JPS61296734A - Wafer tape mounting method and apparatus - Google Patents

Abstract

PURPOSE:To realize mounting of wafer to the tape without giving damage to the wafer surface by pressing the wafer surface through the protection tape on the occasion of adhering the wafer to the tape. CONSTITUTION:A wafer 4 is adhered at the rear surface to the adhesive side of an adhesive tape 10 while it is pressed by the upper and lower rollers 5a, 5b. In this case, since there is a protection tape 12 at the surface of wafer 4, namely between the upper roller 5a which presses the circuit forming side and the wafer surface, if a foreign matter such as a silicon piece is adhered to the upper roller 5a which presses the circuit forming surface, the circuit surface at the wafer surface may be directly protected from damage. Moreover, since the protection tape 12 is always supplied as the new tape surface to the upper roller 5a from a protection tape supply roller 11, there is no fear that the wafer surface is damaged by adhesion of foreign matter to the protection tape 12.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a technique that is effective when applied to a so-called wafer tape mount in which a wafer is attached to a tape when dividing a wafer.

[Background Art] In the manufacturing process of semiconductor devices, there is a so-called wafer dividing process in which a semiconductor wafer having a predetermined circuit layer formed on its surface is divided into pellet sections. Here, the wafer is provided to the process while being attached to a tape stretched over a frame made of metal or the like.

The reason why the wafer is provided to the process in a tape-mounted state is to ensure that each pellet after division is held and to facilitate transportation.

By the way, the following method can be considered as a mechanism for tape mounting the wafer in order to provide the above process.

That is, FIG. 5 is a schematic diagram showing the outline of the tape mount mechanism. According to this tape mount mechanism 51, the wafer 52 is first subjected to positional correction, that is, alignment, at position A. As a method for this alignment, for example, a method can be considered in which the orientation flat 52a of the wafer 52 is aligned in a predetermined direction using positioning pins or the like. The wafer 52 that has been aligned in this manner is placed on the mount stage 53 with its front and back surfaces turned over by 180 degrees by a vacuum suction arm (not shown), that is, with the wafer surface in contact with the stage surface. Ru. At the same time, a ring-shaped frame member 54 made of a metal member is carried and placed on the mount stage 53 at a predetermined position. Thereafter, the mount stage 53 moves upward with the wafer and frame member placed thereon. This mount stage 5
3, the adhesive tape 58 stretched from above the mount stage 53 by the supply roller 56 and the take-up roller 57 via a plurality of guide rollers 55a-c is pushed down by the tape mount chamber 59. . At this time, the adhesive surface 5a of the adhesive tape 58 is the lower surface, that is, the mount stage 5
3 side, this tape mount chamber 59
By the pressing operation, the frame member 54 and the wafer 52 are adhered to the adhesive surface 58a of the adhesive tape 58 with the back side facing up. When the wafer 52 and the frame member 54 are attached to the adhesive surface 58a of the adhesive tape 5th in this way, the adhesive tape 5B is cut along the frame member 54 by a tape cutter (not shown) installed inside the tape mount chamber 59. The wafer tape is then cut to complete the wafer tape mounting process.

By the way, with this wafer tape mounting method,
Since the wafer 52 is placed on the stage with the front side, which is the circuit forming surface, in surface contact with the stage surface 53a of the mount stage 53, if there is a foreign object such as a piece of silicon on the stage surface 53a, The inventor of the present invention has revealed that the surface of the wafer 52 may be damaged and the product may be defective.

Furthermore, as shown in FIG. 5, since the alignment of the wafer 52 is performed at a position A away from the mount stage 53,
The inventor has also revealed that it is difficult to ensure accurate positioning with respect to the frame member 54 when the wafer 52 is placed on the stage 53.

That is, this means that the wafer 52 is stuck to the adhesive tape 58 without accurate positioning, and the frame member 5
First, if there is a large positional deviation, dicing (cutting) the wafer 52 will be performed.
When cutting the wafer, it was not possible to cut it accurately and the wafer 5
2. This will result in poor cutting on the top. And secondly,
It was revealed that even if the positional deviation is minute, there is a risk that the collet may damage the corners of the pellet when each pellet is adsorbed by the collet.

An example of a wafer splitting technique explained is Kogyo Chosenkai Co., Ltd., published on January 15, 1980.
"IC Mounting Technology" (Japan Micro 1 Electronics Association #M), P100-P101.

[Object of the Invention] An object of the present invention is to provide a technique that allows tape mounting of a wafer without damaging the wafer surface.

