TW201906065A - Substrate holder and plating device - Google Patents

Abstract

This substrate holder is for holding a substrate and comprises: a first holding member having a first opening part for exposing a first surface of the substrate; and a second holding member for holding the substrate by sandwiching the same with the first holding member, the second holding member having a second opening part for exposing a second surface of the substrate. The first holding member has at least one first external connection contact point, and the second holding member has at least one second external connection contact point that is separate from the first external connection contact point.

Description

 Substrate holder and plating device  

The present invention relates to a substrate holder and a plating apparatus.

In the past, wiring, bumps (protruding electrodes), and the like have been formed on the surface of a substrate such as a semiconductor wafer or a printed substrate. A method of forming the wiring, bumps, and the like is known as an electrolytic plating method. A plating apparatus for electrolytic plating has a substrate holder that seals an end surface of a circular or polygonal substrate and exposes the surface (coated surface). In such a plating apparatus, when the plating treatment is performed on the surface of the substrate, the substrate holder holding the substrate is immersed in the plating solution.

Patent Document 1 describes a substrate holder for plating both surfaces of a substrate. The substrate holder includes a base portion 1, a cover portion 2, and a center portion 3 which are formed of another member. The base portion 1 is mounted with the substrate in a state in which the center portion 3 is overlapped, and the cover portion 2 is further overlapped, and the base portion 1 is centered. The portion 3 and the cover portion 2 are fixed by sandwiching the clamp portion 4 from both sides. When an electric current is supplied to the substrate, an electric current is supplied from the energizing path of the arm portion 14 provided in the base portion 1 to the energizing ring 6 of the base portion 1 via one of the current-carrying rods 34 in the center portion 3, and the current is supplied through the other side. 34 supplies current to the energizing ring 6 of the cover portion 2, and supplies current from each of the energizing rings 6 to each surface of the substrate (third and sixth figures).

Patent Document 2 describes a substrate holder 70 for plating both surfaces of a substrate, and the substrate holder 70 is held between the first holding member 11 and the second holding member 12 including the hanger 14 with the substrate interposed therebetween. When a current is supplied to the substrate, current is supplied to each surface of the substrate via the conductive plate 22 and the conductive film plug 23 in the first holding member 11. The conductive film plug 23 connected to one of the sides of the substrate is connected to the terminal plate 27 provided on one side of the hanger 14, and is connected to the conductive film plug 23 on the other side of the substrate and the terminal provided on the other side of the hanger 14. The board 28 is connected (the ninth and tenth figures).

Further, the first holding member 71 and the second holding member 72 hold the upper edge portion of the square substrate, and the current is supplied from the terminal plates 78 and 79 on both sides of the first holding member 71 to the respective surfaces of the substrate. In this configuration, current is supplied from one terminal plate 79 of the first holding member 71 to one surface of the substrate via the electrode contact 75, and the other terminal plate 78 of the first holding member 71 is passed through the contact point 81 for energization. The second holding member 72 is energized by the spring contact 82 and the electrode contact 76 to supply current to the substrate (the twentieth and twenty-first figures).

Patent Document 3 describes that two wafers are placed in a superposed manner, and the wafer carrier 100 for the two outer surfaces is exposed by a plating process. The wafer carrier 100 includes a non-conductive flange 120 sandwiching the wafer, and a hanger-shaped conductive flange 110 provided on the upper portion of the flange 120. In this configuration, the conductive body 426 and the contact 427 are disposed in the flange pieces 121 and 122 of the non-conductive flange 120 from the conductive flange 110, and current is supplied to each surface of the wafer via a plurality of spring pins 428.

[Previous Technical Literature]

[Patent Literature]

[Patent Document 1] International Publication No. 2014-076781

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2008-184692

[Patent Document 3] US Patent No. 8216151

In the electrolytic plating, it is necessary to provide a contact (substrate contact) suitable for the substrate size to the substrate holder, and supply current to the substrate contacts. In addition, it is sometimes preferable to connect each substrate contact to one or a plurality of external connection contacts by an individual current path. When the substrate size is large, the number of contacts and current paths tends to increase. However, as the number of contacts and current paths increases, the thickness of the substrate holder may increase. Such a problem is particularly problematic in the substrate jig on both sides of the plated substrate, but it also occurs when the substrate is plated on one side.

It is an object of the present invention to address at least some of the above problems.

A substrate holder for holding a substrate. The substrate holder includes: a first holding member having a first opening for exposing a first surface of the substrate; and a second holding member for sandwiching the substrate with the first holding member And maintaining, and having a second opening for exposing the second surface of the substrate; the first holding member has at least one first external connection contact, and the second holding member has the first external connection contact Independent of at least one second external connection contact.

A plating apparatus according to the present invention includes: a substrate holder for holding a substrate; a substrate attaching and detaching portion for attaching and detaching the substrate to the substrate holder; and a plating groove for holding the substrate The substrate holder is subjected to a plating treatment. The substrate holder of the plating apparatus includes: a first holding member having a first opening for exposing a first surface of the substrate; and a second holding member for use with the first holding member Holding the substrate together, and having a second opening for exposing the second surface of the substrate; the first holding member has at least one first external connection contact, and the second holding member has the foregoing An external connection contact is independent of at least one second external connection contact.

10, 10a, 10b, 10c‧‧‧ plating tank

11‧‧‧Substrate Holder

101‧‧‧Rack

101a~101h‧‧‧Attendance components

103‧‧‧Control Department

105‧‧‧Loading platform

107‧‧‧Unloading the stage

110A‧‧‧First holding member

110B‧‧‧Second holding member

111A‧‧‧First Body Department

111B‧‧‧Second body

1110A‧‧‧First Ontology

1110B‧‧‧Second Ontology

112A‧‧‧First opening

112B‧‧‧Second opening

113A, 113B, 114A, 114B, 115A, 115B‧‧‧ Installation Department

117A‧‧‧First substrate contact

117B‧‧‧Second substrate contacts

118A, 118B, 119A, 119B‧‧‧ Seal Holder

120A, 120B‧‧‧ inside seal

121A‧‧‧Outside seal

122‧‧‧Substrate transport device

122A, 122B, 123A, 123B, 124A‧‧‧ screws

125‧‧‧Flexible wire

126‧‧‧Pre-wet groove

126A‧‧‧ditch

127A‧‧‧Wiring path

128‧‧‧Prepreg tank

130a‧‧‧First rinse tank

130b‧‧‧Second rinse tank

130c‧‧‧ third flushing tank

132‧‧‧Blowing groove

140‧‧‧Transporter

141‧‧‧Transporter

142‧‧‧ fixed seat

150‧‧‧Wiring accommodating department

150A‧‧‧First wiring accommodating department

150B‧‧‧Second wiring accommodating department

151A‧‧‧First Cover

152A‧‧‧ accommodating space

154A, 154B, 155A, 158A, 159A, 159B‧‧‧ Installation Department

157A, 157B‧‧‧ highlights

160‧‧‧ Arms

160A‧‧‧First arm

160B‧‧‧Second arm

161A‧‧‧First External Connection

161B‧‧‧Second external connection

162A, 162B‧‧‧ External connector cover

163L, 163R‧‧‧ Positioning Department

164A‧‧‧Meshing Department

164B‧‧‧Sarrow

165A‧‧‧Meshing Department

165B‧‧‧End

166A, 166B‧‧‧Installation Department

167‧‧‧ bus bar

168‧‧‧External connection contacts

169‧‧‧Confirm energization device

170A‧‧‧Loading/Unloading Department

170B‧‧‧Substrate placement

170C‧‧‧Processing Department

170D‧‧‧Retainer Storage

170E‧‧ Cleaning Department

173C‧‧‧Processing Department

180, 180A, 180B, 181, 181A, 181B, 191A, 191B‧‧‧ Installation Department

192A, 192B‧‧‧ wiring holes

193‧‧‧ bolt

194‧‧‧through holes

194a‧‧‧鍃孔

195‧‧‧ screw holes

200‧‧‧ inside space

210A‧‧‧Protruding

210B‧‧‧through hole

30A‧‧‧First Anode Holder

30B‧‧‧Second anode holder

31A, 31B‧‧‧ first and second anodes

32A, 32B‧‧‧ first and second anode masks

35A, 35B‧‧‧ first and second blades

36A, 36B‧‧‧ first and second intermediate masks

37‧‧‧External power supply

230‧‧‧ terminals

240‧‧‧ Current Supply Department

250‧‧‧ Arm hoisting department

410, 420‧‧‧ conductive path

410L‧‧‧Left conductive path member

410R‧‧‧right conductive path member

420L‧‧‧Left conductive path member

420R‧‧‧right conductive path member

411L~415L, 411R~415R, 421L~425L, 421R~425R‧‧‧ path film

430‧‧‧conductive plate

440L, 440R‧‧‧ external connection contacts

1000‧‧‧Substrate loading and unloading device

1600‧‧‧Installation recess

1650A‧‧‧

L‧‧‧ wiring

S‧‧‧ plating liquid level

W‧‧‧Substrate

300‧‧‧Circulatory body

302‧‧‧Circular pipeline

304‧‧‧ Valve

306‧‧‧ pump

308‧‧‧ Temperature control device

310‧‧‧Filter

The first figure shows a schematic view of one embodiment of a plating apparatus.

The second A is a perspective view from the first side of the substrate holder.

The second B diagram is a perspective view from the second side of the substrate holder.

The third A is a perspective view of the first holding member and the second holding member in which the substrate holder is in an open state as viewed from the first side.

The third B is a perspective view of the first holding member and the second holding member in which the substrate holder is in an open state as viewed from the second side.

The fourth A diagram is an exploded perspective view from the first side of the first holding member.

The fourth B diagram is an exploded perspective view from the second side of the first holding member.

The fourth C diagram is a perspective view of the wiring accommodating portion.

The fifth A diagram is an exploded perspective view from the first side of the second holding member.

The fifth B diagram is an exploded perspective view from the second side of the second holding member.

The sixth A diagram is an enlarged perspective view of the vicinity of the arm portion in a state in which the first arm portion and the second arm portion are engaged from the first side.

Fig. 6B is an enlarged perspective view showing the vicinity of the arm portion in a state in which the first arm portion and the second arm portion are engaged from the second side.

The sixth C is an enlarged perspective view of the vicinity of the arm portion in a state in which the first arm portion and the second arm portion are opened from the first side.

The sixth D diagram is an enlarged perspective view of the vicinity of the arm portion in a state in which the first arm portion and the second arm portion are opened from the second side.

The seventh A diagram is a partial perspective perspective view of the first holding member for displaying the path of the wiring from the first external connection portion to the first body portion.

FIG. 7B is a perspective view of the first body portion in the connection portion between the first body portion and the wiring accommodating portion.

The seventh C is a perspective view of the wiring accommodating portion in the connection portion between the wiring accommodating portion and the first main body portion as viewed from the inside.

The seventh D diagram is a perspective view of the wiring accommodating portion in the connection portion between the wiring accommodating portion and the first main body portion as viewed from the outside.

The eighth drawing is an enlarged plan view of the connection portion between the wiring accommodating portion and the main body portion.

Figure 8A is a cross-sectional view of the A-A of the eighth figure.

Fig. 8B is a cross-sectional view taken along line B-B of the eighth diagram in which the wiring hole is not formed.

The eighth C diagram is a cross-sectional view taken along line C-C of the eighth diagram in which the wiring holes are formed.

The ninth A diagram is a front view as seen from the inner side surface side of the first holding member.

The ninth B diagram is a partially enlarged front view seen from the inner side surface side of the first holding member.

The ninth C diagram shows a C-C cross-sectional view of the second holding member in the ninth B diagram together with the first holding member.

Figure 11 is a cross-sectional view showing the first and second body portions of the screw arrangement of the fixed substrate contacts.

The eleventh figure shows a cross-sectional view of the first and second body portions of the arrangement of the screws for fixing the seal holder for the inner seal.

The twelfth A is an enlarged perspective view of the external connection portion in which the wiring cover is removed.

The twelfth B-picture is an explanatory diagram of a current path in the first holding member.

The twelfth Cth is an explanatory diagram of a current path in the second holding member.

The twelfth D is a diagram showing the connection pattern of the contacts of the external connection portion when the energization is confirmed.

The twelfth E is a connection mode diagram showing the contacts of the external connection portion during the plating process.

Fig. 13A is a schematic view showing the arrangement of the substrate in the substrate placing portion on the substrate holder.

Fig. 13B shows an example of a method of fixing the substrate holder.

Fig. 14A is an enlarged perspective view showing the vicinity of the positioning portion of the first holding member.

The fourteenth Bth diagram is an enlarged perspective view of the positioning portion of the second holding member.

The fifteenth diagram schematically shows a side view of the configuration of the plating tank.

Fig. 16A is an enlarged perspective view showing the vicinity of the positioning portion on the side opposite to the external connection portion of the first arm portion of the first holding member.

Fig. 16B is an enlarged perspective view showing the vicinity of the positioning portion on the outer connecting portion side of the first arm portion of the first holding member.

Figure 17 is a perspective view of the substrate holder of the other embodiment as viewed from the first side.

The eighteenth view is a perspective view of the first holding member and the second holding member in which the substrate holder is in an open state as viewed from the first side.

The nineteenth embodiment is an exploded perspective view of the first holding member and the second holding member of the substrate holder.

Fig. 20 is a perspective view of a conductive path portion of another embodiment.

The twenty-first figure is an arrow view of the first holding member and the second holding member as viewed from the substrate holding surface side.

The twenty-second A-picture is an enlarged view of the vicinity of the substrate contact of the substrate holder.

The twenty-second B-picture is an enlarged view showing the vicinity of the substrate contact of the substrate holder in a state where a part of the substrate contact is removed.

The twenty-third figure shows a C-C cross-sectional view of the second holding member in the twenty-second B-picture together with the first holding member.

