JPS54107256A - Semiconductor device mounting method - Google Patents
Semiconductor device mounting methodInfo
- Publication number
- JPS54107256A JPS54107256A JP1445278A JP1445278A JPS54107256A JP S54107256 A JPS54107256 A JP S54107256A JP 1445278 A JP1445278 A JP 1445278A JP 1445278 A JP1445278 A JP 1445278A JP S54107256 A JPS54107256 A JP S54107256A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- substrate
- adhesive
- print substrate
- fpt
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
PURPOSE: To facilitate the movement of a fitting substrate after positioning, by sticking an adhesive metallic thin film after arranging and positioning a FPT (flat package-type) semiconductor device on the fitting substrate.
CONSTITUTION: After FPT semiconductor device 12 is arranged and positioned on print substrate 11, adhesive metallic thin film 13 where an adhesive film is formed, for example, by applying adhesive materials to aluminum foil is sticked, and both are fixed temporarily. As a result, even if print substrate 11 is moved, the positional slippage of device 12 is not generated unless print substrate 11 is handled roughly.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1445278A JPS54107256A (en) | 1978-02-09 | 1978-02-09 | Semiconductor device mounting method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1445278A JPS54107256A (en) | 1978-02-09 | 1978-02-09 | Semiconductor device mounting method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS54107256A true JPS54107256A (en) | 1979-08-22 |
Family
ID=11861422
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1445278A Pending JPS54107256A (en) | 1978-02-09 | 1978-02-09 | Semiconductor device mounting method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54107256A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57157145U (en) * | 1981-03-26 | 1982-10-02 | ||
JPS5822745U (en) * | 1981-08-05 | 1983-02-12 | 日本電気株式会社 | Mount board for flat package type IC |
JPS61119334U (en) * | 1985-01-11 | 1986-07-28 |
-
1978
- 1978-02-09 JP JP1445278A patent/JPS54107256A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57157145U (en) * | 1981-03-26 | 1982-10-02 | ||
JPS5822745U (en) * | 1981-08-05 | 1983-02-12 | 日本電気株式会社 | Mount board for flat package type IC |
JPS61119334U (en) * | 1985-01-11 | 1986-07-28 |
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