IT1097900B - PROCEDURE FOR PREPARING LAMINATES WITH ADHESIVE COATING - Google Patents

PROCEDURE FOR PREPARING LAMINATES WITH ADHESIVE COATING

Info

Publication number
IT1097900B
IT1097900B IT26253/78A IT2625378A IT1097900B IT 1097900 B IT1097900 B IT 1097900B IT 26253/78 A IT26253/78 A IT 26253/78A IT 2625378 A IT2625378 A IT 2625378A IT 1097900 B IT1097900 B IT 1097900B
Authority
IT
Italy
Prior art keywords
procedure
adhesive coating
preparing laminates
laminates
preparing
Prior art date
Application number
IT26253/78A
Other languages
Italian (it)
Other versions
IT7826253A0 (en
Original Assignee
Uop Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Uop Inc filed Critical Uop Inc
Publication of IT7826253A0 publication Critical patent/IT7826253A0/en
Application granted granted Critical
Publication of IT1097900B publication Critical patent/IT1097900B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/28—Processes for applying liquids or other fluent materials performed by transfer from the surfaces of elements carrying the liquid or other fluent material, e.g. brushes, pads, rollers
    • B05D1/286—Processes for applying liquids or other fluent materials performed by transfer from the surfaces of elements carrying the liquid or other fluent material, e.g. brushes, pads, rollers using a temporary backing to which the coating has been applied
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/066—Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0709—Catalytic ink or adhesive for electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Manufacturing Of Printed Wiring (AREA)
IT26253/78A 1977-07-29 1978-07-28 PROCEDURE FOR PREPARING LAMINATES WITH ADHESIVE COATING IT1097900B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US82049477A 1977-07-29 1977-07-29

Publications (2)

Publication Number Publication Date
IT7826253A0 IT7826253A0 (en) 1978-07-28
IT1097900B true IT1097900B (en) 1985-08-31

Family

ID=25230939

Family Applications (1)

Application Number Title Priority Date Filing Date
IT26253/78A IT1097900B (en) 1977-07-29 1978-07-28 PROCEDURE FOR PREPARING LAMINATES WITH ADHESIVE COATING

Country Status (8)

Country Link
JP (1) JPS5425983A (en)
BR (1) BR7804899A (en)
DE (1) DE2832024A1 (en)
FR (1) FR2398608A1 (en)
GB (1) GB2004499A (en)
IT (1) IT1097900B (en)
NL (1) NL7807829A (en)
SE (1) SE7808182L (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BR8108687A (en) * 1980-07-10 1982-06-01 Schlaepfer & Co Ag APPLICATION OF MATERIALS, POLYMERS TO SUBSTRATES
FR2645872B1 (en) * 1989-04-14 1992-06-12 Gerland Etancheite METHOD AND DEVICE FOR PREPARING A SEALING COATING
DE4103389A1 (en) * 1991-02-05 1992-08-06 Albert Lang Local stiffening of soft objects, esp. inner shoe caps - by applying molten polymer by low pressure process to release strip carrier and transferring to soft material where bonding occurs
JPH07282361A (en) * 1994-04-14 1995-10-27 Delta:Kk Emergency relief signal displaying device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2085449A7 (en) * 1970-04-22 1971-12-24 Sopaland Resin-coated particle boards - covered continually with resin (and paper) from an aluminium travelling belt
DE2136212B1 (en) * 1971-07-20 1972-05-31 Aeg Isolier Und Kunststoff Gmbh Process for the production of a base material for printed circuits
JPS5748874B2 (en) * 1972-07-11 1982-10-19

Also Published As

Publication number Publication date
IT7826253A0 (en) 1978-07-28
GB2004499A (en) 1979-04-04
JPS5425983A (en) 1979-02-27
FR2398608A1 (en) 1979-02-23
NL7807829A (en) 1979-01-31
DE2832024A1 (en) 1979-02-15
BR7804899A (en) 1979-04-10
SE7808182L (en) 1979-01-30

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