JPS5530876A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5530876A
JPS5530876A JP10470078A JP10470078A JPS5530876A JP S5530876 A JPS5530876 A JP S5530876A JP 10470078 A JP10470078 A JP 10470078A JP 10470078 A JP10470078 A JP 10470078A JP S5530876 A JPS5530876 A JP S5530876A
Authority
JP
Japan
Prior art keywords
metal layer
film
wiring
wiring metal
sio
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10470078A
Other languages
Japanese (ja)
Inventor
Toshio Shigekane
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP10470078A priority Critical patent/JPS5530876A/en
Publication of JPS5530876A publication Critical patent/JPS5530876A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To eliminate unevenness of curve and thickness of wiring metal layer, by protecting the region just heneath the wiring metal layer solely by oxide film while eliminating the grasivation, thereby to improve the relialibity.
CONSTITUTION: An exposed part of a pn joint 1 is installed with a glass film 2, but the part where is just below position of a metal layer 4 for wiring, the glass film 2 is not covered. This part is covered by a SiO2 film 3 same as the other surface. The wiring metal layer 4 is positioned on the film 3 of SiO2 all having the same thickness, for this reason the surface is all even and no warpage and unevenness is observed.
COPYRIGHT: (C)1980,JPO&Japio
JP10470078A 1978-08-28 1978-08-28 Semiconductor device Pending JPS5530876A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10470078A JPS5530876A (en) 1978-08-28 1978-08-28 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10470078A JPS5530876A (en) 1978-08-28 1978-08-28 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5530876A true JPS5530876A (en) 1980-03-04

Family

ID=14387747

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10470078A Pending JPS5530876A (en) 1978-08-28 1978-08-28 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5530876A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5838595A (en) * 1981-08-20 1983-03-07 エスエスエムシー　インコーポレーテッド Lock stitch sewing machine

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5365088A (en) * 1976-11-22 1978-06-10 Nec Corp Semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5365088A (en) * 1976-11-22 1978-06-10 Nec Corp Semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5838595A (en) * 1981-08-20 1983-03-07 エスエスエムシー　インコーポレーテッド Lock stitch sewing machine
JPH0327230B2 (en) * 1981-08-20 1991-04-15 Ssmc Inc

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