The twenty-fourth embodiment is an enlarged perspective view of the external connection portion in a state where the outer connecting portion cover is removed.

The twenty-fifth figure is a cross-sectional view of the external connection portion.

Hereinafter, embodiments of the plating apparatus of the present invention and the substrate holder used in the plating apparatus will be described with reference to the drawings. In the drawings, the same or similar components are designated by the same or similar reference numerals, and the repeated description of the same or similar elements is omitted in the description of the various embodiments. Further, the features shown in the various embodiments can be applied to other embodiments as long as they do not contradict each other. In addition, in the present specification, the "substrate" includes a magnetic recording medium, a magnetic recording sensor, a mirror, an optical element, a micro mechanical element, or a partial production in addition to a semiconductor substrate, a glass substrate, and a printed circuit board. The integrated circuit. The substrate includes any shape (square, round, etc.). In addition, the expressions "front", "back", "front", "rear", "up", "down", "left", "right", etc. are used in this specification, and these are displayed for convenience of explanation. The position and orientation on the illustrated paper surface may differ in the actual configuration when the device is used.

The first figure shows a schematic view of one embodiment of a plating apparatus. As shown in the first figure, the plating apparatus includes a gantry 101, a control unit 103 that controls the operation of the plating apparatus, a loading/unloading unit 170A that loads and unloads the substrate W (see FIG. 2), and a substrate holder 11 ( Referring to the second drawing), the substrate W is placed thereon, and the substrate placement portion (machine room, substrate attaching and detaching portion) 170B of the substrate W is removed from the substrate holder 11; the processing portion (pretreatment chamber, plating chamber) for plating the substrate W 170C; a holder storage portion (storage chamber) 170D for accommodating the substrate holder 11; and a cleaning portion 170E for cleaning and drying the plated substrate W. The plating apparatus of the present embodiment is an electrolytic plating apparatus that applies a current to the plating liquid to plate the first surface and the second surface of the substrate W with a metal. The first surface and the second surface are opposed to each other, and the present embodiment is a front surface and a back surface. Further, the substrate W to be processed in the present embodiment is a semiconductor package substrate or the like. Further, a conductive layer made of a seed layer or the like is formed on the front surface side and the back surface side of the substrate W, and a resist layer is further formed on the pattern surface forming region on the conductive layer, and a trench is formed in advance in the resist layer ( Trench) and connecting holes (Via). In the present embodiment, a substrate (that is, a via substrate) having a through hole connecting the surface of the substrate and the back surface may be included as a processing target.

As shown in the first figure, the gantry 101 is composed of a plurality of gantry members 101a to 101h, and the gantry members 101a to 101h can be coupled to each other. The components of the loading/unloading unit 170A are disposed on the first gantry member 101a, the components of the substrate placing portion 170B are disposed on the second gantry member 101b, and the components of the processing portion 170C are disposed on the third gantry member 101c to the sixth gantry member 101f. The components of the holder storage unit 170D are disposed on the seventh gantry member 101g and the eighth gantry member 101h.

The loading/unloading unit 170A is provided with a loading stage 105 on which a cassette (not shown) for storing the substrate W before plating is mounted, and a cassette (not shown) on which the substrate W plated by the processing unit 170C is mounted. The loading stage 107 is unloaded. Further, the substrate transfer device 122 including the transfer robot that transports the substrate W is disposed in the loading/unloading unit 170A.

The substrate transfer device 122 enters the cassette mounted on the loading stage 105, takes out the substrate W before plating from the cassette, and sends the substrate W to the substrate placement portion 170B. The substrate placing portion 170B places the substrate W before plating on the substrate holder 11 and takes out the plated substrate W from the substrate holder 11.

The treatment unit 170C is provided with a pre-wet tank 126, a pre-dip tank 128, a first rinse tank 130a, a blowing tank 132, a second rinse tank 130b, a first plating tank 10a, a second plating tank 10b, and a third. The tank 130c and the third plating tank 10c are rinsed. These slots 126, 128, 130a, 132, 130b, 10a, 10b, 130c, 10c are arranged in this order. In the following description, the first plating tank 10a, the second plating tank 10b, and the third plating tank 10c are combined, or any plating tank in any of the plating tanks is referred to as a plating tank 10 .

The pre-wet groove 126 is prepared by pretreatment to immerse the substrate W in pure water. The prepreg 128 removes an oxide film formed on the surface of a conductive layer such as a seed layer on the surface of the substrate W by a chemical etching. The first rinse tank 130a cleans the pre-impregnated substrate W with a cleaning liquid (for example, pure water).

At least one plating tank 10 of the first plating tank 10a, the second plating tank 10b, and the third plating tank 10c is plated on both surfaces of the substrate W. Further, in the embodiment shown in the first embodiment, the number of plating tanks 10 is three. However, in other embodiments, any number of plating tanks 10 may be provided.

The second rinse tank 130b washes the substrate W plated with the first plating tank 10a or the second plating tank 10b together with the substrate holder 11 with a cleaning liquid (for example, pure water). The third rinse tank 130c cleans the substrate W that has been plated by the third plating tank 10c together with the substrate holder 11 with a cleaning liquid (for example, pure water). The blowing groove 132 is a liquid removal of the substrate W after cleaning before and after the plating treatment.

The pre-wet tank 126, the pre-dip tank 128, the rinsing tanks 130a-130c, and the plating tanks 10a-10c are the processing tank which can store the process liquid (liquid) internally. These processing tanks have a plurality of processing chambers for storing the processing liquid. However, the processing tanks are not limited to the embodiment, and the processing tanks may be provided with a single processing chamber. Further, at least a portion of the processing tanks may have a single processing chamber, and the other processing tanks may have a plurality of processing chambers.

The plating apparatus further includes a conveyor 140 that transports the substrate holder 11 . The conveyor 140 is configured to move between components of the plating apparatus. The conveyor 140 includes a fixing base 142 that extends in the horizontal direction from the substrate placing portion 170B to the processing portion 170C, and a plurality of conveyors 141 that are movable along the fixing base 142.

These conveyors 141 each have a movable portion (not shown) for holding the substrate holder 11, and are configured to hold the substrate holder 11. The conveyor 141 is configured to transport the substrate holder 11 between the substrate placing portion 170B, the holder storage portion 170D, and the processing portion 170C, and further move the substrate holder 11 up and down together with the substrate W. For example, one of the conveyors 141 can be immersed in the plating solution in the plating tank 10 together with the substrate holder 11 by lowering the substrate holder 11 holding the substrate W from the plating tank 10. The moving mechanism of the conveyor 141 can employ, for example, a combination of a motor and a rack and pinion pair. Further, in the embodiment shown in the first embodiment, three conveyors are provided, but in other embodiments, any number of conveyors may be employed.

(substrate holder)

The second A is a perspective view from the first side of the substrate holder. The second B diagram is a perspective view from the second side of the substrate holder. The third A is a perspective view of the first holding member and the second holding member in which the substrate holder is in an open state as viewed from the first side. The third B is a perspective view of the first holding member and the second holding member in which the substrate holder is in an open state as viewed from the second side. The fourth A diagram is an exploded perspective view from the first side of the first holding member. The fourth B diagram is an exploded perspective view from the second side of the first holding member. The fourth C diagram is a perspective view of the wiring accommodating portion. The fifth A diagram is an exploded perspective view from the first side of the second holding member. The fifth B diagram is an exploded perspective view from the second side of the second holding member.

The substrate holder 11 includes a first holding member 110A having a first opening portion 112A and a second holding member 110B having a second opening portion 112B. In the substrate holder 11 , the substrate W is held by sandwiching the substrate W between the first holding member 110A and the second holding member 110B. The first holding member 110A and the second holding member 110B are exposed by the respective coated surfaces of the first surface (surface) and the second surface (back surface) of the substrate W by the first opening portion 112A and the second opening portion 112B, respectively. Way to keep. In other words, the first opening portion 112A holds the substrate W by sandwiching only the outer peripheral portion of the substrate W from both sides. The substrate holder 11 has an arm portion 160, and the arm portion 160 is conveyed while being held by the conveyor 141. In the following description, the side of the substrate holder 11 on which the first surface (surface) of the substrate W is exposed may be referred to as a first side, and the side on which the second surface (back surface) of the substrate is exposed may be referred to as a second side. The second A diagram shows that the first surface (surface) of the substrate W is exposed from the first opening portion 112A of the first holding member 110A. The second B diagram shows that the second surface (back surface) of the substrate W is exposed from the second opening portion 112B of the second holding member 110B.

The substrate holder 11 of the present embodiment is for holding a square substrate W, but is not limited thereto, and may be a substrate that holds a circular shape. At this time, the first opening portion 112A and the second opening portion 112B also have a circular shape. Alternatively, the substrate W may be a polygonal substrate such as a hexagon. At this time, the first opening portion 112A and the second opening portion 112B are also polygonal in the same manner.

The first holding member 110A includes a first body portion 111A, a first wire accommodating portion 150A, and a first arm portion 160A (third A picture, fourth A picture). The second holding member 110B includes a second main body portion 111B, a second wiring accommodating portion 150B, and a second arm portion 160B (third A diagram, fifth A diagram).

The first body portion 111A and the second body portion 111B together provide a body portion 111 (second A, third A) that holds the substrate W. The first main body portion 111A includes a first main body 1110A in which the first opening portion 112A is formed, and a constituent member such as a seal or a substrate contact to be described later. The first body 1110A has a plate-like member that becomes the outer side and the inner side and the inner side when the first holding member 110A and the second holding member 110B are engaged. A constituent member such as a seal or a substrate contact is disposed on the inner side surface of the first body 1110A. The first main body portion 111A has a mounting portion 113A (fourth A diagram) attached to the mounting portion 155A of the first wiring accommodating portion 150A on both sides of the protruding portion 157A of the first wiring accommodating portion 150A. Each of the mounting portions 113A protrudes on both sides of the protruding portion 157A of the first wiring accommodating portion 150A. Further, the first main body portion 111A has a mounting portion 114A (a fourth A diagram) as a protruding portion of the mounting portion 158A attached to the substantially central portion of the first wiring accommodating portion 150A side. Mounting portions 113A and 114A and mounting portions 155A and 158A are provided with mounting structures such as bolt holes. The attachment portions 113A and 114A are fixed to the attachment portions 155A and 158A by fastening members such as bolts. The mounting portions 113A and 114A of the present embodiment are integrally formed with the first body 1110A.

The first wire accommodating portion 150A provides a path through which a plurality of wires L (current path) are passed, and provides a wire accommodating portion 150 (second A diagram, third A diagram) that accommodates an excess length portion of each of the wires L. The first wiring accommodating portion 150A has a housing space 152A (fourth C diagram). The accommodating space 152A provides a path through which a plurality of wires L (current paths) extending from the external connection portion 161A of the first arm portion 160A to the substrate contacts pass, and accommodates excess length portions of the respective wires L. The first wire accommodating portion 150A has a first cover portion 151A that closes the accommodating space 152A. In the present embodiment, each of the external connection contacts 168 and each of the substrate contacts 117 are connected by an individual wiring L, and the lengths of the respective wirings L are formed to have substantially the same length, so that the external connection contacts 168 are connected to the respective substrates. The resistance value between 117 (Fig. 12B) is uniform. This is to make the current flowing into the substrate contacts 117 uniform. At this time, the distance between each external connection contact 168 and each substrate contact 117 differs depending on the position of the substrate contact 117, and the wiring length is set in accordance with the path having the largest distance. Therefore, the excess length portion of the wiring is generated depending on the position of the substrate contact 117, and is accommodated in the first wiring accommodating portion 150A.

The first wire accommodating portion 150A has two mounting portions 154A (fourth A diagram) attached to the mounting portion 166A of the first arm portion 160A. The mounting portion 154A is provided with a mounting structure for attaching to a bolt hole or the like of the first arm portion 160A. Further, the first wiring accommodating portion 150A further includes two mounting portions 155A of the mounting portion 113A attached to the two main body portions 111A, and a mounting portion 158A attached to the mounting portion 114A of the first body portion 111A. The mounting portions 155A and 158A are provided with a mounting structure for attaching to a bolt hole or the like of the first wiring accommodating portion 150A. The first wire accommodating portion 150A fixes the first arm portion 160A and the first body portion 111A to each of the mounting portions by, for example, a fastening mechanism such as a bolt.

The first arm portion 160A together with the second arm portion 160B provides a portion that the conveyor 141 holds, and an arm portion 160 that is held in the plating tank (second A, third A). The first arm portion 160A is provided with an elongated plate member or a rod member. The first arm portion 160A has an external connection portion 161A and an external connection portion cover 162A for protecting the external connection portion 161A and the wiring L. Further, the first arm portion 160A has meshing portions 164A, 165A (third B-picture) that mesh with the second arm portion 160B of the second holding member 110B. The first arm portion 160A and the second arm portion 160B are engaged with each other by the engaging portions 164A, 165A. Further, the first arm portion 160A has two mounting portions 166A (fourth A diagram) corresponding to the two mounting portions 154A of the first wiring accommodating portion 150A. As shown in FIGS. 4B and 6D, the engaging portion 165A includes a thin portion 1650A that is longer than the other portion (for example, the central portion) of the elongated plate-shaped member or the rod-shaped member on the first main body portion 111A side. Further, a portion having a thickness substantially the same as that of the other portion (for example, the central portion) is provided in a flange shape on the side of the first body portion 111A of the thin portion 1650A. Further, a rectangular portion thicker than the thin portion is provided on the outer connecting portion 161A side of the thin portion 1650A. Therefore, the thin portion 1650A is a recess surrounded by three aspects, and the end portion 165B of the second arm portion 160B can be engaged in the recess.

