JPS5352067A - Pellet fitting method to metallic substrate - Google Patents

Pellet fitting method to metallic substrate

Info

Publication number
JPS5352067A
JPS5352067A JP12611676A JP12611676A JPS5352067A JP S5352067 A JPS5352067 A JP S5352067A JP 12611676 A JP12611676 A JP 12611676A JP 12611676 A JP12611676 A JP 12611676A JP S5352067 A JPS5352067 A JP S5352067A
Authority
JP
Japan
Prior art keywords
pellet
metallic substrate
fitting method
collet
pellet fitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12611676A
Other languages
Japanese (ja)
Inventor
Kunio Kobayashi
Tsuneo Okada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP12611676A priority Critical patent/JPS5352067A/en
Publication of JPS5352067A publication Critical patent/JPS5352067A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83193—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE: A pellet is soldered on a metallic substrate temporarily through solder materials - which are under a melting state - by using a collect with a heating equipment; and after the collet is pulled up to make solder materials spherical by surface tension action, the collet is pressed down to connect the pellet and the substrate, so that blowholes in the solder layer can be restrained from being generated.
COPYRIGHT: (C)1978,JPO&Japio
JP12611676A 1976-10-22 1976-10-22 Pellet fitting method to metallic substrate Pending JPS5352067A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12611676A JPS5352067A (en) 1976-10-22 1976-10-22 Pellet fitting method to metallic substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12611676A JPS5352067A (en) 1976-10-22 1976-10-22 Pellet fitting method to metallic substrate

Publications (1)

Publication Number Publication Date
JPS5352067A true JPS5352067A (en) 1978-05-12

Family

ID=14927023

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12611676A Pending JPS5352067A (en) 1976-10-22 1976-10-22 Pellet fitting method to metallic substrate

Country Status (1)

Country Link
JP (1) JPS5352067A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019171835A1 (en) * 2018-03-08 2019-09-12 日立オートモティブシステムズ株式会社 Semiconductor device production method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019171835A1 (en) * 2018-03-08 2019-09-12 日立オートモティブシステムズ株式会社 Semiconductor device production method

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