JPS5586135A - Preparation of semiconductor device - Google Patents
Preparation of semiconductor deviceInfo
- Publication number
- JPS5586135A JPS5586135A JP16162678A JP16162678A JPS5586135A JP S5586135 A JPS5586135 A JP S5586135A JP 16162678 A JP16162678 A JP 16162678A JP 16162678 A JP16162678 A JP 16162678A JP S5586135 A JPS5586135 A JP S5586135A
- Authority
- JP
- Japan
- Prior art keywords
- film
- films
- jig
- chips
- cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Dicing (AREA)
Abstract
PURPOSE: To avoid damaging chips when cracking them, and further, arrange and adhere the cut chips at appropriate intervals on a plastic film.
CONSTITUTION: The surface without scribed grooves 2 of a silicon substrate 1 is adhered to a plastic film 3 and the film is fixed to a cover 4, a film 7 of the same material is fixed to a jig 6 and the cover and the jig with the films are mounted on a pressure reducing jig 11 one over the other. Evacuating air between the films 3 and 7 first from 12 and then introducing air from 10, the two films are vacuum adhered. Next, being placed on a jig 13 with the grooves 2 downwards and pressed with a roller 14, chips 16 are packed between the two films at prescribed intervals without being damaged. Next, they are placed on a vacuum chuck 17 with the cover 4 downwards and after the film 3 is absorbed onto a filter 18, the surface of the film 7 is heated by infrared rays 19, etc., while air is introduced fom 12, then, the film 7 peels off from the surface of the chips 16. Next, the film 3 is removed from the chuck 17. By so constructing, the yield and the reliability of the device are improved and automatic assembly is enabled.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16162678A JPS5586135A (en) | 1978-12-23 | 1978-12-23 | Preparation of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16162678A JPS5586135A (en) | 1978-12-23 | 1978-12-23 | Preparation of semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5586135A true JPS5586135A (en) | 1980-06-28 |
JPS5735583B2 JPS5735583B2 (en) | 1982-07-29 |
Family
ID=15738750
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16162678A Granted JPS5586135A (en) | 1978-12-23 | 1978-12-23 | Preparation of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5586135A (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50142163A (en) * | 1974-05-07 | 1975-11-15 |
-
1978
- 1978-12-23 JP JP16162678A patent/JPS5586135A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50142163A (en) * | 1974-05-07 | 1975-11-15 |
Also Published As
Publication number | Publication date |
---|---|
JPS5735583B2 (en) | 1982-07-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ES353893A1 (en) | Method for separating substrates | |
JPS51114886A (en) | Photocoupling semiconductor device and its manufacturing process | |
CA2143077A1 (en) | Process for Fabricating an Integrated Circuit | |
JPS54132675A (en) | Overlaying method | |
JPS5586135A (en) | Preparation of semiconductor device | |
JPS5478026A (en) | Production of solid color image pickup unit | |
JPS5570041A (en) | Apparatus for fabricating semiconductor device | |
JPS5583239A (en) | Mounting tip element | |
JPS5599741A (en) | Affixing method of article onto adhesive tape | |
JPS5543871A (en) | Packaging of semiconductor device | |
SU917366A1 (en) | Method and device for forming protective coating | |
JPS5578544A (en) | Pelletization of semiconductor wafer | |
JPS53137685A (en) | Manufacture for semiconductor device | |
JPS61296734A (en) | Wafer tape mounting method and apparatus | |
JPS5388573A (en) | Production of beam lead type semiconductor device | |
JPS54152463A (en) | Manufacture of semiconductor element | |
JPS546455A (en) | Dicing method for semiconductor wafer | |
JPS54137972A (en) | Manufacture of semiconductor device | |
JPS54107256A (en) | Semiconductor device mounting method | |
JPS5553438A (en) | Treatment of semiconductor substrate | |
EP0171801A3 (en) | Method for processing a backside illuminated detector assembly | |
JPS55123666A (en) | Method and apparatus to arrange and bond a number of small pieces to substrate | |
JPS5375866A (en) | Wafer transfer device | |
JPS56114353A (en) | Method of separating semiconductor wafer and wafer fixing plate | |
JPS54113253A (en) | Bonding method of semiconductor pellet |