Fig. 16A is an enlarged perspective view showing the vicinity of the positioning portion on the side opposite to the external connection portion of the first arm portion of the first holding member. Fig. 16B is an enlarged perspective view showing the vicinity of the positioning portion on the outer connecting portion side of the first arm portion of the first holding member. As shown in FIGS. 16A and 16B, the first arm portion 160A has positioning portions 163R for positioning the substrate holder 11 in the substrate placing portion 170B and the plating groove 10 at both end portions thereof. , 163L. Each of the positioning portions 163R and 163L has a positioning hole, and the substrate holder 11 can be positioned by being engaged with a positioning pin (not shown) provided in the substrate placing portion 170B and the plating groove 10. Further, one of the positioning holes may be used as a growth hole to adjust the position of the substrate holder 11 in the left-right direction. The case where the positioning hole of the positioning portion 163L is formed into a long hole is shown in Fig. 16A.

The second holding member 110B includes a second main body portion 111B, a second wiring accommodating portion 150B, and a second arm portion 160B (third A diagram, fifth A diagram). Since the configurations of the second main body portion 111B and the second electric wire accommodating portion 150B are substantially the same as those of the first main body portion 111A and the first electric wire accommodating portion 150A, the detailed description thereof will be omitted, and the same reference numerals and the same numbers will be noted in the same configuration. The symbol displayed by the letter B.

The second arm portion 160B is provided with an elongated plate member or a rod member. The second arm portion 160B has an external connection portion 161B and an external connection portion cover 162B for protecting the external connection portion 161B and the wiring L. Further, the second arm portion 160B has two mounting portions 166B (fifth A diagram) corresponding to the two mounting portions 154B of the second wiring accommodating portion 150B. The second arm portion 160B is fixed to the mounting portion 154B of the second wire accommodating portion 150B by the attaching portion 166B by, for example, a tightening mechanism such as a bolt. Further, the second arm portion 160B has a narrow portion 164B having a narrower width than the other portions between the two attachment portions 166B.

The sixth A diagram is an enlarged perspective view of the vicinity of the arm portion in a state in which the first arm portion and the second arm portion are engaged from the first side. Fig. 6B is an enlarged perspective view showing the vicinity of the arm portion in a state in which the first arm portion and the second arm portion are engaged from the second side. The sixth C is an enlarged perspective view of the vicinity of the arm portion in a state in which the first arm portion and the second arm portion are opened from the first side. The sixth D diagram is an enlarged perspective view of the vicinity of the arm portion in a state in which the first arm portion and the second arm portion are opened from the second side.

As shown in the sixth A to D, the meshing portion 164A of the first arm portion 160A meshes with the upper surface and the end surface of the outer connecting portion cover 162B of the second arm portion 160B (Fig. 6A, Fig. 6B). . The recessed portion of the engaging portion 165A of the first arm portion 160A engages with the end portion 165B on the opposite side of the outer connecting portion cover 162B of the second arm portion 160B (Fig. 6B). At this time, the meshing portion 165A of the first arm portion 160A has a shape in which the end portion 165B of the second arm portion 160B is fitted from the vertical direction and the end surface side. Therefore, the first arm portion 160A and the second arm portion 160B are integrally engaged with each other in a state where the first arm portion 160A overlaps the second arm portion 160B. That is, in a state where the first holding member 110A and the second holding member 110B are engaged, the first arm portion 160A and the second arm portion 160B are oriented from the first and second body portions 111A, 111B toward the first and second portions. The arms 160A and 160B are arranged in the direction. That is, in the first arm portion 160A and the second arm portion 160B, the spaces above and below the substrate holder 11 are respectively distributed, and are vertically separated. With this configuration, the size of the substrate holder 11 in the thickness direction can be suppressed or prevented from increasing.

Further, in a portion of the narrow portion 164B of the second arm portion 160B, a gap is formed between the first arm portion 160A and the second arm portion 160B to form a claw of the conveyor 141 (for holding the substrate holding) The retraction space of the claw of the device 11).

Further, as shown in FIGS. 6A to D, when the first arm portion 160A and the second arm portion 160B are engaged, the first and second outer connecting portions 161A of the first and second arm portions 160A and 160B, 161B is disposed on the opposite side of the width direction of the substrate holder 11 so as not to interfere with each other. That is, the first and second outer connecting portions 161A, 161B are located at the left and right ends of the substrate holder 11, in other words, at the left and right ends of the arm portion 160. In the plating tank 10, since the first surface and the second surface of the substrate W can be fed from the left and right ends of the arm portion 160 of the substrate holder 11, the external connection portion is concentrated on the arm. The form of one end portion of the portion 160 prevents the thickness of the substrate holder 11 from increasing.

The seventh A diagram is a partial perspective perspective view of the first holding member for displaying the path of the wiring from the first external connection portion to the first body portion. FIG. 7B is a perspective view of the first body portion in the connection portion between the first body portion and the wiring accommodating portion. The seventh C is a perspective view of the wiring accommodating portion in the connection portion between the wiring accommodating portion and the first main body portion as viewed from the inside. The seventh D diagram is a perspective view of the wiring accommodating portion in the connection portion between the wiring accommodating portion and the first main body portion as viewed from the outside. In addition, the following description explains the path configuration of the wiring L of the first holding member 110A, but the path of the wiring L of the second holding member 110B is also the same.

As shown in FIG. 7A, the plurality of wires L connected to the first external connection portion 161A pass through the accommodating space 152A (fourth C-figure) inside the first wiring accommodating portion 150A, and pass through the first body portion 111A. The wiring hole 116A (Fig. 7A, B) is introduced into the first body portion 111A. The wiring hole 116A is a tapered hole formed by machining, and is provided corresponding to each wiring L. A plurality of wiring holes 192A (seventh C and D diagrams) corresponding to the respective wirings L are provided in the thick portion on the first main body portion 111A side of the first wiring accommodating portion 150A, and the plurality of wirings L pass through the wiring holes 192A. The first body portion 111A side is derived. The wiring L sent from the plurality of wiring holes 192A is introduced into the first main body portion 111A through the wiring hole 116A (Fig. 7B) corresponding to the first main body portion 111A.

The eighth drawing is an enlarged plan view of the connection portion between the wiring accommodating portion and the main body portion. Figure 8A is a cross-sectional view of the A-A of the eighth figure. Fig. 8B is a cross-sectional view taken along line B-B of the eighth diagram in which the wiring hole is not formed. The eighth C diagram is a cross-sectional view taken along line C-C of the eighth diagram in which the wiring holes are formed.

As shown in FIG. 8 and FIG. 8A, the first main body portion 111A has a mounting portion 114A having a thin central portion in the width direction. The mounting portion 114A has a stepped portion formed on the inner side surface (surface on the second holding member 110B side) and the outer side surface (surface opposite to the second holding member 110B) having a thickness smaller than that of the other portions of the first main body portion 111A. unit. The first wire accommodating portion 150A has mounting portions 158A and 159A that form recesses corresponding to the shape of the step portion of the mounting portion 114A of the first body portion 111A. For example, bolt holes (not shown) are formed in the mounting portion 114A of the first main body portion 111A and the mounting portion 158A of the first wiring accommodating portion 150A, and the mounting portion 114A and the mounting portion 158A are fixed by bolts. The second main body portion 111B and the second electric wire accommodating portion 150B of the second holding member 110B have the same configuration.

Since the configuration is such that the mounting portion 159A of the first wiring accommodating portion 150A overlaps the outer surface of the mounting portion 114A of the first body portion 111A, the plating liquid can be suppressed or prevented from the outside of the first holding member 110A. The side invades the inner space 200 between the first holding member 110A and the second holding member 110B. In the same manner, since the mounting portion 159B of the second wiring accommodating portion 150B is overlapped with the umbrella structure of the outer surface of the mounting portion 114B of the second main body portion 111B, the plating liquid can be suppressed or prevented from the outside of the second holding member 110B. The side (opposite side of the first holding member 110A) intrudes into the inner space 200. In other words, the umbrella structure can suppress or prevent the plating solution from intruding into the inner space 200 of the substrate holder 11 by the liquid blade or the like.

As shown in FIGS. 8 and 8B, the first body portion 111A has a mounting portion 115A at a portion where the wiring hole 116A is not formed other than the mounting portion 114A. The mounting portion 115A has a step portion formed of a thin portion having a smaller thickness than the other portions of the first body portion 111A on the outer side surface (the surface opposite to the second holding member 110B). The first wire accommodating portion 150A has a mounting portion 191A composed of a flange portion corresponding to the shape of the step portion of the mounting portion 115A of the first body portion 111A. When the first holding member 110A is engaged with the second holding member 110B, the mounting portion 191A of the first wiring accommodating portion 150A meshes with the step portion of the mounting portion 115A of the first body portion 111A. The second main body portion 111B and the second electric wire accommodating portion 150B of the second holding member 110B have the same configuration.

Since this configuration is an umbrella structure in which the mounting portion 191A of the first wiring accommodating portion 150A is overlapped with the outer surface of the mounting portion 115A of the first body portion 111A, the plating liquid can be suppressed or prevented from the outside of the first holding member 110A. The side invades the inner space 200 of the substrate holder 11. In the same manner, since the mounting portion 191B of the second wiring accommodating portion 150B is overlapped with the umbrella structure of the outer surface of the mounting portion 115B of the second main body portion 111B, the plating liquid can be suppressed or prevented from the outside of the second holding member 110B. The side invades the inner space 200 of the substrate holder 11. In other words, the umbrella structure can suppress or prevent the plating solution from intruding into the inner space 200 of the substrate holder 11 by the liquid blade or the like.

As shown in FIG. C, the positions of C-C in the eighth diagram are provided with wiring holes 192A and wiring holes 116A in the first wiring accommodating portion 150A and the first main body portion 111A, respectively. The connection structure between the first wire accommodating portion 150A and the first body portion 111A is the same as that in the case of the eighth B diagram. The wiring L passes through the wiring hole 192A from the accommodating space 152A of the first wiring accommodating portion 150A, and passes through the wiring hole 116A of the first main body portion 111A. The second main body portion 111B and the second electric wire accommodating portion 150B of the second holding member 110B have the same configuration.

Since the configuration is such that the mounting portion 191A of the first wiring accommodating portion 150A overlaps the outer surface of the mounting portion 115A of the first body portion 111A, the plating liquid can be suppressed or prevented from the outside of the first holding member 110A. The side invades the inner space 200 of the substrate holder 11. In the same manner, since the mounting portion 191B of the second wiring accommodating portion 150B is overlapped with the umbrella structure on the outer side of the mounting portion 115B of the second main body portion 111B, the plating liquid can be suppressed or prevented from the outside of the second holding member 110B. The side invades the inner space 200 of the substrate holder 11. In other words, the umbrella structure can suppress or prevent the plating solution from intruding into the inner space 200 of the substrate holder 11 by the liquid blade or the like.

As described above with reference to FIGS. 8 to 8C, the first body portion 111A and the first wire accommodating portion 150A have the wall portion (mounting portion) of the first wire accommodating portion 150A in the connecting portion overlapping from the outside from the first side. The umbrella structure of the wall portion (mounting portion) of the main body portion 111A. With this configuration, it is possible to suppress or prevent the plating solution from entering the wiring hole 192A through the connection portion between the first main body portion 111A and the first wiring accommodating portion 150A from the outer surface side of the first holding member 110A and/or through the inner space 200 and Wiring hole 116A. Similarly, the second main body portion 111B and the second wiring accommodating portion 150B have the wall portion (mounting portion) of the second wiring accommodating portion 150B in the connecting portion overlapping the wall portion (mounting portion) of the second main body portion 111B from the outside. Umbrella construction. According to this configuration, it is possible to suppress or prevent the plating liquid from entering the wiring hole 192B through the connection portion between the second main body portion 111B and the second wiring accommodating portion 150B from the outer surface side of the second holding member 110B and/or through the inner space 200 and Wiring hole 116B. Since this configuration can protect the wiring L from intrusion of the plating liquid, the sealing member that seals the wiring hole 192 and the wiring hole 116 can be omitted.

Further, in the present embodiment, when the substrate holder 11 is placed in the plating tank 10, the connection portion between the first main body portion 111A and the first wiring accommodating portion 150A, and the second main body portion 111B and the second wiring accommodating portion 150B are The position of each connection portion (eighth A to eighth C) is arranged such that the connection portion is positioned above the plating liquid surface S. In other words, the plating liquid surface S is positioned above the holding position of the substrate W, and is connected to the connection portion between the first main body portion 111A and the first wiring accommodating portion 150A, and the second main body portion 111B and the second wiring accommodating portion 150B. The lower portion of the portion constitutes the substrate holder 11. Therefore, the arrangement of the umbrella portion in the connection portion between the first main body portion 111A and the first wiring accommodating portion 150A and the connection portion between the second main body portion 111B and the second wiring accommodating portion 150B and the arrangement of the plating liquid from the connection portion are separated from the connection portion. The plating solution can be more effectively suppressed or prevented from intruding into the wiring hole 192 and the wiring hole 116. Since this configuration can protect the wiring L from intrusion of the plating liquid, the sealing member that seals the wiring hole 192 and the wiring hole 116 can be omitted.

In the present embodiment, when the substrate holder 11 is placed in the plating tank 10, the first and second wirings are disposed such that the first and second wiring accommodating portions 150A and 150B are positioned above the plating liquid surface S. The accommodating portions 150A and 150B. Since the configuration is close to both sides of the main body portion 111 and the first and second wiring accommodating portions 150A and 150B are disposed above the space in which the blades are disposed, the first and second wiring accommodating portions 150A and 150B are not easily dimensioned in the thickness direction. restricted.

The ninth A diagram is a front view as seen from the inner side surface side of the first holding member. The ninth B diagram is a partially enlarged front view seen from the inner side surface side of the first holding member. The ninth C diagram shows a C-C cross-sectional view of the second holding member in the ninth B diagram together with the first holding member.

