JPS55123666A - Method and apparatus to arrange and bond a number of small pieces to substrate - Google Patents
Method and apparatus to arrange and bond a number of small pieces to substrateInfo
- Publication number
- JPS55123666A JPS55123666A JP3063779A JP3063779A JPS55123666A JP S55123666 A JPS55123666 A JP S55123666A JP 3063779 A JP3063779 A JP 3063779A JP 3063779 A JP3063779 A JP 3063779A JP S55123666 A JPS55123666 A JP S55123666A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- pieces
- tile
- bond
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To bond a number of small pieces such as pieces of tile, etc. to a substrate, uniformly with a simple apparatus, regardless of the variation of the thickness and the uneven surface of the pieces, by arranging the pieces on the substrate with an adhesive, covering with a sheet, and evacuating the space between the sheet and the substrate.
CONSTITUTION: Pieces of tile 6 are turned upside down, and put into cavities 10 of a gauge 7 placed on a table 1. A substrate 11 is laid on the tile 6 putting an adhesive layer 16 therebetween. The tile pieces 6 and the substrate 11 are covered with a non-breathing synthetic resin film 18, and the circumferencial edge of the film 18 is hermetically fixed to a table 1 with a sealing means 19. The sealed space 20 is evacuated with a vacuum pump 5, whereby the substrate 11 is pressed with the atmospheric pressure to the tile pieces 6. After the curing of the adhesive 16, the fim 18 is released from the substrate.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3063779A JPS55123666A (en) | 1979-03-15 | 1979-03-15 | Method and apparatus to arrange and bond a number of small pieces to substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3063779A JPS55123666A (en) | 1979-03-15 | 1979-03-15 | Method and apparatus to arrange and bond a number of small pieces to substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS55123666A true JPS55123666A (en) | 1980-09-24 |
Family
ID=12309343
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3063779A Pending JPS55123666A (en) | 1979-03-15 | 1979-03-15 | Method and apparatus to arrange and bond a number of small pieces to substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55123666A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06136328A (en) * | 1991-04-04 | 1994-05-17 | Nippon Parker Raijingu Hiroshima Kojo:Kk | Vacuum contact bonding apparatus |
-
1979
- 1979-03-15 JP JP3063779A patent/JPS55123666A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06136328A (en) * | 1991-04-04 | 1994-05-17 | Nippon Parker Raijingu Hiroshima Kojo:Kk | Vacuum contact bonding apparatus |
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