Another object of the present invention is to provide a technique that allows accurate positioning of a wafer and a frame member.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Summary of the Invention] A brief overview of typical inventions disclosed in this application is as follows.

That is, after the surface of the wafer is covered with protective tape and the surface of the wafer is pressed to adhere and fix the wafer onto the tape, the position of the wafer on the tape is recognized, and the frame member is adjusted based on the recognition information. After performing positioning by moving a predetermined amount, the frame member is placed on the tape so as to maintain a predetermined positional relationship with the wafer, and the tape is further cut into a predetermined shape corresponding to the frame shape. When attaching the wafer to the tape, the wafer surface can be pressed through the protective tape, and the wafer can be mounted on the tape without damaging the wafer surface.

Further, since the alignment between the wafer and the frame member can be performed at the same position as the attachment of the frame member, the wafer and the frame member can be accurately positioned.

[Example 1] Fig. 1 is a schematic diagram showing the outline of a wafer tape mounting device which is an embodiment of the present invention, Fig. 2 is a schematic diagram showing a mechanism for feeding a wafer to an adhesive tape, and Fig. 3 is a fat diagram. is a plan view showing the wafer mount frame obtained in this example, (b
Figure 1 is a sectional view taken along line bb in figure fa1.

The wafer tape mounting apparatus 1 of the first embodiment is equipped with a supply cartridge 2 on the loader side, and a storage cartridge 3 on the unloader side, and the wafer 4 is transferred between these two cartridges 2 and 3, and then The tape is mounted using this mechanism.

A belt mechanism 6 as a wafer transfer means is provided between the supply cartridge 2 and the laminating roller 5, and as shown in FIG. 2, a stopper pin 7 is protruded from the end of the belt mechanism 6. The guide arm 8 is attached so that it can move up and down. The laminating rollers 5 are a pair of rollers 5a that rotate so as to sandwich the wafer 4 therebetween.

5b, an adhesive tape 10 supplied from an adhesive tape supply roller 9 is wrapped around the lower roller 5b about half a circumference with the adhesive side facing upward, and
The protective tape 12 is supplied from the protective tape supply roller 11.
is wrapped around about 1/4 of the way around it. Here, the adhesive tape 10 and the protective tape 12 are both made of polyester resin, for example, and the adhesive tape 10 is coated with an adhesive on one side. This adhesive tape 10 also functions as a transport system that adheres the wafer 4 to the adhesive surface and transports the wafer 4 between each process as the adhesive tape 10 advances. - On the other hand, the protective tape 12 is wound up by a protective tape take-up roller 15' installed above the peeling roller 14, which is installed in front of the frame mount mechanism 13 when viewed from the wafer advancing direction. It has become.

The frame mount mechanism 13 includes a mount stage 16 provided below where the adhesive tape 10 advances, a position recognition camera 17, and a frame member holding means (not shown) that is movable slightly in the X, Y, and θ directions. The frame members held in said means are shown in FIG.
(As shown in bl, it has a ring shape made of a metal member such as a stainless alloy. For example, if the diameter of the wafer 4 is 125N, the maximum diameter of the frame member is 1
95 fi, and the ring width M can be about 15 m, that is, the inner diameter of the ring can be about 165 fi.

A tape cutting mechanism 19 is provided further forward of the frame mount mechanism 13 in the wafer advancing direction. This tape cutting mechanism 19 includes a canter mount 20 having a vacuum suction port 20a, and a tape cutting mechanism 19 that cuts the adhesive tape 10 while rotating a substantially central part of the frame from the back side of the frame member 18 in a circumferential manner along the frame shape. It has a tape cutter 21 for cutting (the broken line portion in FIG. 3 fa1).

Further forward of the tape cutting mechanism 19, a guide roller 2 is provided.
2 and the remaining adhesive tape 10b cut into a predetermined shape
A take-up roller 23 is provided for winding up. Further, a belt mechanism 24 is installed between the guide roller 22 and the storage cartridge 3.

Next, the operation of the first embodiment will be explained.

The wafer 4 taken out from the supply cartridge 2 is the front surface,
That is, once it is transferred to the guide arm 8 via the belt mechanism 6 with the circuit forming surface facing upward, its progress is once stopped by the stopper bin 7. Here stopper pin 7
is the wafer orientation flat 4a (Fig. 3f)
Since a plurality of wafers 4 are protruded in the linear direction corresponding to the direction shown in FIG. will be held.

