JPS54113253A - Bonding method of semiconductor pellet - Google Patents

Bonding method of semiconductor pellet

Info

Publication number
JPS54113253A
JPS54113253A JP1981878A JP1981878A JPS54113253A JP S54113253 A JPS54113253 A JP S54113253A JP 1981878 A JP1981878 A JP 1981878A JP 1981878 A JP1981878 A JP 1981878A JP S54113253 A JPS54113253 A JP S54113253A
Authority
JP
Japan
Prior art keywords
pellet
material layer
adhesive material
tab
face
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1981878A
Other languages
Japanese (ja)
Inventor
Yoshiaki Wakashima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1981878A priority Critical patent/JPS54113253A/en
Publication of JPS54113253A publication Critical patent/JPS54113253A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE: To eliminate the irregularity of a paste application quantity to remove the fear of adhesion defects, crack generation, characteristic deterioration, etc., by forming previously an adhesive material layer on the adhesion face of a pellet and putting the pellet on a tab face and melting the adhesive material layer by heating.
CONSTITUTION: Adhesive material layer 2 which is hardened in a desired thickness by application, printing, etc., is formed on one face of a wafer. Semiconductor pellet 11 which adhesive material layer 2 is caused to adhere to and is divided in a desired size is put on tab 3 so that adhesive material layer 2 may be in the tab 3 side, and the pellet and the tab are heated at an adhesive melting temperature and are caused to adhere to each other. As a result, the fear of adhesion defects, crack generation, characteristic deterioration, etc., can be removed, and further, pellet handling becomes easy.
COPYRIGHT: (C)1979,JPO&Japio
JP1981878A 1978-02-24 1978-02-24 Bonding method of semiconductor pellet Pending JPS54113253A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981878A JPS54113253A (en) 1978-02-24 1978-02-24 Bonding method of semiconductor pellet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981878A JPS54113253A (en) 1978-02-24 1978-02-24 Bonding method of semiconductor pellet

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP10457984A Division JPS6016432A (en) 1984-05-25 1984-05-25 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS54113253A true JPS54113253A (en) 1979-09-04

Family

ID=12009891

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981878A Pending JPS54113253A (en) 1978-02-24 1978-02-24 Bonding method of semiconductor pellet

Country Status (1)

Country Link
JP (1) JPS54113253A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5943531A (en) * 1982-09-02 1984-03-10 Nitto Electric Ind Co Ltd Manufacture of semiconductor device
JPS59143335A (en) * 1983-02-03 1984-08-16 Oki Electric Ind Co Ltd Manufacture of semiconductor device
JPS6049635A (en) * 1983-08-29 1985-03-18 Sumitomo Bakelite Co Ltd Mounting method of chip

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5943531A (en) * 1982-09-02 1984-03-10 Nitto Electric Ind Co Ltd Manufacture of semiconductor device
JPS59143335A (en) * 1983-02-03 1984-08-16 Oki Electric Ind Co Ltd Manufacture of semiconductor device
JPS6049635A (en) * 1983-08-29 1985-03-18 Sumitomo Bakelite Co Ltd Mounting method of chip

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