JPH0623774A - Molding method and device for molding material - Google Patents
Molding method and device for molding materialInfo
- Publication number
- JPH0623774A JPH0623774A JP17828092A JP17828092A JPH0623774A JP H0623774 A JPH0623774 A JP H0623774A JP 17828092 A JP17828092 A JP 17828092A JP 17828092 A JP17828092 A JP 17828092A JP H0623774 A JPH0623774 A JP H0623774A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- molding
- frame body
- molding material
- packing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、成型材料の成型方法と
その成型装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a molding method for a molding material and a molding apparatus therefor.
【０００２】[0002]
【従来の技術】従来は、多層印刷配線板等を成型するに
は、プリント配線板、プリプレグ、銅貼り樹脂板などの
被成形樹脂板を積み重ね、加熱加圧してプリプレグを溶
融させ、さらに熱硬化させることにより、多層積層板と
して成型されることが知られている。この加熱加圧する
方法には、平板プレスが採用されてきたが、近年は、こ
の方法の欠点を改良したオートクレーブ法が使用される
ようになった（例えば、特開昭６１ー４３５４３）図１
は、我々が最初に検討した方法であって、オートクレー
ブにおける成型断面図を示す。この方法ではシートを被
成型体に被覆後シールし、内部を減圧し、外部を加圧し
た状態で加熱して成型していた。しかして、一枚のシー
トを被成型体の上部及び全側面に被覆するため、シート
にしわが発生し亀裂の原因となり、特にコーナ部のシー
ルが不完全になりやすい。しかも一回しか使用できない
等の問題があった。この方法では、シートにシールテー
プを貼る時間がかかり、またシートを基板に張り合わせ
て真空を保持するための時間がかかり、シートの成型物
との密着を丁寧にしなければ亀裂のおそれがあり、加熱
加圧時にシートが破れて他の製品をだめにすることがあ
り、作業者の負担がかなり大きく、作業能率が悪い等の
問題があった。2. Description of the Related Art Conventionally, in order to mold a multilayer printed wiring board, etc., a printed wiring board, a prepreg, a resin plate to be molded such as a copper-clad resin plate are stacked, heated and pressed to melt the prepreg, and then thermoset. It is known that by doing so, it is molded as a multilayer laminate. A flat plate press has been adopted as the heating and pressurizing method, but in recent years, an autoclave method, which is an improvement of the drawbacks of this method, has come to be used (for example, JP-A-61-43543).
Shows the molding cross-section in the autoclave, which is the method we first examined. In this method, the sheet is covered with the molding target, then sealed, the interior is depressurized, and the exterior is pressurized and heated to mold. Then, since one sheet is coated on the upper surface and all side surfaces of the molded body, wrinkles are generated in the sheet, which causes cracks, and in particular, the corners are apt to be incompletely sealed. Moreover, there was a problem that it could only be used once. In this method, it takes time to attach the sealing tape to the sheet, and it takes time to attach the sheet to the substrate and maintain a vacuum, and if the sheet is not carefully adhered to the molded product, cracking may occur. There is a problem that the sheet may be broken during pressurization to spoil other products, the burden on the operator is considerably heavy, and the work efficiency is poor.
【０００３】[0003]
【発明が解決しょうとする課題】本発明は、上記の如き
問題に鑑みて検討された結果なされたものであり、シー
トの装着が簡単で、シートの破損がなく、長期的に何回
も使用できて、作業能率が上がる等の効果が期待できる
成型方法とその成型装置を提供せんとするものである。DISCLOSURE OF THE INVENTION The present invention has been made as a result of studies made in view of the above-mentioned problems, and it is easy to mount the seat, does not damage the seat, and is used many times in the long term. It is intended to provide a molding method and a molding apparatus which can be expected to bring about effects such as an increase in work efficiency.
