JPS5689580A - Thin film type thermal head - Google Patents

Thin film type thermal head

Info

Publication number
JPS5689580A
JPS5689580A JP16649679A JP16649679A JPS5689580A JP S5689580 A JPS5689580 A JP S5689580A JP 16649679 A JP16649679 A JP 16649679A JP 16649679 A JP16649679 A JP 16649679A JP S5689580 A JPS5689580 A JP S5689580A
Authority
JP
Japan
Prior art keywords
film
resistor
lead wire
thermal head
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16649679A
Other languages
Japanese (ja)
Inventor
Kiyoharu Yamashita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP16649679A priority Critical patent/JPS5689580A/en
Publication of JPS5689580A publication Critical patent/JPS5689580A/en
Pending legal-status Critical Current

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Abstract

PURPOSE: To retard breakdown and internal separation of the thermal head by a method wherein a resistor film carrying a high evaporation temperature and a large adhesive force is formed with a heating resistor, between a glass layer and a Cr-film on the lower side of a plated Au-film connected with a lead wire.
CONSTITUTION: After an Si-Ta film as a resistor film is evaporated on the whole surface of a substrate, the Si-Ta film is removed by photoetching excepting the part of the heating resistor 2 and the parts of the resistor films 2' in the connecting parts of a diode 8 and an external lead wire 9. Then, when patterning is carried out after the formation of a Cr-Au electrode film by vacuum evaporation, the Au-film on the heating resistor 2 part is removed and connection with the resistor 2 is made on a Cr-film 3 so that the Si-Ta film and the Au-film are not laminated. Further, a wear- resistant protecting film 4 is formed by spattering. Then, Au-plating is made around the connecting parts of the diode lead wire 8 and the external lead wire 9 and finally resin coating 6 is carried out on the exposed part of the plated Au-film excepting around the connected parts.
COPYRIGHT: (C)1981,JPO&Japio
JP16649679A 1979-12-20 1979-12-20 Thin film type thermal head Pending JPS5689580A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16649679A JPS5689580A (en) 1979-12-20 1979-12-20 Thin film type thermal head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16649679A JPS5689580A (en) 1979-12-20 1979-12-20 Thin film type thermal head

Publications (1)

Publication Number Publication Date
JPS5689580A true JPS5689580A (en) 1981-07-20

Family

ID=15832436

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16649679A Pending JPS5689580A (en) 1979-12-20 1979-12-20 Thin film type thermal head

Country Status (1)

Country Link
JP (1) JPS5689580A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5959474A (en) * 1982-09-30 1984-04-05 Toshiba Corp Thin film thermal head
JPS5959475A (en) * 1982-09-30 1984-04-05 Toshiba Corp Manufacture of thin film thermal head
JP2014201030A (en) * 2013-04-08 2014-10-27 アオイ電子株式会社 Circuit board and thermal print head using the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5959474A (en) * 1982-09-30 1984-04-05 Toshiba Corp Thin film thermal head
JPS5959475A (en) * 1982-09-30 1984-04-05 Toshiba Corp Manufacture of thin film thermal head
JP2014201030A (en) * 2013-04-08 2014-10-27 アオイ電子株式会社 Circuit board and thermal print head using the same

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