JPS5730334A - Protection of wiring layer - Google Patents

Protection of wiring layer

Info

Publication number
JPS5730334A
JPS5730334A JP10427480A JP10427480A JPS5730334A JP S5730334 A JPS5730334 A JP S5730334A JP 10427480 A JP10427480 A JP 10427480A JP 10427480 A JP10427480 A JP 10427480A JP S5730334 A JPS5730334 A JP S5730334A
Authority
JP
Japan
Prior art keywords
wiring layer
layer
resin
semiconductor substrate
zirconium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10427480A
Other languages
Japanese (ja)
Other versions
JPS6156869B2 (en
Inventor
Shinetsu Fujieda
Shiyuichi Suzuki
Naoyuki Kokuni
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP10427480A priority Critical patent/JPS5730334A/en
Publication of JPS5730334A publication Critical patent/JPS5730334A/en
Publication of JPS6156869B2 publication Critical patent/JPS6156869B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers

Abstract

PURPOSE:To increase the adhesive property for both wiring layer provided on a semiconductor substrate and a resin film by a method wherein a zirconium or zirconia layer is placed between the wiring layer formed on the semiconductor substrate and the resin film. CONSTITUTION:After a zirconium thermal oxide layer or a zirconium layer 4 has been provided on the Al wiring layer via an SiO2 film 2 on the semiconductor substrate 1, a resin layer 5 such as polyimide resin or the like is coated. Through these procedures, the adhesiveness between the wiring layer 3 and the resin layer 5 is increased and the corrosion on the wiring layer can be prevented effectively.
JP10427480A 1980-07-31 1980-07-31 Protection of wiring layer Granted JPS5730334A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10427480A JPS5730334A (en) 1980-07-31 1980-07-31 Protection of wiring layer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10427480A JPS5730334A (en) 1980-07-31 1980-07-31 Protection of wiring layer

Publications (2)

Publication Number Publication Date
JPS5730334A true JPS5730334A (en) 1982-02-18
JPS6156869B2 JPS6156869B2 (en) 1986-12-04

Family

ID=14376338

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10427480A Granted JPS5730334A (en) 1980-07-31 1980-07-31 Protection of wiring layer

Country Status (1)

Country Link
JP (1) JPS5730334A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0264134A2 (en) * 1986-10-16 1988-04-20 International Business Machines Corporation Zirconium as an adhesion material in a multi-layer wiring substrate
JPS63211818A (en) * 1987-02-27 1988-09-02 Toshiba Corp Digital phase synchronizing controller
JPS6486715A (en) * 1987-09-29 1989-03-31 Toshiba Corp Automatic frequency control circuit

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0264134A2 (en) * 1986-10-16 1988-04-20 International Business Machines Corporation Zirconium as an adhesion material in a multi-layer wiring substrate
JPS63211818A (en) * 1987-02-27 1988-09-02 Toshiba Corp Digital phase synchronizing controller
JPS6486715A (en) * 1987-09-29 1989-03-31 Toshiba Corp Automatic frequency control circuit

Also Published As

Publication number Publication date
JPS6156869B2 (en) 1986-12-04

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