The ninth A and ninth B drawings are described by taking the first holding member 110A as an example. In addition, the second holding member 110B applies the same description except that it does not have an outer seal. As shown in FIG. 9A, the first holding member 110A has a plurality of substrate contacts 117A around the first opening portion 112A. In the present embodiment, the case where 18 substrate contacts 117A are provided is exemplified, but an arbitrary number of substrate contacts may be provided depending on the size of the substrate W, the magnitude of the plating current, and the like. Each of the substrate contacts 117A is connected to the external connection portion 161A (third A diagram) by the respective wires L.

As shown in FIG. BB, the first body portion 111A is provided on the inner side surface of the first body 1110A with an inner seal 120A, a seal holder 118A for mounting the inner seal 120A, an outer seal 121A, and an outer seal 121A. Seal holder 119A. A wiring path 127A through which the wiring L passes is formed between the seal holder 118A and the seal holder 119A. Each of the substrate contacts 117A is fixed to the seal holder 118A by a screw 122A on the outer side of the inner seal 120A. The seal holder 118A is fixed to the first body 1110A (ninth C-picture) in a state where the inner seal 120A is sandwiched between the inner body 12010A and the first body 1110A. The seal holder 118A of the present embodiment is fixed to the first body 1110A (Fig. IX) by a screw 123A. A portion of the arrangement screw 123A is provided with a hole in the substrate contact 117A, and is configured such that the screw 123A does not contact the substrate contact 117A. The seal holder 119A is fixed to the first body 1110A in a state where the outer seal 121A is sandwiched between the first body 1110A (ninth C-figure). The seal holder 119A of the present embodiment is fixed to the first body 1110A (Fig. IX) by a screw 124A.

Each of the wires L extends to the vicinity of the corresponding substrate contact 117A, and the coating on the front end side is removed to expose the conductive line 125 (Fig. IX). The conductive line 125 of the wiring L is introduced into the groove 126A (Fig. C) provided in the sealing holder 118A, and the conductive line 125 of the wiring L and the substrate contact 117A are sealed by the screw 122A (Fig. VIII). The device 118A is fastened. Thereby, the wiring L is electrically connected to the corresponding substrate contact 117A. Further, the ninth C diagram shows a portion where the conductive line 125 of the wiring L and the substrate contact 117B are fastened to the seal holder 118A by the screw 122B in the second body portion 111B of the second holding member 110B. As shown in FIG. 9C, the second main body portion 111B has the same configuration as the first main body portion 111A except that it does not have an outer seal and a seal holder. In other embodiments, an outer seal may be provided in the second body portion 111B.

As shown in FIG. C, the inner region of the first and second body portions 111A and 111B is sealed by the inner seal 120 to seal the plated region (the first and second openings 112A and 112B sides) of the substrate W. Between the side ends. Further, the first holding member 110A outer side seal 121A is in close contact with the inner side surface of the second main body portion 111B of the second holding member 110B, and the first and second main body portions 111A and 111B are sealed on the outer peripheral side. As a result, the internal space between the first and second main body portions 111A and 111B is sealed by the inner seals 120A and B and the outer seal 121A, and the substrate contact 117 and the cable L are protected from intrusion of the plating liquid.

Figure 11 is a cross-sectional view showing the first and second body portions of the screw arrangement of the fixed substrate contacts. The eleventh figure shows a cross-sectional view of the first and second body portions of the arrangement of the screws for fixing the seal holder for the inner seal. As shown in the tenth diagram, the screw 122A of the fixed substrate contact 117A and the screw 122B of the fixed substrate contact 117B are disposed so as not to overlap each other in a state where the first holding member 110A and the second holding member 110B are engaged with each other. Avoiding interference between the screw 122A of the first holding member 110A and the screw 122B of the second holding member 110B can bring the first holding member 110A and the second holding member 110B closer together. Further, as shown in the eleventh diagram, the screw 123A of the fixed seal holder 118A and the screw 123B of the fixed seal holder 118B are disposed so as not to overlap each other in a state where the first holding member 110A and the second holding member 110B are engaged. Avoiding interference between the screw 123A of the first holding member 110A and the screw 123B of the second holding member 110B can bring the first holding member 110A and the second holding member 110B closer together. As a result, interference between the screws 122A, 123A of the first holding member 110A and the screws 122B, 123B of the second holding member 110B can be avoided, and the first holding member 110A and the second holding member 110B can be brought closer together.

The twelfth A is an enlarged perspective view of the external connection portion in which the outer connecting portion cover is removed. Here, the first outer connecting portion 161A of the first holding member 110A is taken as an example, but the second outer connecting portion 161B of the second holding member 110B has the same configuration. The first external connection portion 161A has individual external connection contacts 168 corresponding to the number of substrate contacts 117A of the first holding member 110A. In the present embodiment, nine of the 18 substrate contacts 117A are arranged in two rows. In the following description, in the twelfth A, the proximal end of the paper corresponds to the inner side of the substrate holder, and the distal end of the paper corresponds to the outer side of the substrate holder. In the first external connection portion 161A, a bus bar 167 is provided inside the plurality of substrate contacts 117A. Each of the external connection contacts 168 is connected to the corresponding substrate contact 117A by an individual wiring L, and is electrically insulated from each other. When the energization is confirmed, as shown in FIG. 12D, it is confirmed that the respective contacts 230 of the energization device 169 are electrically connected to the respective external connection contacts 168. Further, at the time of the plating treatment, as will be described later, each of the external connection contacts 168 is electrically short-circuited to each other and supplied with the same potential (Twelfth E-E). In other embodiments, two or more wirings L may be connected to one external connection contact 168, and the other ends of the two or more wirings may be connected to different substrate contacts 117A, respectively. Further, a plurality of external connection contacts 168 may be connected to the plurality of wirings L, and the wirings L may be connected to one substrate contact.

The twelfth B-picture is an explanatory diagram of a current path in the first holding member. The twelfth Cth is an explanatory diagram of a current path in the second holding member. The first holding member 110A supplies current from each of the external connection contacts 168 of the first external connection portion 161A to each of the substrate contacts 117A in a path indicated by an arrow (Twelfth B). The second holding member 110B supplies current from each of the external connection contacts 168 of the second external connection portion 161B to each of the substrate contacts 117B in accordance with the path indicated by the arrow (Twelfth C-C). In each of the external connection contacts 168 and the substrate contacts 117A and 117B of the first holding member 110A and the second holding member 110B, a common potential is supplied during the plating process, and when the energization is confirmed, some or all of the external connections are connected. Point 168 supplies different potentials.

The twelfth D is a diagram showing the connection pattern of the contacts of the external connection portion when the energization is confirmed. It is confirmed that the energization process is performed in a state where the substrate holder 11 is sandwiched between the substrate W in the substrate placement portion 170B (first drawing). A terminal 230 for confirming the energization device 169 is disposed in the substrate placement portion 170B. The external connection portion 161A of this embodiment has two rows of nine external connection contacts 168 arranged in two rows (Fig. 12A). It is confirmed that the energization processing is performed in a state where the external connection contacts 168 of the external connection portion 161A are not in contact with the bus bar 167 and are in contact with the terminal 230 of the confirmation energization device 169 (Twelfth D). It is confirmed that each terminal 230 of the energizing device 169 can supply an individual potential to the corresponding external connection contact 168, and can measure the current between any two external connection contacts 168. In addition, a plurality of external connection contacts 168 can be used as a group, and each group measures the current between the external connection contacts 168.

For example, as shown in FIG. 12A, three sets of contacts are arranged as a group, and three groups I, II, and III are divided into three groups I, II, and III to perform confirmation energization processing. One example is to measure the current by applying a potential difference between the terminal 230 of the three external connection contacts 168 connected to the proximal column of the group I and the terminal 230 connected to the three external connection contacts 168 of the distal column. Next, a potential difference is applied between the terminal 230 connected to the three external connection contacts 168 in the proximal column of the group II and the terminal 230 connected to the three external connection contacts 168 in the distal column to measure the current. Next, a potential difference is applied between the terminal 230 connected to the three external connection contacts 168 in the proximal column of the group III and the terminal 230 connected to the three external connection contacts 168 in the distal column to measure the current.

The current, for example, the terminal 230 at the proximal end is at a high potential, and when the terminal 230 at the distal end is at a low potential, the group I is connected to the terminal 230 at the proximal end, the three external connection contacts 168 at the proximal end of the group I, and the like. The wiring L of the three contacts, the substrate contact 117A connected to the wiring L, the seed layer of the first surface (surface) of the substrate W, the substrate contact 117A of the terminal 230 connected to the distal end, the wiring L, and the far The three external connection contacts 168 and the path of the terminal 230 flow. Similarly, the current flowing between the external connection contacts 168 on the first side and the second side of the other two groups II, III was measured. As a result, when the measured value of the current is within the specified range, it is determined that the external connection contact 168 of the external connection portion 161A, the wiring L, the substrate contact 117, and the substrate W are all normal, and the substrate holder 11 is transported to the processing portion 173C ( The first figure) performs a plating process. When the measured value of the current is outside the specified range, the external connection contact 168, the wiring L, the substrate contact 117, or the substrate W of the external connection portion 161A is abnormal, and the substrate W is taken out from the substrate holder 11 and the substrate is removed. The holder 11 is returned to the holder storage unit 170D (first figure).

In addition, the number of external connection contacts included in each group is not limited, and the number of external connection contacts between groups may be different. Alternatively, a potential difference can be applied between the external connection contacts 168 at the proximal or distal end to determine the current. In addition, the number of external connection contacts included in each group may be two, and the current is measured by two external connection contacts 168. It is easy to find an abnormal portion by measuring the current between the external connection contacts 168 by each group.

The same confirmation energization device 169 is also provided in the second external connection portion 161B of the second holding member 110B, and the same confirmation energization process is performed on the second surface (back surface) of the substrate W.

The twelfth E is a connection mode diagram showing the contacts of the external connection portion during the plating process. The substrate holder 11 holds and holds the arm portion 160 in the arm housing portion 250 of the plating tank 10. The arm accommodating portion 250 is disposed one by one in each of the two sides of the plating tank, and the both ends of the arm portion 160 are supported by the arm accommodating portion 250 to suspend the substrate holder 11. The arm supply unit 250 is provided with a current supply unit 240, and the current supply unit 240 is provided with external connection units 161A and 161B. At this time, each of the external connection contacts 168 is pressed against the current supply unit 240 by the weight of the first and second external connection portions 161A and 161B or an additional actuator or the like, and is in contact with the bus bar 167. Deformation. As a result, all of the external connection contacts 168 are electrically short-circuited by the current supply portion 240 and the bus bar 167. In this state, when the potential is supplied from the external power source 37 (fifteenth diagram) to the current supply unit 240, all the contacts 168 are supplied with the same potential. In the plating treatment, the current flows from the external power source 37 through the anode 31A (31B), the plating liquid, the surface layer (back surface) of the substrate W, the substrate contact 117A (117B), the wiring L, the first and second external portions. Each of the external portions of the connection portion 161A (161B) is connected to the contact 168, and flows back to the path of the external power source 37. The bus bar 167 is provided in order to make the short circuit between the external connection contacts 168 more reliable. Further, a different current may flow into the current supply unit 240 that is in contact with the first external connection portion 161A and the current supply unit 240 that is in contact with the second external connection portion 161B.

Fig. 13A is a schematic view showing the arrangement of the substrate in the substrate placing portion on the substrate holder. The thirteenth A diagram includes the first holding member 110A and the second holding member 110B and is in a mode display configuration. The substrate attaching and detaching device 1000 is disposed in the substrate placing portion 170B (first drawing). The substrate handling device 1000 includes a rotating device 1100 and a workstation 1200. In the state in which the second holding member 110B of the substrate holder 11 is held in the substantially horizontal posture, the rotation device 1100 detaches or mounts the substrate W to the second holding member 110B, and the second holding member 110B is vertically oriented. In the erected state, the substrate W is sandwiched between the first holding member 110A and the second holding member 110B held by the workstation 1200. Thereby, the substrate W can be attached to and detached from the substrate holder 11. The workstation 1200 may be constituted by, for example, a stationary station that suspends the substrate holder 11 and a supporting device that supports the substrate holder 11 held at the stationary station toward the rotating device 1100 side. The above-described confirmation energization means can be provided, for example, at a portion where the first and second external connection portions 161A, 161B of the arm portion 160 of the substrate holder 11 of the workstation 1200 are placed.

The substrate holder 11 before mounting the substrate is separated into the first holding member 110A and the second holding member 110B, the first holding member 110A is disposed in the standing state on the workstation 1200, and the second holding member 110B is disposed in the substantially horizontal state on the rotating device 1100. On the stage. In this state, the substrate W of the robot arm held by the transport device 122 is placed on the second holding member 110B on the rotating device 1100. Then, the stage of the rotating device 1100 rotates to move the second holding member 110B into a substantially vertical state, in which the second holding member 110B is pressed against the first holding member to engage (fix) the first holding member 110A with The second holding member 110B holds the substrate W by the first holding member 110A and the second holding member 110B. In this state, the aforementioned confirmation energization process is executed. When it is confirmed that the energization processing result is good, the substrate holder 11 holding the substrate W is transported to the processing unit 170C (first drawing) by the transporter 141 to perform a plating process. When it is confirmed that the result of the energization process is defective, the substrate W is taken out from the substrate holder 11 and the substrate holder 11 is returned to the holder storage portion 170D (first drawing).

When the substrate W is detached from the substrate holder 11, in the workstation 1200, the second holding member 110B is detached from the first holding member 110A together with the substrate W by the rotating device 1100. Then, as shown in FIG. 13A, the second holding member 110B is rotated into a substantially horizontal posture, and the robot arm of the transport device 122 carries out the substrate W.

