FR2659344A1 - Process for bubble-free instantaneous adhesive bonding, especially of surfaces of rigid and nonporous components, and device for its use - Google Patents

Process for bubble-free instantaneous adhesive bonding, especially of surfaces of rigid and nonporous components, and device for its use Download PDF

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Publication number
FR2659344A1
FR2659344A1 FR9003037A FR9003037A FR2659344A1 FR 2659344 A1 FR2659344 A1 FR 2659344A1 FR 9003037 A FR9003037 A FR 9003037A FR 9003037 A FR9003037 A FR 9003037A FR 2659344 A1 FR2659344 A1 FR 2659344A1
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Prior art keywords
elements
vacuum
bonded
pressure
chamber
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Granted
Application number
FR9003037A
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French (fr)
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FR2659344B1 (en
Inventor
Dieumegard Michel
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Thales SA
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Thomson CSF SA
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Publication of FR2659344B1 publication Critical patent/FR2659344B1/fr
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/751—Means for controlling the bonding environment, e.g. valves, vacuum pumps
    • H01L2224/75101—Chamber
    • H01L2224/75102—Vacuum chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75314—Auxiliary members on the pressing surface
    • H01L2224/75315—Elastomer inlay
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75314—Auxiliary members on the pressing surface
    • H01L2224/75317—Removable auxiliary member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0999—Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/085—Using vacuum or low pressure

Abstract

Process for instantaneous adhesive bonding, without any residual air bubbles, intended more particularly for the adhesive bonding of two rigid and nonporous surfaces. The process consists in depositing the components to be bonded facing each other and keeping them at a distance from one another, creating a vacuum in a space defined between and around the components to be bonded, and then breaking the vacuum outside this space so as to apply a pinning pressure to the components to be assembled. The invention also relates to a device for making use of this process comprising, in particular, a vacuum chamber and a deformable means capable of applying the said pinning pressure. The invention applies to adhesive bonding between rigid and nonporous materials, particularly in the electronics field.

Description

PROCEDE DE COKAGE INSTANTANE, SANS BUtES,
NOTAMMENT DE SURFACES D'ELEMENTS
RIGIDES ET NON POREUX,
ET DISPOSITIF DE SE EN OEUVRE
L'invention se rapporte au domaine du collage, et plus particulièrement à un procédé de collage instantané, sans bulles, notamment entre les surfaces d'éléments rigides et non poreux et à un dispositif de mise en oeuvre d'un tel procédé.INSTANT COKING PROCESS, WITHOUT GOALS,
ESPECIALLY OF ELEMENT SURFACES
RIGID AND NON-POROUS,
AND DEVICE FOR IMPLEMENTING IT
The invention relates to the field of bonding, and more particularly to an instant bonding method, without bubbles, in particular between the surfaces of rigid and non-porous elements and to a device for implementing such a method.

La nécessité d'un tel collage peut apparaître dans le cadre de la vie courante (pose de formica, de cadres photographiques, de .plaques de verre, plaquage d'éléments décoratifs ...) ou pour des applications plus techniques, par exemple assemblage de cartes électroniques sur d'autres modules électroniques. The need for such a bonding may appear in the context of everyday life (installation of formica, photographic frames, glass plates, plating of decorative elements ...) or for more technical applications, for example assembly electronic cards on other electronic modules.

Les solutions classiques à partir de colle contact ou de film transfert ne permettent un collage sans bulles que lorsque l'un des éléments est flexible ou poreux, l'air étant chassé progressivement en courbant l'un des éléments ou évacué à travers le support poreux ; ces solutions ne peuvent s'appliquer à des structures rigides non poreuses dans le cas où le but visé est un collage très soigné exempt, ou pratiquement exempt, d'air résiduel de façon à obtenir une bonne reproductibilité dans la qualité du transfert thermique ou de l'esthétique. Conventional solutions from contact adhesive or transfer film only allow bubble-free bonding when one of the elements is flexible or porous, the air being gradually expelled by bending one of the elements or evacuated through the porous support. ; these solutions cannot be applied to rigid non-porous structures in the case where the aim is a very careful bonding free, or practically free, of residual air so as to obtain good reproducibility in the quality of the heat transfer or aesthetics.

