JPS53106585A - Production of semiconductor device - Google Patents

Production of semiconductor device

Info

Publication number
JPS53106585A
JPS53106585A JP2124677A JP2124677A JPS53106585A JP S53106585 A JPS53106585 A JP S53106585A JP 2124677 A JP2124677 A JP 2124677A JP 2124677 A JP2124677 A JP 2124677A JP S53106585 A JPS53106585 A JP S53106585A
Authority
JP
Japan
Prior art keywords
openings
production
semiconductor device
photosensitiver
depositing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2124677A
Other languages
Japanese (ja)
Inventor
Masaru Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP2124677A priority Critical patent/JPS53106585A/en
Publication of JPS53106585A publication Critical patent/JPS53106585A/en
Pending legal-status Critical Current

Links

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Weting (AREA)

Abstract

PURPOSE: To facilitate mechanical peeling of unnecessary metal films and obtain fine wirings by forming inverted trapezoidal side face parts on the side faces of openings through excess removing of the lower side of opening end part regions at the time of providing the openings in the dry type photosensitiver resin film deposited on the surface of a semiconductor substrate and depositing a circuit wiring metal film thereon.
COPYRIGHT: (C)1978,JPO&Japio
JP2124677A 1977-02-28 1977-02-28 Production of semiconductor device Pending JPS53106585A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2124677A JPS53106585A (en) 1977-02-28 1977-02-28 Production of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2124677A JPS53106585A (en) 1977-02-28 1977-02-28 Production of semiconductor device

Publications (1)

Publication Number Publication Date
JPS53106585A true JPS53106585A (en) 1978-09-16

Family

ID=12049691

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2124677A Pending JPS53106585A (en) 1977-02-28 1977-02-28 Production of semiconductor device

Country Status (1)

Country Link
JP (1) JPS53106585A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57120355A (en) * 1981-01-20 1982-07-27 Toshiba Corp Manufacture of semiconductor element

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57120355A (en) * 1981-01-20 1982-07-27 Toshiba Corp Manufacture of semiconductor element

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