Next, as shown by the broken line in FIG. 2, the stopper pin 7 is released from the top of the guide arm 8, and the tip of the guide arm 8 is tilted downward. As a result, the wafer 4 on the guide arm 8 slides on the guide arm 8, and its orientation flat 4a comes into contact with the lower roller 5b side of the laminating roller 5. Here, lower roller 5
Since the adhesive tape 10 supplied from the adhesive tape supply roller 9 is partially wrapped around b with the adhesive surface facing the outer circumferential side, the wafer 4 has its orientation flat 4a fixed to the adhesive tape 10. As the adhesive tape 10 advances in this state, the rollers 5a, 5. It is inserted between b.

In this way, the back surface of the wafer 4 is stuck to the adhesive side of the adhesive tape 10 while being pressed by the upper and lower rollers 5a and 5b. At this time, since the protective tape 12 is interposed between the upper roller 5a that presses the surface of the wafer 4, that is, the circuit-forming surface side, and the wafer surface, if the upper roller 5a that presses the circuit-formed surface Even if foreign matter such as the like is attached, direct damage to the circuit surface on the wafer surface can be prevented. Furthermore, since the new surface of the protective tape 12 is always supplied to the upper roller 5a by the protective tape supply roller 11, there is no risk of damage to the wafer surface due to foreign matter adhering to the protective tape 12. Immediately before the protective tape 12 is sent to the frame mount mechanism 13, it is peeled off from the surface of the wafer 4 by a peeling roller 14 and wound up by a protective tape winding roller 15. In this way, by peeling off the protective tape 12 from the surface of the wafer 4 just before the frame mount mechanism 13,
In the frame mounting process, the resolution of the position recognition camera 17 is improved, and position recognition accuracy can be maintained at a high level. Note that, after the protective tape 12 is wound up by the winding roller 15, the wafer contact side of the tape surface may be cleaned and used again.

When the wafer 4 attached to the adhesive tape 10 is sent to the frame mounting mechanism 13, the frame member 18
Alignment is performed. In this alignment,
First, the position of the wafer 4 on the adhesive tape 10 is recognized by the position recognition camera 17. Next, based on the above recognition information, the position of the frame member 18 is adjusted to move in the X, Y, and θ directions by a frame member holding means (not shown).

Here, when using a ring-shaped frame member 18, for example, the frame member 18 is aligned so that the wafer 4 is located at the center of the inner diameter of the ring. With the position corrected by alignment, the frame member 1 is lowered and the adhesive tape 1 is placed around the wafer 4.
0 adhesive surface. In this way, in the first embodiment, the frame member 18 is attached immediately before the frame member 18 is attached.
Since the positional relationship between the frame member 8 and the wafer 4 is aligned, the positional relationship with the wafer 4 can be maintained with high accuracy when the frame member 18 is attached.

As described above, when the frame member 18 is attached around the wafer 4 on the adhesive tape 10, the wafer 4 is transferred to the tape cutting mechanism 19. In the tape cutting machine 119, the cutter mount 20 is lowered at a predetermined position to perform vacuum suction between the frame member 18 and the wafer 4. While maintaining the suction state in this way, the tape cutter 21
moves upward and cuts the adhesive tape into a disk shape along the ring width of the frame member 18 (the portion shown by the broken line in the fat diagram in FIG. 3). In this way, the disc-shaped adhesive tape 1
A so-called wafer mount frame 25 can be obtained in which the frame member 18 and the wafer 4 are attached to 0a (Fig. 3 (Figs. The loaded state is transferred onto the belt mechanism 24 and housed in the storage cartridge 3 on the unloader side.

[Embodiment 2] FIG. 4 is a schematic diagram showing a tape cutting mechanism portion of a wafer tape mounting apparatus according to another embodiment of the present invention. In the tape cutting mechanism 41 of this embodiment 2, the adhesive tape 10
The cutter mount 42 is provided downward, while the tape cutter 43 is provided upward relative to the wafer 4 and the frame member 18 that are attached to the surface. That is, when the wafer 4 with the frame member 18 attached around it is transferred onto the cutter mount 42 , the tape cutter 43 is lowered and the frame member 18 is attached to the wafer 4 .
Cut the adhesive tape 10 along the outer periphery of the adhesive tape 10.

In this manner, in the second embodiment, by cutting the adhesive tape IO from above the frame member 18, cutting of the adhesive tape 10 can be completed without performing vacuum suction using the counter mount 42.

[Effects] (1) After fixing the wafer on the tape while covering the surface of the wafer with protective tape, the position of the wafer on the tape is recognized, and the frame member is moved by a predetermined amount based on the recognition information. The wafer tape mounting method comprises: after positioning the wafer on the tape, attaching the frame member to the wafer on the tape so as to maintain a predetermined positional relationship, and further cutting the tape into a predetermined shape corresponding to the frame shape. Therefore, when attaching the wafer to the tape, the wafer surface can be pressed through the protective tape, and the wafer can be mounted on the tape without damaging the wafer surface.

