JPS5552233A - Masking sheet - Google Patents

Masking sheet

Info

Publication number
JPS5552233A
JPS5552233A JP12587178A JP12587178A JPS5552233A JP S5552233 A JPS5552233 A JP S5552233A JP 12587178 A JP12587178 A JP 12587178A JP 12587178 A JP12587178 A JP 12587178A JP S5552233 A JPS5552233 A JP S5552233A
Authority
JP
Japan
Prior art keywords
base plate
semiconductor base
masking sheet
sheet
penetrating holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12587178A
Other languages
Japanese (ja)
Inventor
Shigeo Sasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP12587178A priority Critical patent/JPS5552233A/en
Publication of JPS5552233A publication Critical patent/JPS5552233A/en
Pending legal-status Critical Current

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  • Dicing (AREA)

Abstract

PURPOSE: To prevent breakage of small piece of a semiconductor base plate and a masking sheet to occur while pasting the two, by providing numerous penetrating holes on the masking sheet to be used in dividing a semiconductor base plate into small pieces.
CONSTITUTION: Plural penetrating holes 11 are provided on a sheet-like masking sheet 10 which is composed of resin members to be used for fixing a semiconductor base plate in the case of dividing the semiconductor base plate into small pieces. When attaching this masking sheet onto the semiconductor base plate, at first, the sheet surface is coated with adhesive and heated, and a semiconductor base plate 12 is placed on this. As gas generated in the heating process and surplus adhesive can be discharged to outside through the penetrating holes, it is not necessary to apply pressure to the semiconductor device by a roller, etc., the device can be pre vented from a trouble caused by deformation of wiring. Moreover, if an arrangement is made for sucking up by vacuum pressure, the adhesion can be improved.
COPYRIGHT: (C)1980,JPO&Japio
JP12587178A 1978-10-13 1978-10-13 Masking sheet Pending JPS5552233A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12587178A JPS5552233A (en) 1978-10-13 1978-10-13 Masking sheet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12587178A JPS5552233A (en) 1978-10-13 1978-10-13 Masking sheet

Publications (1)

Publication Number Publication Date
JPS5552233A true JPS5552233A (en) 1980-04-16

Family

ID=14920984

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12587178A Pending JPS5552233A (en) 1978-10-13 1978-10-13 Masking sheet

Country Status (1)

Country Link
JP (1) JPS5552233A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58115833A (en) * 1981-12-28 1983-07-09 Sony Corp Division of wafer
JPS59152639A (en) * 1983-02-21 1984-08-31 Nec Home Electronics Ltd Method for provisional fixing of semiconductor wafer
JPS61162054U (en) * 1985-03-27 1986-10-07

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58115833A (en) * 1981-12-28 1983-07-09 Sony Corp Division of wafer
JPH0318343B2 (en) * 1981-12-28 1991-03-12 Sony Corp
JPS59152639A (en) * 1983-02-21 1984-08-31 Nec Home Electronics Ltd Method for provisional fixing of semiconductor wafer
JPS61162054U (en) * 1985-03-27 1986-10-07

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