【０００４】[0004]
【課題を解決するための手段】本発明者等は、上記種々
の問題点を解決し、安価でかつ作業性が高く、成型物を
一体化することを目的として鋭意検討を重ねた結果、図
３に断面図を示す如く該枠体が伸び率が高く引裂き強度
の大きい材質からなるもので成型物を覆い、該枠体の鍔
部の裏面に設けたシール用のパッキンを、基板に設けた
溝状のくぼみにはめ込みシールを施し、さらに真空排気
し、外部から加圧、加熱することで上記目的を達成する
ことができ、しかも枠体が繰り返し使用可能な効率よい
成型物が製造可能であることを見いだし本発明を完成す
るに至ったものである。Means for Solving the Problems The inventors of the present invention have solved the above-mentioned various problems, are inexpensive and have high workability, and have conducted extensive studies for the purpose of integrating molded products. As shown in the cross-sectional view in Fig. 3, the frame was made of a material having a high elongation and a high tear strength, and the molded product was covered, and the packing for sealing provided on the back surface of the flange portion of the frame was provided on the substrate. It is possible to achieve the above object by fitting a seal into the groove-shaped recess, further evacuating, and pressurizing and heating from the outside, and it is possible to manufacture an efficient molded product in which the frame body can be repeatedly used. This has led to the completion of the present invention.
【０００５】すなわち、本発明は、圧力容器の内部に置
かれた基板上に、銅箔、プリプレグ、内層材を積み重ね
た積層板用の成型材料を設置し、該成型材料の周囲を鍔
のある帽子型の枠体で覆い、該基板上と接触する該鍔部
の外周表面には、シール用のパッキンを備えて、基板上
の外周に設けられた溝部にはめ込み、基板に設けられた
排気口より内部を減圧すると共に、該圧力容器の内部を
気体を介して加圧、加熱して該成型材料と密着させ、基
板溝部と密着せしめて、該成型材料を成型することを特
徴とする成型材料の成型方法、および、圧力容器の内部
に置かれた、基板上の成型材料を覆うための周囲に鍔の
ある帽子状の枠体と、該鍔部の外周に設けたシール用パ
ッキンと、該基板上の外周に該パッキンを押し込むため
の溝が設けられ、真空排気できる基板の底部の排気口
と、該枠体の外部を加圧加熱する手段を備えてなること
を特徴とする成型材料の成型用装置、である。That is, according to the present invention, a molding material for a laminated plate in which a copper foil, a prepreg and an inner layer material are stacked is placed on a substrate placed inside a pressure vessel, and the periphery of the molding material has a collar. An exhaust port provided on the substrate, which is covered with a hat-shaped frame, is provided with a packing for sealing on the outer peripheral surface of the collar portion that comes into contact with the substrate, and is fitted into a groove provided on the outer periphery of the substrate. A molding material characterized by molding the molding material by further depressurizing the inside and pressurizing and heating the inside of the pressure vessel through a gas to bring the molding material into close contact with the substrate groove portion. And a cap-shaped frame body, which is placed inside the pressure vessel and has a brim around the brim to cover the molding material on the substrate, and a sealing packing provided on the outer periphery of the brim portion, A groove for pushing the packing is provided on the outer periphery of the substrate, Sky and outlet of the bottom of the substrate which can be evacuated, molding apparatus of the molded material characterized in that it comprises means for the external pressure heating of the frame body is.
【０００６】以下本発明をさらに詳細に説明する。本発
明において使用する枠体の材質としては、シリコンゴム
或はシリコンゴムにテフロンを張り合わせたもの及びポ
リアクリルゴム等から選ばれる。この内、シリコンゴム
としては、伸び率が高く、引裂き強度の強いものが挙げ
られる。また、シリコンゴムにテフロンを張り合わせた
ものは、テフロンの薄膜としたものが挙げられる。ま
た、ポリアクリルゴムで枠体と鍔とシール用バッキンを
形成したものが挙げられる。またシリコンゴムを張り合
わせたものでもかまわない。本発明においては、その何
れでも可能であるが、シリコンゴムからできたものは成
型体とよく密着し、材質の歪を減少させることができる
ことより好ましい。枠体の形状は、鍔のある帽子型でで
きており、鍔部には、外周にシール用パッキンを形成し
た形状である。該帽子型は、成型材料に密着しやすいサ
イズとし、真空排気時及び加熱、加圧した時点で、成型
材料の全体に均一に圧力がかかる形状とする。該シール
用パッキンは、基板と密着することで、枠体内を真空に
するため、枠体と密着性を増すために、同一材質あるい
は柔軟性のある異種の材質でできており、断面が、三角
形、四角形、台形、半球状等のいずれかで、外周にこれ
らの形状でシール用パッキンを形成する。The present invention will be described in more detail below. The material of the frame used in the present invention is selected from silicone rubber, silicone rubber to which Teflon is laminated, polyacrylic rubber, and the like. Among these, as the silicone rubber, one having a high elongation rate and a high tear strength can be mentioned. The Teflon laminated to the silicone rubber may be a Teflon thin film. Further, a frame body, a collar, and a sealing backing formed of polyacrylic rubber can be used. In addition, it is also possible to stick silicon rubber together. In the present invention, any of them is possible, but it is more preferable that the one made of silicone rubber is well adhered to the molded body and the strain of the material can be reduced. The frame is shaped like a cap with a collar, and the collar has a seal packing on the outer periphery. The hat mold is sized so as to be easily adhered to the molding material, and has a shape in which pressure is uniformly applied to the entire molding material at the time of evacuation, heating and pressurization. The sealing packing is made of the same material or different materials having flexibility in order to bring the inside of the frame into a vacuum by bringing it into close contact with the substrate. The sealing packing is formed in the shape of a square, a trapezoid, a hemisphere, or the like on the outer circumference.