Plus précisément, dans le domaine de l'électronique, les différents modules électroniques peuvent dans certains cas être assemblés par brasage, en utilisant une brasure en stries de façon à former des canaux d'évacuation de l'air résiduel ; ce procédé ne peut s'appliquer pour l'assemblage de plaques de circuits imprimés du fait du caractères électroconducteur de la soudure.  More specifically, in the field of electronics, the various electronic modules can in certain cases be assembled by soldering, using a solder in striations so as to form channels for evacuating residual air; this method cannot be applied for the assembly of printed circuit boards due to the electroconductive characteristics of the solder.

De plus, ce procédé est délicat donc long, et le résultat obtenu est aléatoire. In addition, this process is delicate and therefore long, and the result obtained is random.

L'invention a pour objet de pallier les inconvénients évoqués et d'atteindre un collage instantané de haute qualité, avec un coefficient de transfert thermique reproductible. The object of the invention is to overcome the drawbacks mentioned and to achieve instant high quality bonding with a reproducible heat transfer coefficient.

Pour ce faire, le procédé conforme à l'invention pour le collage instantané, sans bulles d'air, notamment de surfaces d'éléments rigides et non poreux, dont l'une au moins est pré-encollée, est caractérisé en ce qu'il consiste
- dans une première étape, à pré-positionner les surfaces à coller en les disposant en regard l'une par rapport à l'autre par un moyen de guidage et en les maintenant à distance l'une de l'autre par des moyens de retenue et de centrage,
- dans une seconde étape, à créer un vide pour évacuer l'air entre et dans un espace entourant les éléments à coller, la qualité du vide étant déterminée en fonction de la qualité de collage désirée,
- dans une troisième étape, à casser le vide à l'extérieur dudit espace de manière à exercer une pression sur l'un au moins des éléments à assembler pour vaincre la résistance des moyens de retenue et plaquer les surfaces à coller ltune contre l'autre. To do this, the method according to the invention for instant bonding, without air bubbles, in particular of rigid and non-porous element surfaces, at least one of which is pre-glued, is characterized in that it consists
- in a first step, to pre-position the surfaces to be bonded by placing them facing each other with respect to each other by a guide means and by keeping them at a distance from each other by means of retaining and centering,
- in a second step, to create a vacuum to evacuate the air between and in a space surrounding the elements to be bonded, the quality of the vacuum being determined as a function of the desired quality of bonding,
- In a third step, to break the vacuum outside of said space so as to exert pressure on at least one of the elements to be assembled to overcome the resistance of the retaining means and press the surfaces to be bonded against the other.

L'invention concerne également un dispositif destiné à mettre en oeuvre un tel procédé caractérisé en ce qu'il comprend une chambre à vide, des moyens de mise sous vide pour évacuer l'air dans toute la chambre à vide et en particulier entre les éléments à coller, un moyen déformable au moins en partie partageant la chambre en un espace contenant les éléments à coller pré-positionnés et en un espace extérieur et des moyens de rétablissement de la pression atmosphérique uniquement dans l'espace extérieur pour que le moyen déformable exerce sur le volume interne resté sous vide, et en particulier sur l'un des éléments à coller, une pression telle que les moyens de retenue cèdent et que les éléments à assembler viennent se plaquer l'un contre l'autre.  The invention also relates to a device intended to implement such a method characterized in that it comprises a vacuum chamber, vacuum means for evacuating the air throughout the vacuum chamber and in particular between the elements to be bonded, a deformable means at least in part dividing the chamber into a space containing the pre-positioned elements to be bonded and into an external space and means for restoring atmospheric pressure only in the external space so that the deformable means on the internal volume remaining under vacuum, and in particular on one of the elements to be bonded, a pressure such that the retaining means give way and that the elements to be assembled are pressed against one another.