Here, the case where the first holding member 110A and the second holding member 110B are engaged in the upright state will be described, but the first holding member 110A and the second holding member 110B may be engaged in a horizontal state.

Fig. 13B shows an example of a method of fixing the substrate holder. The first holding member 110A and the second holding member 110B can be fixed by any fixing method. For example, as shown in FIG. 13B, the first holding member 110A and the second holding member 110B may be fixed by a fastening mechanism such as a bolt. In this example, a screw hole 195 is provided in the first body 1110A of the first holding member 110A, and a through hole 194 is provided in the second body 1110B of the second holding member 110B, and the first holding member 110A is screwed by the bolt 193. And the second holding member 110B. Further, in this example, the bore 194a is provided corresponding to the through hole 194, and the head of the bolt 193 is disposed in the bore 194a. Thereby, the thickness of the substrate holder 11 can be reduced. The first holding member 110A and the second holding member 110B are configured to be fixed at a plurality of places by bolts 193. Further, a jig may be provided on one of the first holding member 110A and the second holding member 110B, and the first holding member 110A and the second holding member 110B may be fixed to each other. When any fixing method is employed, an actuator or the like can be provided in the substrate handling apparatus 1000, and an automatic fixing method can be employed.

Fig. 14A is an enlarged perspective view showing the vicinity of the positioning portion of the first holding member. The fourteenth Bth diagram is an enlarged perspective view of the positioning portion of the second holding member. The first holding member 110A has a protrusion (positioning pin) 210A as a positioning portion in the first body 1110A of the first body portion 111A. The second holding member 110B has a through hole 210B as a positioning portion in the second body 1110B of the second body portion 111B. The projecting portion 210A is fixed to the first body 1110A by a fastening member such as a bolt. The protruding portion 210A may be fixed to the first body 1110A by other fixing means, or may be integrally formed with the first body 1110A. Each of the first main body portion 111A and the second main body portion 111B is provided in a plurality of the protruding portion 210A and the through hole 210B. When the first holding member 110A and the second holding member 110B are engaged, each of the through holes 210B can be inserted and fitted. Projection portion 210A. Thereby, the positioning between the first holding member 110A and the second holding member 110B is performed. Further, the through hole 210B may be provided in the first holding member 110A, and the protruding portion 210A may be provided in the second holding member 110B.

The fifteenth diagram schematically shows a side view of the configuration of the plating tank 10. In the plating treatment, the first anode holder 30A is disposed to face the first surface (surface) of the substrate W, and the second anode holder 30B is disposed to face the second surface (back surface) of the substrate W. The first anode holder 30A has an anode mask (not shown) for adjusting the electric field between the first anode 31A and the substrate W. The anode mask is, for example, a schematic plate member made of a dielectric material, and is disposed on a surface of the first anode holder 30A opposite to the substrate holder 11. The anode mask has an opening through which a current flowing between the first anode 31A and the substrate W passes at a schematic central portion, and the opening diameter or the side length is preferably smaller than the diameter or side length of the first anode 31A. In addition, the anode mask can also constitute an adjustable opening diameter or side length. For example, a plurality of throttle blades are provided in the opening, and the opening diameter or the side length can be enlarged or reduced by the same structure as the aperture mechanism of the camera. The second anode holder 30B is also constructed in the same manner as the first anode holder 30A.

A first intermediate mask 36A is provided between the first anode holder 30A and the substrate holder 11. Further, a second intermediate mask 36B is provided between the second anode holder 30B and the substrate holder 11. The first and second intermediate masks 36A, 36B are configured to adjust the opening diameters of the first and second intermediate masks 36A, 36B by a configuration similar to the first and second anode masks 32A, 32B. The side length is used to adjust the electric field between the first and second anodes 31A, 31B and the substrate W. In one embodiment, the first intermediate mask 36A and the second intermediate mask 36B may be coupled to the moving mechanism, and the distance between the substrate W and the first intermediate mask 36A and the substrate W and the second intermediate mask 36B may be changed. The distance between them. Further, when an insoluble anode is used, since it is necessary to continuously replenish the plating metal in the plating solution, a replenishing mechanism for plating the metal may be provided in a circulation mechanism to be described later.

A first paddle 35A for agitating the plating solution in the vicinity of the first surface of the substrate W is provided between the first anode holder 30A and the substrate holder 11. Further, a second paddle 35B for agitating the plating liquid in the vicinity of the plated surface of the substrate W is provided between the second anode holder 30B and the substrate holder 11. These blades 35A and 35B may be, for example, a substantially rod-shaped member, and may be provided in the plating treatment tank in the vertical direction. The paddles 35A and 35B are configured to be horizontally movable along the plated surface of the substrate W by a driving device (not shown). Further, the blades 35A, 35B may be provided with a plurality of slits in the longitudinal direction in the plate member.

The first anode 31A is connected to the external power source 37 via wiring in the first anode holder 30A. Further, as described above, the first external connection portion 161A of the first holding member 110A exposing the first surface (surface) of the substrate W of the substrate holder 11 is connected to the external power source 37. When a voltage is supplied from the external power source 37 between the first anode 31A and the first external connection portion 161A of the substrate holder 11, the substrate W is passed from the external power source 37 through the first anode 31A, the plating liquid, and the substrate holder 11. The first layer of the seed layer and the first external connection portion 161A (the first holding member 110A) return to the external power source 37 to flow a plating current. The external power source 37 is connected via wiring in the second anode 31B and the second anode holder 30B. Further, as described above, the second external connection portion 161B of the second holding member 110B exposing the second surface (surface) of the substrate W of the substrate holder 11 is connected to the external power source 37. When a voltage is supplied from the external power source 37 between the second anode 31B and the second external connection portion 161B of the substrate holder 11, the substrate W is passed from the external power source 37 through the second anode 31B, the plating solution, and the substrate holder 11. The second surface layer and the second external connection portion 161B (second holding member 110B) return to the external power source 37 to flow a plating current.

The plating apparatus according to the embodiment shown in the fifteenth diagram includes a circulation mechanism 300 that circulates the plating solution between the plating tank 10 and the outer tank 16. The circulation mechanism 300 includes a circulation line 302 that connects the outer tank 16 that accommodates the plating liquid overflowing from the plating tank 10, and the plating tank 10. A valve 304 is provided in the circulation line 302 to open and close the circulation line 302. The valve 304 may be, for example, a solenoid valve, and the opening and closing of the circulation line 302 may be controlled by the control unit 103 (refer to the first diagram). A pump 306 is provided in the circulation line 302, and the pumping liquid 306 can circulate the plating solution from the outer tank 16 to the plating tank 10 through the circulation line 302. A temperature control device 308 is provided in the circulation line 302 to control the temperature of the plating solution passing through the circulation line 302. For example, a thermometer (not shown) may be provided in the plating tank 10, and the temperature control device 308 may be controlled by the control unit 103 depending on the temperature of the plating solution measured by the thermometer. A filter 310 is disposed in the circulation line 302 to remove solid matter from the plating liquid of the circulation line 302.

In the present embodiment, the first holding member 110A and the second holding member 110B are provided with a first external connecting portion 161A and a second external connecting portion 161B which are independent of each other. Thereby, the first external connection portion 161A, the wiring L, the current path for the first surface of the substrate W composed of the substrate contact 117A, and the second external connection portion 161B, the wiring L, and the substrate contact 117B can be formed. The current paths for the second surface of the substrate W are respectively distributed to the first and second holding members 110A and 110B. As a result, it is possible to suppress an increase in the thickness of the substrate holder, and it is possible to secure a space for supplying a current path to the first surface and the second surface of the substrate. This is effective when the number of wirings is increased due to the size of the substrate, or when the wiring diameter is increased due to the magnitude of the current. Further, since the double-sided plated substrate is generally twice as large as the one-sided plated substrate, it is particularly effective. Further, since the current can be independently supplied to the first surface and the second surface of the substrate, the plating specifications such as the plating thickness of each surface can be independently controlled.

In the above, the substrate holder for double-sided plating is described. However, even in the substrate holder for single-sided plating, the first holding member and the second holding member may be provided with the first outer portions independent of each other. a connecting portion and a second external connecting portion. When the connection paths of the current paths of the first holding member and the second holding member are respectively connected, the current can be supplied from the first and second external connecting portions of the first and second holding members to the surface to be plated. At this time, the current path for the first surface of the substrate can be distributed to the first and second holding members to secure the space in which the current supply path is provided. Even in the substrate holder for single-sided plating, it is effective when the number of wires and the wire diameter increase due to the substrate size, current magnitude, and the like.

(Other embodiments)

Figure 17 is a perspective view of the substrate holder of the other embodiment as viewed from the first side. The eighteenth view is a perspective view of the first holding member and the second holding member in which the substrate holder is in an open state as viewed from the first side. The nineteenth embodiment is an exploded perspective view of the first holding member and the second holding member of the substrate holder.

The substrate holder 11 of the other embodiment has the same configuration as that of the above-described substrate holder 11 in the second A diagram and the like. Therefore, the same components are denoted by the same reference numerals, and detailed description thereof will be omitted. In this embodiment, instead of the wiring L formed of the cable, the plurality of substrate contacts 117 and the external connection contacts 161A, 161B are connected by the conductive path portions 410 and 420 having a larger sectional area (refer to the twentieth diagram). . Thereby, the wiring accommodating portion 150 (the first wiring accommodating portion 150A and the second wiring accommodating portion 150B) can be omitted to reduce the size and cost of the substrate holder. Further, in the case of a substrate holder for single-sided plating, a conductive path portion may be provided on one of the first holding member or the second holding member.

As shown in FIGS. 17 and 18, the substrate holder 11 includes a main body portion 111, left and right mounting portions 180, a central mounting portion 181, and an arm portion 160. The substrate holder 11 is divided into a first holding member 110A having a first opening portion 112A and a second holding member 110B having a second opening portion 112B. The first holding member 110A includes a first body portion 111A, left and right mounting portions 180A, a center mounting portion 181A, and a first arm portion 160A (eighteenth and nineteenth views). The second holding member 110B includes a second main body portion 111B, left and right mounting portions 180B, a center mounting portion 181B, and a second arm portion 160B (eighteenth and nineteenth views).

The first body portion 111A is attached to the first arm portion 160A by a mounting portion 181A at the center between the left and right mounting portions 180A and the right and left mounting portions 180A. The right and left attachment portions 180A and the central attachment portion 181A are respectively fixed to the first body portion 111A and the first arm portion 160A by a fastening mechanism such as a bolt, thereby fixing the first body portion 111A to the first arm portion 160A. .

The first arm portion 160A is provided with an elongated plate member or a rod member. The first arm portion 160A has an external connection portion 161A and an external connection portion cover 162A for protecting the external connection portion 161A and the conductive path portion 410. Further, the first arm portion 160A has positioning portions 163R and 163L for positioning the substrate holder 11 in the substrate placing portion 170B and the plating groove 10 at both end portions thereof in the same manner as described above.

The second holding member 110B includes a second main body portion 111B, left and right mounting portions 180B, a center mounting portion 181B, and a second arm portion 160B (eighteenth and nineteenth views). Since the configurations of the second main body portion 111B and the mounting portions 180B and 181B are the same as those of the first main body portion 111A and the mounting portions 180A and 181A, detailed descriptions thereof will be omitted, and the same numbers and the same letter B will be noted in the same structure. The symbol shown.

The second arm portion 160B is provided with an elongated plate member or a rod member. The second arm portion 160B has an external connection portion 161B and an external connection portion cover 162B for protecting the external connection portion 161B and the conductive path portion 420. Similarly to the above-described embodiment, when the first arm portion 160A and the second arm portion 160B are engaged, the first and second outer connecting portions 161A, 161B of the first and second arm portions 160A, 160B are not in contact with each other. The interference is disposed on the opposite side of the substrate holder 11 in the left-right direction.

Fig. 20 is a perspective view of a conductive path portion of another embodiment. The twenty-first figure is an arrow view of the first holding member and the second holding member as viewed from the substrate holding surface side. In the twenty-fifth diagram, reference numeral 410 denotes a conductive path portion disposed in the first holding member 110A, and reference numeral 420 denotes a conductive path portion disposed in the second holding member 110B. In addition, here, the case where the conductive path portion 410 (the conductive path portion 420) includes the two systems of the left conductive path member 410L (420L) and the right conductive path member 410R (420R) will be described. However, the conductive path portion 410 may be integrated. Or a conductive path member of one system composed of a plurality of path pieces.

Each of the conductive path portions 410 and 420 is made of a material having a small resistance value such as copper (for example, oxygen-free copper). This embodiment is formed of a plate member as shown in the twentieth diagram. By forming each of the conductive path portions 410 and 420 into a plate shape, the thickness of the substrate holder can be suppressed from increasing. Further, each of the conductive path portions 410 and 420 may be formed in a rod shape, and thus it is easy to process along the path. Further, each of the conductive path portions 410 and 420 may be coated with a resin (for example, PFA) having a chemical resistance in addition to a contact portion and a conductive portion such as another wiring.

Since the conductive path portion 410 and the conductive path portion 420 have a similar configuration, the conductive path portion 410 will be described below as an example.

The conductive path portion 410 includes a left conductive path member 410L and a right conductive path member 410R. The left conductive path member 410L and the right conductive path member 410R are separated from each other and electrically insulated within the first holding member 110A. In addition, in other embodiments, the left conductive path member 410L and the right conductive path member 410R may be short-circuited to each other in the first holding member 110A, or an integral member may be formed.

The left conductive path member 410L and the right conductive path member 410R each have a configuration in which a plurality of path pieces (here, five path pieces) are connected. Further, the left conductive path member 410L and the right conductive path member 410R may be integrally formed, or may be configured to connect five or less path pieces, or may be configured to connect six or more path pieces.