【０００７】基板上に設けられた溝は、該シール用パッ
キンをこの溝にはめ込むことにより、密着性させる。さ
らに密着性を増すために、該シール用パッキンと同一の
形状或は異形でできているものを基板に接着するか焼き
付けることにより外周に形成してもよい。材質は基板そ
のものに溝を形成したもの、あるいは溝に枠体と同一か
異種のものでできている。外部の容器は、加圧、加熱す
るためのもので通常のオートクレーブが好ましい。The groove provided on the substrate is adhered by fitting the sealing packing into the groove. In order to further improve the adhesiveness, a member having the same shape as or a different shape from the sealing packing may be adhered to the substrate or baked to form the outer periphery. The material is made by forming a groove in the substrate itself, or by making the groove the same as or different from the frame body. The external container is for pressurizing and heating, and a normal autoclave is preferable.
【０００８】以下本発明の一実施例を図面を参照しなが
ら説明する。図２、図３は、本発明の斜視図及び断面図
をそれぞれ示す。加熱、圧力容器の内部に真空排気口
（６）を持つ基板（５）が配置され、その上に、好まし
くは、枠体内部を容易に減圧するためのディスパージャ
ー（９）を配置し、次に好ましくは、金型（１０）を置
く。多層プリント配線板基板用の成型材料（２）が置か
れ、さらにその上に好ましくは、金型（１０）を置いた
後、その周囲を、好ましくは、ブリーザシート（１）で
覆う。図は、これを、断面が鍔のある帽子型状の枠体
（８）で囲んだ状態を示している。An embodiment of the present invention will be described below with reference to the drawings. 2 and 3 show a perspective view and a sectional view of the present invention, respectively. A substrate (5) having a vacuum exhaust port (6) is arranged inside the heating and pressure vessel, and a disperger (9) for easily depressurizing the inside of the frame is arranged thereon, and then Preferably, the mold (10) is placed. A molding material (2) for a multilayer printed wiring board substrate is placed, and a mold (10) is further placed on the molding material (2), and then the periphery thereof is preferably covered with a breather sheet (1). The figure shows a state in which this is surrounded by a hat-shaped frame body (8) having a brim in cross section.
【０００９】該枠体の鍔部は、基板（５）と密着するべ
くシール用パッキンが外周に設けられいる。該パッキン
の形状としては、図４のように、断面三角形、図５のよ
うに長方形、図６のように半球状等のものが挙げられ
る。この該パッキンが真空排気口（６）から排気されな
がら、基板（５）の溝部にはまり込み密着するようにな
っている。該シール用パッキンの形状は、溝部と面接触
させて密着性をますために、好ましくは台形、半球状の
ものがよい。基板に設けた溝部は、枠体の該パッキンと
同一な形状或は異種の形状で、基板の外周に設けられて
いる。溝部は、基板に溝を形成したもの（図７〜図
９）、あるいは溝部を枠体と同一或は異質の材質として
凹字型（図１０〜図１２）のものを基板に設置したもの
で形成されている。A sealing packing is provided on the outer periphery of the flange portion of the frame so as to be in close contact with the substrate (5). Examples of the shape of the packing include a triangular cross section as shown in FIG. 4, a rectangular shape as shown in FIG. 5, and a hemispherical shape as shown in FIG. While the packing is being exhausted from the vacuum exhaust port (6), the packing fits into the groove portion of the substrate (5) and comes into close contact therewith. The shape of the sealing packing is preferably trapezoidal or hemispherical in order to make surface contact with the groove to enhance the adhesion. The groove provided on the substrate has the same shape as the packing of the frame or a different shape, and is provided on the outer periphery of the substrate. The groove may be a groove formed on the substrate (FIGS. 7 to 9), or a groove (FIG. 10 to FIG. 12) having the same groove material as that of the frame or a different material. Has been formed.
