JPS53122650A - Soldering method and device therefor - Google Patents

Soldering method and device therefor

Info

Publication number
JPS53122650A
JPS53122650A JP3787677A JP3787677A JPS53122650A JP S53122650 A JPS53122650 A JP S53122650A JP 3787677 A JP3787677 A JP 3787677A JP 3787677 A JP3787677 A JP 3787677A JP S53122650 A JPS53122650 A JP S53122650A
Authority
JP
Japan
Prior art keywords
device therefor
soldering method
soldering
molten solder
print plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3787677A
Other languages
Japanese (ja)
Inventor
Toru Shigeno
Toru Kuroda
Takuro Kamiyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP3787677A priority Critical patent/JPS53122650A/en
Publication of JPS53122650A publication Critical patent/JPS53122650A/en
Pending legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE: To provide the subject method and device wherein the flow direction of injected molten solder is defined so that the molten solder flows only in a direction opposite to the shifting direction of a print plate, and the print plate is tilted at a preselected angle relative to the injected surface to carry out soldering, whereby exceellent soldering can be achieved.
COPYRIGHT: (C)1978,JPO&Japio
JP3787677A 1977-04-01 1977-04-01 Soldering method and device therefor Pending JPS53122650A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3787677A JPS53122650A (en) 1977-04-01 1977-04-01 Soldering method and device therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3787677A JPS53122650A (en) 1977-04-01 1977-04-01 Soldering method and device therefor

Publications (1)

Publication Number Publication Date
JPS53122650A true JPS53122650A (en) 1978-10-26

Family

ID=12509724

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3787677A Pending JPS53122650A (en) 1977-04-01 1977-04-01 Soldering method and device therefor

Country Status (1)

Country Link
JP (1) JPS53122650A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8497166B2 (en) 2009-08-24 2013-07-30 Honda Motor Co., Ltd. Electronic device and method of manufacturing electronic device
CN106604552A (en) * 2016-12-20 2017-04-26 安徽理工大学 PCB (printed circuit board) automatic double-side coating machine and control circuit thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5051450A (en) * 1973-09-07 1975-05-08

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5051450A (en) * 1973-09-07 1975-05-08

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8497166B2 (en) 2009-08-24 2013-07-30 Honda Motor Co., Ltd. Electronic device and method of manufacturing electronic device
CN106604552A (en) * 2016-12-20 2017-04-26 安徽理工大学 PCB (printed circuit board) automatic double-side coating machine and control circuit thereof

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