GB2004499A - Transferring coatings of adhesives to laminates - Google Patents
Transferring coatings of adhesives to laminatesInfo
- Publication number
- GB2004499A GB2004499A GB7831569A GB7831569A GB2004499A GB 2004499 A GB2004499 A GB 2004499A GB 7831569 A GB7831569 A GB 7831569A GB 7831569 A GB7831569 A GB 7831569A GB 2004499 A GB2004499 A GB 2004499A
- Authority
- GB
- United Kingdom
- Prior art keywords
- laminates
- adhesives
- adhesive
- carrier
- coated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
- H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/28—Processes for applying liquids or other fluent materials performed by transfer from the surfaces of elements carrying the liquid or other fluent material, e.g. brushes, pads, rollers
- B05D1/286—Processes for applying liquids or other fluent materials performed by transfer from the surfaces of elements carrying the liquid or other fluent material, e.g. brushes, pads, rollers using a temporary backing to which the coating has been applied
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/066—Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0709—Catalytic ink or adhesive for electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
In a process for providing a uniformly thick adhesive coating on a surface of a structure which is to receive, over said adhesive coating, a conductive coating to form a circuit board, a surface of a carrier having a release agent thereon, is coated with an adhesive, which is dried at an elevated temperature prior to pressing the coated carrier on the structure and removing said carrier to leave the adhesive-coated structure.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US82049477A | 1977-07-29 | 1977-07-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB2004499A true GB2004499A (en) | 1979-04-04 |
Family
ID=25230939
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB7831569A Withdrawn GB2004499A (en) | 1977-07-29 | 1978-07-28 | Transferring coatings of adhesives to laminates |
Country Status (8)
Country | Link |
---|---|
JP (1) | JPS5425983A (en) |
BR (1) | BR7804899A (en) |
DE (1) | DE2832024A1 (en) |
FR (1) | FR2398608A1 (en) |
GB (1) | GB2004499A (en) |
IT (1) | IT1097900B (en) |
NL (1) | NL7807829A (en) |
SE (1) | SE7808182L (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57501413A (en) * | 1980-07-10 | 1982-08-12 | ||
FR2645872B1 (en) * | 1989-04-14 | 1992-06-12 | Gerland Etancheite | METHOD AND DEVICE FOR PREPARING A SEALING COATING |
DE4103389A1 (en) * | 1991-02-05 | 1992-08-06 | Albert Lang | Local stiffening of soft objects, esp. inner shoe caps - by applying molten polymer by low pressure process to release strip carrier and transferring to soft material where bonding occurs |
JPH07282361A (en) * | 1994-04-14 | 1995-10-27 | Delta:Kk | Emergency relief signal displaying device |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2085449A7 (en) * | 1970-04-22 | 1971-12-24 | Sopaland | Resin-coated particle boards - covered continually with resin (and paper) from an aluminium travelling belt |
DE2136212B1 (en) * | 1971-07-20 | 1972-05-31 | Aeg Isolier Und Kunststoff Gmbh | Process for the production of a base material for printed circuits |
JPS5748874B2 (en) * | 1972-07-11 | 1982-10-19 |
-
1978
- 1978-07-21 DE DE19782832024 patent/DE2832024A1/en not_active Withdrawn
- 1978-07-24 NL NL7807829A patent/NL7807829A/en not_active Application Discontinuation
- 1978-07-27 SE SE7808182A patent/SE7808182L/en unknown
- 1978-07-28 IT IT26253/78A patent/IT1097900B/en active
- 1978-07-28 GB GB7831569A patent/GB2004499A/en not_active Withdrawn
- 1978-07-28 JP JP9245578A patent/JPS5425983A/en active Pending
- 1978-07-28 FR FR7822434A patent/FR2398608A1/en active Pending
- 1978-07-28 BR BR7804899A patent/BR7804899A/en unknown
Also Published As
Publication number | Publication date |
---|---|
IT1097900B (en) | 1985-08-31 |
NL7807829A (en) | 1979-01-31 |
DE2832024A1 (en) | 1979-02-15 |
FR2398608A1 (en) | 1979-02-23 |
IT7826253A0 (en) | 1978-07-28 |
SE7808182L (en) | 1979-01-30 |
JPS5425983A (en) | 1979-02-27 |
BR7804899A (en) | 1979-04-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |