JPS54113253A - Bonding method of semiconductor pellet - Google Patents
Bonding method of semiconductor pelletInfo
- Publication number
- JPS54113253A JPS54113253A JP1981878A JP1981878A JPS54113253A JP S54113253 A JPS54113253 A JP S54113253A JP 1981878 A JP1981878 A JP 1981878A JP 1981878 A JP1981878 A JP 1981878A JP S54113253 A JPS54113253 A JP S54113253A
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- material layer
- adhesive material
- tab
- face
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
Landscapes
- Die Bonding (AREA)
Abstract
PURPOSE: To eliminate the irregularity of a paste application quantity to remove the fear of adhesion defects, crack generation, characteristic deterioration, etc., by forming previously an adhesive material layer on the adhesion face of a pellet and putting the pellet on a tab face and melting the adhesive material layer by heating.
CONSTITUTION: Adhesive material layer 2 which is hardened in a desired thickness by application, printing, etc., is formed on one face of a wafer. Semiconductor pellet 11 which adhesive material layer 2 is caused to adhere to and is divided in a desired size is put on tab 3 so that adhesive material layer 2 may be in the tab 3 side, and the pellet and the tab are heated at an adhesive melting temperature and are caused to adhere to each other. As a result, the fear of adhesion defects, crack generation, characteristic deterioration, etc., can be removed, and further, pellet handling becomes easy.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1981878A JPS54113253A (en) | 1978-02-24 | 1978-02-24 | Bonding method of semiconductor pellet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1981878A JPS54113253A (en) | 1978-02-24 | 1978-02-24 | Bonding method of semiconductor pellet |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10457984A Division JPS6016432A (en) | 1984-05-25 | 1984-05-25 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS54113253A true JPS54113253A (en) | 1979-09-04 |
Family
ID=12009891
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1981878A Pending JPS54113253A (en) | 1978-02-24 | 1978-02-24 | Bonding method of semiconductor pellet |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54113253A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5943531A (en) * | 1982-09-02 | 1984-03-10 | Nitto Electric Ind Co Ltd | Manufacture of semiconductor device |
JPS59143335A (en) * | 1983-02-03 | 1984-08-16 | Oki Electric Ind Co Ltd | Manufacture of semiconductor device |
JPS6049635A (en) * | 1983-08-29 | 1985-03-18 | Sumitomo Bakelite Co Ltd | Mounting method of chip |
-
1978
- 1978-02-24 JP JP1981878A patent/JPS54113253A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5943531A (en) * | 1982-09-02 | 1984-03-10 | Nitto Electric Ind Co Ltd | Manufacture of semiconductor device |
JPS59143335A (en) * | 1983-02-03 | 1984-08-16 | Oki Electric Ind Co Ltd | Manufacture of semiconductor device |
JPS6049635A (en) * | 1983-08-29 | 1985-03-18 | Sumitomo Bakelite Co Ltd | Mounting method of chip |
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