JPS5480254A - Soldering method - Google Patents

Soldering method

Info

Publication number
JPS5480254A
JPS5480254A JP14707677A JP14707677A JPS5480254A JP S5480254 A JPS5480254 A JP S5480254A JP 14707677 A JP14707677 A JP 14707677A JP 14707677 A JP14707677 A JP 14707677A JP S5480254 A JPS5480254 A JP S5480254A
Authority
JP
Japan
Prior art keywords
soldered
substrate
jig
root portion
pin parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14707677A
Other languages
Japanese (ja)
Other versions
JPS5944948B2 (en
Inventor
Hiroshi Tsuneno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP14707677A priority Critical patent/JPS5944948B2/en
Publication of JPS5480254A publication Critical patent/JPS5480254A/en
Publication of JPS5944948B2 publication Critical patent/JPS5944948B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE: To efficiently perform the soldering work at low cost, by heat treating the jig, provided with the printed soldering pattern, located on the part to be soldered, and by transferring the soldering pattern onto the part to be soldered.
CONSTITUTION: The solder 12 is printed on the suitable jig 10 made of carbon, etc., at a specified pattern depending on the screen printing method, etc. Next, the jig 10 is put upside down, and is placed on the substrate 20 that is provided with the part to be soldered, and then, is heat treated within the heating furnace. The part to be soldered, installed in the substrate 20, is the root portion of many pin parts 22; and the jig 10 is placed on the substrate 20 so as to cause the printed solder 12 to lap over the root portion of the corresponding pin parts 22. The printed solder 12 melts by heating, and wetly sticks to the root portion of pin parts 22; and hereby, the soldered pattern is transferred. After that, the substrate 20 is taken out of the furnace and is cooled, and the root portion of each pin parts 22 is tightly soldered and fixed to the substrate 20.
COPYRIGHT: (C)1979,JPO&Japio
JP14707677A 1977-12-09 1977-12-09 brazing method Expired JPS5944948B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14707677A JPS5944948B2 (en) 1977-12-09 1977-12-09 brazing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14707677A JPS5944948B2 (en) 1977-12-09 1977-12-09 brazing method

Publications (2)

Publication Number Publication Date
JPS5480254A true JPS5480254A (en) 1979-06-26
JPS5944948B2 JPS5944948B2 (en) 1984-11-02

Family

ID=15421919

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14707677A Expired JPS5944948B2 (en) 1977-12-09 1977-12-09 brazing method

Country Status (1)

Country Link
JP (1) JPS5944948B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59105346A (en) * 1982-12-08 1984-06-18 Tanaka Kikinzoku Kogyo Kk Manufacture of silver brazed lead pin
JPS60169193A (en) * 1984-02-13 1985-09-02 三菱電機株式会社 Method of preliminarily supplying solder to circuit board
JPS6146014A (en) * 1984-08-10 1986-03-06 東海カーボン株式会社 Welding table
US5402926A (en) * 1992-10-01 1995-04-04 Ngk Insulators, Ltd. Brazing method using patterned metallic film having high wettability with respect to low-wettability brazing metal between components to be bonded together

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59105346A (en) * 1982-12-08 1984-06-18 Tanaka Kikinzoku Kogyo Kk Manufacture of silver brazed lead pin
JPS6351543B2 (en) * 1982-12-08 1988-10-14 Tanaka Precious Metal Ind
JPS60169193A (en) * 1984-02-13 1985-09-02 三菱電機株式会社 Method of preliminarily supplying solder to circuit board
JPH0436479B2 (en) * 1984-02-13 1992-06-16 Mitsubishi Electric Corp
JPS6146014A (en) * 1984-08-10 1986-03-06 東海カーボン株式会社 Welding table
JPH036876B2 (en) * 1984-08-10 1991-01-31 Fudoo Kk
US5402926A (en) * 1992-10-01 1995-04-04 Ngk Insulators, Ltd. Brazing method using patterned metallic film having high wettability with respect to low-wettability brazing metal between components to be bonded together

Also Published As

Publication number Publication date
JPS5944948B2 (en) 1984-11-02

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