The left conductive path member 410L includes a first path piece 411L, a second path piece 412L, a third path piece 413L, a fourth path piece 414L, and a fifth path piece 415L, and is configured by being connected thereto. The right conductive path member 410R includes a first path piece 411R, a second path piece 412R, a third path piece 413R, a fourth path piece 414R, and a fifth path piece 415R, and is configured by being connected thereto.

The first path piece 411L, the second path piece 412L of the left conductive path member 410L, and the first path piece 411R and the second path piece 412R of the right side conductive path member 410R extend in parallel with each other in a separated state. The third path piece 413L, the fourth path piece 414L, and the fifth path piece 415L of the left side conductive path member 410L are disposed on the left half portion (the twenty-first figure) of the first body portion 111A. The third path piece 413R, the fourth path piece 414R, and the fifth path piece 415R of the right side conductive path member 410R are disposed on the right half portion (the twenty-first diagram) of the first body portion 111A. The fifth path piece 415R of the right side conductive path member 410R is separated from each other by leaving a gap with the fifth path piece 415L of the left side conductive path member 410L as shown in the twenty-first figure. Thus, by dividing the conductive path member by the right conductive path member 410R and the left conductive path member 410L, when the substrate is held on the substrate holder 11 by the substrate placing portion 170B (first drawing), the right conductive path member 410R is A potential difference is applied between the left conductive path members 410L, and a current flows in a path of the left conductive path member 410L→substrate (seed layer)→right conductive path member 410R (or reversed), and the substrate can be determined to be held when the resistance value is abnormal. The device 11 or the substrate has an abnormal energization test.

The first path piece 411L is disposed in the body of the first arm portion 160A in the eighteenth figure so as to extend from the external connection portion 161A to the connection portion of the center attachment portion 181A. The nineteenth diagram shows a state in which one end of the first path piece 411L is exposed in the mounting recess 1600 provided in the first arm portion 160A. The other end of the first path piece 411L is connected to the external connection contact 440L in the external connection portion 161A (Fig. 24).

As shown in FIG. 19, the second path piece 412L is disposed on the mounting portion 181A so as to extend inside the mounting portion 181A at the center. One end of the second path piece 412L on the side of the first arm portion 160A is exposed at one end of the mounting portion 181A (similar to the second path piece 412R of the nineteenth diagram), and one end portion of the mounting portion 181A and the first arm portion When the mounting recess 1600 of the 160A is fitted, it is in contact with one end of the first path piece 411L disposed in the first arm portion 160A, and is electrically connected to the first path piece 411L. When the attachment portion 181A fixes the first arm portion 160A with a fastening member such as a bolt, the first path piece 411L and the second path piece 412L are also fixed together by bolt stoppers. The other end of the second path piece 412L protrudes from the other end of the mounting portion 181A, and when the mounting portion 181A is attached to the first body portion 111A, the opening is inserted into the opening of the first body 1110A, and is connected to the third path piece 413L. One end (the twenty-first figure). The second path piece 412L and the third path piece 413L are also fixed to each other by a screwing member such as a screw or a bolt (and the third path piece 413R and the fourth path piece 414R of the twenty-second A picture, the twenty-second B picture) Connect the same).

As shown in the twenty-first diagram, the third path piece 413L, the fourth path piece 414L, and the fifth path piece 415L are disposed on the left half of the substrate holding surface side of the first body 1110A of the first body portion 111A. The third path piece 413L is provided along the upper side of the first opening portion 112A on the side close to the first arm portion 160A. One end of the third path piece 413L is connected to the other end of the second path piece 412L near the central portion of the first holding member 110A. The other end of the third path piece 413L is connected to one end of the fourth path piece 414L with a screw 416 near the upper corner portion of the first opening portion 112A (the third of the second path piece 414L and the second piece of the twenty-second A picture The path piece 413R is the same as the connection of the fourth path piece 414R). The fourth path piece 414L is disposed from the proximal end of the first arm portion 160A toward the distal end, along the left side of the first opening portion 112A. The other end of the fourth path piece 414L is connected to one end of the fifth path piece 415L by a screw or the like near the corner of the lower portion of the first opening portion 112A (with the twenty-second A picture, the twenty-second B picture) The third path piece 413R is the same as the fourth path piece 414R. The fifth path piece 415L is disposed along the lower side of the first opening portion 112A from the distal end of the first arm portion 160A. The other end of the fifth path piece 415L is in the vicinity of the central portion of the first holding member 110A, and is terminated in a state of being separated from the fifth path piece 415R.

Each of the path pieces 411R to 415R of the right conductive path member 410R is arranged in substantially the same manner as each of the path pieces 411L to 415L of the left conductive path member 410L. However, the third path piece 413R, the fourth path piece 414R, and the fifth path piece 415R of the right conductive path member 410R are in the first body 1110A, and the third path piece 413L and the fourth path piece of the left conductive path member 410L. The 414L and the fifth path piece 415L are disposed on the opposite side (the right half portion) of the first opening portion 112A.

The first path piece 411R is disposed in the body of the first arm portion 160A in the eighteenth figure so as to extend from the external connection portion 161A to the connection portion with the center attachment portion 181A. The nineteenth diagram shows a state in which one end of the first path piece 411R is exposed in the mounting recess 1600 provided in the first arm portion 160A. The other end of the first path piece 411R is connected to the external connection contact 440R (the twenty-fourth figure) in the external connection portion 161A.

As shown in FIG. 19, the second path piece 412R is disposed on the mounting portion 181A so as to extend inside the mounting portion 181A at the center. One end of the second path piece 412R on the side of the first arm portion 160A is exposed at one end of the attachment portion 181A (similar to the second path piece 412L of the nineteenth diagram), and one end of the attachment portion 181A is fitted to the first end. When the concave portion 1600 of the arm portion 160A is attached, it is in contact with one end of the first path piece 411R disposed in the first arm portion 160A, and is electrically connected to the first path piece 411R. When the attachment portion 181A fixes the first arm portion 160A with a fastening member such as a bolt, the first path piece 411R and the second path piece 412R are also fixed together by bolt stoppers. The other end of the second path piece 412R protrudes from the other end of the mounting portion 181A, and when the mounting portion 181A is attached to the first body portion 111A, the opening is provided in the opening of the first body 1110A, and one end of the third path piece 413R Connection (21st picture). The second path piece 412R and the third path piece 413R are also fixed to each other by a screwing member such as a screw or a bolt (and the third path piece 413R and the fourth path piece 414R of the twenty-second A picture, the twenty-second B picture) Connect the same).

As shown in the twenty-first diagram, the third path piece 413R, the fourth path piece 414R, and the fifth path piece 415R are disposed on the right half of the substrate holding surface side of the first body 1110A of the first body portion 111A. The third path piece 413R is disposed along the upper side of the first opening portion 112A on the side close to the first arm portion 160A. One end of the third path piece 413R is connected to the other end of the second path piece 412R in the vicinity of the central portion of the first holding member 110A. The other end of the third path piece 413R is connected to one end of the fourth path piece 414R by screws 416 near the upper corner portion of the first opening portion 112A (the third path with the 22nd A picture and the 22nd B picture) The sheet 413R is the same as the fourth path piece 414R. The fourth path piece 414R is disposed along the right side of the first opening portion 112A from the proximal end toward the distal end of the first arm portion 160A. The other end of the fourth path piece 414R is connected to one end of the fifth path piece 415R by a screw or the like near the corner portion of the lower portion of the first opening portion 112A (with the twenty-second A picture, the twenty-second B picture) The third path piece 413R is the same as the fourth path piece 414R. The fifth path piece 415R is disposed along the lower side of the first opening portion 112A from the distal end of the first arm portion 160A. The other end of the fifth path piece 415R is terminated in the vicinity of the central portion of the first holding member 110A and separated from the fifth path piece 415L.

As described above, the first path pieces 411L, R are inserted into the first arm portion 160A, the second path pieces 412L, R are inserted into the mounting portion 181A, and the third to fifth path pieces 413L, R, 414L, R, 415L, R are inserted. After the first body portion 111A is inserted, the first arm portion 160A, the mounting portion 181A, and the first body portion 111A are combined with each other. Thus, the formation of each conductive path member can be easily performed.

Since the configuration of the conductive path portion 420 is substantially the same as that of the conductive path portion 410, the symbols 410 and 411 of the conductive path portion 410 are replaced by 420 and 421 to indicate the corresponding configurations, and the detailed description is omitted. The path pieces of the left conductive path member 420L and the right conductive path member 420R are in the second holding member 110B, and the second body 1110B of the second body portion 111B is included from the external connection portion 161B, and the left conductive path with the conductive path portion 410 The path pieces of the member 410L and the right conductive path member 410R are also arranged in the same manner (refer to the nineteenth, twenty-first, twenty-second, twenty-second, twenty-fourth, and twenty-th) Five maps).

The twenty-second A-picture is an enlarged view of the vicinity of the substrate contact of the substrate holder. The twenty-second B-picture is an enlarged view showing the vicinity of the substrate contact of the substrate holder in a state where a part of the substrate contact is removed. The twenty-third figure shows a C-C cross-sectional view of the second holding member in the twenty-second B-picture together with the first holding member.

As shown in the twenty-third diagram, the conductive path portion 410 and the conductive path portion 420 are disposed in a space sealed by the inner seals 120A and 120B and the outer seal 121A. The seal holder 118A for fixing the inner seal 120A is fixed to the first body 1110A by screws 123 (Fig. 22A).

As shown in FIG. 22A and FIG. 22B, each of the path pieces 413R and 414R of the conductive path portion 410 is fixed to the first body 1110A by screws 416 in a state in which the respective end portions are overlapped. The portion is fixed to the first body 1110A by a screw 417. The screws 417 are equally arranged along the longitudinal direction of each of the path pieces, and the respective path pieces are equally pressed in the longitudinal direction. In other words, each of the path pieces can be individually replaced by removing the screws 416, 417. For example, when the processing liquid leaks in the substrate holder 11, depending on the posture of the substrate holder 11 in the processing tank, there is a portion that is easily affected by the processing liquid. When the substrate holder is placed in the plating tank in an upright posture, when the treatment liquid leaks, the treatment liquid is likely to accumulate in the vicinity of the lowermost portion of the substrate holder. Therefore, when the processing liquid leaks, only when the path piece near the lowermost portion of the substrate holder contacts the processing liquid, it is not necessary to replace the entire conductive path portions 410, 420 (or the respective conductive path members 410L, 410R, 420L, 420R). Replace only the path piece that is in contact with the treatment fluid. The cost can be reduced as compared to when the entire substrate holder is replaced or the entire conductive path portion (or each conductive path member) is replaced.

A plurality of substrate contacts 117A are connected to the right conductive path member 410R of the conductive path portion 410 by screws 122A. In other words, each of the substrate contacts 117A can be individually replaced from the conductive path portion 410 by removing the screws 122A. By replacing a portion of the substrate contacts, the substrate holder can continue to be used, reducing the cost of repair and replacement of the substrate holder. For example, when the processing liquid leaks, a part of the substrate such as the substrate contact (for example, the lowermost portion of the substrate holder) which is easily contacted with the processing liquid is replaced in the posture of the substrate holder 11 in the processing tank. The contact can be reduced in cost compared to when the entire substrate holder 11 or the entire substrate contact is replaced.

Here, the right conductive path member 410R of the conductive path portion 410 will be described. However, the left conductive path member 410L of the conductive path portion 410, the right conductive path member 420R of the conductive path portion 420, and the left conductive path member 420L are also disposed in the same manner.

The twenty-fourth embodiment is an enlarged perspective view of the external connection portion in a state where the outer connecting portion cover is removed. The twenty-fifth figure is a cross-sectional view of the external connection portion. One end of the right conductive path member 410R (first path piece 411R) of the conductive path portion 410 is in the external connection portion 161A, and the external connection contact 440R is screwed together with the conductive plate 430, and is electrically connected to the external connection contact 440R. Sexual connection. The first path piece 411R can be detached from the external connection contact 440R by removing the screw. The external connection contact 440R has a plurality of sheets (here, nine sheets), and the base end side of each sheet portion is an integral sheet contact. One end of the left conductive path member 410L (first path piece 411L) of the conductive path portion 410 is in the external connection portion 161A, and the external connection contact 440L is screwed together with the conductive plate 430, and is electrically connected to the external connection contact 440L. Sexual connection. The first path piece 411L can be detached from the external connection contact 440L by removing the screw. The external connection contact 440L has a plurality of sheets (here, nine sheets), and the base end side of each sheet portion is an integral sheet contact. When the substrate holder 11 is disposed in the plating tank, as shown in the twenty-fifth figure, the respective sheet portions of the external connection contact 440R and the external connection contact 440L are in contact with the bus bar 167, and are electrically short-circuited via the bus bar 167. . Further, in the energization test, similarly to the twelfth DD, the respective sheet portions of the external connection contact 440R and the external connection contact 440L are separated from the bus bar 167. Therefore, each of the contacts 230 of the confirmation energization device 169 is connected to the external connection contact 440R and the external connection contact 440L, and the external connection contact 440R, the right conductive path member 410R, the substrate contact, the substrate W, and the substrate are connected. The point, the left conductive path member 410L, and the external connection contact 440L flow current to perform an energization test. The same applies to the conductive path portion 420.

Here, the case where the external connection contact 440R and the external connection contact 440L are provided to the right conductive path member 410R and the left conductive path member 410L will be described here. However, when the conductive path portion 410 is used as one system, The external connection contact is an integral component. Further, the external connection portion 161B of the second holding member 110B is also configured in the same manner.

