JPS5480254A - Soldering method - Google Patents
Soldering methodInfo
- Publication number
- JPS5480254A JPS5480254A JP14707677A JP14707677A JPS5480254A JP S5480254 A JPS5480254 A JP S5480254A JP 14707677 A JP14707677 A JP 14707677A JP 14707677 A JP14707677 A JP 14707677A JP S5480254 A JPS5480254 A JP S5480254A
- Authority
- JP
- Japan
- Prior art keywords
- soldered
- substrate
- jig
- root portion
- pin parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
PURPOSE: To efficiently perform the soldering work at low cost, by heat treating the jig, provided with the printed soldering pattern, located on the part to be soldered, and by transferring the soldering pattern onto the part to be soldered.
CONSTITUTION: The solder 12 is printed on the suitable jig 10 made of carbon, etc., at a specified pattern depending on the screen printing method, etc. Next, the jig 10 is put upside down, and is placed on the substrate 20 that is provided with the part to be soldered, and then, is heat treated within the heating furnace. The part to be soldered, installed in the substrate 20, is the root portion of many pin parts 22; and the jig 10 is placed on the substrate 20 so as to cause the printed solder 12 to lap over the root portion of the corresponding pin parts 22. The printed solder 12 melts by heating, and wetly sticks to the root portion of pin parts 22; and hereby, the soldered pattern is transferred. After that, the substrate 20 is taken out of the furnace and is cooled, and the root portion of each pin parts 22 is tightly soldered and fixed to the substrate 20.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14707677A JPS5944948B2 (en) | 1977-12-09 | 1977-12-09 | brazing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14707677A JPS5944948B2 (en) | 1977-12-09 | 1977-12-09 | brazing method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5480254A true JPS5480254A (en) | 1979-06-26 |
JPS5944948B2 JPS5944948B2 (en) | 1984-11-02 |
Family
ID=15421919
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14707677A Expired JPS5944948B2 (en) | 1977-12-09 | 1977-12-09 | brazing method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5944948B2 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59105346A (en) * | 1982-12-08 | 1984-06-18 | Tanaka Kikinzoku Kogyo Kk | Manufacture of silver brazed lead pin |
JPS60169193A (en) * | 1984-02-13 | 1985-09-02 | 三菱電機株式会社 | Method of preliminarily supplying solder to circuit board |
JPS6146014A (en) * | 1984-08-10 | 1986-03-06 | 東海カーボン株式会社 | Welding table |
US5402926A (en) * | 1992-10-01 | 1995-04-04 | Ngk Insulators, Ltd. | Brazing method using patterned metallic film having high wettability with respect to low-wettability brazing metal between components to be bonded together |
-
1977
- 1977-12-09 JP JP14707677A patent/JPS5944948B2/en not_active Expired
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59105346A (en) * | 1982-12-08 | 1984-06-18 | Tanaka Kikinzoku Kogyo Kk | Manufacture of silver brazed lead pin |
JPS6351543B2 (en) * | 1982-12-08 | 1988-10-14 | Tanaka Precious Metal Ind | |
JPS60169193A (en) * | 1984-02-13 | 1985-09-02 | 三菱電機株式会社 | Method of preliminarily supplying solder to circuit board |
JPH0436479B2 (en) * | 1984-02-13 | 1992-06-16 | Mitsubishi Electric Corp | |
JPS6146014A (en) * | 1984-08-10 | 1986-03-06 | 東海カーボン株式会社 | Welding table |
JPH036876B2 (en) * | 1984-08-10 | 1991-01-31 | Fudoo Kk | |
US5402926A (en) * | 1992-10-01 | 1995-04-04 | Ngk Insulators, Ltd. | Brazing method using patterned metallic film having high wettability with respect to low-wettability brazing metal between components to be bonded together |
Also Published As
Publication number | Publication date |
---|---|
JPS5944948B2 (en) | 1984-11-02 |
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