JPS57169257A - Exfoliating device for semiconductor element - Google Patents

Exfoliating device for semiconductor element

Info

Publication number
JPS57169257A
JPS57169257A JP5530981A JP5530981A JPS57169257A JP S57169257 A JPS57169257 A JP S57169257A JP 5530981 A JP5530981 A JP 5530981A JP 5530981 A JP5530981 A JP 5530981A JP S57169257 A JPS57169257 A JP S57169257A
Authority
JP
Japan
Prior art keywords
adhesive tape
chip
exfoliated
vacuum cylinder
contacted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5530981A
Other languages
Japanese (ja)
Inventor
Satoshi Owada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP5530981A priority Critical patent/JPS57169257A/en
Publication of JPS57169257A publication Critical patent/JPS57169257A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H01L2221/68322—Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To improve operation efficiency by mounting a vacuum cylinder, which partially contacts with the back of an adhesive tape and evacuates, and a supporting needle, which is set up in the vacuum cylinder and exfoliates a semiconductor chip from the adhesive tape, in the device exfoliating the chip from the adhesive tape. CONSTITUTION:The adhesive tape 15 on which the semiconductor chips 18 severally separated are pasted is fixed to a ring 16, and the vacuum cylinder 11 is contacted with the back of the adhesive tape 15 so that the chips 18' to be exfoliated are located at the central position. A chip supporting needle holder 13 is elevated by a cam 14', the chip supporting needle 12 is contacted with the back of the adhesive tape 15 opposed to the chip 18' to be exfoliated, and the inside of the vacuum cylinder 11 is evacuated. An adsorbing nozzle 17 is contacted with the chip 18' at the same time, and the chip 18' is exfoliated from the adhesive tape 15 by sucking force. The chips 18 are exfoliated successively from the adhesive tape 15 by repeating said process.
JP5530981A 1981-04-13 1981-04-13 Exfoliating device for semiconductor element Pending JPS57169257A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5530981A JPS57169257A (en) 1981-04-13 1981-04-13 Exfoliating device for semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5530981A JPS57169257A (en) 1981-04-13 1981-04-13 Exfoliating device for semiconductor element

Publications (1)

Publication Number Publication Date
JPS57169257A true JPS57169257A (en) 1982-10-18

Family

ID=12994960

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5530981A Pending JPS57169257A (en) 1981-04-13 1981-04-13 Exfoliating device for semiconductor element

Country Status (1)

Country Link
JP (1) JPS57169257A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180218952A1 (en) * 2017-01-27 2018-08-02 International Business Machines Corporation Picking up irregular semiconductor chips
CN109132547A (en) * 2018-09-04 2019-01-04 上海釜川自动化设备有限公司 One texture-etching side slicing apparatus and its application method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4919229B1 (en) * 1968-01-12 1974-05-16

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4919229B1 (en) * 1968-01-12 1974-05-16

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180218952A1 (en) * 2017-01-27 2018-08-02 International Business Machines Corporation Picking up irregular semiconductor chips
US10672638B2 (en) * 2017-01-27 2020-06-02 International Business Machines Corporation Picking up irregular semiconductor chips
CN109132547A (en) * 2018-09-04 2019-01-04 上海釜川自动化设备有限公司 One texture-etching side slicing apparatus and its application method
CN109132547B (en) * 2018-09-04 2023-12-15 无锡釜川科技股份有限公司 Single-sided texturing and slicing device and application method thereof

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