JPS545380A - Impurity introducing method for semiconductor wafer and its jig - Google Patents
Impurity introducing method for semiconductor wafer and its jigInfo
- Publication number
- JPS545380A JPS545380A JP6982977A JP6982977A JPS545380A JP S545380 A JPS545380 A JP S545380A JP 6982977 A JP6982977 A JP 6982977A JP 6982977 A JP6982977 A JP 6982977A JP S545380 A JPS545380 A JP S545380A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- jig
- wafer
- introducing method
- impurity introducing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To enable the use of a thin wafer, by sealing up the wafer into the upper and lower frame bodies containing the groove which supports two sheets two sheets of the semiconductor wafer oppositely inside, supplrting the frame bodies via the basket-type frame body to provide them into process furnace and applying a deposition only to the outer side surface of the exposed wafer.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6982977A JPS545380A (en) | 1977-06-15 | 1977-06-15 | Impurity introducing method for semiconductor wafer and its jig |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6982977A JPS545380A (en) | 1977-06-15 | 1977-06-15 | Impurity introducing method for semiconductor wafer and its jig |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS545380A true JPS545380A (en) | 1979-01-16 |
Family
ID=13414038
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6982977A Pending JPS545380A (en) | 1977-06-15 | 1977-06-15 | Impurity introducing method for semiconductor wafer and its jig |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS545380A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01259528A (en) * | 1988-04-08 | 1989-10-17 | Hitachi Ltd | Wafer supporting device for semiconductor wafer heat-treating apparatus, and semiconductor wafer heat-treating apparatus |
US5000371A (en) * | 1987-08-24 | 1991-03-19 | Cooper Industries, Inc. | Method of producing a metallic interface |
US5169453A (en) * | 1989-03-20 | 1992-12-08 | Toyoko Kagaku Co., Ltd. | Wafer supporting jig and a decompressed gas phase growth method using such a jig |
-
1977
- 1977-06-15 JP JP6982977A patent/JPS545380A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5000371A (en) * | 1987-08-24 | 1991-03-19 | Cooper Industries, Inc. | Method of producing a metallic interface |
JPH01259528A (en) * | 1988-04-08 | 1989-10-17 | Hitachi Ltd | Wafer supporting device for semiconductor wafer heat-treating apparatus, and semiconductor wafer heat-treating apparatus |
US5169453A (en) * | 1989-03-20 | 1992-12-08 | Toyoko Kagaku Co., Ltd. | Wafer supporting jig and a decompressed gas phase growth method using such a jig |
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