【００１０】該成型材料（２）は、内層用プリント配線
板、半硬化性樹脂がガラスクロス基材に含浸処理された
プリプレグ並びに銅張り積層板が多層状に積み重ねら
れ、金型、ディスパージャーで固定されたもので加圧加
熱されることで、一体成型物とするものである。The molding material (2) is a printed wiring board for an inner layer, a prepreg in which a glass cloth base material is impregnated with a semi-curable resin, and a copper-clad laminated board are stacked in a multi-layered structure, and is used in a mold or a disperser. By being fixed and heated under pressure, an integrally molded product is obtained.
【００１１】該圧力容器（７）は、内部にヒーターによ
る加熱手段が設置され、内部温度を均一とするためのフ
ァンが設置されている。且つ加圧気体を導入できる構造
となっており、該成型材料（２）を加熱、加圧して多層
プリント配線板を成型することができる。該枠体の鍔部
に、密着性を増すための重しを乗せるか、張り合わせる
かによって真空洩れを防ぐことが採用されてもよい。The pressure vessel (7) is provided with a heating means by a heater inside and a fan for making the internal temperature uniform. Moreover, it has a structure capable of introducing a pressurized gas, and can heat and pressurize the molding material (2) to mold a multilayer printed wiring board. It may be adopted to prevent vacuum leakage by placing a weight for increasing the adhesiveness on the flange portion of the frame body or by adhering it to each other.
【００１２】本発明において、使用される枠体には、耐
熱性があり、伸び率の高いゴム材、例えばシリコンゴ
ム、シリコンにテフロンを張り合わせたもの、あるいは
成型材料の外周部にポリアクリルラバーにシリコンゴム
を張り合わせて形成したもの等が好ましくで、さらに鍔
部の基板と密着する部分にシリコン、あるいはシリコン
にテフロンを張り合わせたものが好ましい。なお、上記
では、プリント配線板用の成型材料を成型していたが、
本発明の成型メカニズムを利用できるものであればその
対象は特に限定されない。次に、実施例により、本発明
の具体化の一態様を説明する。In the present invention, the frame body used is a heat-resistant rubber material having a high elongation rate, for example, silicon rubber, silicon with Teflon attached, or a polyacrylic rubber on the outer periphery of the molding material. Those formed by laminating silicon rubber and the like are preferable, and further, those in which silicon or Teflon is laminated on silicon are preferable in the portion of the flange portion that is in close contact with the substrate. In the above, the molding material for the printed wiring board was molded,
The target is not particularly limited as long as the molding mechanism of the present invention can be used. Next, one embodiment of the present invention will be described with reference to examples.
【００１３】[0013]
実施例１ 成型材料の大きさが520mm ×620mm で、基板上にディス
パージァー、金型を設置しガイドピンを配置し、銅箔18
μ、プリプレグ0.1mm×2枚、内層材0.3mmの銅箔35μ/35
μ、プリプレグ0.1mm ×2 枚、内層材0.3mm の銅箔35μ
/35 μ、プリプレグ0.1mm ×2枚、銅箔18μのそれぞれ
にガイド孔を設けたものを順次ガイドピンに積み重ね、
これらを金型で挟んだ後、端部をブリザーシートで覆
い、枠体をかぶせ、鍔に設けたシール部を基板上に設け
た溝に押し込み、枠体の内側を減圧し10torrとし、オー
トクレーブ内に配置し、徐々に温度、圧力を上げて200
℃、14kg/cm2で4 時間保持した後、冷却した。結果を表
に示す。Example 1 A molding material having a size of 520 mm x 620 mm, a discharger and a mold were set on a substrate, guide pins were arranged, and a copper foil 18
μ, prepreg 0.1mm × 2 sheets, inner layer material 0.3mm copper foil 35μ / 35
μ, prepreg 0.1 mm × 2 sheets, inner layer material 0.3 mm copper foil 35 μ
/ 35 μ, prepreg 0.1 mm × 2 sheets, copper foil 18 μ each with guide holes, stacked sequentially on guide pins,
After sandwiching these with a mold, cover the end with a blister sheet, cover the frame, push the seal part provided on the flange into the groove provided on the substrate, decompress the inside of the frame to 10 torr, and in the autoclave The temperature and pressure are gradually increased to 200
After keeping at 14 ° C / cm 2 for 4 hours, it was cooled. The results are shown in the table.
