JPS536341A - Method for vacuum pressure application - Google Patents
Method for vacuum pressure applicationInfo
- Publication number
- JPS536341A JPS536341A JP8054876A JP8054876A JPS536341A JP S536341 A JPS536341 A JP S536341A JP 8054876 A JP8054876 A JP 8054876A JP 8054876 A JP8054876 A JP 8054876A JP S536341 A JPS536341 A JP S536341A
- Authority
- JP
- Japan
- Prior art keywords
- vacuum pressure
- pressure application
- film
- adherend
- involvement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Laminated Bodies (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
PURPOSE: To laminate a film material, e.g. polarized film, etc. on the surfaces of an adherend, e.g. glass, etc. using a vacuum chamber partitioned with diaphragms made of a non-rigid elastic material, etc. via a tacky adhesive without involvement of air bubbles.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8054876A JPS536341A (en) | 1976-07-06 | 1976-07-06 | Method for vacuum pressure application |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8054876A JPS536341A (en) | 1976-07-06 | 1976-07-06 | Method for vacuum pressure application |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS536341A true JPS536341A (en) | 1978-01-20 |
JPS5419016B2 JPS5419016B2 (en) | 1979-07-12 |
Family
ID=13721387
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8054876A Granted JPS536341A (en) | 1976-07-06 | 1976-07-06 | Method for vacuum pressure application |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS536341A (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4382833A (en) * | 1981-08-25 | 1983-05-10 | Rca Corporation | Vacuum lamination fixture |
FR2659344A1 (en) * | 1990-03-09 | 1991-09-13 | Thomson Csf | Process for bubble-free instantaneous adhesive bonding, especially of surfaces of rigid and nonporous components, and device for its use |
US5094709A (en) * | 1986-09-26 | 1992-03-10 | General Electric Company | Apparatus for packaging integrated circuit chips employing a polymer film overlay layer |
FR2873499A1 (en) * | 2004-07-23 | 2006-01-27 | Thales Sa | Apparatus for assembling/sticking two or more components such as patch antenna has chamber with separator and effluent circuit with inlet, outlet and valve |
WO2009034819A1 (en) * | 2007-09-11 | 2009-03-19 | Konica Minolta Medical & Graphic, Inc. | Microchip manufacturing method, microchip and vacuum bonding apparatus |
JP2009203284A (en) * | 2008-02-26 | 2009-09-10 | Meisei Ind Co Ltd | Bonding method |
US7594977B2 (en) * | 2004-05-25 | 2009-09-29 | Tsubaki Seiko, Inc | Tape bonder, tape bonding method, and process for manufacturing electronic component |
CN103722739A (en) * | 2012-10-12 | 2014-04-16 | 爱元福科技股份有限公司 | Manufacturing method of three-dimensional explosion-proof glass |
CN104520977A (en) * | 2012-10-12 | 2015-04-15 | 新东工业株式会社 | Depressurizing jig and method for pressurizing object by using depressurizing jig |
-
1976
- 1976-07-06 JP JP8054876A patent/JPS536341A/en active Granted
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4382833A (en) * | 1981-08-25 | 1983-05-10 | Rca Corporation | Vacuum lamination fixture |
US5094709A (en) * | 1986-09-26 | 1992-03-10 | General Electric Company | Apparatus for packaging integrated circuit chips employing a polymer film overlay layer |
FR2659344A1 (en) * | 1990-03-09 | 1991-09-13 | Thomson Csf | Process for bubble-free instantaneous adhesive bonding, especially of surfaces of rigid and nonporous components, and device for its use |
US7594977B2 (en) * | 2004-05-25 | 2009-09-29 | Tsubaki Seiko, Inc | Tape bonder, tape bonding method, and process for manufacturing electronic component |
FR2873499A1 (en) * | 2004-07-23 | 2006-01-27 | Thales Sa | Apparatus for assembling/sticking two or more components such as patch antenna has chamber with separator and effluent circuit with inlet, outlet and valve |
EP1622437A1 (en) | 2004-07-23 | 2006-02-01 | Thales | Verfahren zum Verkleben oder Zusammenstellen mehrerer Elemente |
WO2009034819A1 (en) * | 2007-09-11 | 2009-03-19 | Konica Minolta Medical & Graphic, Inc. | Microchip manufacturing method, microchip and vacuum bonding apparatus |
JP2009203284A (en) * | 2008-02-26 | 2009-09-10 | Meisei Ind Co Ltd | Bonding method |
CN103722739A (en) * | 2012-10-12 | 2014-04-16 | 爱元福科技股份有限公司 | Manufacturing method of three-dimensional explosion-proof glass |
CN104520977A (en) * | 2012-10-12 | 2015-04-15 | 新东工业株式会社 | Depressurizing jig and method for pressurizing object by using depressurizing jig |
Also Published As
Publication number | Publication date |
---|---|
JPS5419016B2 (en) | 1979-07-12 |
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