JPS53124993A - Production of semiconductor device - Google Patents

Production of semiconductor device

Info

Publication number
JPS53124993A
JPS53124993A JP4002177A JP4002177A JPS53124993A JP S53124993 A JPS53124993 A JP S53124993A JP 4002177 A JP4002177 A JP 4002177A JP 4002177 A JP4002177 A JP 4002177A JP S53124993 A JPS53124993 A JP S53124993A
Authority
JP
Japan
Prior art keywords
production
semiconductor device
resist film
electrode wiring
patterns
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4002177A
Other languages
Japanese (ja)
Other versions
JPS5850026B2 (en
Inventor
Hiroshi Kuroda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP52040021A priority Critical patent/JPS5850026B2/en
Publication of JPS53124993A publication Critical patent/JPS53124993A/en
Publication of JPS5850026B2 publication Critical patent/JPS5850026B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Weting (AREA)

Abstract

PURPOSE: To obtain fine electrode wiring patterns and increase the scale of integration by evaporating Al so as to be buried within photo resist film patterns thereafter removing the resist film patterns at the time of forming Al electrode wiring patterns on a semiconductor substrate.
COPYRIGHT: (C)1978,JPO&Japio
JP52040021A 1977-04-07 1977-04-07 Manufacturing method of semiconductor device Expired JPS5850026B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP52040021A JPS5850026B2 (en) 1977-04-07 1977-04-07 Manufacturing method of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP52040021A JPS5850026B2 (en) 1977-04-07 1977-04-07 Manufacturing method of semiconductor device

Publications (2)

Publication Number Publication Date
JPS53124993A true JPS53124993A (en) 1978-10-31
JPS5850026B2 JPS5850026B2 (en) 1983-11-08

Family

ID=12569241

Family Applications (1)

Application Number Title Priority Date Filing Date
JP52040021A Expired JPS5850026B2 (en) 1977-04-07 1977-04-07 Manufacturing method of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5850026B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS613038U (en) * 1984-06-07 1986-01-09 新明和オ−トエンジニアリング株式会社 Loading platform device for cargo handling vehicles

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50153870A (en) * 1974-05-30 1975-12-11

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50153870A (en) * 1974-05-30 1975-12-11

Also Published As

Publication number Publication date
JPS5850026B2 (en) 1983-11-08

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