(2) By moving the frame member a predetermined amount and positioning it, and then attaching the frame member to the tape on which the wafer is attached, the frame member and the wafer can be aligned at the same position. Therefore, it is possible to accurately ensure alignment accuracy and prevent misalignment between the frame member and the wafer.

(3) According to (2) above, it is possible to prevent misalignment between the frame member and the wafer, thereby preventing cutting defects when dividing the wafer.

(4) By peeling off the protective tape from the wafer surface immediately before the frame mount mechanism, the resolution of the position recognition camera is improved and highly accurate alignment can be performed.

Although the invention made by the present inventor has been specifically explained above based on Examples, it goes without saying that the present invention is not limited to the Examples and can be modified in various ways without departing from the gist thereof. Nor.

For example, in the embodiments, a ring-shaped frame member made of a metal member such as a stainless alloy is described, but it may also be made of plastic, and the shape is not limited to a ring-shaped frame member. It's okay.

[Brief explanation of drawings]

Fig. 1 is a schematic diagram showing the outline of a wafer tape mounting device according to the first embodiment of the present invention, Fig. 2 is a schematic diagram showing the mechanism for feeding a wafer to the adhesive tape of the first embodiment, and Fig. 3 is a diagram ia1. A plan view showing the wafer mount frame obtained in Example 1, FIG.
FIG. 4 is a schematic diagram showing a tape cutting mechanism portion of a wafer tape mounting apparatus according to a second embodiment of the present invention, and FIG. 5 is a schematic diagram showing an outline of a tape mounting mechanism that can be considered as background art. DESCRIPTION OF SYMBOLS 1... Wafer tape mounting device, 2... Supply cartridge, 3... Accommodation cartridge, 4... Wafer, 5... Laminating roller, 5a... Upper roller,
5b... Lower roller, 6... Belt mechanism, 7...
7 Pabin, 8... Guide arm, 9... Adhesive tape supply roller, 10... Adhesive tape, 11... Protective tape supply roller, 12... Protective tape, 13...
・Frame mount mechanism, 14...Peeling roller, 15
...Protective tape winding roller, 16...Mount stage, 17...Position recognition camera, 18...Frame member, 19...Tape cutting mechanism, 20...-Canter mount, 20a... - Vacuum suction port, 21... Tape cutter, 22... Guide roller, 23... Winding roller, 24... Belt mechanism, 41... Tape cutting mechanism, 42... Cutter mount, 43 ...
tape cutter, 51... tape mount mechanism, 52
... Wafer, 52a... Orientation flat, 53... Mount stage, 53a... Stage surface, 54... Frame member, 55 a - c...
Guide roller, 56... Supply roller, 57... Take-up roller, 5th... Adhesive tape, 59... Tape mount chamber Fig. 2 (me) 4th interval 5th
figure

Claims (1)

[Claims] 1. After the back side of the wafer is adhesively fixed on the tape by pressing the front side of the wafer while the front side of the wafer is covered with a protective tape, the position of the wafer on the tape is recognized. , after positioning the frame member by moving it a predetermined amount based on the recognition information, placing the frame member so as to maintain a predetermined positional relationship with the wafer on the tape, and further adjusting the tape to the frame shape. A wafer tape mounting method characterized by cutting the wafer into a predetermined shape. 2. The wafer tape mounting method according to claim 1, wherein the protective tape is supplied to the surface of the wafer by a roller that rotates in synchronization with the advancing speed of the adhesive tape. 3. The wafer tape mounting method according to claim 1, wherein the protective tape on the wafer surface is peeled off before position recognition is performed. 4. The wafer tape mounting method according to claim 1, wherein the wafer adhesively fixed on the tape is transported between the steps by unwinding and winding the tape. 5. means for adhering and fixing the wafer on an adhesive tape; a position recognition means for recognizing the position of the wafer adhered and fixed on the tape; and a frame member based on the recognition information from the position recognition means. A wafer tape mounting device comprising: a sticking device that moves a predetermined amount and sticks the tape onto the tape; and a tape cutting device that cuts the tape into a predetermined shape corresponding to the shape of a frame member. 6. The wafer tape mounting apparatus according to claim 5, wherein the means for adhering and fixing the wafer onto the adhesive tape comprises means for protecting the surface of the wafer. 7. The wafer tape mounting apparatus according to claim 6, wherein the wafer surface protection means is a protective tape sticking mechanism.