JPS5753120A - Production of adhesive substrate for precise lapping of thin material - Google Patents
Production of adhesive substrate for precise lapping of thin materialInfo
- Publication number
- JPS5753120A JPS5753120A JP12811480A JP12811480A JPS5753120A JP S5753120 A JPS5753120 A JP S5753120A JP 12811480 A JP12811480 A JP 12811480A JP 12811480 A JP12811480 A JP 12811480A JP S5753120 A JPS5753120 A JP S5753120A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive substrate
- wax
- substrate
- production
- adhesion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02086—Means for compensation or elimination of undesirable effects
- H03H9/02094—Means for compensation or elimination of undesirable effects of adherence
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
PURPOSE:To make high-precision adhesion possible, by producing an adhesive substrate with a wax penetrating layer after the processing for an average uniform roughened surface. CONSTITUTION:After the surface of an adhesive substrate 3 is roughened up to >=10S by the sand blast method, a liquid with a wax or the like 2 dissolved is coated onto grooves 4 uniformly by spray to form the adhesive substrate 3. Next, a work 1 (such as a thin crystal wafer) is put on the adhesive substrate 3, and a constant or more load is applied and the substrate 3 is heated at a temperature higher than the melting point of the wax to cause the wax 2, which is not required for adhesion on the adhesive substrate 3, to penetrate into grooves 4, thereby realizing high-precision adhesion.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12811480A JPS5753120A (en) | 1980-09-16 | 1980-09-16 | Production of adhesive substrate for precise lapping of thin material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12811480A JPS5753120A (en) | 1980-09-16 | 1980-09-16 | Production of adhesive substrate for precise lapping of thin material |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5753120A true JPS5753120A (en) | 1982-03-30 |
Family
ID=14976717
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12811480A Pending JPS5753120A (en) | 1980-09-16 | 1980-09-16 | Production of adhesive substrate for precise lapping of thin material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5753120A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010153961A (en) * | 2008-12-24 | 2010-07-08 | Ngk Insulators Ltd | Method of manufacturing compound substrate, and compound substrate |
JP2010259011A (en) * | 2009-04-28 | 2010-11-11 | Murata Mfg Co Ltd | Substrate for surface acoustic wave element and method of manufacturing the surface acoustic wave element |
-
1980
- 1980-09-16 JP JP12811480A patent/JPS5753120A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010153961A (en) * | 2008-12-24 | 2010-07-08 | Ngk Insulators Ltd | Method of manufacturing compound substrate, and compound substrate |
JP2010259011A (en) * | 2009-04-28 | 2010-11-11 | Murata Mfg Co Ltd | Substrate for surface acoustic wave element and method of manufacturing the surface acoustic wave element |
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