JPS54149472A - Mounting method of semiconductor device - Google Patents
Mounting method of semiconductor deviceInfo
- Publication number
- JPS54149472A JPS54149472A JP5751678A JP5751678A JPS54149472A JP S54149472 A JPS54149472 A JP S54149472A JP 5751678 A JP5751678 A JP 5751678A JP 5751678 A JP5751678 A JP 5751678A JP S54149472 A JPS54149472 A JP S54149472A
- Authority
- JP
- Japan
- Prior art keywords
- circuit substrate
- cooling plate
- semiconductor device
- mounting method
- bolt
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
PURPOSE: To obtain a mounting method to a semiconductor device where the circuit substrate can be fitted to and removed from a cooling plate easily.
CONSTITUTION: Hole 7 for a bolt is previously provided in circuit substrate 2, where semiconductor element 1 is accumulated, and cooling plate 3, and Teflon coating films 5 and 6 of a thickness of 0.05 to 10 μm are applied to the surface of circuit substrate 2 and cooling plate 3. Next, sheet-shaped resin adhesive layer 4 of a thickness of 50 to 300 μm is interposed between circuit substrate 2 and cooling plate 3 so that layer 4 may be brought into contact with Teflon coating films 5 and 6. Then, a bolt is inserted into bolt hole 7 to fix them.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5751678A JPS54149472A (en) | 1978-05-17 | 1978-05-17 | Mounting method of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5751678A JPS54149472A (en) | 1978-05-17 | 1978-05-17 | Mounting method of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS54149472A true JPS54149472A (en) | 1979-11-22 |
Family
ID=13057893
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5751678A Pending JPS54149472A (en) | 1978-05-17 | 1978-05-17 | Mounting method of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54149472A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62150867A (en) * | 1985-12-25 | 1987-07-04 | Nec Corp | High density ceramic package |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5143730U (en) * | 1974-09-30 | 1976-03-31 | ||
JPS5233812U (en) * | 1976-07-30 | 1977-03-10 |
-
1978
- 1978-05-17 JP JP5751678A patent/JPS54149472A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5143730U (en) * | 1974-09-30 | 1976-03-31 | ||
JPS5233812U (en) * | 1976-07-30 | 1977-03-10 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62150867A (en) * | 1985-12-25 | 1987-07-04 | Nec Corp | High density ceramic package |
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