JPS6451694A - Cream solder printing method by using metal mask or metal screen - Google Patents
Cream solder printing method by using metal mask or metal screenInfo
- Publication number
- JPS6451694A JPS6451694A JP20739187A JP20739187A JPS6451694A JP S6451694 A JPS6451694 A JP S6451694A JP 20739187 A JP20739187 A JP 20739187A JP 20739187 A JP20739187 A JP 20739187A JP S6451694 A JPS6451694 A JP S6451694A
- Authority
- JP
- Japan
- Prior art keywords
- metal
- metal mask
- pins
- cream
- slit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
PURPOSE:To enable the spreading of solder cream with a squeegee, and facilitate the mounting work of a flat IC, by arranging a continuous slit at positions corresponding to pin holes on the metal mask of a printed circuit board. CONSTITUTION:On the metal mask or metal screen of a printed circuit board, holes are not made on by one at positions corresponding to pins 3, but a slit 4 connecting these holes is arranged. For the slit 4, cream solder 5 is spread by printing. After the metal mask or metal screen is eliminated, FIC's 2 are mounted thereon, which are subjected to soldering in a reflow furnace. At this time, excessive cream part between pins is attracted by pins on both sides on account of surface tension, and the excessive part vanishes, so that final products without defects can be manufactured.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20739187A JPS6451694A (en) | 1987-08-22 | 1987-08-22 | Cream solder printing method by using metal mask or metal screen |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20739187A JPS6451694A (en) | 1987-08-22 | 1987-08-22 | Cream solder printing method by using metal mask or metal screen |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6451694A true JPS6451694A (en) | 1989-02-27 |
Family
ID=16538965
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20739187A Pending JPS6451694A (en) | 1987-08-22 | 1987-08-22 | Cream solder printing method by using metal mask or metal screen |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6451694A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5271549A (en) * | 1992-03-30 | 1993-12-21 | Sony Corporation | Multiple-lead element soldering method using sheet solder |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62126691A (en) * | 1985-11-27 | 1987-06-08 | 日本電気ホームエレクトロニクス株式会社 | Printing screen for soldering |
-
1987
- 1987-08-22 JP JP20739187A patent/JPS6451694A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62126691A (en) * | 1985-11-27 | 1987-06-08 | 日本電気ホームエレクトロニクス株式会社 | Printing screen for soldering |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5271549A (en) * | 1992-03-30 | 1993-12-21 | Sony Corporation | Multiple-lead element soldering method using sheet solder |
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