JPS53104640A - Bonding method - Google Patents
Bonding methodInfo
- Publication number
- JPS53104640A JPS53104640A JP1820277A JP1820277A JPS53104640A JP S53104640 A JPS53104640 A JP S53104640A JP 1820277 A JP1820277 A JP 1820277A JP 1820277 A JP1820277 A JP 1820277A JP S53104640 A JPS53104640 A JP S53104640A
- Authority
- JP
- Japan
- Prior art keywords
- bonding method
- nozzle
- paste
- chip
- contamination
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Manufacture Of Macromolecular Shaped Articles (AREA)
Abstract
PURPOSE: To prevent the contamination of nozzle and the surface of a semiconductor chip with silver paste, by blasting gas from the nozzle of a vacuum chuck during the wetting stage of the chip with the paste.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1820277A JPS53104640A (en) | 1977-02-23 | 1977-02-23 | Bonding method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1820277A JPS53104640A (en) | 1977-02-23 | 1977-02-23 | Bonding method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS53104640A true JPS53104640A (en) | 1978-09-12 |
Family
ID=11965044
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1820277A Pending JPS53104640A (en) | 1977-02-23 | 1977-02-23 | Bonding method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS53104640A (en) |
-
1977
- 1977-02-23 JP JP1820277A patent/JPS53104640A/en active Pending
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