D'autres caractéristiques et avantages de l'invention apparaîtront à la lecture de la description détaillée qui va
suivre, donnée à titre d'exemple non limitatif, et illustrée par les figures annexées dans lesquelles
- la figure 1 représente le schéma relatif au pré-positionnement des surfaces à coller
- la figure 2 représente le schéma d'un premier mode de réalisation du dispositif destiné à la mise en oeuvre du procédé selon l'invention; - la figure 3 représente le schéma d'un second mode de réalisation du dispositif de mise en oeuvre.Other characteristics and advantages of the invention will appear on reading the detailed description which will
follow, given by way of nonlimiting example, and illustrated by the appended figures in which
- Figure 1 shows the diagram relating to the pre-positioning of the surfaces to be bonded
- Figure 2 shows the diagram of a first embodiment of the device for implementing the method according to the invention; - Figure 3 shows the diagram of a second embodiment of the implementation device.

La description ci-après s'applique au cas particulier du collage d'une plaque de circuits imprimés sur un module comportant un radiateur en vue, par exemple, d'un équipement en avionique. The description below applies to the specific case of bonding a printed circuit board to a module comprising a radiator for the purpose, for example, of avionics equipment.

La préparation des surfaces à coller se fait de manière classique : une seule surface est rendue adhésive dans le cas du collage par film transfert d'adhésivage, les deux surfaces étant encollées dans le cas du collage par colle-contact. The surfaces to be bonded are prepared in the conventional manner: a single surface is made adhesive in the case of bonding by adhesive transfer film, the two surfaces being bonded in the case of bonding by contact adhesive.

Sur la figure 1 ont été représentés une plaque de circuit imprimé l équipée de composants électroniques munis, pour certains, d'éléments de protection, tels que 2, et un module électronique 3 dont la surface 4 doit être collée à la surface 5 de la plaque 1. FIG. 1 shows a printed circuit board l fitted with electronic components, some of which are provided with protective elements, such as 2, and an electronic module 3, the surface 4 of which must be bonded to the surface 5 of the plate 1.

Le procédé selon l'invention consiste, dans une première étape, à opérer le pré-positionnement des deux surfaces 4 et 5 représentées figure 1 dont l'une au moins a été pré-encollée : pour guider correctement la plaque l dans le module 3, celui-ci forme un trou-guide limité par deux rebords 51 et 52 ; les surfaces à coller sont alors maintenues à distance grâce à des moyens de retenue. Ces moyens doivent être flexibles mais suffisamment résistants pour permettre l'accomplissement des manoeuvres d'ajustage et de centrage préliminaires ; des ressorts à lame, tels que ceux référencés 61 et 62, sur la figure 1, peuvent servir de moyens de retenue.En particulier des ressorts au bronze-béryllium, utilisés habituellement comme joints de blindages, présentent avantageusement une raideur adaptée pour assurer la double fonction de retenue et de centrage ; ils sont fixés aux rebords de guidage du module 3 -par leurs surfaces arrières 31, 32, recouvertes d'un film autocollant. The method according to the invention consists, in a first step, in operating the pre-positioning of the two surfaces 4 and 5 shown in FIG. 1, at least one of which has been pre-glued: to correctly guide the plate l in the module 3 , it forms a guide hole limited by two flanges 51 and 52; the surfaces to be bonded are then kept at a distance by means of retaining means. These means must be flexible but strong enough to allow the accomplishment of preliminary adjustment and centering maneuvers; leaf springs, such as those referenced 61 and 62, in Figure 1, can serve as retaining means. retaining and centering function; they are fixed to the guide edges of the module 3 - by their rear surfaces 31, 32, covered with a self-adhesive film.

La deuxième étape du procédé consiste alors, par l'introduction d'un vide suffisant, par exemple un vide primaire de quelques Pascals, à éliminer l'air entre et dans un espace entourant les surfaces à coller puis, dans une troisième étape, à vaincre la résistance de retenue pour mettre en contact les deux surfaces à coller en rétablissant la pression atmosphérique à l'extérieur dudit espace de manière à exercer une pression adaptée sur au moins l'un des éléments à assembler. The second step of the process then consists, by introducing a sufficient vacuum, for example a primary vacuum of a few Pascals, to eliminate the air between and in a space surrounding the surfaces to be bonded, then, in a third step, to overcoming the retaining resistance in order to bring the two surfaces to be bonded into contact by restoring atmospheric pressure outside said space so as to exert a suitable pressure on at least one of the elements to be assembled.

