JPS5419685A - Securing method of semiconductor pellets - Google Patents

Securing method of semiconductor pellets

Info

Publication number
JPS5419685A
JPS5419685A JP8426177A JP8426177A JPS5419685A JP S5419685 A JPS5419685 A JP S5419685A JP 8426177 A JP8426177 A JP 8426177A JP 8426177 A JP8426177 A JP 8426177A JP S5419685 A JPS5419685 A JP S5419685A
Authority
JP
Japan
Prior art keywords
securing method
semiconductor pellets
pellets
mount part
securing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8426177A
Other languages
Japanese (ja)
Inventor
Masami Kiyono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP8426177A priority Critical patent/JPS5419685A/en
Publication of JPS5419685A publication Critical patent/JPS5419685A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83194—Lateral distribution of the layer connectors

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE: To suppress the productin of voids and avert the occurrence of cloating and cracking of pellets by applying the paste to be coated on mount part in X-form at the time of securing a square form pellet onto the pellet mount part by using conductive paste.
COPYRIGHT: (C)1979,JPO&Japio
JP8426177A 1977-07-15 1977-07-15 Securing method of semiconductor pellets Pending JPS5419685A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8426177A JPS5419685A (en) 1977-07-15 1977-07-15 Securing method of semiconductor pellets

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8426177A JPS5419685A (en) 1977-07-15 1977-07-15 Securing method of semiconductor pellets

Publications (1)

Publication Number Publication Date
JPS5419685A true JPS5419685A (en) 1979-02-14

Family

ID=13825504

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8426177A Pending JPS5419685A (en) 1977-07-15 1977-07-15 Securing method of semiconductor pellets

Country Status (1)

Country Link
JP (1) JPS5419685A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11887921B2 (en) 2020-08-28 2024-01-30 Stmicroelectronics S.R.L. Method of producing semiconductor devices and corresponding semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11887921B2 (en) 2020-08-28 2024-01-30 Stmicroelectronics S.R.L. Method of producing semiconductor devices and corresponding semiconductor device

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