【００１４】比較例１ 枠体の代わりにナイロンフィルムを使用し、基板と密着
する部分にシールテープを張った以外は、実施例と同様
な方法で実施した。表中の○は良好、△は良好ではない
が実用上差し支えない。結果を表に示す。Comparative Example 1 The same procedure as in Example 1 was carried out except that a nylon film was used instead of the frame and a seal tape was applied to the portion in close contact with the substrate. In the table, ◯ is good and Δ is not good, but there is no problem in practical use. The results are shown in the table.
【００１５】[0015]
【表１】 [Table 1]
【００１６】[0016]
【発明の効果】以上詳細に示したごとく、図１に示され
た方法で、成形材料を覆い成型する方法は、一回の使用
でフィルムを廃棄していた。また、フィルムに基板と密
着させる為のシーラントテープを張り付ける作業があり
準備時間を要していた。また、成型材料に覆った後、真
空排気した場合に、成型物のコーナー部でシールが不完
全となり、加熱、加圧した際に真空が破れて、成型不良
となる場合があった。As described above in detail, in the method shown in FIG. 1 in which the molding material is covered and molded, the film is discarded after one use. In addition, there is a work of sticking a sealant tape to the film so that the film is brought into close contact with the substrate, which requires preparation time. In addition, when the material is covered with the molding material and then evacuated, the sealing may be incomplete at the corners of the molding, and the vacuum may be broken when heated and pressed, resulting in defective molding.
【００１７】発明の方法は、上記のごとくシーラントゴ
ム付きフィルムを使う事なく、該枠体を繰り返し加圧、
加熱して使用できる方法であって、本発明による成型装
置を使用すれば、成型材料をフィルムで囲む従来法に比
べ、軽量の枠体を成型材料のを覆って、溝部に突起物を
はめ込むだけでシールが簡単にできることより、作業者
の負担にならず、作業能率が改善されシートロスがな
く、しかも完全なシールが容易に得られる。According to the method of the invention, the frame is repeatedly pressed without using the film with the sealant rubber as described above,
It is a method that can be used by heating, and by using the molding apparatus according to the present invention, as compared with the conventional method in which the molding material is surrounded by a film, a lightweight frame body is covered with the molding material, and a protrusion is fitted in the groove portion. Since the sealing can be easily performed, the operator is not burdened, the working efficiency is improved, there is no sheet loss, and a complete sealing can be easily obtained.
【図１】本発明者らが最初に検討した装置の断面図。FIG. 1 is a cross-sectional view of a device first examined by the present inventors.
【図２】本発明の一実施例の斜視図。FIG. 2 is a perspective view of an embodiment of the present invention.
【図３】本発明の一実施例の断面図。FIG. 3 is a sectional view of an embodiment of the present invention.
【図４】本発明におけるシール用パッキンの部分断面
図。FIG. 4 is a partial cross-sectional view of a sealing packing according to the present invention.
【図５】本発明におけるシール用パッキンの部分断面
図。FIG. 5 is a partial cross-sectional view of a sealing packing according to the present invention.
【図６】本発明におけるシール用パッキンの部分断面
図。FIG. 6 is a partial cross-sectional view of a sealing packing according to the present invention.
【図７】本発明における溝部の部分断面図。FIG. 7 is a partial cross-sectional view of a groove portion according to the present invention.
【図８】本発明における溝部の部分断面図。FIG. 8 is a partial cross-sectional view of a groove portion according to the present invention.
【図９】本発明における溝部の部分断面図。FIG. 9 is a partial cross-sectional view of a groove portion according to the present invention.
【図１０】本発明における溝部の部分断面図。FIG. 10 is a partial cross-sectional view of a groove portion according to the present invention.
