JPS53104640A - Bonding method - Google Patents

Bonding method

Info

Publication number
JPS53104640A
JPS53104640A JP1820277A JP1820277A JPS53104640A JP S53104640 A JPS53104640 A JP S53104640A JP 1820277 A JP1820277 A JP 1820277A JP 1820277 A JP1820277 A JP 1820277A JP S53104640 A JPS53104640 A JP S53104640A
Authority
JP
Japan
Prior art keywords
bonding method
nozzle
paste
chip
contamination
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1820277A
Other languages
Japanese (ja)
Inventor
Haruo Kugimiya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1820277A priority Critical patent/JPS53104640A/en
Publication of JPS53104640A publication Critical patent/JPS53104640A/en
Pending legal-status Critical Current

Links

Landscapes

  • Manufacture Of Macromolecular Shaped Articles (AREA)

Abstract

PURPOSE: To prevent the contamination of nozzle and the surface of a semiconductor chip with silver paste, by blasting gas from the nozzle of a vacuum chuck during the wetting stage of the chip with the paste.
COPYRIGHT: (C)1978,JPO&Japio
JP1820277A 1977-02-23 1977-02-23 Bonding method Pending JPS53104640A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1820277A JPS53104640A (en) 1977-02-23 1977-02-23 Bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1820277A JPS53104640A (en) 1977-02-23 1977-02-23 Bonding method

Publications (1)

Publication Number Publication Date
JPS53104640A true JPS53104640A (en) 1978-09-12

Family

ID=11965044

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1820277A Pending JPS53104640A (en) 1977-02-23 1977-02-23 Bonding method

Country Status (1)

Country Link
JP (1) JPS53104640A (en)

Similar Documents

Publication Publication Date Title
JPS51131274A (en) Tip bonding method
JPS52147064A (en) Semiconductor device
JPS5387163A (en) Production of semiconductor device
JPS53104640A (en) Bonding method
JPS5424571A (en) Manufacture for semiconductor wafer
JPS5321570A (en) Bonding method of semiconductor substrates
JPS5441665A (en) Manufacture for semiconductor device
JPS54162465A (en) Chip replacing method
JPS5219975A (en) Semiconductor device
JPS52106681A (en) Etching method
JPS5410670A (en) Bonding method of semiconductor chips
JPS5417677A (en) Manufacture of semiconductor
JPS547869A (en) Lead bending method of semiconductor device
JPS53137055A (en) Solder
JPS5311577A (en) Soldering method for wafers of semiconductor devices
JPS5358764A (en) Bonding method of flip chip
JPS5413264A (en) Bonding method of semiconductor chip
JPS52143763A (en) Soldering method to holding substrate for semiconductor substrates
JPS542670A (en) Plasma etching method
JPS52156558A (en) Collet for die bonding
JPS53105374A (en) Die bonding method for semiconductor chip
JPS5368070A (en) Etching method
JPS5379462A (en) Manufacture of semiconductor integrated circuit
JPS51112279A (en) Semiconductor device
JPS5389654A (en) Cutting method of semiconductor device