one first substrate contact; the first conductive path member is detachably installed on the first substrate contact, and the first conductive The path member is disposed in the space sealed by the first holding member and the second holding member, and is detachably installed on the body of the first holding member. The second holding member has a second opening for The second surface of the aforementioned substrate is exposed, and has: at least one second substrate contact, which is in contact with the aforementioned second surface of the aforementioned substrate, and is used to supply current to the aforementioned second surface of the aforementioned substrate; the second external connection part; and a second conductive path member, which is connected to the second external connection portion and the at least one second substrate contact; wherein, the second substrate contact is detachably installed in the second conductive path member.

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