【図１１】本発明における溝部の部分断面図。FIG. 11 is a partial cross-sectional view of a groove portion according to the present invention.
【図１２】本発明における溝部の部分断面図。FIG. 12 is a partial cross-sectional view of a groove portion according to the present invention.
１ ブリーザーシート ２ 成型材料 ３ フィルム ４ 接着テープ ５ 基板 ６ 真空排気口 ７ 圧力容器 ８ 枠体 ９ ディスパージャー １０ 金型 １１ シール用パッキン １２ 溝 1 Breather sheet 2 Molding material 3 Film 4 Adhesive tape 5 Substrate 6 Vacuum exhaust port 7 Pressure container 8 Frame 9 Disperser 10 Mold 11 Seal packing 12 Groove
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｂ２９Ｌ 31:34 4Ｆ (72)発明者 佐藤 明夫 神奈川県伊勢原市板戸481−１ハイツ持田 101号─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification number Reference number within the agency FI Technical display location B29L 31:34 4F (72) Inventor Akio Sato 481-1 Itado, Isehara City, Kanagawa No. 101 Heights Mochida
Claims (9)
箔、プリプレグ、内層材を積み重ねた積層板用の成型材
料を設置し、該成型材料の周囲を鍔のある帽子型の枠体
で覆い、該基板上と接触する該鍔部の外周表面には、シ
ール用のパッキンを備えて、基板上の外周に設けられた
溝部にはめ込み、基板に設けられた排気口より内部を減
圧すると共に、該圧力容器の内部を気体を介して加圧、
加熱して該成型材料と密着させ、基板溝部と密着せしめ
て、該成型材料を成型することを特徴とする成型材料の
成型方法。1. A hat-shaped frame in which a molding material for a laminated plate in which copper foil, prepreg, and an inner layer material are stacked is installed on a substrate placed inside a pressure vessel, and the periphery of the molding material has a brim. Covering with a body, the outer peripheral surface of the flange that comes into contact with the substrate is provided with a sealing packing, and is fitted into a groove provided on the outer periphery of the substrate to reduce the pressure inside the exhaust port provided on the substrate. And pressurize the inside of the pressure vessel via gas,
A method for molding a molding material, which comprises heating to bring the molding material into close contact with the substrate groove portion, and then molding the molding material.
型材料を覆うための周囲に鍔のある帽子状の枠体と、該
鍔部の外周に設けたシール用パッキンと、該基板上の外
周に該パッキンを押し込むための溝が設けられ、真空排
気できる基板の底部の排気口と、該枠体の外部を加圧加
熱する手段を備えてなることを特徴とする成型材料の成
型用装置。2. A cap-shaped frame body, which is placed inside a pressure vessel and has a flange for covering the molding material on the substrate, a sealing packing provided on the outer periphery of the flange portion, and the substrate. Molding of a molding material, characterized in that a groove for pushing the packing is provided on an upper outer periphery, and an exhaust port at the bottom of the substrate capable of vacuum evacuation and a means for pressurizing and heating the outside of the frame are provided. Equipment.
い材質からなり、枠体内を真空排気した際、成型材料と
密着させることのできるものである請求項１項記載の成
型方法。3. The molding method according to claim 1, wherein the frame body is made of a material having a high elongation and a high tear strength, and can be brought into close contact with the molding material when the frame body is evacuated.
い材質からなるもので、枠体内を真空排気した際、成型
材料と密着させることのできるものである請求項２項記
載の成型装置。4. The molding apparatus according to claim 2, wherein the frame body is made of a material having a high elongation and a high tear strength, and can be brought into close contact with the molding material when the frame body is evacuated. .
が、該枠体と同質或は異質の材質からなり、断面が三角
形、四角形、台形または半球状の形状を有するものであ
る請求項１記載の成型方法。5. The packing for sealing provided on the flange portion of the frame body is made of the same or different material as the frame body, and has a cross section of a triangle, a quadrangle, a trapezoid or a hemisphere. Item 1. The molding method according to Item 1.
が、該枠体と同質或は異質の材質からなり、断面が三角
形、四角形、台形または半球状の形状を有するものであ
る請求項２記載の成型装置。6. The packing for sealing provided on the flange portion of the frame body is made of the same or different material as the frame body, and has a cross section of a triangle, a quadrangle, a trapezoid or a hemisphere. Item 2. The molding apparatus according to item 2.
