JPS6439090A - Substrate for reflow - Google Patents

Substrate for reflow

Info

Publication number
JPS6439090A
JPS6439090A JP19591787A JP19591787A JPS6439090A JP S6439090 A JPS6439090 A JP S6439090A JP 19591787 A JP19591787 A JP 19591787A JP 19591787 A JP19591787 A JP 19591787A JP S6439090 A JPS6439090 A JP S6439090A
Authority
JP
Japan
Prior art keywords
substrate
heat
rate
furnace
same time
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19591787A
Other languages
Japanese (ja)
Inventor
Tomohide Hirono
Hiroyuki Naka
Takashi Ichiyanagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP19591787A priority Critical patent/JPS6439090A/en
Publication of JPS6439090A publication Critical patent/JPS6439090A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

PURPOSE:To make it possible to perform the simultaneous reflow soldering of many kinds of parts having different thermal capacities, by providing a layer having a second heat radiation rate, which is different from the heat radiation rate of the surface of a substrate on a part of or on almost the entire surface of the substrate. CONSTITUTION:A paint applied part 39 having a heat radiating rate, which is relatively smaller than the heat radiating rate of a substrate 31, is formed on the lower surface of a part 37 by a screen printing method. Therefore, radiating heat, which is applied on the substrate 31 having the thermal capacity distribution, is controlled, and the increasing temperature of the substrate 31 can be controlled. Thus, the reflow soldering of parts having low heat resistance can be performed at the same time, and the substrates having the different thermal capacities can be inputted into a furnace at the same time without the change in preset conditions of the furnace.
JP19591787A 1987-08-05 1987-08-05 Substrate for reflow Pending JPS6439090A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19591787A JPS6439090A (en) 1987-08-05 1987-08-05 Substrate for reflow

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19591787A JPS6439090A (en) 1987-08-05 1987-08-05 Substrate for reflow

Publications (1)

Publication Number Publication Date
JPS6439090A true JPS6439090A (en) 1989-02-09

Family

ID=16349132

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19591787A Pending JPS6439090A (en) 1987-08-05 1987-08-05 Substrate for reflow

Country Status (1)

Country Link
JP (1) JPS6439090A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018078244A (en) * 2016-11-11 2018-05-17 新電元工業株式会社 Manufacturing method of electronic device and electronic device
JP2019080700A (en) * 2017-10-30 2019-05-30 株式会社大一商会 Game machine
JP2019080694A (en) * 2017-10-30 2019-05-30 株式会社大一商会 Game machine
JP2019080701A (en) * 2017-10-30 2019-05-30 株式会社大一商会 Game machine
JP2021058623A (en) * 2020-12-16 2021-04-15 株式会社大一商会 Game machine

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59193085A (en) * 1983-04-15 1984-11-01 株式会社日立製作所 Circuit board of electronic circuit device
JPS6242595A (en) * 1985-08-20 1987-02-24 松下電器産業株式会社 Printed wiring board

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59193085A (en) * 1983-04-15 1984-11-01 株式会社日立製作所 Circuit board of electronic circuit device
JPS6242595A (en) * 1985-08-20 1987-02-24 松下電器産業株式会社 Printed wiring board

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018078244A (en) * 2016-11-11 2018-05-17 新電元工業株式会社 Manufacturing method of electronic device and electronic device
JP2019080700A (en) * 2017-10-30 2019-05-30 株式会社大一商会 Game machine
JP2019080694A (en) * 2017-10-30 2019-05-30 株式会社大一商会 Game machine
JP2019080701A (en) * 2017-10-30 2019-05-30 株式会社大一商会 Game machine
JP2021058623A (en) * 2020-12-16 2021-04-15 株式会社大一商会 Game machine

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