Pour mettre en oeuvre ce procédé, le dispositif de collage sans bulles selon l'invention comporte
- une chambre à vide dans laquelle sont introduits les éléments à coller pré-positionnés selon le procédé de l'invention,
- des moyens de mise sous vide pour évacuer l'air dans toute la chambre à vide et en particulier entre les éléments à coller,
- un moyen déformable au moins en partie partageant la chambre en un espace interne au moyen déformable contenant les éléments à coller pré-positionnés et en un espace externe à ce moyen,
- et des moyens de rétablissement de la pression atmosphérique uniquement dans le volume externe pour que le moyen déformable exerce sur le volume interne resté sous vide, et en particulier sur l'un des éléments à coller une pression telle que les moyens de retenue cèdent et que les éléments à assembler viennent se plaquer l'un contre l'autre.To implement this method, the bubble-free bonding device according to the invention comprises
a vacuum chamber into which the elements to be bonded are pre-positioned according to the method of the invention,
- vacuum means for evacuating the air throughout the vacuum chamber and in particular between the elements to be bonded,
a means which can be deformed at least in part by dividing the chamber into an internal space by means of deformable containing the elements to be glued pre-positioned and in a space external to this means,
- And means for restoring atmospheric pressure only in the external volume so that the deformable means exerts on the internal volume which remains under vacuum, and in particular on one of the elements to be bonded, such that the retaining means give way and that the elements to be assembled are pressed against each other.

Deux modes de réalisation du dispositif de mise en oeuvre du procédé vont être décrits ci-après, le premier, de structure simple et le second de structure plus élaborée.  Two embodiments of the device for implementing the method will be described below, the first, of simple structure and the second of more elaborate structure.

Le premier mode de réalisation tel qu'illustré par la figure 2, utilise la combinaison d'un sac de polyéthylène 7, fermé par soudure sur trois côtés hors l'ouverture pour que le sac présente une certaine rigidité et définisse deux parois principales 71, 72, d'un moyen d'appui tel qu'une règle 8 disposé sur le sac et parallèlement au côté ouvert, et d'un plan de travail 9 ; le montage pré-positionné selon la figure 1 est introduit dans le sac plastique 7, le tout étant enfermé dans une chambre à vide. The first embodiment as illustrated by FIG. 2 uses the combination of a polyethylene bag 7, closed by welding on three sides outside the opening so that the bag has a certain rigidity and defines two main walls 71, 72, a support means such as a rule 8 disposed on the bag and parallel to the open side, and a work surface 9; the pre-positioned assembly according to FIG. 1 is introduced into the plastic bag 7, the whole being enclosed in a vacuum chamber.

Au cours de la mise sous vide, la pression à l'intérieur du sac 7 est légèrement supérieure à celle de la chambre et I'air s'évacue du sac, le moyen d'appui étant alors une fermeture tout à fait inefficace ; en cassant le vide, la différence de pression applique fortement, en quelques dixièmes de seconde, les parois du sac l'une contre l'autre, le moyen d'appui 8 préservant le vide régnant dans le sac en empêchant l'air d'y pénétrer. Lorsque la différence de pression de part et d'autre de la paroi supérieure 71 atteint une valeur suffisante, les ressorts de retenue cèdent sous la pression de cette paroi et la plaque de circuit imprimé vient se plaquer contre le fond du module électronique, entraînant par là-même le collage des surfaces en regard. During the evacuation, the pressure inside the bag 7 is slightly higher than that of the chamber and the air is evacuated from the bag, the support means then being a completely ineffective closure; by breaking the vacuum, the pressure difference strongly applies, in a few tenths of a second, the walls of the bag against each other, the support means 8 preserving the vacuum prevailing in the bag by preventing the air from enter it. When the pressure difference on either side of the upper wall 71 reaches a sufficient value, the retaining springs yield under the pressure of this wall and the printed circuit board is pressed against the bottom of the electronic module, causing there the bonding of the facing surfaces.

