JPS54104289A - Detachment of printed-substrate mounted parts - Google Patents

Detachment of printed-substrate mounted parts

Info

Publication number
JPS54104289A
JPS54104289A JP1110878A JP1110878A JPS54104289A JP S54104289 A JPS54104289 A JP S54104289A JP 1110878 A JP1110878 A JP 1110878A JP 1110878 A JP1110878 A JP 1110878A JP S54104289 A JPS54104289 A JP S54104289A
Authority
JP
Japan
Prior art keywords
jig
component
printed
detachment
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1110878A
Other languages
Japanese (ja)
Inventor
Zenichi Matsuzawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP1110878A priority Critical patent/JPS54104289A/en
Publication of JPS54104289A publication Critical patent/JPS54104289A/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE: To detach parts from a printed substrate by moving the parts by a jig, by adsobing the jig to the part surface integrally.
CONSTITUTION: Jig 6 is adsorbed to the surface of component 2 mounted on a printed substrate. Jig 6 has thin plate ring 8 on smooth adsorption part 7a of rubber body 7 with I-shaped section, and spring 9 resides between the ring and peak part 7b. Adsorption part 7a is pushed up onto component 2, so that it will be adsorbed integrally. Solder at the lead part of the component is fused by fusion solder in pot 4 and jig 6 is drawn, so that component 2 will be detached. Then, spring 9 is bent to make the component free.
COPYRIGHT: (C)1979,JPO&Japio
JP1110878A 1978-02-03 1978-02-03 Detachment of printed-substrate mounted parts Pending JPS54104289A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1110878A JPS54104289A (en) 1978-02-03 1978-02-03 Detachment of printed-substrate mounted parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1110878A JPS54104289A (en) 1978-02-03 1978-02-03 Detachment of printed-substrate mounted parts

Publications (1)

Publication Number Publication Date
JPS54104289A true JPS54104289A (en) 1979-08-16

Family

ID=11768807

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1110878A Pending JPS54104289A (en) 1978-02-03 1978-02-03 Detachment of printed-substrate mounted parts

Country Status (1)

Country Link
JP (1) JPS54104289A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6170969U (en) * 1984-10-15 1986-05-15
US5553766A (en) * 1994-11-21 1996-09-10 International Business Machines Corporation In-situ device removal for multi-chip modules
US5556024A (en) * 1994-09-29 1996-09-17 International Business Machines Corporation Apparatus and method for removing known good die using hot shear process

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6170969U (en) * 1984-10-15 1986-05-15
US5556024A (en) * 1994-09-29 1996-09-17 International Business Machines Corporation Apparatus and method for removing known good die using hot shear process
US5553766A (en) * 1994-11-21 1996-09-10 International Business Machines Corporation In-situ device removal for multi-chip modules
US5779133A (en) * 1994-11-21 1998-07-14 International Business Machines Corporation In-situ device removal for multi-chip modules

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