JPS55123666A - Method and apparatus to arrange and bond a number of small pieces to substrate - Google Patents

Method and apparatus to arrange and bond a number of small pieces to substrate

Info

Publication number
JPS55123666A
JPS55123666A JP3063779A JP3063779A JPS55123666A JP S55123666 A JPS55123666 A JP S55123666A JP 3063779 A JP3063779 A JP 3063779A JP 3063779 A JP3063779 A JP 3063779A JP S55123666 A JPS55123666 A JP S55123666A
Authority
JP
Japan
Prior art keywords
substrate
pieces
tile
bond
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3063779A
Other languages
Japanese (ja)
Inventor
Koichi Nanbu
Haruhide Masada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toto Ltd
Original Assignee
Toto Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toto Ltd filed Critical Toto Ltd
Priority to JP3063779A priority Critical patent/JPS55123666A/en
Publication of JPS55123666A publication Critical patent/JPS55123666A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To bond a number of small pieces such as pieces of tile, etc. to a substrate, uniformly with a simple apparatus, regardless of the variation of the thickness and the uneven surface of the pieces, by arranging the pieces on the substrate with an adhesive, covering with a sheet, and evacuating the space between the sheet and the substrate.
CONSTITUTION: Pieces of tile 6 are turned upside down, and put into cavities 10 of a gauge 7 placed on a table 1. A substrate 11 is laid on the tile 6 putting an adhesive layer 16 therebetween. The tile pieces 6 and the substrate 11 are covered with a non-breathing synthetic resin film 18, and the circumferencial edge of the film 18 is hermetically fixed to a table 1 with a sealing means 19. The sealed space 20 is evacuated with a vacuum pump 5, whereby the substrate 11 is pressed with the atmospheric pressure to the tile pieces 6. After the curing of the adhesive 16, the fim 18 is released from the substrate.
COPYRIGHT: (C)1980,JPO&Japio
JP3063779A 1979-03-15 1979-03-15 Method and apparatus to arrange and bond a number of small pieces to substrate Pending JPS55123666A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3063779A JPS55123666A (en) 1979-03-15 1979-03-15 Method and apparatus to arrange and bond a number of small pieces to substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3063779A JPS55123666A (en) 1979-03-15 1979-03-15 Method and apparatus to arrange and bond a number of small pieces to substrate

Publications (1)

Publication Number Publication Date
JPS55123666A true JPS55123666A (en) 1980-09-24

Family

ID=12309343

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3063779A Pending JPS55123666A (en) 1979-03-15 1979-03-15 Method and apparatus to arrange and bond a number of small pieces to substrate

Country Status (1)

Country Link
JP (1) JPS55123666A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06136328A (en) * 1991-04-04 1994-05-17 Nippon Parker Raijingu Hiroshima Kojo:Kk Vacuum contact bonding apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06136328A (en) * 1991-04-04 1994-05-17 Nippon Parker Raijingu Hiroshima Kojo:Kk Vacuum contact bonding apparatus

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