JPS6451694A - Cream solder printing method by using metal mask or metal screen - Google Patents

Cream solder printing method by using metal mask or metal screen

Info

Publication number
JPS6451694A
JPS6451694A JP20739187A JP20739187A JPS6451694A JP S6451694 A JPS6451694 A JP S6451694A JP 20739187 A JP20739187 A JP 20739187A JP 20739187 A JP20739187 A JP 20739187A JP S6451694 A JPS6451694 A JP S6451694A
Authority
JP
Japan
Prior art keywords
metal
metal mask
pins
cream
slit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20739187A
Other languages
Japanese (ja)
Inventor
Yoshihito Chiga
Yoshiko Tanaka
Mikio Arai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NIPPON ALMIT KK
NIPPON ARUMITSUTO KK
Original Assignee
NIPPON ALMIT KK
NIPPON ARUMITSUTO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NIPPON ALMIT KK, NIPPON ARUMITSUTO KK filed Critical NIPPON ALMIT KK
Priority to JP20739187A priority Critical patent/JPS6451694A/en
Publication of JPS6451694A publication Critical patent/JPS6451694A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To enable the spreading of solder cream with a squeegee, and facilitate the mounting work of a flat IC, by arranging a continuous slit at positions corresponding to pin holes on the metal mask of a printed circuit board. CONSTITUTION:On the metal mask or metal screen of a printed circuit board, holes are not made on by one at positions corresponding to pins 3, but a slit 4 connecting these holes is arranged. For the slit 4, cream solder 5 is spread by printing. After the metal mask or metal screen is eliminated, FIC's 2 are mounted thereon, which are subjected to soldering in a reflow furnace. At this time, excessive cream part between pins is attracted by pins on both sides on account of surface tension, and the excessive part vanishes, so that final products without defects can be manufactured.
JP20739187A 1987-08-22 1987-08-22 Cream solder printing method by using metal mask or metal screen Pending JPS6451694A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20739187A JPS6451694A (en) 1987-08-22 1987-08-22 Cream solder printing method by using metal mask or metal screen

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20739187A JPS6451694A (en) 1987-08-22 1987-08-22 Cream solder printing method by using metal mask or metal screen

Publications (1)

Publication Number Publication Date
JPS6451694A true JPS6451694A (en) 1989-02-27

Family

ID=16538965

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20739187A Pending JPS6451694A (en) 1987-08-22 1987-08-22 Cream solder printing method by using metal mask or metal screen

Country Status (1)

Country Link
JP (1) JPS6451694A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5271549A (en) * 1992-03-30 1993-12-21 Sony Corporation Multiple-lead element soldering method using sheet solder

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62126691A (en) * 1985-11-27 1987-06-08 日本電気ホームエレクトロニクス株式会社 Printing screen for soldering

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62126691A (en) * 1985-11-27 1987-06-08 日本電気ホームエレクトロニクス株式会社 Printing screen for soldering

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5271549A (en) * 1992-03-30 1993-12-21 Sony Corporation Multiple-lead element soldering method using sheet solder

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