JPS5413264A - Bonding method of semiconductor chip - Google Patents

Bonding method of semiconductor chip

Info

Publication number
JPS5413264A
JPS5413264A JP7781877A JP7781877A JPS5413264A JP S5413264 A JPS5413264 A JP S5413264A JP 7781877 A JP7781877 A JP 7781877A JP 7781877 A JP7781877 A JP 7781877A JP S5413264 A JPS5413264 A JP S5413264A
Authority
JP
Japan
Prior art keywords
semiconductor chip
bonding method
highly accurate
tray
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7781877A
Other languages
Japanese (ja)
Inventor
Shiyouichi Ogata
Hiroshi Oishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP7781877A priority Critical patent/JPS5413264A/en
Publication of JPS5413264A publication Critical patent/JPS5413264A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE: To perform highly accurate bonding with decreased number processes, by automatically perofrming highly accurate chip alignment by using a metal tray in advance and by picking up chips directly from the tray through the use of heated bonding collet.
COPYRIGHT: (C)1979,JPO&Japio
JP7781877A 1977-07-01 1977-07-01 Bonding method of semiconductor chip Pending JPS5413264A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7781877A JPS5413264A (en) 1977-07-01 1977-07-01 Bonding method of semiconductor chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7781877A JPS5413264A (en) 1977-07-01 1977-07-01 Bonding method of semiconductor chip

Publications (1)

Publication Number Publication Date
JPS5413264A true JPS5413264A (en) 1979-01-31

Family

ID=13644601

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7781877A Pending JPS5413264A (en) 1977-07-01 1977-07-01 Bonding method of semiconductor chip

Country Status (1)

Country Link
JP (1) JPS5413264A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4933299A (en) * 1972-07-26 1974-03-27

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4933299A (en) * 1972-07-26 1974-03-27

Similar Documents

Publication Publication Date Title
JPS51131274A (en) Tip bonding method
JPS5337383A (en) Semiconductor integrated circuit
JPS5413264A (en) Bonding method of semiconductor chip
JPS5240063A (en) Lead frame
JPS54162465A (en) Chip replacing method
JPS5439576A (en) Inspection method for semiconductor device
JPS51147255A (en) Semiconductor device
JPS5210032A (en) Construction method of semiconductor memory unit
JPS5419652A (en) Lead bonding method
JPS547869A (en) Lead bending method of semiconductor device
JPS5211769A (en) Method of adhering semiconductor proper and semiconductor holder
JPS5410670A (en) Bonding method of semiconductor chips
JPS5358764A (en) Bonding method of flip chip
JPS5310968A (en) Pellet bonding method
JPS5441070A (en) Semiconductor element
JPS53126275A (en) Semiconductor device
JPS53104640A (en) Bonding method
JPS5389654A (en) Cutting method of semiconductor device
JPS544568A (en) Semiconductor device and production of the same
JPS5427364A (en) Metal wire bonding method for semiconductor device
JPS5210678A (en) Ic package
JPS542663A (en) Positioning method for mounting semiconductor chip
JPS5410669A (en) Bonding method of semiconductor chips
JPS53133380A (en) Manufacture of semiconductor element
JPS5360576A (en) Flip chip bonding device