The substrate holder of the above embodiment includes at least one substrate contact, at least one external contact, and a conductive path member connected thereto, and the conductive path member and/or the substrate contact are replaceably provided. Thus, when the conductive path member and/or the substrate contact are in contact with the plating solution to cause corrosion or precipitation of the metal, the conductive path member and/or the substrate contact can be replaced. Thus, by replacing the conductive path members and/or substrate contacts, the substrate holder can continue to be used, reducing the cost of repair and replacement of the substrate holder. In particular, since the conductive path member is divided into a plurality of path pieces, only the portion to be replaced can be replaced. In addition, only a portion of the substrate contacts can be replaced. For example, when the treatment liquid leaks, the substrate holder and the path piece which are easily accessible to the treatment liquid are replaced by the substrate holder in the treatment tank. (The substrate holder is used when the substrate holder adopts the vertical posture. One of the substrate contacts and/or the path piece, such as the bottom side, can be reduced in cost compared to when the entire substrate holder, the entire conductive path member, or the entire substrate contact is replaced.

By arranging the wirings of the plurality of substrate contacts 117 into the conductive path portions, it is possible to ensure a large cross-sectional area of each of the conductive path portions (one example is a cable 10-20 portions), and the per-unit length of each conductive path portion can be reduced. Wiring resistance. Thereby, the difference in voltage drop in the path from the external connection portion to each of the first substrate contacts can be reduced. As a result, the plating current flowing through the contacts of the respective first substrates can be made uniform, and the thickness of the plating film can be made uniform. Further, since the wiring of the plurality of first substrate contacts is formed into the respective conductive path portions, the wiring size to the plurality of first substrate contacts can be reduced, or the cable wiring can be omitted.

At least the following aspects can be grasped from the above embodiment.

The first aspect relates to a substrate holder for holding a substrate. The substrate holder includes: a first holding member having a first opening for exposing a first surface of the substrate; and a second holding member for sandwiching the substrate with the first holding member And holding, and having a second opening for exposing the second surface of the substrate. The first holding member has at least one first substrate contact for supplying current to the first surface of the substrate, at least one first external connection contact, and at least one first wiring. The at least one first substrate contact and the at least one first external connection contact are electrically connected. The second holding member has at least one second substrate contact for supplying current to the second surface of the substrate, at least one second external connection contact, and at least one second wiring. The at least one second substrate contact and the at least one second external connection contact are electrically connected. The at least one first external connection contact is electrically independent of the at least one second external connection contact. "Electrically independent" means electrically insulated from each other in the substrate holder.

In the first aspect, the first and second external connection contacts, the first substrate contact and the second substrate contact, the first wiring, and the second wiring are respectively disposed in the first and second holding members, respectively. A path for supplying current to the first surface and the second surface of the substrate is respectively distributed to the first and second holding members. Thereby, it is possible to suppress an increase in the thickness of the substrate holder, and it is possible to secure a space for supplying a current path to the first surface and the second surface of the substrate. Further, since the current can be independently supplied to the first surface and the second surface of the substrate, the plating specifications such as the plating thickness of each surface can be independently controlled.

Further, a current may be supplied to the first surface of the substrate from at least one of the first external connection contacts via the at least one first wiring and the at least one first substrate contact. The resistance value between the at least one first substrate contact and the at least one first external connection contact can be adjusted by adjusting the length of the first wiring. Similarly, current can be supplied to the second surface of the substrate via at least one second external connection contact via at least one second wiring and at least one second substrate contact. The resistance value between the at least one second substrate contact and the at least one second external connection contact can be adjusted by adjusting the length of the second wiring.

In the above embodiment, each of the first holding member and the second holding member has a plurality of substrate contacts, which are disposed, for example, along the outer circumference of the substrate, and are in contact with the substrate in order to supply current to the substrate. Further, the substrate contacts that are in contact with the substrate in order to supply a current to the substrate may be one substrate contact that is integrally connected to each other along the outer periphery of the substrate.

The substrate holder of the first aspect, wherein the first holding member has: a plurality of the first substrate contacts; a plurality of the first external connection contacts; and a plurality of the first wirings The plurality of the first substrate contacts are connected to the plurality of the first external connection contacts.

One of the first substrate contacts may be one-to-one corresponding to one external connection contact, and may be connected by one first wiring. In addition, two or more first wires may be connected to one first external connection contact, and the other ends of the two or more first wires may be connected to different first substrate contacts, respectively. In addition, a plurality of external connection contacts may be connected to the plurality of first wires, and the first wires may be connected to one substrate contact. Further, two or more of these connection methods may be combined.

In the second aspect, the resistance value between the at least one first substrate contact and the at least one first external connection contact can be adjusted by adjusting the length of each of the first wires. For example, by making the lengths of the respective first wires the same, the resistance value between the at least one first substrate contact and the at least one first external connection contact can be made uniform. Further, by holding the substrate in the substrate holder state, it is possible to confirm the energization before the plating process by applying a potential difference between the first wiring and the other portion of the first wiring.

A substrate holder according to a second aspect, wherein the first holding member has a first arm portion, the at least one first external connection contact is disposed on the first arm portion, and the second holding member has The second arm portion, the at least one second external connection contact is disposed on the second arm portion, and the at least one first external connection contact and the at least one second external connection contact are located at the substrate holder The left and right ends.

In the third aspect, when the substrate holder is placed in the plating tank, the first surface and the second surface of the substrate can be fed from the left and right ends of the arm portion, so that the external contact is concentrated on the arm portion. The shape of one of the square ends prevents the thickness of the substrate holder from increasing.

A substrate holder according to the first aspect, wherein the first holding member has a first arm portion, and has a substrate holder for positioning the substrate holder in the plating groove on both sides of the first arm portion First and second positioning portions.

In the fourth aspect, since the positioning portions on both sides of the arm portion are provided to the first holding member, even if the meshing state of the first holding member and the second holding member is deviated, the positional relationship between the positioning portions on both sides is not affected.

A substrate holder according to the first aspect, wherein the first holding member has a first body portion having the first opening portion, and the second holding member has a second body portion having the second portion The opening portion, the first body portion and the second body portion have a positioning structure that meshes with each other.

According to the fifth aspect, since the positioning structure between the first and second body portions is provided, the positioning accuracy of the substrate with respect to the first and second holding members is improved.

A substrate holder according to a first aspect, wherein the first holding member has: a first body portion having the first opening portion; and a first arm portion that is coupled to the first body portion One of the end faces; the second holding member has: a second body portion having the second opening portion; and a second arm portion attached to one end side of the second body portion; In a state in which the member is engaged with the second holding member, the first arm portion and the second arm portion are arranged in a direction from the first and second body portions toward the first and second arm portions.

In the sixth aspect, since the first arm portion and the second arm portion are arranged in the direction of the surface of the substrate holder, the thickness of the arm portion can be suppressed from increasing. Thereby, the overall thickness when a plurality of substrate holders are arranged can be reduced.

According to a seventh aspect, the substrate holder of the first aspect, wherein the first holding member has a first body portion having the first opening portion and the at least one of the first substrate contacts; and the first arm portion Having at least one of the first external connection contacts; and a first wiring accommodating portion disposed between the first body portion and the first arm portion for accommodating the at least one first The excess length of the wiring.

In a seventh aspect, in order to adjust a resistance value between at least one first substrate contact and at least one first external connection contact, and at least one first wiring is adjusted, at least one first wiring is generated. The length of the first wiring may be accommodated in the first wiring accommodating portion. In addition, when a plurality of first substrate contacts are individually connected by the plurality of first wires, the first one is adjusted to adjust a resistance value between the plurality of first substrate contacts and at least one first external connection contact. When the length of the wiring is long, the excess length of the first wiring is generated depending on the position of the first substrate contact, but the excess length of the first wiring can be accommodated in the first wiring accommodating portion. For example, the length of the first wiring is adjusted in such a manner that the resistance between the plurality of first substrate contacts and the at least one first external connection contact is uniform. Further, in order to adjust the amount of current to a specific substrate contact, the length of the first wiring may be changed by changing the resistance value.

According to a seventh aspect of the invention, in the substrate holder of the seventh aspect, the first wiring accommodating portion is integrally formed with the first mounting portion that mounts the first wiring accommodating portion to the first arm portion.

In the eighth aspect, it is not necessary to separately provide the first mounting portion that mounts the first wiring accommodating portion to the first arm portion. It can reduce the number of combined parts and suppress the variation of the combination.

According to a ninth aspect, in the substrate holder of the eighth aspect, the first wiring accommodating portion has a first protruding portion that protrudes toward the first body portion, and the first body portion has two second protruding portions. It protrudes from both sides of the first protruding portion of the first wiring accommodating portion.

According to the ninth aspect, the accommodating space portion in which the first wiring in the first wiring accommodating portion is housed is disposed, and the first main body portion can be attached to the thick portion of the first wiring accommodating portion, whereby the rigidity of the first holding member can be improved.

According to a tenth aspect, in the substrate holder of the seventh aspect, the first wiring housing portion and the first body portion are connected to each other on a side of the outer surface of the substrate holder, and the wall of the first wiring housing portion is in the The outer sides of the walls of a body portion overlap.

According to the tenth aspect, since the wall of the first wiring accommodating portion is disposed outside the wall of the first main body portion on the outer surface of the substrate holder, the wall of the first wiring accommodating portion has an umbrella structure, thereby suppressing or preventing The plating solution intrudes into the inside of the substrate holder by a liquid blade or the like. By suppressing or preventing the plating solution from intruding into the inside of the substrate holder, the arrangement of the wiring holes and the like in the substrate holder can be omitted.

According to a seventh aspect of the invention, in the substrate holder of the seventh aspect, the connection portion between the first wiring accommodating portion and the first main body portion is located at a specific plating solution when the substrate holder is disposed in the plating groove The first holding member is formed in a manner above the surface.

In the eleventh aspect, the plating solution is further suppressed or prevented from intruding into the inside of the substrate holder, and the arrangement of the wiring holes and the like in the substrate holder can be omitted.

According to a twelfth aspect, the substrate holder of the first aspect, wherein the first holding member has a first substrate contact for supplying a current to the first surface of the substrate, and the second holding member has a second substrate a contact for supplying a current to the second surface of the substrate, a first contact fixing portion for fixing the first substrate contact in the first holding member, and for using the second The second contact fixing portion, in which the substrate contact is fixed in the second holding member, does not overlap each other when the first holding member and the second holding member are engaged.

The twelfth aspect prevents interference between the first contact fixing portion and the second contact fixing portion, and can suppress or prevent an increase in thickness of the substrate holder.

According to a thirteenth aspect, the substrate holder of the twelfth aspect, wherein the first holding member has a first sealing holder attached to an outer side of the first opening portion, and the second holding member has a second sealing holder Provided on the outer side of the second opening, the first and second substrate contacts are respectively attached to the first and second sealing holders by the first and second contact fixing portions, and are used for a first sealing holder fixing portion in which the first sealing holder is fixed in the first holding member, and a second sealing holder fixing portion for fixing the second sealing holder in the second holding member The first holding member and the second holding member are not overlapped with each other in a meshed state.

The thirteenth aspect prevents interference between the first seal holder fixing portion and the second seal holder fixing portion, and can suppress or prevent an increase in thickness of the substrate holder.

A substrate holder according to the first aspect, wherein the first holding member has a first seal that is disposed around the first opening, and the second holding member has a second seal that is attached to At least one of the first holding member and the second holding member is further provided with an outer seal around the first sealing member and the second sealing member around the second opening portion.

The fourteenth aspect can be sealed from the outside of the substrate holder by the first and second seals by being sealed on the outer side of at least one of the first holding member and the second holding member.

A fifteenth aspect is the substrate holder according to the first aspect, wherein the first and second openings are rectangular.

According to the fifteenth aspect, it is possible to provide a substrate holder for a substrate having a rectangular shape having a large size.

A sixteenth aspect provides a plating apparatus comprising: a substrate holder for holding a substrate; a substrate attaching and detaching portion for detaching the substrate to the substrate holder; and a plating groove for holding the substrate The substrate holder of the substrate is subjected to a plating treatment, and the conveyor is configured to transport the substrate holder. The substrate holder of the plating apparatus includes: a first holding member having a first opening for exposing a first surface of the substrate; and a second holding member sandwiching the first holding member The substrate is held and has a second opening for exposing the second surface of the substrate. The first holding member has at least one first substrate contact for supplying current to the first surface of the substrate, at least one first external connection contact, and at least one first wiring. The at least one first substrate contact and the at least one first external connection contact are electrically connected. The second holding member has at least one second substrate contact for supplying current to the second surface of the substrate, at least one second external connection contact, and at least one second wiring. The at least one second substrate contact and the at least one second external connection contact are electrically connected. The at least one first external connection contact is electrically independent of the at least one second external connection contact.

According to a sixteenth aspect, the first and second external connection contacts, the first substrate contact and the second substrate contact, the first wiring, and the second wiring are respectively disposed on the first and second holding members, and thus The paths for supplying current to the first surface and the second surface of the substrate are respectively distributed to the first and second holding members. Thereby, in the plating apparatus, it is possible to suppress an increase in the thickness of the substrate holder, and it is possible to secure a space for supplying a current path to the first surface and the second surface of the substrate. Further, since the current can be independently supplied to the first surface and the second surface of the substrate, the plating specifications such as the plating thickness of each surface can be independently controlled.

A seventeenth aspect provides a substrate holder for holding a substrate, comprising: a first holding member having a first opening for exposing a first surface of the substrate; and a second holding member And being held by sandwiching the substrate together with the first holding member; the first holding member has: a first external connecting portion; at least one first substrate contact, which is in contact with the first surface of the substrate, And a first conductive path member connected to the first external connecting portion and the at least one first substrate; wherein the first conductive path member is The first substrate contact is detachably mounted, and the first conductive path member is disposed in a space sealed by the first holding member and the second holding member, and is detachably attached to the body of the first holding member.