Le second mode de réalisation représenté à la figure 3 comporte une chambre à vide 10 munie de trois vannes 11, 12 et 13 ; une membrane en élastomère 14 fixée dans un cadre 41, 42, disposé à hauteur réglable séparent la chambre en deux compartiments 21 et 22 ; le montage pré-positionné est introduit sur un plateau 15 situé dans le compartiment inférieur 22, puis le vide est établi dans toute la chambre, la vanne 11 et la vanne 12 communiquant avec la pompe à vide 16 étant ouvertes, la vanne 13 communiquant avec l'extérieur étant fermée ; lorsque le niveau de vide désiré est atteint, on ferme la vanne 11, puis la vanne 12 et on ouvre la vanne 13 pour effectuer le rétablissement en pression du seul compartiment supérieur 21 la membrane 14 se déforme sous l'effet de la pression rétablie dans le compartiment supérieur 21 alors que le compartiment inférieur 22 reste sous vide ; la membrane 14 vient alors exercer une pression sur le montage initial, ce qui va permettre de vaincre la résistance des ressorts de retenue, provoquant presqu'instantanément la mise en contact des surfaces à coller. The second embodiment shown in FIG. 3 comprises a vacuum chamber 10 provided with three valves 11, 12 and 13; an elastomer membrane 14 fixed in a frame 41, 42, arranged at adjustable height, separates the chamber into two compartments 21 and 22; the pre-positioned assembly is introduced on a plate 15 located in the lower compartment 22, then the vacuum is established throughout the chamber, the valve 11 and the valve 12 communicating with the vacuum pump 16 being open, the valve 13 communicating with the exterior being closed; when the desired vacuum level is reached, the valve 11 is closed, then the valve 12 and the valve 13 is opened to restore the pressure in the only upper compartment 21 the membrane 14 deforms under the effect of the pressure restored in the upper compartment 21 while the lower compartment 22 remains under vacuum; the membrane 14 then exerts pressure on the initial assembly, which will make it possible to overcome the resistance of the retaining springs, causing almost instantaneously bringing the surfaces to be bonded into contact.

On ouvre enfin la vanne 11 afin de rétablir la pression dans toute la chambre.Finally, the valve 11 is opened in order to restore the pressure throughout the chamber.

L'invention n'est pas limitée à l'assemblage d'une plaque de circuit imprimé sur un radiateur mais s' applique à l'assemblage de tous modules électroniques et, plus généralement, au collage de deux éléments dont les caractéristiques (forme, volume, matériau, poids, ...) peuvent différer notablement de celles des éléments précédemment décrits : les adaptations nécessaires, notamment pour le pré-positionnement des éléments à coller ou pour l'application de la pression de plaquage sur ces éléments, sont de la compétence de l'homme de l'art. Ainsi, lorsque les supports à coller ne présentent pas de rebords, les moyens de retenue (ressorts à lame, cales, éléments rotatifs, trombones, bilies, ...) peuvent également servir de moyens d'espacement de même, sans sortir du cadre de l'invention, d'autres moyens déformables (mousse sur plaque, feuillue d'aluminium) peuvent être utilisés pour exercer la pression de plaquage.  The invention is not limited to the assembly of a printed circuit board on a radiator but applies to the assembly of all electronic modules and, more generally, to the bonding of two elements whose characteristics (shape, volume, material, weight, ...) may differ significantly from those of the elements previously described: the necessary adaptations, in particular for the pre-positioning of the elements to be bonded or for the application of the pressing pressure on these elements, are of the competence of a person skilled in the art. Thus, when the supports to be bonded do not have edges, the retaining means (leaf springs, shims, rotary elements, paper clips, binder, ...) can also serve as spacing means likewise, without leaving the frame. of the invention, other deformable means (foam on plate, aluminum foil) can be used to exert the pressing pressure.

