JPS5662628A - Production of die for forming - Google Patents

Production of die for forming

Info

Publication number
JPS5662628A
JPS5662628A JP13964079A JP13964079A JPS5662628A JP S5662628 A JPS5662628 A JP S5662628A JP 13964079 A JP13964079 A JP 13964079A JP 13964079 A JP13964079 A JP 13964079A JP S5662628 A JPS5662628 A JP S5662628A
Authority
JP
Japan
Prior art keywords
substrate
patterns
forming
die
etching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13964079A
Other languages
Japanese (ja)
Inventor
Takashi Kurokawa
Choichi Niizeki
Tetsuo Yoshizawa
Yuzo Katayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Telegraph and Telephone Corp
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP13964079A priority Critical patent/JPS5662628A/en
Publication of JPS5662628A publication Critical patent/JPS5662628A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To manufacture a high hardness die having high-precision fine convex patterns by forming a thin conductive layer through electroless plating treatment on the fine concave patterns formed through etching on the surface of an Si single crystal substrate then performing electrochemical molding.
CONSTITUTION: Fine concave patterns 35 are formed on the surface 31 of an Si single crystal substrate 32 having a flat surface, by the etching treatment using striplike masks 33 for etching. Next, a conductive substrate 36 is secured to this substrate 32 by using a conductive adhesive agent 37, and in this state, a thin conductive layer 40 is stuck by electroless plating treatment on the surface 31 of the substrate 32. Next, in electrolyte 41, electrochemical forming is applied on the surface 31 of the substrate 32 having formed with the fine concave patterns 35, whereby a thick metal layer 45 of high hardness is formed. Thence, the metal layer 45 is peeled from the substrate surface 31 and is taken out as the die for forming having the surface 48 formed with the fine convex patterns 47 corresponding to the patterns 35, after which the circumference of the layer 45 is subjected to working.
COPYRIGHT: (C)1981,JPO&Japio
JP13964079A 1979-10-29 1979-10-29 Production of die for forming Pending JPS5662628A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13964079A JPS5662628A (en) 1979-10-29 1979-10-29 Production of die for forming

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13964079A JPS5662628A (en) 1979-10-29 1979-10-29 Production of die for forming

Publications (1)

Publication Number Publication Date
JPS5662628A true JPS5662628A (en) 1981-05-28

Family

ID=15249978

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13964079A Pending JPS5662628A (en) 1979-10-29 1979-10-29 Production of die for forming

Country Status (1)

Country Link
JP (1) JPS5662628A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05220751A (en) * 1992-08-07 1993-08-31 Nikon Corp Manufacture of mold for molding plastic

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05220751A (en) * 1992-08-07 1993-08-31 Nikon Corp Manufacture of mold for molding plastic

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