JPS5753120A - Production of adhesive substrate for precise lapping of thin material - Google Patents

Production of adhesive substrate for precise lapping of thin material

Info

Publication number
JPS5753120A
JPS5753120A JP12811480A JP12811480A JPS5753120A JP S5753120 A JPS5753120 A JP S5753120A JP 12811480 A JP12811480 A JP 12811480A JP 12811480 A JP12811480 A JP 12811480A JP S5753120 A JPS5753120 A JP S5753120A
Authority
JP
Japan
Prior art keywords
adhesive substrate
wax
substrate
production
adhesion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12811480A
Other languages
Japanese (ja)
Inventor
Katsura Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Holdings Co Ltd
Citizen Watch Co Ltd
Original Assignee
Citizen Holdings Co Ltd
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Holdings Co Ltd, Citizen Watch Co Ltd filed Critical Citizen Holdings Co Ltd
Priority to JP12811480A priority Critical patent/JPS5753120A/en
Publication of JPS5753120A publication Critical patent/JPS5753120A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02007—Details of bulk acoustic wave devices
    • H03H9/02086—Means for compensation or elimination of undesirable effects
    • H03H9/02094—Means for compensation or elimination of undesirable effects of adherence

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Abstract

PURPOSE:To make high-precision adhesion possible, by producing an adhesive substrate with a wax penetrating layer after the processing for an average uniform roughened surface. CONSTITUTION:After the surface of an adhesive substrate 3 is roughened up to >=10S by the sand blast method, a liquid with a wax or the like 2 dissolved is coated onto grooves 4 uniformly by spray to form the adhesive substrate 3. Next, a work 1 (such as a thin crystal wafer) is put on the adhesive substrate 3, and a constant or more load is applied and the substrate 3 is heated at a temperature higher than the melting point of the wax to cause the wax 2, which is not required for adhesion on the adhesive substrate 3, to penetrate into grooves 4, thereby realizing high-precision adhesion.
JP12811480A 1980-09-16 1980-09-16 Production of adhesive substrate for precise lapping of thin material Pending JPS5753120A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12811480A JPS5753120A (en) 1980-09-16 1980-09-16 Production of adhesive substrate for precise lapping of thin material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12811480A JPS5753120A (en) 1980-09-16 1980-09-16 Production of adhesive substrate for precise lapping of thin material

Publications (1)

Publication Number Publication Date
JPS5753120A true JPS5753120A (en) 1982-03-30

Family

ID=14976717

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12811480A Pending JPS5753120A (en) 1980-09-16 1980-09-16 Production of adhesive substrate for precise lapping of thin material

Country Status (1)

Country Link
JP (1) JPS5753120A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010153961A (en) * 2008-12-24 2010-07-08 Ngk Insulators Ltd Method of manufacturing compound substrate, and compound substrate
JP2010259011A (en) * 2009-04-28 2010-11-11 Murata Mfg Co Ltd Substrate for surface acoustic wave element and method of manufacturing the surface acoustic wave element

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010153961A (en) * 2008-12-24 2010-07-08 Ngk Insulators Ltd Method of manufacturing compound substrate, and compound substrate
JP2010259011A (en) * 2009-04-28 2010-11-11 Murata Mfg Co Ltd Substrate for surface acoustic wave element and method of manufacturing the surface acoustic wave element

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