Claims (7)

REVENDICATIONS 1. Procédé de collage instantané, sans bulles d'air, notamment de surfaces d'éléments rigides et non poreux, dont l'une au moins est pré-encollée, caractérisé en ce qu'il consiste  1. Instant bonding process, without air bubbles, in particular of rigid and non-porous element surfaces, at least one of which is pre-glued, characterized in that it consists - dans une première étape, à pré-positionner les surfaces à coller en les disposant en regard l'une par rapport à l'autre par un moyen de guidage et en les maintenant à distance l'une de l'autre par des moyens de retenue et de centrage - in a first step, to pre-position the surfaces to be bonded by placing them facing each other by means of a guide means and by keeping them at a distance from each other by means of restraint and centering - dans une seconde étape, à créer un vide pour évacuer l'air entre et dans un espace entourant les éléments à coller, la qualité du vide étant déterminée en fonction de la qualité de collage désirée  - in a second step, to create a vacuum to evacuate the air between and in a space surrounding the elements to be bonded, the quality of the vacuum being determined as a function of the desired quality of bonding - dans une troisième étape, à casser le vide à l'extérieur dudit espace de manière à exercer une pression sur l'un au moins des éléments à assembler pour vaincre la résistance des moyens de retenue et plaquer les surfaces à coller l'une contre l'autre.  - In a third step, to break the vacuum outside said space so as to exert pressure on at least one of the elements to be assembled to overcome the resistance of the retaining means and press the surfaces to be bonded one against the other. 2. Procédé selon la revendication 1, caractérisé en ce que le moyen de guidage est constitué par les rebords d'une des structures à coller formant un trou-guide pour le second support. 2. Method according to claim 1, characterized in that the guide means is constituted by the edges of one of the structures to be bonded forming a guide hole for the second support. 3. Procédé selon la revendication 1, caractérisé en ce que les moyens de retenue et de centrage servent également de moyen de guidage. 3. Method according to claim 1, characterized in that the retaining and centering means also serve as guide means. 4. Procédé selon la revendication 3, caractérisé en ce que les moyens de retenue et de centrage sont constitués par des ressorts au bronze-béryllium. 4. Method according to claim 3, characterized in that the retaining and centering means are constituted by bronze-beryllium springs. 5. Dispositif de mise en oeuvre du procédé selon la revendication 1, caractérisé en ce qu'il comprend une chambre à vide, des moyens de mise sous vide pour évacuer l'air dans toute la chambre à vide et en particulier entre les éléments à coller, un moyen déformable au moins en partie partageant la chambre en un espace contenant les éléments à coller pré-positionnés et en un espace extérieur, et des moyens de rétablissement de la pression atmosphérique uniquement dans l'espace extérieur pour que le moyen déformable exerce sur le volume interne resté sous vide, et en particulier sur l'un des éléments à coller, une pression telle que les moyens de retenue cèdent et que les éléments à assembler viennent se plaquer l'un contre l'autre. 5. Device for implementing the method according to claim 1, characterized in that it comprises a vacuum chamber, vacuum means for evacuating the air throughout the vacuum chamber and in particular between the elements to bonding, a deformable means at least partially dividing the chamber in a space containing the elements to be bonded pre-positioned and in an external space, and means for restoring atmospheric pressure only in the external space so that the deformable means on the internal volume remaining under vacuum, and in particular on one of the elements to be bonded, a pressure such that the retaining means give way and that the elements to be assembled are pressed against one another. 6. Dispositif selon la revendication 5, caractérisé en ce que le moyen déformable est un sac en plastique (7) fermé par soudure sur trois côtés, ce sac présentant ainsi deux parois principales (71,72) pour envelopper les éléments à coller pré-positionnés selon la revendication 1, en ce qu'il comprend un moyen d'appui (8) apte à fermer le sac sans empêcher la mise sous vide de son espace intérieur lors de la mise sous vide de l'ensemble de la chambre, en ce que ce moyen (8) conserve le vide installé dans le sac lors du rétablissement de la pression atmosphérique dans la chambre créant une différence de pression de part et d'autre de la paroi supérieure (71) du sac, et en ce que la paroi (71) exerce alors sur l'un (1) des éléments à assembler la pression adaptée pour vaincre les moyens de retenue et plaquer les surfaces à coller l'une contre l'autre. 6. Device according to claim 5, characterized in that the deformable means is a plastic bag (7) closed by welding on three sides, this bag thus having two main walls (71,72) for wrapping the elements to be glued pre- positioned according to claim 1, in that it comprises a support means (8) capable of closing the bag without preventing the evacuation of its interior space during the evacuation of the entire chamber, in that this means (8) keeps the vacuum installed in the bag when restoring atmospheric pressure in the chamber creating a pressure difference on either side of the upper wall (71) of the bag, and in that the wall (71) then exerts on one (1) of the elements to be assembled the pressure adapted to overcome the retaining means and press the surfaces to be bonded one against the other. 7. Dispositif selon la revendication 5, caractérisé en ce que le moyen déformable est une membrane en élastomère (14) fixée sur un cadre (41,42) horizontal et réglable en hauteur dans la chambre à vide, en ce que la membrane sépare la chambre à vide en deux compartiments (21, 22) correspondant respectivement à l'espace extérieur et à l'espace contenant les éléments à coller pré-positionnés, ces deux compartiments pouvant communiquer par une ouverture commandée par une vanne (11), en ce que l'ouverture d'une vanne (12) communiquant avec la pompe à vide met sous vide l'ensemble de la chambre, la vanne (11) étant ouverte, en ce que le rétablissement en pression du seul compartiment supérieur (21) est obtenu par la fermeture des vannes (11 et (12) et l'ouverture d'une vanne (13) communiquant avec l'extérieur de la chambre, et en ce que la membrane (14) se déforme du fait de la différence de pression entre les compartiments (21) et (22) et exerce alors la pression de plaquage adaptée pour vaincre les éléments de retenue et plaquer les éléments à assembler l'un contre l'autre.  7. Device according to claim 5, characterized in that the deformable means is an elastomer membrane (14) fixed on a horizontal frame (41,42) and adjustable in height in the vacuum chamber, in that the membrane separates the vacuum chamber in two compartments (21, 22) corresponding respectively to the external space and to the space containing the pre-positioned elements to be bonded, these two compartments being able to communicate by an opening controlled by a valve (11), in that that the opening of a valve (12) communicating with the vacuum pump puts the entire chamber under vacuum, the valve (11) being open, in that the re-establishment of pressure in the only upper compartment (21) is obtained by closing the valves (11 and (12) and opening a valve (13) communicating with the outside of the chamber, and in that the membrane (14) deforms due to the pressure difference between compartments (21) and (22) and then exerts pressure n of suitable plating to overcome the retaining elements and press the elements to be assembled one against the other.
FR9003037A 1990-03-09 1990-03-09 Process for bubble-free instantaneous adhesive bonding, especially of surfaces of rigid and nonporous components, and device for its use Granted FR2659344A1 (en)

