JPS56148838A - Mounting method for ic - Google Patents

Mounting method for ic

Info

Publication number
JPS56148838A
JPS56148838A JP5327780A JP5327780A JPS56148838A JP S56148838 A JPS56148838 A JP S56148838A JP 5327780 A JP5327780 A JP 5327780A JP 5327780 A JP5327780 A JP 5327780A JP S56148838 A JPS56148838 A JP S56148838A
Authority
JP
Japan
Prior art keywords
adhering layer
wafer
substrate member
kerfs
hot melt
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5327780A
Other languages
Japanese (ja)
Inventor
Isao Komine
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Watch Co Ltd
Original Assignee
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Watch Co Ltd filed Critical Citizen Watch Co Ltd
Priority to JP5327780A priority Critical patent/JPS56148838A/en
Publication of JPS56148838A publication Critical patent/JPS56148838A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Dicing (AREA)

Abstract

PURPOSE:To use a substrate member repeatedly by a method wherein an IC wafer is fastened onto a hot melt type thick adhering layer, kerfs are formed up to the way of the adhering layer and dicing is conducted. CONSTITUTION:The surface of a substrate member 1 is honed, and a rough surface section 7 is formed. The section 7 is coated with a polyester group hot melt type adhering layer 8, and an IC wafer 3 is stacked, heated and glued. Kerfs 4 reaching up to the way of the adhering layer 8 are processed penetrating the wafer 3. Heat and pressure are applied to a finger lead of a tape carrier and an IC electrode, and each IC chip 5 is removed gradually from the adhering layer 8. The substrate member 1 can be reused by exfoliating the adhering layer 8 by means of a physical method.
JP5327780A 1980-04-22 1980-04-22 Mounting method for ic Pending JPS56148838A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5327780A JPS56148838A (en) 1980-04-22 1980-04-22 Mounting method for ic

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5327780A JPS56148838A (en) 1980-04-22 1980-04-22 Mounting method for ic

Publications (1)

Publication Number Publication Date
JPS56148838A true JPS56148838A (en) 1981-11-18

Family

ID=12938237

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5327780A Pending JPS56148838A (en) 1980-04-22 1980-04-22 Mounting method for ic

Country Status (1)

Country Link
JP (1) JPS56148838A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0614102A2 (en) * 1993-03-03 1994-09-07 Texas Instruments Incorporated Improvements in or relating to integrated circuit fabrication
JP2007509501A (en) * 2003-10-22 2007-04-12 ノースロップ・グラマン・コーポレーション Sewing process of hard substrate wafer

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0614102A2 (en) * 1993-03-03 1994-09-07 Texas Instruments Incorporated Improvements in or relating to integrated circuit fabrication
EP0614102A3 (en) * 1993-03-03 1994-11-30 Texas Instruments Inc Improvements in or relating to integrated circuit fabrication.
US5622900A (en) * 1993-03-03 1997-04-22 Texas Instruments Incorporated Wafer-like processing after sawing DMDs
JP2007509501A (en) * 2003-10-22 2007-04-12 ノースロップ・グラマン・コーポレーション Sewing process of hard substrate wafer

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