JPS5371566A - Wafer matching equipment - Google Patents

Wafer matching equipment

Info

Publication number
JPS5371566A
JPS5371566A JP14652276A JP14652276A JPS5371566A JP S5371566 A JPS5371566 A JP S5371566A JP 14652276 A JP14652276 A JP 14652276A JP 14652276 A JP14652276 A JP 14652276A JP S5371566 A JPS5371566 A JP S5371566A
Authority
JP
Japan
Prior art keywords
matching equipment
wafer
wafer matching
equipment
adhesion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14652276A
Other languages
Japanese (ja)
Other versions
JPS6053464B2 (en
Inventor
Susumu Komoriya
Kiyoshi Yoshida
Hiroshi Nishizuka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP51146522A priority Critical patent/JPS6053464B2/en
Publication of JPS5371566A publication Critical patent/JPS5371566A/en
Publication of JPS6053464B2 publication Critical patent/JPS6053464B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

PURPOSE: To obtain the wafer matching equipment which can perform the adhesion and separation between the wafer and mask mounted on a stand easily by using air pressure.
COPYRIGHT: (C)1978,JPO&Japio
JP51146522A 1976-12-08 1976-12-08 Wafer alignment equipment Expired JPS6053464B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP51146522A JPS6053464B2 (en) 1976-12-08 1976-12-08 Wafer alignment equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP51146522A JPS6053464B2 (en) 1976-12-08 1976-12-08 Wafer alignment equipment

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP58157805A Division JPS5980930A (en) 1983-08-31 1983-08-31 Aligning method of wafer
JP58157806A Division JPS5932892B2 (en) 1983-08-31 1983-08-31 Wafer alignment method

Publications (2)

Publication Number Publication Date
JPS5371566A true JPS5371566A (en) 1978-06-26
JPS6053464B2 JPS6053464B2 (en) 1985-11-26

Family

ID=15409544

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51146522A Expired JPS6053464B2 (en) 1976-12-08 1976-12-08 Wafer alignment equipment

Country Status (1)

Country Link
JP (1) JPS6053464B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007134368A (en) * 2005-11-08 2007-05-31 Nikon Corp Pattern transferring apparatus, aligner, and pattern transfer method
JP2007305895A (en) * 2006-05-15 2007-11-22 Apic Yamada Corp Imprinting method, and nano-imprinting apparatus
JP2010517300A (en) * 2007-01-29 2010-05-20 ヒューレット−パッカード デベロップメント カンパニー エル．ピー． Contact lithography apparatus and method using substrate deformation

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007134368A (en) * 2005-11-08 2007-05-31 Nikon Corp Pattern transferring apparatus, aligner, and pattern transfer method
JP2007305895A (en) * 2006-05-15 2007-11-22 Apic Yamada Corp Imprinting method, and nano-imprinting apparatus
JP2010517300A (en) * 2007-01-29 2010-05-20 ヒューレット−パッカード デベロップメント カンパニー エル．ピー． Contact lithography apparatus and method using substrate deformation

Also Published As

Publication number Publication date
JPS6053464B2 (en) 1985-11-26

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