JPS54149472A - Mounting method of semiconductor device - Google Patents

Mounting method of semiconductor device

Info

Publication number
JPS54149472A
JPS54149472A JP5751678A JP5751678A JPS54149472A JP S54149472 A JPS54149472 A JP S54149472A JP 5751678 A JP5751678 A JP 5751678A JP 5751678 A JP5751678 A JP 5751678A JP S54149472 A JPS54149472 A JP S54149472A
Authority
JP
Japan
Prior art keywords
circuit substrate
cooling plate
semiconductor device
mounting method
bolt
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5751678A
Other languages
Japanese (ja)
Inventor
Shiro Takeda
Yuji Nagai
Minoru Nakajima
Takenori Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP5751678A priority Critical patent/JPS54149472A/en
Publication of JPS54149472A publication Critical patent/JPS54149472A/en
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE: To obtain a mounting method to a semiconductor device where the circuit substrate can be fitted to and removed from a cooling plate easily.
CONSTITUTION: Hole 7 for a bolt is previously provided in circuit substrate 2, where semiconductor element 1 is accumulated, and cooling plate 3, and Teflon coating films 5 and 6 of a thickness of 0.05 to 10 μm are applied to the surface of circuit substrate 2 and cooling plate 3. Next, sheet-shaped resin adhesive layer 4 of a thickness of 50 to 300 μm is interposed between circuit substrate 2 and cooling plate 3 so that layer 4 may be brought into contact with Teflon coating films 5 and 6. Then, a bolt is inserted into bolt hole 7 to fix them.
COPYRIGHT: (C)1979,JPO&Japio
JP5751678A 1978-05-17 1978-05-17 Mounting method of semiconductor device Pending JPS54149472A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5751678A JPS54149472A (en) 1978-05-17 1978-05-17 Mounting method of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5751678A JPS54149472A (en) 1978-05-17 1978-05-17 Mounting method of semiconductor device

Publications (1)

Publication Number Publication Date
JPS54149472A true JPS54149472A (en) 1979-11-22

Family

ID=13057893

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5751678A Pending JPS54149472A (en) 1978-05-17 1978-05-17 Mounting method of semiconductor device

Country Status (1)

Country Link
JP (1) JPS54149472A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62150867A (en) * 1985-12-25 1987-07-04 Nec Corp High density ceramic package

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5143730U (en) * 1974-09-30 1976-03-31
JPS5233812U (en) * 1976-07-30 1977-03-10

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5143730U (en) * 1974-09-30 1976-03-31
JPS5233812U (en) * 1976-07-30 1977-03-10

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62150867A (en) * 1985-12-25 1987-07-04 Nec Corp High density ceramic package

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