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WO1996030937A1 (en) * 1995-03-27 1996-10-03 Micron Technology, Inc. A curing method and equipment design for epoxy mounted flip chip devices
EP0750550A1 (en) * 1995-01-13 1997-01-02 Libbey-Owens-Ford Co. Vacuum-assisted device for mounting an optical moisture sensor on glass
EP0803414A1 (en) * 1996-04-23 1997-10-29 Itt Manufacturing Enterprises, Inc. Device for the bubble free affixing of components to be glued together
DE19755088A1 (en) * 1997-12-11 1999-06-17 Daimler Chrysler Ag Calibrated bonding device for bubble-free adhesive bonding of structured semiconductor wafers
FR2798935A1 (en) * 1999-09-29 2001-03-30 Siemens Ag GLUING PROCESS
WO2003074333A1 (en) * 2002-03-05 2003-09-12 Robert Bosch Gmbh Device and method for fixing a sensing means
DE10102848B4 (en) * 2000-05-31 2004-04-15 Sebastian Erb Process for positive and bubble-free gluing of populated or non-populated printed circuits with flat heat sinks using adhesive foils
FR2873499A1 (en) * 2004-07-23 2006-01-27 Thales Sa Apparatus for assembling/sticking two or more components such as patch antenna has chamber with separator and effluent circuit with inlet, outlet and valve
EP1705969A2 (en) * 2005-01-27 2006-09-27 Delphi Technologies, Inc. Electronic assembly having a substrate laminated within a backplate cavity
DE102009049386A1 (en) * 2009-10-14 2011-04-21 Scheugenpflug Ag Method for flat gluing of contact surfaces of two objects, comprises applying a defined adhesive volume per unit of area on one of the contact surfaces and joining both contact surfaces and pressing against each other
EP2521430A1 (en) * 2011-05-06 2012-11-07 Pierburg Pump Technology GmbH Method for fixing a PCB to a body and pump driven by an electric motor

