JPS54107256A - Semiconductor device mounting method - Google Patents

Semiconductor device mounting method

Info

Publication number
JPS54107256A
JPS54107256A JP1445278A JP1445278A JPS54107256A JP S54107256 A JPS54107256 A JP S54107256A JP 1445278 A JP1445278 A JP 1445278A JP 1445278 A JP1445278 A JP 1445278A JP S54107256 A JPS54107256 A JP S54107256A
Authority
JP
Japan
Prior art keywords
semiconductor device
substrate
adhesive
print substrate
fpt
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1445278A
Other languages
Japanese (ja)
Inventor
Riichi Masuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP1445278A priority Critical patent/JPS54107256A/en
Publication of JPS54107256A publication Critical patent/JPS54107256A/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE: To facilitate the movement of a fitting substrate after positioning, by sticking an adhesive metallic thin film after arranging and positioning a FPT (flat package-type) semiconductor device on the fitting substrate.
CONSTITUTION: After FPT semiconductor device 12 is arranged and positioned on print substrate 11, adhesive metallic thin film 13 where an adhesive film is formed, for example, by applying adhesive materials to aluminum foil is sticked, and both are fixed temporarily. As a result, even if print substrate 11 is moved, the positional slippage of device 12 is not generated unless print substrate 11 is handled roughly.
COPYRIGHT: (C)1979,JPO&Japio
JP1445278A 1978-02-09 1978-02-09 Semiconductor device mounting method Pending JPS54107256A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1445278A JPS54107256A (en) 1978-02-09 1978-02-09 Semiconductor device mounting method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1445278A JPS54107256A (en) 1978-02-09 1978-02-09 Semiconductor device mounting method

Publications (1)

Publication Number Publication Date
JPS54107256A true JPS54107256A (en) 1979-08-22

Family

ID=11861422

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1445278A Pending JPS54107256A (en) 1978-02-09 1978-02-09 Semiconductor device mounting method

Country Status (1)

Country Link
JP (1) JPS54107256A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57157145U (en) * 1981-03-26 1982-10-02
JPS5822745U (en) * 1981-08-05 1983-02-12 日本電気株式会社 Mount board for flat package type IC
JPS61119334U (en) * 1985-01-11 1986-07-28

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57157145U (en) * 1981-03-26 1982-10-02
JPS5822745U (en) * 1981-08-05 1983-02-12 日本電気株式会社 Mount board for flat package type IC
JPS61119334U (en) * 1985-01-11 1986-07-28

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