JPS5541286A - Adhesion method - Google Patents
Adhesion methodInfo
- Publication number
- JPS5541286A JPS5541286A JP11564478A JP11564478A JPS5541286A JP S5541286 A JPS5541286 A JP S5541286A JP 11564478 A JP11564478 A JP 11564478A JP 11564478 A JP11564478 A JP 11564478A JP S5541286 A JPS5541286 A JP S5541286A
- Authority
- JP
- Japan
- Prior art keywords
- adhesion
- bodies
- glued
- coarse
- voids
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To improve adherence properties, by eliminating voids on adhesion surfaces by holding a thermal plastic adhesion sheet, which surface is coarse, between bodies to be glued, by heating the bodies to be glued under pressure reduction conditions and by glueing the bodies and the sheet.
CONSTITUTION: A thermal plastic polybutadiene resin film 4, which one side is coarse, is placed on a cooling plate 3 in copper, a circuit substrate 2, on which a semiconductor element is put, is laid on the film and the whole is admitted into a decompression device and held under low-pressure conditions in approximate 20mmHg. In this case, the air of the voids of portions, at where adhesion is expected, pooduced by the camber of the ceramic substrate, on which the semiconductor element is placed, passes through passages formed by the unevenness of a coarse surface of the polybutadiene resin film and is discharged. The ceramic substrate 2 and the cooling plate 3 are glued at temperature not less than the melting point of polybutadiene resin while they remain as they are under low-pressure conditions, and the voids of the portions where adhesion is expected are filled with the resin film.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11564478A JPS5541286A (en) | 1978-09-20 | 1978-09-20 | Adhesion method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11564478A JPS5541286A (en) | 1978-09-20 | 1978-09-20 | Adhesion method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5541286A true JPS5541286A (en) | 1980-03-24 |
Family
ID=14667737
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11564478A Pending JPS5541286A (en) | 1978-09-20 | 1978-09-20 | Adhesion method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5541286A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6432511B1 (en) * | 1997-06-06 | 2002-08-13 | International Business Machines Corp. | Thermoplastic adhesive preform for heat sink attachment |
| WO2017187920A1 (en) * | 2016-04-28 | 2017-11-02 | 三菱重工業株式会社 | Joined member assembly method and joined member |
-
1978
- 1978-09-20 JP JP11564478A patent/JPS5541286A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6432511B1 (en) * | 1997-06-06 | 2002-08-13 | International Business Machines Corp. | Thermoplastic adhesive preform for heat sink attachment |
| US6893591B2 (en) | 1997-06-06 | 2005-05-17 | International Business Machines Corporation | Thermoplastic adhesive preform for heat sink attachment |
| US7645410B2 (en) | 1997-06-06 | 2010-01-12 | International Business Machines Corporation | Thermoplastic adhesive preform for heat sink attachment |
| WO2017187920A1 (en) * | 2016-04-28 | 2017-11-02 | 三菱重工業株式会社 | Joined member assembly method and joined member |
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