JPS644395A - Printing plate for printing creamy solder - Google Patents

Printing plate for printing creamy solder

Info

Publication number
JPS644395A
JPS644395A JP15942987A JP15942987A JPS644395A JP S644395 A JPS644395 A JP S644395A JP 15942987 A JP15942987 A JP 15942987A JP 15942987 A JP15942987 A JP 15942987A JP S644395 A JPS644395 A JP S644395A
Authority
JP
Japan
Prior art keywords
sides
moving direction
width
parallel
printing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15942987A
Other languages
Japanese (ja)
Inventor
Masao Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP15942987A priority Critical patent/JPS644395A/en
Publication of JPS644395A publication Critical patent/JPS644395A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing

Abstract

PURPOSE:To equalize the printing widths of sides perpendicular to the moving direction of a squeegee and sides parallel to the moving direction of the squeegee, of a creamy solder printed, by setting the width of a sides of a screen stencil pattern perpendicular to the moving direction of the squeegee to be smaller than the width of the sides of the screen stencil pattern parallel to the moving direction. CONSTITUTION:Of four sides of a screen stencil pattern 4A having a rectangular frame shape, the sides 4a perpendicular to the moving direction (a) of a squeegee on a screen printing press have a width W1 smaller than the width W2 of the sides 4b parallel to the moving direction. When a creamy solder is printed on a printed circuit board by use of a printing plate having the screen stencil pattern 4A, the creamy solder is printed in a rectangular frame shape corresponding to the pattern 4A. In this case, there is a tendency that the amount of the solder applied is greater at the sides 4a perpendicular to the moving direction of the squeegee than at the sides 4b parallel to the moving direction. Therefore, with the width of the perpendicular sides 4a initially set to be smaller than the width of the parallel sides 4b, the printing widths of the perpendicular sides and the parallel sides of the creamy solder are equalized.
JP15942987A 1987-06-26 1987-06-26 Printing plate for printing creamy solder Pending JPS644395A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15942987A JPS644395A (en) 1987-06-26 1987-06-26 Printing plate for printing creamy solder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15942987A JPS644395A (en) 1987-06-26 1987-06-26 Printing plate for printing creamy solder

Publications (1)

Publication Number Publication Date
JPS644395A true JPS644395A (en) 1989-01-09

Family

ID=15693550

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15942987A Pending JPS644395A (en) 1987-06-26 1987-06-26 Printing plate for printing creamy solder

Country Status (1)

Country Link
JP (1) JPS644395A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7251880B2 (en) * 2001-09-28 2007-08-07 Intel Corporation Method and structure for identifying lead-free solder
CN103240953A (en) * 2013-04-24 2013-08-14 昆山恒盛电子有限公司 Top frame machine

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7251880B2 (en) * 2001-09-28 2007-08-07 Intel Corporation Method and structure for identifying lead-free solder
CN103240953A (en) * 2013-04-24 2013-08-14 昆山恒盛电子有限公司 Top frame machine

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