JPS5689580A - Thin film type thermal head - Google Patents
Thin film type thermal headInfo
- Publication number
- JPS5689580A JPS5689580A JP16649679A JP16649679A JPS5689580A JP S5689580 A JPS5689580 A JP S5689580A JP 16649679 A JP16649679 A JP 16649679A JP 16649679 A JP16649679 A JP 16649679A JP S5689580 A JPS5689580 A JP S5689580A
- Authority
- JP
- Japan
- Prior art keywords
- film
- resistor
- lead wire
- thermal head
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electronic Switches (AREA)
Abstract
PURPOSE: To retard breakdown and internal separation of the thermal head by a method wherein a resistor film carrying a high evaporation temperature and a large adhesive force is formed with a heating resistor, between a glass layer and a Cr-film on the lower side of a plated Au-film connected with a lead wire.
CONSTITUTION: After an Si-Ta film as a resistor film is evaporated on the whole surface of a substrate, the Si-Ta film is removed by photoetching excepting the part of the heating resistor 2 and the parts of the resistor films 2' in the connecting parts of a diode 8 and an external lead wire 9. Then, when patterning is carried out after the formation of a Cr-Au electrode film by vacuum evaporation, the Au-film on the heating resistor 2 part is removed and connection with the resistor 2 is made on a Cr-film 3 so that the Si-Ta film and the Au-film are not laminated. Further, a wear- resistant protecting film 4 is formed by spattering. Then, Au-plating is made around the connecting parts of the diode lead wire 8 and the external lead wire 9 and finally resin coating 6 is carried out on the exposed part of the plated Au-film excepting around the connected parts.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16649679A JPS5689580A (en) | 1979-12-20 | 1979-12-20 | Thin film type thermal head |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16649679A JPS5689580A (en) | 1979-12-20 | 1979-12-20 | Thin film type thermal head |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5689580A true JPS5689580A (en) | 1981-07-20 |
Family
ID=15832436
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16649679A Pending JPS5689580A (en) | 1979-12-20 | 1979-12-20 | Thin film type thermal head |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5689580A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5959474A (en) * | 1982-09-30 | 1984-04-05 | Toshiba Corp | Thin film thermal head |
JPS5959475A (en) * | 1982-09-30 | 1984-04-05 | Toshiba Corp | Manufacture of thin film thermal head |
JP2014201030A (en) * | 2013-04-08 | 2014-10-27 | アオイ電子株式会社 | Circuit board and thermal print head using the same |
-
1979
- 1979-12-20 JP JP16649679A patent/JPS5689580A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5959474A (en) * | 1982-09-30 | 1984-04-05 | Toshiba Corp | Thin film thermal head |
JPS5959475A (en) * | 1982-09-30 | 1984-04-05 | Toshiba Corp | Manufacture of thin film thermal head |
JP2014201030A (en) * | 2013-04-08 | 2014-10-27 | アオイ電子株式会社 | Circuit board and thermal print head using the same |
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