ール用パッキンと密着し、固定されるものである請求項
１記載の成型方法。7. The molding method according to claim 1, wherein the groove portion provided on the substrate is in close contact with and fixed to the sealing packing of the flange portion.
形成されているか、基板に配設された、枠体と同質或は
異質の材質に形成されている請求項２記載の成型装置。8. The molding apparatus according to claim 2, wherein the groove portion provided on the substrate is formed on the substrate itself or is made of the same material as or a material different from that of the frame body provided on the substrate. .
テフロン或はイミドを張り合わせたものまたはポリアク
リルゴムからなるものである請求項１記載の成型方法。9. The molding method according to claim 1, wherein the frame body is made of silicone rubber, silicone rubber bonded with Teflon or imide, or polyacrylic rubber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17828092A JP3308304B2 (en) | 1992-07-06 | 1992-07-06 | Molding method of molding material and molding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17828092A JP3308304B2 (en) | 1992-07-06 | 1992-07-06 | Molding method of molding material and molding device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0623774A true JPH0623774A (en) | 1994-02-01 |
| JP3308304B2 JP3308304B2 (en) | 2002-07-29 |
Family
ID=16045713
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17828092A Expired - Fee Related JP3308304B2 (en) | 1992-07-06 | 1992-07-06 | Molding method of molding material and molding device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3308304B2 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07124972A (en) * | 1993-10-29 | 1995-05-16 | Mitsui Toatsu Chem Inc | Method and device for molding material |
| WO2009123131A1 (en) | 2008-03-31 | 2009-10-08 | ユニ・チャーム株式会社 | Stacked sheet body and sheet storing device |
| JP2013078937A (en) * | 2011-08-26 | 2013-05-02 | Boeing Co:The | Integrally stiffened, reusable vacuum bag, and method of making the same |
| JP2014500164A (en) * | 2010-11-05 | 2014-01-09 | ライトウェイト ラブス，エルエルシー | Heat treatment and solidification system and method |
| KR20140007344A (en) * | 2010-11-05 | 2014-01-17 | 라이트웨이트 랩스, 엘엘씨 | Thermal processing and consolidation system and method |
| JP6322732B1 (en) * | 2017-01-12 | 2018-05-09 | 日本飛行機株式会社 | Frame and vacuuming method |
| CN112002676A (en) * | 2020-08-21 | 2020-11-27 | 上海申矽凌微电子科技有限公司 | Substrate structure and chip thereof |
-
1992
- 1992-07-06 JP JP17828092A patent/JP3308304B2/en not_active Expired - Fee Related
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07124972A (en) * | 1993-10-29 | 1995-05-16 | Mitsui Toatsu Chem Inc | Method and device for molding material |
| WO2009123131A1 (en) | 2008-03-31 | 2009-10-08 | ユニ・チャーム株式会社 | Stacked sheet body and sheet storing device |
| US8393496B2 (en) | 2008-03-31 | 2013-03-12 | Uni-Charm Corporation | Stack of sheets and sheet container |
| JP2014500164A (en) * | 2010-11-05 | 2014-01-09 | ライトウェイト ラブス，エルエルシー | Heat treatment and solidification system and method |
| KR20140007344A (en) * | 2010-11-05 | 2014-01-17 | 라이트웨이트 랩스, 엘엘씨 | Thermal processing and consolidation system and method |
| JP2016182825A (en) * | 2010-11-05 | 2016-10-20 | ライトウェイト ラブス，エルエルシー | System and method for heat treatment and solidification |
| JP2013078937A (en) * | 2011-08-26 | 2013-05-02 | Boeing Co:The | Integrally stiffened, reusable vacuum bag, and method of making the same |
| JP6322732B1 (en) * | 2017-01-12 | 2018-05-09 | 日本飛行機株式会社 | Frame and vacuuming method |
| JP2018111256A (en) * | 2017-01-12 | 2018-07-19 | 日本飛行機株式会社 | Frame and vacuum drawing method |
| CN112002676A (en) * | 2020-08-21 | 2020-11-27 | 上海申矽凌微电子科技有限公司 | Substrate structure and chip thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3308304B2 (en) | 2002-07-29 |
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| LAPS | Cancellation because of no payment of annual fees |