JPS53144265A - Etching device - Google Patents

Etching device

Info

Publication number
JPS53144265A
JPS53144265A JP5870477A JP5870477A JPS53144265A JP S53144265 A JPS53144265 A JP S53144265A JP 5870477 A JP5870477 A JP 5870477A JP 5870477 A JP5870477 A JP 5870477A JP S53144265 A JPS53144265 A JP S53144265A
Authority
JP
Japan
Prior art keywords
etching device
jig
etching
surfacing
bubbles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5870477A
Other languages
Japanese (ja)
Inventor
Oshi Otsuka
Kazuo Uchida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP5870477A priority Critical patent/JPS53144265A/en
Publication of JPS53144265A publication Critical patent/JPS53144265A/en
Pending legal-status Critical Current

Links

Landscapes

  • Weting (AREA)

Abstract

PURPOSE: To ensure a uniform etching by standing substrate close together to the jig and turning the jig with the bubbles surfacing up from the lower part of the etching tank.
COPYRIGHT: (C)1978,JPO&Japio
JP5870477A 1977-05-23 1977-05-23 Etching device Pending JPS53144265A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5870477A JPS53144265A (en) 1977-05-23 1977-05-23 Etching device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5870477A JPS53144265A (en) 1977-05-23 1977-05-23 Etching device

Publications (1)

Publication Number Publication Date
JPS53144265A true JPS53144265A (en) 1978-12-15

Family

ID=13091891

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5870477A Pending JPS53144265A (en) 1977-05-23 1977-05-23 Etching device

Country Status (1)

Country Link
JP (1) JPS53144265A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5758435U (en) * 1980-09-19 1982-04-06
JPH0555192A (en) * 1991-08-27 1993-03-05 Mitsubishi Electric Corp Surface processing apparatus for thin board substance such as wafer
US5488964A (en) * 1991-05-08 1996-02-06 Tokyo Electron Limited Washing apparatus, and washing method
US5791357A (en) * 1996-06-06 1998-08-11 Shin-Etsu Handotai Co., Ltd. Support jig for thin circular objects
US5839460A (en) * 1997-11-13 1998-11-24 Memc Electronic Materials, Inc. Apparatus for cleaning semiconductor wafers
US6199563B1 (en) * 1997-02-21 2001-03-13 Canon Kabushiki Kaisha Wafer processing apparatus, wafer processing method, and semiconductor substrate fabrication method
US6273107B1 (en) * 1997-12-05 2001-08-14 Texas Instruments Incorporated Positive flow, positive displacement rinse tank
US6767840B1 (en) 1997-02-21 2004-07-27 Canon Kabushiki Kaisha Wafer processing apparatus, wafer processing method, and semiconductor substrate fabrication method

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5758435U (en) * 1980-09-19 1982-04-06
JPS6327784Y2 (en) * 1980-09-19 1988-07-27
US5488964A (en) * 1991-05-08 1996-02-06 Tokyo Electron Limited Washing apparatus, and washing method
US5782990A (en) * 1991-05-08 1998-07-21 Tokyo Electron Limited Method for washing objects
US5887604A (en) * 1991-05-08 1999-03-30 Tokyo Electron Limited Washing apparatus, and washing method
JPH0555192A (en) * 1991-08-27 1993-03-05 Mitsubishi Electric Corp Surface processing apparatus for thin board substance such as wafer
US5791357A (en) * 1996-06-06 1998-08-11 Shin-Etsu Handotai Co., Ltd. Support jig for thin circular objects
US6199563B1 (en) * 1997-02-21 2001-03-13 Canon Kabushiki Kaisha Wafer processing apparatus, wafer processing method, and semiconductor substrate fabrication method
US6767840B1 (en) 1997-02-21 2004-07-27 Canon Kabushiki Kaisha Wafer processing apparatus, wafer processing method, and semiconductor substrate fabrication method
US5839460A (en) * 1997-11-13 1998-11-24 Memc Electronic Materials, Inc. Apparatus for cleaning semiconductor wafers
US6273107B1 (en) * 1997-12-05 2001-08-14 Texas Instruments Incorporated Positive flow, positive displacement rinse tank

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