JPS536341A - Method for vacuum pressure application - Google Patents

Method for vacuum pressure application

Info

Publication number
JPS536341A
JPS536341A JP8054876A JP8054876A JPS536341A JP S536341 A JPS536341 A JP S536341A JP 8054876 A JP8054876 A JP 8054876A JP 8054876 A JP8054876 A JP 8054876A JP S536341 A JPS536341 A JP S536341A
Authority
JP
Japan
Prior art keywords
vacuum pressure
pressure application
film
adherend
involvement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8054876A
Other languages
Japanese (ja)
Other versions
JPS5419016B2 (en
Inventor
Seiki Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Industrial Co Ltd filed Critical Nitto Electric Industrial Co Ltd
Priority to JP8054876A priority Critical patent/JPS536341A/en
Publication of JPS536341A publication Critical patent/JPS536341A/en
Publication of JPS5419016B2 publication Critical patent/JPS5419016B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

PURPOSE: To laminate a film material, e.g. polarized film, etc. on the surfaces of an adherend, e.g. glass, etc. using a vacuum chamber partitioned with diaphragms made of a non-rigid elastic material, etc. via a tacky adhesive without involvement of air bubbles.
COPYRIGHT: (C)1978,JPO&Japio
JP8054876A 1976-07-06 1976-07-06 Method for vacuum pressure application Granted JPS536341A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8054876A JPS536341A (en) 1976-07-06 1976-07-06 Method for vacuum pressure application

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8054876A JPS536341A (en) 1976-07-06 1976-07-06 Method for vacuum pressure application

Publications (2)

Publication Number Publication Date
JPS536341A true JPS536341A (en) 1978-01-20
JPS5419016B2 JPS5419016B2 (en) 1979-07-12

Family

ID=13721387

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8054876A Granted JPS536341A (en) 1976-07-06 1976-07-06 Method for vacuum pressure application

Country Status (1)

Country Link
JP (1) JPS536341A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4382833A (en) * 1981-08-25 1983-05-10 Rca Corporation Vacuum lamination fixture
FR2659344A1 (en) * 1990-03-09 1991-09-13 Thomson Csf Process for bubble-free instantaneous adhesive bonding, especially of surfaces of rigid and nonporous components, and device for its use
US5094709A (en) * 1986-09-26 1992-03-10 General Electric Company Apparatus for packaging integrated circuit chips employing a polymer film overlay layer
FR2873499A1 (en) * 2004-07-23 2006-01-27 Thales Sa Apparatus for assembling/sticking two or more components such as patch antenna has chamber with separator and effluent circuit with inlet, outlet and valve
WO2009034819A1 (en) * 2007-09-11 2009-03-19 Konica Minolta Medical & Graphic, Inc. Microchip manufacturing method, microchip and vacuum bonding apparatus
JP2009203284A (en) * 2008-02-26 2009-09-10 Meisei Ind Co Ltd Bonding method
US7594977B2 (en) * 2004-05-25 2009-09-29 Tsubaki Seiko, Inc Tape bonder, tape bonding method, and process for manufacturing electronic component
CN103722739A (en) * 2012-10-12 2014-04-16 爱元福科技股份有限公司 Manufacturing method of three-dimensional explosion-proof glass
CN104520977A (en) * 2012-10-12 2015-04-15 新东工业株式会社 Depressurizing jig and method for pressurizing object by using depressurizing jig

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4382833A (en) * 1981-08-25 1983-05-10 Rca Corporation Vacuum lamination fixture
US5094709A (en) * 1986-09-26 1992-03-10 General Electric Company Apparatus for packaging integrated circuit chips employing a polymer film overlay layer
FR2659344A1 (en) * 1990-03-09 1991-09-13 Thomson Csf Process for bubble-free instantaneous adhesive bonding, especially of surfaces of rigid and nonporous components, and device for its use
US7594977B2 (en) * 2004-05-25 2009-09-29 Tsubaki Seiko, Inc Tape bonder, tape bonding method, and process for manufacturing electronic component
FR2873499A1 (en) * 2004-07-23 2006-01-27 Thales Sa Apparatus for assembling/sticking two or more components such as patch antenna has chamber with separator and effluent circuit with inlet, outlet and valve
EP1622437A1 (en) 2004-07-23 2006-02-01 Thales Verfahren zum Verkleben oder Zusammenstellen mehrerer Elemente
WO2009034819A1 (en) * 2007-09-11 2009-03-19 Konica Minolta Medical & Graphic, Inc. Microchip manufacturing method, microchip and vacuum bonding apparatus
JP2009203284A (en) * 2008-02-26 2009-09-10 Meisei Ind Co Ltd Bonding method
CN103722739A (en) * 2012-10-12 2014-04-16 爱元福科技股份有限公司 Manufacturing method of three-dimensional explosion-proof glass
CN104520977A (en) * 2012-10-12 2015-04-15 新东工业株式会社 Depressurizing jig and method for pressurizing object by using depressurizing jig

Also Published As

Publication number Publication date
JPS5419016B2 (en) 1979-07-12

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