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Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0750550A1 (en) * 1995-01-13 1997-01-02 Libbey-Owens-Ford Co. Vacuum-assisted device for mounting an optical moisture sensor on glass
EP0750550A4 (en) * 1995-01-13 1997-02-12
WO1996030937A1 (en) * 1995-03-27 1996-10-03 Micron Technology, Inc. A curing method and equipment design for epoxy mounted flip chip devices
US5605547A (en) * 1995-03-27 1997-02-25 Micron Technology, Inc. Method and apparatus for mounting a component to a substrate using an anisotropic adhesive, a compressive cover film, and a conveyor
EP0803414A1 (en) * 1996-04-23 1997-10-29 Itt Manufacturing Enterprises, Inc. Device for the bubble free affixing of components to be glued together
DE19755088A1 (en) * 1997-12-11 1999-06-17 Daimler Chrysler Ag Calibrated bonding device for bubble-free adhesive bonding of structured semiconductor wafers
FR2798935A1 (en) * 1999-09-29 2001-03-30 Siemens Ag GLUING PROCESS
DE10102848B4 (en) * 2000-05-31 2004-04-15 Sebastian Erb Process for positive and bubble-free gluing of populated or non-populated printed circuits with flat heat sinks using adhesive foils
WO2003074333A1 (en) * 2002-03-05 2003-09-12 Robert Bosch Gmbh Device and method for fixing a sensing means
US7104149B2 (en) 2002-03-05 2006-09-12 Robert Bosch Gmbh Device and method for fixing a sensing means
FR2873499A1 (en) * 2004-07-23 2006-01-27 Thales Sa Apparatus for assembling/sticking two or more components such as patch antenna has chamber with separator and effluent circuit with inlet, outlet and valve
EP1622437A1 (en) 2004-07-23 2006-02-01 Thales Verfahren zum Verkleben oder Zusammenstellen mehrerer Elemente
EP1705969A2 (en) * 2005-01-27 2006-09-27 Delphi Technologies, Inc. Electronic assembly having a substrate laminated within a backplate cavity
EP1705969A3 (en) * 2005-01-27 2008-07-02 Delphi Technologies, Inc. Electronic assembly having a substrate laminated within a backplate cavity
US7416011B2 (en) 2005-01-27 2008-08-26 Delphi Technologies, Inc. Electronic assembly having a substrate laminated within a backplate cavity
DE102009049386A1 (en) * 2009-10-14 2011-04-21 Scheugenpflug Ag Method for flat gluing of contact surfaces of two objects, comprises applying a defined adhesive volume per unit of area on one of the contact surfaces and joining both contact surfaces and pressing against each other
DE102009049386B4 (en) 2009-10-14 2018-06-28 Pierburg Pump Technology Gmbh Method and device for bonding by means of vacuum
EP2521430A1 (en) * 2011-05-06 2012-11-07 Pierburg Pump Technology GmbH Method for fixing a PCB to a body and pump driven by an electric motor
WO2012152627A1 (en) * 2011-05-06 2012-11-15 Pierburg Pump Technology Gmbh Method for fastening a circuit board to a body, and electric-motor-driven pump

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