In this embodiment, when the substrate holder is disposed in the processing tank, the first conductive path member is prevented from coming into contact with the processing liquid. Further, since at least one of the first substrate contacts can be detachably mounted to the first conductive path member, replacement of at least one of the first substrate contacts is easy. Therefore, by replacing a part of the first substrate contacts, the substrate holder can be continuously used, and the cost required for maintenance and replacement of the substrate holder can be reduced. For example, when the processing liquid leaks, the substrate holder is in the processing tank, and only a part of the substrate which is easily contacted with the processing liquid is replaced (the substrate holder is in the vertical posture, and the substrate holder is on the bottom side) The contact can be reduced in cost when replacing the entire substrate holder or the entire first substrate contact.

Further, the substrate holder includes at least one substrate contact, at least one external contact, and a conductive path member connected thereto, and the conductive path member is replaceably provided. As such, when the conductive path member comes into contact with the plating solution to cause corrosion or precipitation of the metal, the conductive path member can be replaced. Therefore, the substrate holder can be continuously used by replacing the conductive path member, and the cost required for maintenance and replacement of the substrate holder can be reduced.

Further, in the case of using the first conductive path member connected to the plurality of first substrate contacts, the wiring accommodating portion can be omitted, and the substrate holder can be downsized and cost can be reduced. Further, by arranging the wirings of the plurality of substrate contacts into the conductive path members, it is possible to ensure an increase in the sectional area of the conductive path members, and it is possible to reduce the wiring resistance per unit length of the conductive path members. Thereby, the difference in voltage drop across the path from the external connection portion to each of the first substrate contacts can be reduced. As a result, the plating current flowing through the respective first substrate contacts can be made uniform, and the thickness of the plating film can be made uniform. Further, since the wiring for the plurality of first substrate contacts is a conductive path member, the wiring size up to the plurality of first substrate contacts can be reduced, or the cable wiring can be omitted.

The substrate holder of the seventeenth aspect, wherein the first holding member has a plurality of first substrate contacts, and further has a second conductive path member connected to the first external connecting portion, and At least one of the plurality of first substrate contacts is separated from the first conductive path member.

The form is formed by dividing the conductive path into the first conductive path member and the second conductive path member, and applying a potential difference between the first conductive path member and the second conductive path member while holding the substrate in the substrate holder state , the power can be confirmed before the plating process. Further, by allocating a plurality of first substrate contacts to the first and second conductive path members, the difference in path length from the external connection portion to each of the first substrate contacts can be suppressed. For example, by assigning the first substrate connection contacts of the respective half portions of the first holding member symmetrical to the first and second conductive path members, the path length difference from the external connection portion to each of the first substrate contacts can be made. Roughly the same. In addition, each conductive path member can be replaced.

A substrate holder according to the eighteenth aspect, wherein at least one of the first conductive path member and the second conductive path member is divided into a plurality of path pieces.

In this form, each path piece can be replaced. For example, when a treatment liquid leaks in the substrate holder, depending on the posture of the substrate holder in the treatment tank, there is a portion that is easily affected by the treatment liquid. When the substrate holder is placed in the plating tank in an upright position, when the treatment liquid leaks, the treatment liquid is likely to accumulate in the vicinity of the lowermost portion of the substrate holder. Therefore, the processing liquid leaks, and only when the path piece near the lowermost portion of the substrate holder contacts the processing liquid, instead of replacing the entire conductive path member, only the path piece contacting the processing liquid is replaced. The cost can be reduced compared to when replacing the entire substrate holder, or the entire conductive path member. Further, by forming the respective path sheets and then combining them, the conductive path members can be manufactured at low cost.

According to a twenty-first aspect, the substrate holder of the seventeenth aspect, wherein the first conductive path member is plate-shaped or rod-shaped.

By forming the first conductive path member into a plate shape, the thickness of the substrate holder can be suppressed from increasing. By forming the first conductive path member into a rod shape, it is easy to process along the shape of the curved conductive path.

The substrate holder of any one of the seventeenth to twentieth aspects, wherein the second holding member has a second opening portion for exposing the second surface of the substrate, and having: at least a second substrate contact contacting the second surface of the substrate for supplying current to the second surface of the substrate; a second external connection portion; and a third conductive path member connected to The second external connection portion is in contact with the at least one second substrate; and the second substrate contact is detachably mounted on the third conductive path member.

In this embodiment, the effects of the above-described embodiments can be achieved in the respective holding members of the substrate holder for the double-side plating treatment.

A second aspect of the invention provides a plating apparatus comprising: a substrate holder for holding a substrate; a substrate attaching and detaching portion for attaching and detaching the substrate to the substrate holder; and a plating groove for use The plating process is performed on the substrate holder holding the substrate. The substrate holder includes: a first holding member having a first opening for exposing a first surface of the substrate; and a second holding member for sandwiching the substrate with the first holding member And keep it. The first holding member has: a first external connecting portion; at least one first substrate contact contacting the first surface of the substrate for supplying current to the first surface of the substrate; and first a conductive path member connected to the first external connection portion and the at least one first substrate contact; the first conductive path member detachably mounting the first substrate contact, the first conductive path member The utility model is disposed in a space sealed by the first holding member and the second holding member, and is detachably attached to the body of the first holding member. This form can achieve the same effects as the seventeenth aspect.

The embodiments of the present invention have been described above based on a few examples, but the embodiments of the invention are not intended to limit the invention. The present invention may be modified and improved without departing from the scope of the invention, and the invention may of course include equivalents thereof. For example, the shape of the large substrate is not limited to a rectangle, and may be a square shape, or may be other polygonal shapes such as a pentagon or a hexagon. Further, the present invention can be applied to a substrate attaching and detaching device that attaches and detaches a circular-shaped substrate to a substrate holder. Further, within the scope of at least a part of the above-mentioned problems, or at least a part of the effect, the components described in the claims and the description can be arbitrarily combined or omitted.

The present application claims priority based on Japanese Patent Application No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. The Japanese Patent Application No. 2017-126582, filed on June 28, 2017, and the specification of the Japanese Patent Application No. 2018-079388, filed on April 17, 2018, the entire disclosure of The disclosure is incorporated herein by reference in its entirety.

The specification, the scope of the patent application, and the summary of the invention are disclosed in the specification of the Japanese Patent Publication No. Hei. No. 2008-184692 (Patent Document 1), JP-A-2008-184692 (Patent Document 2), and U.S. Patent No. 82,615,151 (Patent Document 3). The disclosure is incorporated herein by reference in its entirety.

Claims (22)

 A substrate holder for holding a substrate, comprising: a first holding member having a first opening for exposing a first surface of the substrate; and a second holding member for use in the foregoing The first holding member is held together with the substrate, and has a second opening for exposing the second surface of the substrate; the first holding member has: at least one first substrate contact, which is used for Supplying current to the first surface of the substrate; at least one first external connection contact; and at least one first wiring electrically connecting the at least one first substrate contact and the at least one first external Connecting the contact; the second holding member has: at least one second substrate contact for supplying current to the second surface of the substrate; at least one second external connection contact; and at least one a second wiring electrically connecting the at least one second substrate contact and the at least one second external connection contact; wherein the at least one first external connection contact and the at least one second external connection Contact is electrically independent    The substrate holder of claim 1, wherein the first holding member has: a plurality of the first substrate contacts; a plurality of the first external connection contacts; and a plurality of the first wirings The plurality of the first substrate contacts are connected to the plurality of the first external connection contacts.    The substrate holder of claim 1, wherein the first holding member has a first arm portion, and the at least one first outer connecting contact is disposed on the first arm portion, and the second holding member has The second arm portion, the at least one second external connection contact is disposed on the second arm portion, and the at least one first external connection contact and the at least one second external connection contact are located at the substrate holder The left and right ends.    The substrate holder of claim 1, wherein the first holding member has a first arm portion, and has a substrate holder for positioning the substrate holder in the plating groove on both sides of the first arm portion First and second positioning portions.    The substrate holder of claim 1, wherein the first holding member has a first body portion, the first body portion has the first opening portion, and the second holding member has a second body portion, the second portion The main body portion has the second opening portion, and the first body portion and the second body portion have a positioning structure that meshes with each other.    The substrate holder of claim 1, wherein the first holding member has: a first body portion having the first opening portion; and a first arm portion coupled to the first body portion The second holding member has: a second main body portion having the second opening portion; and a second arm portion attached to one end side of the second main body portion; wherein, in the foregoing In a state in which the holding member is engaged with the second holding member, the first arm portion and the second arm portion are arranged in a direction from the first and second body portions toward the first and second arm portions.    The substrate holder of claim 1, wherein the first holding member has: a first body portion having the first opening portion and the at least one of the first substrate contacts; and a first arm portion Having at least one of the first external connection contacts; and a first wiring accommodating portion disposed between the first body portion and the first arm portion for accommodating the at least one first The excess length of the wiring.    The substrate holder of claim 7, wherein the first wiring accommodating portion is integrally formed with a first mounting portion that mounts the first body portion to the first arm portion.    The substrate holder of claim 8, wherein the first wiring accommodating portion has a first protruding portion that protrudes toward the first body portion, and the first body portion has two second protruding portions. It protrudes from both sides of the first protruding portion of the first wiring accommodating portion.    The substrate holder of claim 7, wherein the wall of the first wiring accommodating portion is on the side of the outer surface of the substrate holder at a portion where the first wiring accommodating portion and the first body portion are connected to each other The outer sides of the walls of a body portion overlap.    The substrate holder according to claim 7, wherein the substrate holder is disposed in the plating tank when the substrate holder is disposed in the plating chamber, and the plating layer is located The above manner constitutes the aforementioned first holding member.    The substrate holder of claim 1, wherein the first holding member has a first substrate contact for supplying current to the first surface of the substrate, and the second holding member has a second substrate a point for supplying a current to the second surface of the substrate, a first contact fixing portion for fixing the first substrate contact in the first holding member, and a second substrate for the second substrate The second contact fixing portion that is fixed in the second holding member at the contact does not overlap each other when the first holding member and the second holding member are engaged.    The substrate holder of claim 12, wherein the first holding member has a first sealing holder disposed on an outer side of the first opening portion, and the second holding member has a second sealing holder, Provided on the outer side of the second opening, the first and second substrate contacts are respectively attached to the first and second sealing holders by the first and second contact fixing portions, and are used for a first holder fixing portion fixed in the first holding member by the first sealing holder and a second holder fixing portion for fixing the second sealing holder in the second holding member, The first holding member and the second holding member do not overlap each other in an engaged state.    The substrate holder of claim 1, wherein the first holding member has a first seal disposed around the first opening portion, and the second holding member has a second seal, which is provided in the foregoing At least one of the first holding member and the second holding member is further provided with an outer seal around the first seal and the second seal outside the second opening.    The substrate holder of claim 1, wherein the first and second openings are rectangular.    A plating apparatus comprising: a substrate holder for holding a substrate; a substrate attaching and detaching portion for detaching the substrate to the substrate holder; and a plating groove for holding the substrate of the substrate The holder is subjected to a plating treatment; and the conveyor is configured to convey the substrate holder; the substrate holder includes: a first holding member having a first opening for exposing the first surface of the substrate; and a second holding member held together with the first holding member sandwiching the substrate, and having a second opening for exposing the second surface of the substrate; the first holding member having: at least one first substrate a contact for supplying current to the first surface of the substrate; at least one first external connection contact; and at least one first wiring electrically connecting the at least one first substrate contact And the at least one first external connection contact; the second holding member has: at least one second substrate contact for supplying current to the second surface of the substrate; at least one second And at least one second wiring electrically connecting the at least one second substrate contact and the at least one second external connection contact; wherein the at least one first external connection The point is electrically independent of the at least one second external connection contact.    A substrate holder for holding a substrate, comprising: a first holding member having a first opening for exposing a first surface of the substrate; and a second holding member for use in the foregoing Holding the holding member together with the substrate; the first holding member has: a first external connecting portion; at least one first substrate contact contacting the first surface of the substrate for the substrate The first surface is supplied with current; and the first conductive path member is connected to the first external connection portion and the at least one first substrate contact; and the first conductive path member is detachably mounted to the first surface The first conductive path member is disposed in a space sealed by the first holding member and the second holding member, and is detachably attached to the body of the first holding member.    The substrate holder of claim 17, wherein the first holding member has a plurality of first substrate contacts, and further has a second conductive path member connected to the first external connecting portion, and the foregoing plurality At least one of the first substrate contacts is separated from the first conductive path member.    The substrate holder of claim 18, wherein at least one of the first conductive path member and the second conductive path member is divided into a plurality of path pieces.    The substrate holder of claim 17, wherein the first conductive path member is plate-shaped or rod-shaped.    The substrate holder according to any one of claims 17 to 20, wherein the second holding member has a second opening for exposing the second surface of the substrate, and has at least one second a substrate contact that contacts the second surface of the substrate for supplying current to the second surface of the substrate; a second external connection portion; and a third conductive path member connected to the second external portion The connecting portion is in contact with the at least one second substrate; wherein the second substrate contact is detachably mounted on the third conductive path member.    A plating apparatus comprising: a substrate holder for holding a substrate; a substrate attaching and detaching portion for detaching the substrate to the substrate holder; and a plating groove for holding the substrate The substrate holder is subjected to a plating treatment; the substrate holder includes: a first holding member having a first opening for exposing a first surface of the substrate; and a second holding member for The first holding member is held together with the substrate; the first holding member has: a first external connecting portion; at least one first substrate contact contacting the first surface of the substrate for The first surface of the substrate is supplied with current; and the first conductive path member is connected to the first external connection portion and the at least one first substrate contact; and the first conductive path member is detachably mounted In the first substrate contact, the first conductive path member is disposed in a space sealed by the first holding member and the second holding member, and is detachably attached to the foregoing A holding member of the body.