JPS54152463A - Manufacture of semiconductor element - Google Patents

Manufacture of semiconductor element

Info

Publication number
JPS54152463A
JPS54152463A JP6147978A JP6147978A JPS54152463A JP S54152463 A JPS54152463 A JP S54152463A JP 6147978 A JP6147978 A JP 6147978A JP 6147978 A JP6147978 A JP 6147978A JP S54152463 A JPS54152463 A JP S54152463A
Authority
JP
Japan
Prior art keywords
wafer
adhesives
substrate
metal
metal plates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6147978A
Other languages
Japanese (ja)
Inventor
Takashi Mizuguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP6147978A priority Critical patent/JPS54152463A/en
Publication of JPS54152463A publication Critical patent/JPS54152463A/en
Pending legal-status Critical Current

Links

Landscapes

  • Dicing (AREA)

Abstract

PURPOSE: To simplify extremely a check on the appearance of an element in an incomplete shape at the circumference of a semicondutor wafer, by coating the element with a substance which is not dipped during a removing process for adhesives fixing to a support substrate.
CONSTITUTION: Wafer 5 is N-type Si wafer 1 which has P-type region 2 on the entire surface at its one side and metal electrodes 3 and 4 on both its sides. Next, metal layer 4 is bonded to glass substrate 7 via adhesives 6. Then, metal layer 3 is coated with adhesives 8 and several metal plates 9 are bonded to an adhesive vinyl sheet, etc., after metal plate 9 is stuck to wafer 5, the sheet is peeled off. Next, parts which are not covered with metal plates 9 of wafer 5 are removed by cutting. Then, only element 10a under metal plates 9a stuck projecting partially from the circumference of wafer 5 is covered with a substance which is not dipped in a solution for the removal of adhesives 6 and 8. In consequence, defective element 10a is left on substrate 7 after element 10 is peeled off from substrate 7, so that there will be no need to makes a check on the total number of elements after the peeling process.
COPYRIGHT: (C)1979,JPO&Japio
JP6147978A 1978-05-22 1978-05-22 Manufacture of semiconductor element Pending JPS54152463A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6147978A JPS54152463A (en) 1978-05-22 1978-05-22 Manufacture of semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6147978A JPS54152463A (en) 1978-05-22 1978-05-22 Manufacture of semiconductor element

Publications (1)

Publication Number Publication Date
JPS54152463A true JPS54152463A (en) 1979-11-30

Family

ID=13172239

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6147978A Pending JPS54152463A (en) 1978-05-22 1978-05-22 Manufacture of semiconductor element

Country Status (1)

Country Link
JP (1) JPS54152463A (en)

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